세계의 적층 세라믹 커패시터 시장 : 유형별, 정격 전압별, 최종 용도별, 용도별, 패키지별, 정전 용량 범위별, 지역별 예측(-2030년)

The global multilayer ceramic capacitor market is projected to grow from USD 15.00 billion in 2025 to USD 21.93 billion by 2030, at a CAGR of 7.9%. The rapid deployment of 5G networks is significantly driving the demand for multilayer ceramic capacitors (MLCCs) in the telecommunications sector.

5G infrastructure, including base stations and small cells, requires a substantial number of MLCCs, often several times more than in 4G LTE systems, to ensure high-frequency signal filtering, decoupling, and energy storage for stable and efficient operation. These capacitors must be miniaturized yet capable of handling higher frequencies and elevated temperatures, making them essential for modern high-density circuit boards in telecom equipment. A real-world example is SAMSUNG ELECTRO-MECHANICS, which has developed specialized MLCCs explicitly designed for 5G base stations, supporting the stringent performance requirements of next-generation networks. As 5G deployment continues to expand globally, the reliance on advanced, high-performance MLCCs is expected to grow, solidifying their role as a critical component in the telecommunications industry.

"NP0/C0G Led Class I MLCC Market Share in 2024"

NP0 (Negative-Positive-Zero) or C0G (Class 0, Group G) capacitors held the largest market share within the Class I MLCC segment in 2024, due to their exceptional electrical properties and widespread applicability. These capacitors are known for having a near-zero temperature coefficient, which means their capacitance remains very stable over a wide temperature range, typically from -55°C to +125°C, with minimal variation. They also demonstrate low dielectric loss and high insulation resistance, making them highly efficient for use in high-frequency, precision, and timing applications.

The stability and reliability of NP0/C0G capacitors make them ideal for critical circuits such as oscillators, filters, RF modules, sensors, and decoupling networks in consumer electronics, automotive electronics, industrial automation, and aerospace systems. Additionally, their mature manufacturing processes, wide availability, and compliance with industry standards allow designers to rely on consistent quality and predictable performance, reducing design risks. The combination of high reliability, precision, and versatility ensures that NP0/C0G capacitors continue to dominate the Class I MLCC segment and remain the preferred choice for engineers and manufacturers worldwide.

"Low Voltage (<=16 V) MLCCs Dominated Market in 2024"

Low-voltage MLCCs, typically rated up to 16 volts, held the largest market share in 2024 due to their widespread use across high-volume consumer electronics, automotive, and industrial applications. These capacitors are essential for decoupling, filtering, and energy storage in compact circuit designs of smartphones, tablets, laptops, wearable devices, and automotive control units. Their ability to deliver high capacitance in small form factors makes them ideal for miniaturized and densely packed PCBs, which are common in modern electronic devices. Furthermore, the cost-effectiveness, reliability, and maturity of low-voltage MLCC manufacturing processes make them the preferred choice for designers, sustaining strong demand and maintaining their dominant position within the multilayer ceramic capacitor market.

"China to dominate Asia Pacific Multilayer Ceramic Capacitor Market During Forecast Period"

China is expected to dominate the Asia Pacific market during the forecast period due to its large-scale manufacturing capabilities, robust supply chain, and growing domestic demand for electronic components. The country hosts a significant number of MLCC manufacturers, including both established players and emerging companies, which enables high-volume production and cost advantages. Rapid growth in consumer electronics, automotive electronics (particularly electric vehicles), telecommunications, and industrial automation within China is driving substantial internal demand for MLCCs. Additionally, government support for high-tech manufacturing, investment in smart factories, and expansion of 5G infrastructure further enhance China's capacity to lead the regional market. Combined with ongoing technological advancements in materials and production processes, these factors position China as a key growth hub for MLCCs in the Asia Pacific region.

Breakdown of Primaries

Various executives from key organizations operating in the multilayer ceramic capacitor market were interviewed in-depth, including CEOs, marketing directors, and innovation and technology directors.

• By Company Type: Tier 1-40%, Tier 2-30%, and Tier 3-30%
• By Designation: C-level Executives-40%, Directors-40%, and Others-20%
• By Region: North America-25%, Europe-20%, Asia Pacific-45%, and RoW-10%

The multilayer ceramic capacitor market is dominated by globally established players, such as Murata Manufacturing Co., Ltd. (Japan), SAMSUNG ELECTRO-MECHANICS (South Korea), TDK Corporation (Japan), KYOCERA Corporation (Japan), TAIYO YUDEN CO., LTD. (Japan), YAGEO Group (Taiwan), Vishay Intertechnology, Inc. (US), Walsin Technology Corporation (Taiwan), MARUWA Co., Ltd. (Japan), Holy Stone Enterprise Co., Ltd. (Taiwan), Darfon (Taiwan), Samwha Capacitor Group (South Korea), FengHua (China), Nippon Chemi-Con Corporation (Japan), Fujian Torch Electron Technology Co., Ltd. (China), Shenzhen EYANG Technology Development Co., Ltd. (China), Knowles Capacitors (US), Exxelia (France), Johanson Dielectrics (US), Wurth Elektronik eiSos GmbH & Co. KG (Germany), ChaoZhou Three-Circle (Group) Co., Ltd. (China), PROSPERITY DIELECTRICS CO. LTD. (PDC) (China), Viking Tech Corporation (Taiwan), AEM Components (US), and Xingrong Technologies (China). The study includes an in-depth competitive analysis of these key players in the multilayer ceramic capacitor market, with their company profiles, recent developments, and key market strategies.

Study Coverage

The report segments the multilayer ceramic capacitor market and forecasts its size by type, dielectric type, end, application, capacitance range, rated voltage, package, and region. The report also examines the key drivers, restraints, opportunities, and challenges influencing the market. It gives a detailed view of the market across four main regions-North America, Europe, Asia Pacific, and RoW. The report includes a value chain analysis of the key players and their competitive analysis of the multilayer ceramic capacitor ecosystem.

Key Benefits of Buying the Report:

• Analysis of key drivers (rising incorporation of MLCCs in smartphones, smart wearables, and other electronic devices), restraints (price volatility in raw materials), opportunities (elevating demand for circular sourcing and recycling services for MLCCs), and challenges (availability of counterfeit and substandard MLCCs) influencing the growth of the multilayer ceramic capacitor market
• Products/Solution/Service Development/Innovation: Detailed insights into upcoming technologies, research, and development activities in the multilayer ceramic capacitor market
• Market Development: Comprehensive information about lucrative markets by analyzing the multilayer ceramic capacitor market across varied regions
• Market Diversification: Exhaustive information about new dielectric type MLCC untapped geographies, recent developments, and investments in the multilayer ceramic capacitor market
• Competitive Assessment: In-depth assessment of market shares and growth strategies and offerings of leading players, such as Murata Manufacturing Co., Ltd. (Japan), SAMSUNG ELECTRO-MECHANICS (South Korea), YAGEO Group (Taiwan), TAIYO YUDEN CO., LTD. (Japan), and TDK Corporation (Japan).

TABLE OF CONTENTS

1 NTRODUCTION

• 1.1 STUDY OBJECTIVES
• 1.2 MARKET DEFINITION
• 1.3 STUDY SCOPE
  • 1.3.1 MARKETS COVERED AND REGIONAL SCOPE
  • 1.3.2 INCLUSIONS AND EXCLUSIONS
  • 1.3.3 YEARS CONSIDERED
• 1.4 CURRENCY CONSIDERED
• 1.5 UNIT CONSIDERED
• 1.6 LIMITATIONS
• 1.7 STAKEHOLDERS
• 1.8 SUMMARY OF CHANGES

2 RESEARCH METHODOLOGY

• 2.1 RESEARCH DATA
  • 2.1.1 SECONDARY AND PRIMARY RESEARCH
  • 2.1.2 SECONDARY DATA
    • 2.1.2.1 List of key secondary sources
    • 2.1.2.2 Key data from secondary sources
  • 2.1.3 PRIMARY DATA
    • 2.1.3.1 Key data from primary sources
    • 2.1.3.2 List of primary interview participants
    • 2.1.3.3 Breakdown of primaries
    • 2.1.3.4 Key industry insights
• 2.2 MARKET SIZE ESTIMATION METHODOLOGY
  • 2.2.1 BOTTOM-UP APPROACH
    • 2.2.1.1 Approach to derive market size using bottom-up analysis
  • 2.2.2 TOP-DOWN APPROACH
    • 2.2.2.1 Approach to derive market size using top-down analysis
• 2.3 MARKET SHARE ESTIMATION
• 2.4 DATA TRIANGULATION
• 2.5 RESEARCH ASSUMPTIONS
• 2.6 RESEARCH LIMITATIONS
• 2.7 RISK ASSESSMENT

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

• 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN MULTILAYER CERAMIC CAPACITOR MARKET
• 4.2 MULTILAYER CERAMIC CAPACITOR MARKET, BY DIELECTRIC TYPE
• 4.3 MULTILAYER CERAMIC CAPACITOR MARKET, BY RATED VOLTAGE
• 4.4 MULTILAYER CERAMIC CAPACITOR MARKET, BY REGION

5 MARKET OVERVIEW

• 5.1 INTRODUCTION
• 5.2 MARKET DYNAMICS
  • 5.2.1 DRIVERS
    • 5.2.1.1 Growing demand from automotive industry due to advent of EVs
    • 5.2.1.2 Increasing requirement from telecommunications sector with rapid deployment of 5G technology
    • 5.2.1.3 Rising incorporation of MLCCs in smartphones, smart wearables, and other electronic devices
    • 5.2.1.4 Increased circuit complexity in consumer electronics due to miniaturization
  • 5.2.2 RESTRAINTS
    • 5.2.2.1 Price volatility in raw materials
    • 5.2.2.2 Environmental and regulatory compliance costs
  • 5.2.3 OPPORTUNITIES
    • 5.2.3.1 Elevating demand for circular sourcing and recycling services for MLCCs
    • 5.2.3.2 Surging use of medium- and high-voltage MLCCs in industrial, medical, and automotive applications
  • 5.2.4 CHALLENGES
    • 5.2.4.1 Availability of counterfeit and substandard MLCCs
    • 5.2.4.2 High capital expenditure required for capacity expansion
• 5.3 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS
• 5.4 PRICING ANALYSIS
  • 5.4.1 AVERAGE SELLING PRICE TREND OF NP0/C0G CLASS I DIELECTRIC TYPE MLCC, BY KEY PLAYER, 2021-2024
  • 5.4.2 AVERAGE SELLING PRICE TREND OF NP0/C0G CLASS I DIELECTRIC TYPE MLCC, BY REGION, 2021-2024
• 5.5 VALUE CHAIN ANALYSIS
• 5.6 ECOSYSTEM ANALYSIS
• 5.7 TECHNOLOGY ANALYSIS
  • 5.7.1 KEY TECHNOLOGIES
    • 5.7.1.1 Layer stacking & lamination technology
    • 5.7.1.2 High-precision printing technology for electrodes
    • 5.7.1.3 Electroplating/Termination technology
  • 5.7.2 COMPLEMENTARY TECHNOLOGIES
    • 5.7.2.1 Surface-mount technology (SMT)
    • 5.7.2.2 Circuit simulation & modeling (SPICE, ESR/ESL analysis)
  • 5.7.3 ADJACENT TECHNOLOGIES
    • 5.7.3.1 On-chip passives in semiconductor fabrication
    • 5.7.3.2 Embedded passive technology
• 5.8 PATENT ANALYSIS
• 5.9 TRADE ANALYSIS
  • 5.9.1 EXPORT SCENARIO (HS CODE 853224)
  • 5.9.2 IMPORT SCENARIO (HS CODE 853224)
• 5.10 KEY CONFERENCES AND EVENTS, 2026
• 5.11 CASE STUDY ANALYSIS
  • 5.11.1 MURATA INTRODUCED MULTILAYER CERAMIC CAPACITORS FOR 5G SMARTPHONES
  • 5.11.2 TDK DEVELOPED MLCC WITH ZL CHARACTERISTICS FOR ULTRASONIC PARKING ASSIST
  • 5.11.3 TDK OFFERS CA AND CN SERIES OF MLCCS TO ESTABLISH STABLE AND INTERFERENCE-FREE AUTOMOTIVE POWER SYSTEMS
  • 5.11.4 KEMET MINIATURIZED HIGH-VOLTAGE BME X7R CAPACITORS FOR AUTOMOTIVE APPLICATIONS BY SUPPRESSING SURFACE ARCING
• 5.12 INVESTMENT AND FUNDING SCENARIO
• 5.13 TARIFF AND REGULATORY LANDSCAPE
  • 5.13.1 TARIFF ANALYSIS (HS CODE 853224)
  • 5.13.2 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • 5.13.3 KEY REGULATIONS
• 5.14 PORTER'S FIVE FORCES ANALYSIS
  • 5.14.1 THREAT OF NEW ENTRANTS
  • 5.14.2 THREAT OF SUBSTITUTES
  • 5.14.3 BARGAINING POWER OF BUYERS
  • 5.14.4 BARGAINING POWER OF SUPPLIERS
  • 5.14.5 INTENSITY OF COMPETITIVE RIVALRY
• 5.15 KEY STAKEHOLDERS AND BUYING CRITERIA
  • 5.15.1 KEY STAKEHOLDERS IN BUYING PROCESS
  • 5.15.2 BUYING CRITERIA
• 5.16 IMPACT OF AI ON MULTILAYER CERAMIC CAPACITOR MARKET
• 5.17 IMPACT OF 2025 US TARIFF ON MULTILAYER CERAMIC CAPACITOR MARKET
  • 5.17.1 INTRODUCTION
  • 5.17.2 KEY TARIFF RATES
  • 5.17.3 PRICE IMPACT ANALYSIS
  • 5.17.4 IMPACT ON COUNTRY/REGION
    • 5.17.4.1 US
    • 5.17.4.2 Europe
    • 5.17.4.3 Asia Pacific
  • 5.17.5 IMPACT ON END USES

6 MULTILAYER CERAMIC CAPACITOR MARKET, BY TYPE

• 6.1 INTRODUCTION
• 6.2 GENERAL CAPACITORS
  • 6.2.1 ENHANCED CIRCUIT RELIABILITY AND PERFORMANCE FEATURES TO DRIVE DEMAND
• 6.3 ARRAY
  • 6.3.1 SIGNIFICANT FOCUS ON MINIATURIZATION AND INVENTORY REDUCTION TO BOOST DEMAND
• 6.4 SERIAL CONSTRUCTION
  • 6.4.1 REQUIREMENT FOR HIGH SAFETY AND RELIABILITY FOR AUTOMOTIVE APPLICATIONS TO FUEL SEGMENTAL GROWTH
• 6.5 MEGA CAP
  • 6.5.1 ENHANCED MECHANICAL STRENGTH AND HIGH CAPACITANCE EFFICIENCY TO FACILITATE ADOPTION
• 6.6 OTHER TYPES

7 MULTILAYER CERAMIC CAPACITOR MARKET, BY DIELECTRIC TYPE

• 7.1 INTRODUCTION
• 7.2 CLASS I
  • 7.2.1 NP0/COG
    • 7.2.1.1 Extremely consistent capacitance and zero-drift traits to spike demand
  • 7.2.2 U2J
    • 7.2.2.1 Integration into automotive powertrains, EV inverters, and industrial data acquisition modules to propel market
  • 7.2.3 X8G
    • 7.2.3.1 Long-term reliability and compliance with automotive industry standards to drive market
  • 7.2.4 OTHER CLASS I TYPES
• 7.3 CLASS II
  • 7.3.1 X7R
    • 7.3.1.1 Increasing use in mass production of circuit boards to favor segmental growth
  • 7.3.2 X5R
    • 7.3.2.1 Competence in balancing capacitance and cost efficiency to boost demand
  • 7.3.3 X8R
    • 7.3.3.1 Reliable performance in extended temperatures to drive adoption
  • 7.3.4 OTHER CLASS II TYPES
• 7.4 CLASS III
  • 7.4.1 Y5V
    • 7.4.1.1 Industry-leading capacitance density and most economical price point to elevate requirement
  • 7.4.2 Z5U
    • 7.4.2.1 Competence in offering low-cost manufacturing and simplified logistics to escalate requirement
  • 7.4.3 OTHER CLASS III TYPES

8 MULTILAYER CERAMIC CAPACITOR MARKET, BY RATED VOLTAGE

• 8.1 INTRODUCTION
• 8.2 LOW VOLTAGE (<=16 V)
  • 8.2.1 STABLE CAPACITANCE AND FREQUENCY RESPONSE WITH MINIMAL DRIFT TO DRIVE ADOPTION IN ADAS SENSORS
• 8.3 MID VOLTAGE (25-200 V)
  • 8.3.1 HIGH CAPACITANCE, ROBUST INSULATION, AND COMPACT SMD CONFIGURATIONS TO BOOST DEMAND
• 8.4 HIGH VOLTAGE (>200 V)
  • 8.4.1 ONGOING PUSH TOWARD HIGHER VOLTAGE E-MOBILITY AND GRID MODERNIZATION TO SUPPORT SEGMENTAL GROWTH

9 MULTILAYER CERAMIC CAPACITOR MARKET, BY END USE

• 9.1 INTRODUCTION
• 9.2 CONSUMER ELECTRONICS
  • 9.2.1 SURGING DEMAND FOR MINIATURE CONSUMER ELECTRONICS TO FUEL MARKET
    • 9.2.1.1 Smartphones
    • 9.2.1.2 Tablets
    • 9.2.1.3 Laptops
    • 9.2.1.4 Wearables
• 9.3 AUTOMOTIVE
  • 9.3.1 ELEVATING DEMAND FOR EVS AND ADAS TO FOSTER SEGMENTAL GROWTH
    • 9.3.1.1 Advanced driver-assistance systems (ADAS)
    • 9.3.1.2 Infotainment systems
    • 9.3.1.3 Body electronics
    • 9.3.1.4 EV powertrain
• 9.4 TELECOM
  • 9.4.1 NEED FOR STABLE CONNECTIVITY AND LOW LATENCY IN DENSELY POPULATED NETWORKS TO ELEVATE DEMAND
    • 9.4.1.1 5G base stations
    • 9.4.1.2 Networking gears
• 9.5 INDUSTRIAL
  • 9.5.1 INCREASING USE OF INDUSTRIAL AUTOMATION AND ROBOTICS TO ENHANCE OPERATIONAL RELIABILITY TO DRIVE MARKET
    • 9.5.1.1 Automation
    • 9.5.1.2 Robotics
    • 9.5.1.3 Power supplies
• 9.6 HEALTHCARE & MEDICAL
  • 9.6.1 NEED FOR ACCURATE READINGS AND DEVICE LONGEVITY TO SPUR DEMAND
    • 9.6.1.1 Diagnostic imaging systems
    • 9.6.1.2 Patient monitoring systems
    • 9.6.1.3 Implantable medical devices
• 9.7 AEROSPACE & DEFENSE
  • 9.7.1 ONGOING MODERNIZATION OF DEFENSE ELECTRONICS AND SATELLITE NETWORKS TO ELEVATE DEMAND
    • 9.7.1.1 Avionics
    • 9.7.1.2 Radar & communication systems
    • 9.7.1.3 Missile & guidance electronics
• 9.8 OTHER END USES
  • 9.8.1 ENERGY STORAGE SYSTEMS
  • 9.8.2 IOT DEVICES
  • 9.8.3 SENSORS

10 MULTILAYER CERAMIC CAPACITOR MARKET, BY APPLICATION

• 10.1 INTRODUCTION
• 10.2 DECOUPLING CAPACITORS
  • 10.2.1 PROFICIENCY IN MAINTAINING STABLE ELECTRONIC PERFORMANCE TO FUEL SEGMENTAL GROWTH
• 10.3 FILTERING CAPACITORS
  • 10.3.1 ABILITY TO ELIMINATE UNWANTED NOISE FROM ELECTRONIC CIRCUITS TO FOSTER MARKET
• 10.4 BYPASS CAPACITORS
  • 10.4.1 EXCELLENCE IN ENHANCING BATTERY EFFICIENCY AND PROCESSOR PERFORMANCE TO ACCELERATE DEMAND
• 10.5 RESONANT/TIMING CAPACITORS
  • 10.5.1 WIDE USAGE IN RF TRANSMITTERS, CLOCK GENERATORS, AND GPS SYSTEMS TO FACILITATE MARKET GROWTH
• 10.6 COUPLING/DECOUPLING CAPACITORS IN RF
  • 10.6.1 RAPID EXPANSION OF IOT AND 5G INFRASTRUCTURE TO AUGMENT DEMAND
• 10.7 POWERTRAIN HV CAPACITORS
  • 10.7.1 INCREASING DEMAND FOR EVS TO CREATE OPPORTUNITIES

11 MULTILAYER CERAMIC CAPACITOR MARKET, BY PACKAGE

• 11.1 INTRODUCTION
• 11.2 ULTRA-MINIATURE
  • 11.2.1 RISING USE IN RF MODULES, CAMERA CONTROL SYSTEMS, AND POWER MANAGEMENT CIRCUITS TO FUEL SEGMENTAL GROWTH
• 11.3 SMALL
  • 11.3.1 HIGH RELIABILITY AND DURABILITY EVEN UNDER VIBRATION AND TEMPERATURE STRESS TO BOOST SEGMENTAL GROWTH
• 11.4 MEDIUM
  • 11.4.1 SHIFT TOWARD ELECTRIFICATION AND INDUSTRIAL AUTOMATION TO CREATE OPPORTUNITIES
• 11.5 LARGE
  • 11.5.1 EXCELLENT RELIABILITY UNDER HIGH ELECTRICAL AND THERMAL STRESS TO SPUR DEMAND

12 MULTILAYER CERAMIC CAPACITOR MARKET, BY CAPACITANCE RANGE

• 12.1 INTRODUCTION
• 12.2 <100 PF
  • 12.2.1 INCREASING USE IN RF AND MICROWAVE APPLICATIONS TO FUEL SEGMENTAL GROWTH
• 12.3 100 PF-1 NF
  • 12.3.1 SUITABILITY FOR HIGH-SPEED DATA LINES, OSCILLATORS, AND NETWORK FILTERS TO STIMULATE SEGMENTAL GROWTH
• 12.4 1-100 NF
  • 12.4.1 PROFICIENCY IN REDUCING SIGNAL NOISE IN MICROCONTROLLERS, POWER CONVERTERS, AND COMPUTING SYSTEMS TO DRIVE MARKET
• 12.5 0.1-1 µF
  • 12.5.1 NEED TO ENSURE CLEAN SIGNAL TRANSMISSION ACROSS SMARTPHONES AND LAPTOPS TO BOOST DEMAND
• 12.6 1-100 µF
  • 12.6.1 INTEGRATION INTO NEXT-GENERATION EV INVERTERS AND AUTONOMOUS DRIVING ELECTRONICS TO SUPPORT MARKET GROWTH
• 12.7 >100 µF
  • 12.7.1 SURGING DEMAND FOR ELECTRIC VEHICLES, SOLAR INVERTERS, ROBOTICS, AND AEROSPACE CONTROL SYSTEMS TO DRIVE DEMAND

13 MULTILAYER CERAMIC CAPACITOR MARKET, BY REGION

• 13.1 INTRODUCTION
• 13.2 NORTH AMERICA
  • 13.2.1 MACROECONOMIC OUTLOOK FOR NORTH AMERICA
  • 13.2.2 US
    • 13.2.2.1 Technological advancements and industrial expansion to drive market
  • 13.2.3 CANADA
    • 13.2.3.1 Rapid electrification, 5G deployment, and industrial automation to boost demand
  • 13.2.4 MEXICO
    • 13.2.4.1 Automotive and consumer electronics industries to contribute to market growth
• 13.3 EUROPE
  • 13.3.1 MACROECONOMIC OUTLOOK FOR EUROPE
  • 13.3.2 GERMANY
    • 13.3.2.1 Accelerating shift toward electrification and digitalization to propel market
  • 13.3.3 UK
    • 13.3.3.1 Industrial digitization, 5G expansion, and rising consumer electronics demand to foster market growth
  • 13.3.4 FRANCE
    • 13.3.4.1 Continued investment in telecom and data center infrastructure to stimulate market growth
  • 13.3.5 SPAIN
    • 13.3.5.1 Fast-track solar PV and grid storage projects to augment market growth
  • 13.3.6 ITALY
    • 13.3.6.1 Increasing emphasis on integrating solar and wind energy to boost demand
  • 13.3.7 POLAND
    • 13.3.7.1 Rising demand for automotive electronics to support market growth
  • 13.3.8 NORDICS
    • 13.3.8.1 Strong emphasis on electric mobility and green energy initiatives to create growth opportunities
  • 13.3.9 REST OF EUROPE
• 13.4 ASIA PACIFIC
  • 13.4.1 MACROECONOMIC OUTLOOK FOR ASIA PACIFIC
  • 13.4.2 CHINA
    • 13.4.2.1 5G development initiatives to drive market
  • 13.4.3 JAPAN
    • 13.4.3.1 Presence of leading players to support market growth
  • 13.4.4 SOUTH KOREA
    • 13.4.4.1 Focus on developing MLCCs for AI servers and automotive electronics to stimulate market growth
  • 13.4.5 INDIA
    • 13.4.5.1 Automotive electrification and smart manufacturing initiatives to spike demand
  • 13.4.6 TAIWAN
    • 13.4.6.1 Booming market for autonomous vehicles to create opportunities
  • 13.4.7 AUSTRALIA
    • 13.4.7.1 Emphasis on clean energy expansion to contribute to market growth
  • 13.4.8 INDONESIA
    • 13.4.8.1 Rapidly growing EV market to create opportunities
  • 13.4.9 MALAYSIA
    • 13.4.9.1 Government incentives promoting Industry 4.0 adoption to favour market growth
  • 13.4.10 THAILAND
    • 13.4.10.1 Digital transformation and smart manufacturing initiatives to augment market growth
  • 13.4.11 VIETNAM
    • 13.4.11.1 Need to enhance telecom infrastructure to elevate demand
  • 13.4.12 REST OF ASIA PACIFIC
• 13.5 ROW
  • 13.5.1 MACROECONOMIC OUTLOOK FOR ROW
  • 13.5.2 MIDDLE EAST
    • 13.5.2.1 Bahrain
      • 13.5.2.1.1 Growing data center investment to fuel demand
    • 13.5.2.2 Kuwait
      • 13.5.2.2.1 Coordinated 5G rollouts to create opportunities
    • 13.5.2.3 Oman
      • 13.5.2.3.1 Broader 5G standalone rollouts to push demand
    • 13.5.2.4 Qatar
      • 13.5.2.4.1 Rapid expansion of AI infrastructure to support market growth
    • 13.5.2.5 Saudi Arabia
      • 13.5.2.5.1 Expanding colocation and hyperscale pipeline to stimulate market growth
    • 13.5.2.6 UAE
      • 13.5.2.6.1 Hyperscale AI campuses and cloud investments to elevate demand
    • 13.5.2.7 Rest of Middle East
  • 13.5.3 AFRICA
    • 13.5.3.1 South Africa
      • 13.5.3.1.1 Growing penetration of wearable devices and consumer electronic devices to stimulate demand
    • 13.5.3.2 Rest of Africa
  • 13.5.4 SOUTH AMERICA
    • 13.5.4.1 Industrial automation and consumer electronics expansion to support market growth

14 COMPETITIVE LANDSCAPE

• 14.1 OVERVIEW
• 14.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2022-2025
• 14.3 REVENUE ANALYSIS, 2020-2024
• 14.4 MARKET SHARE ANALYSIS, 2024
• 14.5 COMPANY VALUATION AND FINANCIAL METRICS
• 14.6 PRODUCT COMPARISON
• 14.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2024
  • 14.7.1 STARS
  • 14.7.2 EMERGING LEADERS
  • 14.7.3 PERVASIVE PLAYERS
  • 14.7.4 PARTICIPANTS
  • 14.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2024
    • 14.7.5.1 Company footprint
    • 14.7.5.2 Region footprint
    • 14.7.5.3 Dielectric type footprint
    • 14.7.5.4 Rated voltage footprint
    • 14.7.5.5 End use footprint
    • 14.7.5.6 Application footprint
• 14.8 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2024
  • 14.8.1 PROGRESSIVE COMPANIES
  • 14.8.2 RESPONSIVE COMPANIES
  • 14.8.3 DYNAMIC COMPANIES
  • 14.8.4 STARTING BLOCKS
  • 14.8.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2024
    • 14.8.5.1 Detailed list of key startups/SMEs
    • 14.8.5.2 Competitive benchmarking of key startups/SMEs
• 14.9 COMPETITIVE SCENARIO
  • 14.9.1 PRODUCT LAUNCHES AND ENHANCEMENTS
  • 14.9.2 DEALS

15 COMPANY PROFILES

• 15.1 INTRODUCTION
• 15.2 KEY PLAYERS
  • 15.2.1 MURATA MANUFACTURING CO., LTD.
    • 15.2.1.1 Business overview
    • 15.2.1.2 Products/Solutions/Services offered
    • 15.2.1.3 Recent developments
      • 15.2.1.3.1 Product launches and enhancements
      • 15.2.1.3.2 Deals
    • 15.2.1.4 MnM view
      • 15.2.1.4.1 Key strengths/Right to win
      • 15.2.1.4.2 Strategic choices
      • 15.2.1.4.3 Weaknesses/Competitive threats
  • 15.2.2 SAMSUNG ELECTRO-MECHANICS
    • 15.2.2.1 Business overview
    • 15.2.2.2 Products/Solutions/Services offered
    • 15.2.2.3 Recent developments
      • 15.2.2.3.1 Product launches and enhancements
      • 15.2.2.3.2 Other developments
    • 15.2.2.4 MnM view
      • 15.2.2.4.1 Key strengths/Right to win
      • 15.2.2.4.2 Strategic choices
      • 15.2.2.4.3 Weaknesses/Competitive threats
  • 15.2.3 TDK CORPORATION
    • 15.2.3.1 Business overview
    • 15.2.3.2 Products/Solutions/Services offered
    • 15.2.3.3 Recent developments
      • 15.2.3.3.1 Product launches and enhancements
      • 15.2.3.3.2 Deals
    • 15.2.3.4 MnM view
      • 15.2.3.4.1 Key strengths/Right to win
      • 15.2.3.4.2 Strategic choices
      • 15.2.3.4.3 Weaknesses/Competitive threats
  • 15.2.4 KYOCERA CORPORATION
    • 15.2.4.1 Business overview
    • 15.2.4.2 Products/Solutions/Services offered
    • 15.2.4.3 Recent developments
      • 15.2.4.3.1 Product launches and enhancements
    • 15.2.4.4 MnM view
      • 15.2.4.4.1 Key strengths/Right to win
      • 15.2.4.4.2 Strategic choices
      • 15.2.4.4.3 Weaknesses/Competitive threats
  • 15.2.5 TAIYO YUDEN CO., LTD.
    • 15.2.5.1 Business overview
    • 15.2.5.2 Products/Solutions/Services offered
    • 15.2.5.3 MnM view
      • 15.2.5.3.1 Key strengths/Right to win
      • 15.2.5.3.2 Strategic choices
      • 15.2.5.3.3 Weaknesses/Competitive threats
  • 15.2.6 YAGEO GROUP
    • 15.2.6.1 Business overview
    • 15.2.6.2 Products/Solutions/Services offered
    • 15.2.6.3 Recent developments
      • 15.2.6.3.1 Product launches and enhancements
  • 15.2.7 VISHAY INTERTECHNOLOGY, INC.
    • 15.2.7.1 Business overview
    • 15.2.7.2 Products/Solutions/Services offered
    • 15.2.7.3 Recent developments
      • 15.2.7.3.1 Product launches and enhancements
      • 15.2.7.3.2 Deals
  • 15.2.8 WALSIN TECHNOLOGIES CORPORATION
    • 15.2.8.1 Business overview
    • 15.2.8.2 Products/Solutions/Services offered
  • 15.2.9 MARUWA CO., LTD.
    • 15.2.9.1 Business overview
    • 15.2.9.2 Products/Solutions/Services offered
  • 15.2.10 HOLY STONE ENTERPRISE CO., LTD.
    • 15.2.10.1 Business overview
    • 15.2.10.2 Products/Solutions/Services offered
• 15.3 OTHER PLAYERS
  • 15.3.1 DARFON
  • 15.3.2 SAMWHA CAPACITOR GROUP
  • 15.3.3 FENGHUA
  • 15.3.4 NIPPON CHEMI-CON CORPORATION
  • 15.3.5 FUJIAN TORCH ELECTRON TECHNOLOGY CO., LTD.
  • 15.3.6 SHENZHEN EYANG TECHNOLOGY DEVELOPMENT CO., LTD.
  • 15.3.7 KNOWLES CAPACITORS
  • 15.3.8 EXXELIA
  • 15.3.9 JOHANSON TECHNOLOGY
  • 15.3.10 WURTH ELEKTRONIK EISOS GMBH & CO. KG
  • 15.3.11 CHAOZHOU THREE-CIRCLE (GROUP) CO., LTD.
  • 15.3.12 PROSPERITY DIELECTRICS CO. LTD. (PDC)
  • 15.3.13 VIKING TECH CORPORATION
  • 15.3.14 AEM COMPONENTS
  • 15.3.15 XINGRONG TECHNOLOGIES

16 APPENDIX

• 16.1 INSIGHTS FROM INDUSTRY EXPERTS
• 16.2 DISCUSSION GUIDE
• 16.3 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
• 16.4 CUSTOMIZATION OPTIONS
• 16.5 RELATED REPORTS
• 16.6 AUTHOR DETAILS