세계의 반도체용 세라믹 패키징 재료 시장 : 재료별, 패키징 기술별, 최종 이용 산업별, 지역별 - 예측(-2030년)

The semiconductor ceramic packaging materials market size is projected to grow from USD 1.85 billion in 2025 to USD 2.78 billion by 2030, registering a CAGR of 8.5% during the forecast period.

The demand for semiconductor ceramic packaging materials is increasing due to the growing complexity and miniaturization of modern electronic devices, which require packaging that can reliably manage heat and maintain signal integrity. Rising adoption of high-power and high-frequency applications, such as electric vehicles, industrial automation, and advanced medical devices, is driving the need for materials with superior thermal conductivity and mechanical strength.

Additionally, the shift toward high-density multi-chip modules and system-in-package designs requires ceramics that can support precise assembly and long-term reliability. Increasing environmental and regulatory requirements for non-toxic, durable, and stable materials also favor ceramics over traditional packaging. These combined technological, industrial, and regulatory pressures are collectively fueling sustained growth in market demand.

"By material, the alumina segment is anticipated to account for the largest market share during the forecast period"

Alumina accounts for the largest share in the semiconductor ceramic packaging materials market due to its proven reliability, versatility, and cost-effectiveness across a wide range of applications. Its combination of good thermal conductivity, excellent electrical insulation, and high mechanical strength allows it to meet the performance requirements of both low- and high-power semiconductor devices. Alumina is compatible with established manufacturing processes, including co-firing and metallization techniques, enabling scalable production with minimal defects. Its widespread availability and relatively lower raw material cost compared to other materials make it a preferred choice for mass-market applications. Additionally, alumina's stability under thermal cycling and harsh environmental conditions ensures long-term device performance, reinforcing its dominant position in the market.

"By end-use industry, the consumer electronics segment is anticipated to account for the largest market share during the forecast period"

Consumer electronics account for the largest share of the semiconductor ceramic packaging materials market because the sector drives high-volume demand for reliable and durable semiconductor components. Rapid growth in global electronics consumption, including smartphones, laptops, tablets, audio devices, and wearable technology, increases the need for packaging materials that can maintain performance under frequent use and varying environmental conditions. Manufacturers prioritize components that ensure long-term stability and minimize device failure, supporting brand reputation and customer satisfaction. The wide variety of products and continuous technological upgrades in this industry, including advanced displays, processing power, and connectivity features, make consumer electronics the primary driver of ceramic packaging material demand.

"By packaging technology, the surface mount packages - leadless segment is anticipated to account for the largest market share during the forecast period"

Surface mount packages- leadless account for the largest share in the semiconductor ceramic packaging materials market because they allow for more precise and efficient assembly of semiconductor devices compared to traditional through-hole methods. This technology supports higher component density on printed circuit boards, enabling compact designs and improved signal integrity in advanced electronics. It also enhances mechanical stability and reduces the risk of solder joint failures, which is critical for applications in automotive, aerospace, and high-performance computing. Additionally, leadless surface mount technology is compatible with automated manufacturing and inspection processes, improving production speed and consistency. Its ability to support miniaturization, high-frequency operation, and reliable thermal management makes this packaging technology the preferred choice for modern semiconductor applications, driving its growth in the market.

"Asia Pacific is anticipated to account for the largest market share during the forecast period"

Asia Pacific holds the largest share in the semiconductor ceramic packaging materials market because the region is a global hub for semiconductor assembly, testing, and packaging operations. Strong investments in research and development of advanced packaging technologies drive demand for high-performance ceramic materials. The concentration of electronics manufacturing clusters in countries like China, Taiwan, and South Korea enables efficient production and rapid adoption of new packaging solutions. Additionally, the growing presence of international semiconductor companies establishing regional operations and partnerships increases the consumption of ceramic materials. Supportive industrial policies, export-oriented production, and rising domestic demand for advanced electronics further strengthen the region's market dominance.

In-depth interviews were conducted with chief executive officers (CEOs), marketing directors, other innovation and technology directors, and executives from various key organizations operating in the semiconductor ceramic packaging materials market, and information was gathered from secondary research to determine and verify the market size of several segments.

• By Company Type: Tier 1 - 50%, Tier 2 - 30%, and Tier 3 - 20%
• By Designation: Managers- 15%, Directors - 20%, and Others - 65%
• By Region: North America - 30%, Europe - 25%, Asia Pacific - 35%, the Middle East & Africa -5%, and South America- 5%

The semiconductor ceramic packaging materials market comprises major KYOCERA Corporation (Japan), CeramTec GmbH (Germany), CoorsTek (US), Materion Corporation (US), Resonac Holdings Corporation (Japan), NGK INSULATORS, LTD. (Japan), AGC Inc. (Japan), Morgan Advanced Materials (UK), MARUWA Co., Ltd. (Japan), and Tokuyama Corporation (Japan). The study includes an in-depth competitive analysis of these key players in the semiconductor ceramic packaging materials market, with their company profiles, recent developments, and key market strategies.

Research Coverage

This report segments the semiconductor ceramic packaging materials market on the basis of material, packaging technology, end-use industry, and region, and provides estimations for the overall value of the market across various regions. A detailed analysis of key industry players has been conducted to provide insights into their business overviews, products & services, key strategies, and expansions associated with the semiconductor ceramic packaging materials market.

Key Benefits of Buying This Report

This research report is focused on various levels of analysis - industry analysis (industry trends), market ranking analysis of top players, and company profiles, which together provide an overall view of the competitive landscape; emerging and high-growth segments of the semiconductor ceramic packaging materials market; high-growth regions; and market drivers, restraints, opportunities, and challenges.

The report provides insights on the following pointers:

• Analysis of drivers (expansion of automotive electronics and EV power modules boosting ceramic packaging adoption), restraints (high cost of ceramic packaging materials compared to polymer or metal-based packaging), opportunities (regional localization of semiconductor manufacturing encouraging investment), and challenges (limited design flexibility of ceramic materials makes fabricating complex geometries challenging) influencing the growth of semiconductor ceramic packaging materials market.
• Market Penetration: Comprehensive information on the semiconductor ceramic packaging materials offered by top players in the global semiconductor ceramic packaging materials market.
• Product Development/Innovation: Detailed insights on upcoming technologies, expansions, and partnerships in the semiconductor ceramic packaging materials market.
• Market Development: Comprehensive information about lucrative emerging markets, the report analyzes the markets for semiconductor ceramic packaging materials market across regions.
• Market Capacity: Production capacity of the companies is provided wherever available with upcoming capacities for the semiconductor ceramic packaging materials market.
• Competitive Assessment: In-depth assessment of market shares, strategies, products, and manufacturing capabilities of leading players in the semiconductor ceramic packaging materials market.

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 STUDY OBJECTIVES
• 1.2 MARKET DEFINITION
• 1.3 STUDY SCOPE
  • 1.3.1 MARKETS COVERED
  • 1.3.2 INCLUSIONS & EXCLUSIONS
  • 1.3.3 YEARS CONSIDERED
  • 1.3.4 CURRENCY CONSIDERED
  • 1.3.5 UNITS CONSIDERED
• 1.4 LIMITATIONS
• 1.5 STAKEHOLDERS

2 RESEARCH METHODOLOGY

• 2.1 RESEARCH DATA
  • 2.1.1 SECONDARY DATA
    • 2.1.1.1 Key data from secondary sources
  • 2.1.2 PRIMARY DATA
    • 2.1.2.1 Key data from primary sources
    • 2.1.2.2 Key primary sources
    • 2.1.2.3 Key players for primary interviews
    • 2.1.2.4 Breakdown of interviews with experts
    • 2.1.2.5 Key industry insights
• 2.2 BASE NUMBER CALCULATION
  • 2.2.1 SUPPLY-SIDE ANALYSIS
  • 2.2.2 DEMAND-SIDE ANALYSIS
• 2.3 GROWTH FORECAST
  • 2.3.1 SUPPLY SIDE
  • 2.3.2 DEMAND SIDE
• 2.4 MARKET SIZE ESTIMATION
  • 2.4.1 BOTTOM-UP APPROACH
  • 2.4.2 TOP-DOWN APPROACH
• 2.5 DATA TRIANGULATION
• 2.6 RESEARCH ASSUMPTION
• 2.7 GROWTH FORECAST
• 2.8 RISK ASSESSMENT
• 2.9 FACTOR ANALYSIS

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

• 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET
• 4.2 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL
• 4.3 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY
• 4.4 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY
• 4.5 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY COUNTRY

5 MARKET OVERVIEW

• 5.1 INTRODUCTION
• 5.2 MARKET DYNAMICS
  • 5.2.1 DRIVERS
    • 5.2.1.1 Expansion of automotive electronics and EV power modules
    • 5.2.1.2 Growth in 5G infrastructure and RF devices
  • 5.2.2 RESTRAINTS
    • 5.2.2.1 Higher cost of ceramic packaging materials than polymer or metal-based packaging
  • 5.2.3 OPPORTUNITIES
    • 5.2.3.1 Regional localization of semiconductor manufacturing encouraging investment
    • 5.2.3.2 Advanced multilayer ceramic materials for emerging 2.5D/ 3D semiconductor packaging
  • 5.2.4 CHALLENGES
    • 5.2.4.1 Difficulty in bonding to dissimilar materials
    • 5.2.4.2 Limited design flexibility makes fabricating complex geometries challenging
• 5.3 GENERATIVE AI
  • 5.3.1 INTRODUCTION
• 5.4 IMPACT ON SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET

6 INDUSTRY TRENDS

• 6.1 INTRODUCTION
• 6.2 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
• 6.3 SUPPLY CHAIN ANALYSIS
• 6.4 IMPACT OF 2025 US TARIFF -SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET
  • 6.4.1 INTRODUCTION
  • 6.4.2 KEY TARIFF RATES
  • 6.4.3 PRICE IMPACT ANALYSIS
  • 6.4.4 IMPACT ON REGION
    • 6.4.4.1 North America
    • 6.4.4.2 Europe
    • 6.4.4.3 Asia Pacific
  • 6.4.5 IMPACT ON END-USE INDUSTRY
• 6.5 INVESTMENT LANDSCAPE AND FUNDING SCENARIO
• 6.6 PRICING ANALYSIS
  • 6.6.1 AVERAGE SELLING PRICE TREND OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY REGION, 2021-2024
  • 6.6.2 AVERAGE SELLING PRICE TREND OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL, 2021-2024
  • 6.6.3 AVERAGE SELLING PRICE TREND OF SEMICONDUCTOR CERAMIC PACKAGING MATERIALS, BY KEY PLAYER, 2024
• 6.7 ECOSYSTEM ANALYSIS
• 6.8 TECHNOLOGY ANALYSIS
  • 6.8.1 KEY TECHNOLOGIES
  • 6.8.2 COMPLEMENTARY TECHNOLOGIES
  • 6.8.3 ADJACENT TECHNOLOGIES
• 6.9 PATENT ANALYSIS
  • 6.9.1 METHODOLOGY
  • 6.9.2 PATENTS GRANTED WORLDWIDE, 2015-2024
    • 6.9.2.1 Patent publication trends
  • 6.9.3 INSIGHTS
  • 6.9.4 LEGAL STATUS OF PATENTS
  • 6.9.5 JURISDICTION ANALYSIS
  • 6.9.6 TOP APPLICANTS
  • 6.9.7 LIST OF MAJOR PATENTS
• 6.10 TRADE ANALYSIS
  • 6.10.1 IMPORT SCENARIO (HS CODE 85419000)
  • 6.10.2 EXPORT SCENARIO (HS CODE 85419000)
• 6.11 KEY CONFERENCES AND EVENTS, 2026-2027
• 6.12 TARIFF AND REGULATORY LANDSCAPE
  • 6.12.1 TARIFF ANALYSIS
• 6.13 STANDARDS AND REGULATORY LANDSCAPE
  • 6.13.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • 6.13.2 STANDARDS
• 6.14 PORTER'S FIVE FORCES ANALYSIS
  • 6.14.1 THREAT OF NEW ENTRANTS
  • 6.14.2 THREAT OF SUBSTITUTES
  • 6.14.3 BARGAINING POWER OF SUPPLIERS
  • 6.14.4 BARGAINING POWER OF BUYERS
  • 6.14.5 INTENSITY OF COMPETITIVE RIVALRY
• 6.15 KEY STAKEHOLDERS AND BUYING CRITERIA
  • 6.15.1 KEY STAKEHOLDERS IN BUYING PROCESS
  • 6.15.2 BUYING CRITERIA
• 6.16 MACROECONOMIC OUTLOOK
  • 6.16.1 GDP TRENDS AND FORECASTS OF MAJOR ECONOMIES
• 6.17 CASE STUDY ANALYSIS
  • 6.17.1 LOW THERMAL RESISTANCE PACKAGING FOR HIGH POWER ELECTRONICS
  • 6.17.2 EFFECTS OF BETA-SI3N4 SEEDS ON MICROSTRUCTURE AND PERFORMANCE OF SI3N4 CERAMICS IN SEMICONDUCTOR PACKAGE
  • 6.17.3 PREPARATION OF DIAMOND FILM SUBSTRATES ON ALN CERAMIC AND THEIR PERFORMANCE IN LED PACKAGING

7 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY MATERIAL

• 7.1 INTRODUCTION
• 7.2 ALUMINA
  • 7.2.1 HIGH-TEMPERATURE PERFORMANCE IN SEMICONDUCTOR DEVICES TO DRIVE DEMAND
• 7.3 ALUMINUM NITRIDE
  • 7.3.1 SUPERIOR THERMAL AND ELECTRICAL PROPERTIES TO DRIVE MARKET
• 7.4 SILICON NITRIDE
  • 7.4.1 HIGH MECHANICAL STRENGTH AND THERMAL SHOCK RESILIENCE TO DRIVE DEMAND
• 7.5 SILICON CARBIDE
  • 7.5.1 MATERIAL ADVANCEMENTS TO DRIVE HIGH DENSITY AND THERMALLY STABLE CHIP PACKAGING
• 7.6 BERYLLIUM OXIDE
  • 7.6.1 EFFICIENT HEAT DISSIPATION TO DRIVE NEXT-GENERATION HIGH-POWER PACKAGE DESIGNS
• 7.7 OTHER MATERIALS
  • 7.7.1 BORON NITRIDE
  • 7.7.2 ZIRCONIA

8 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY

• 8.1 INTRODUCTION
• 8.2 THROUGH-HOLE PACKAGES
  • 8.2.1 ENHANCED DEVICE DURABILITY AND THERMAL PERFORMANCE TO DRIVE DEMAND
• 8.3 SURFACE MOUNT PACKAGES - LEADED
  • 8.3.1 EFFICIENT ASSEMBLY AND RELIABLE PERFORMANCE TO DRIVE DEMAND
• 8.4 SURFACE MOUNT PACKAGES - LEADLESS
  • 8.4.1 SUPERIOR ELECTRICAL PERFORMANCE AND EFFICIENT MANUFACTURING TO DRIVE DEMAND
• 8.5 ADVANCED MINIATURIZED PACKAGES
  • 8.5.1 HIGH-PERFORMANCE INTEGRATION AND EFFICIENT CONNECTIVITY TO DRIVE MARKET
• 8.6 OTHER PACKAGING TECHNOLOGIES
  • 8.6.1 FLIP-CHIP CERAMIC PACKAGES
  • 8.6.2 MULTI-CHIP MODULES

9 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY

• 9.1 INTRODUCTION
• 9.2 CONSUMER ELECTRONICS
  • 9.2.1 INCREASE IN ADVANCED CERAMIC PACKAGING ADOPTION FOR HIGH-PERFORMANCE, RELIABLE DEVICES
• 9.3 AUTOMOTIVE
  • 9.3.1 RISE IN VEHICLE PRODUCTION TO DRIVE MARKET
• 9.4 HEALTHCARE
  • 9.4.1 EXPANSION OF HEALTHCARE MARKETS TO DRIVE DEMAND FOR HIGH-PERFORMANCE PACKAGING MATERIALS
• 9.5 IT & TELECOMMUNICATION
  • 9.5.1 5G AND DIGITAL INFRASTRUCTURE EXPANSION TO DRIVE DEMAND
• 9.6 AEROSPACE & DEFENSE
  • 9.6.1 NEXT-GENERATION AEROSPACE TECHNOLOGIES TO DRIVE HIGH-PERFORMANCE PACKAGING ADOPTION
• 9.7 OTHER END-USE INDUSTRIES
  • 9.7.1 RAIL & TRANSPORTATION
  • 9.7.2 RENEWABLE ENERGY

10 SEMICONDUCTOR CERAMIC PACKAGING MATERIALS MARKET, BY REGION

• 10.1 INTRODUCTION
• 10.2 ASIA PACIFIC
  • 10.2.1 CHINA
    • 10.2.1.1 Rapid growth of 5G infrastructure and consumer electronics market
  • 10.2.2 JAPAN
    • 10.2.2.1 Continuous investment in R&D for semiconductor packaging materials
  • 10.2.3 INDIA
    • 10.2.3.1 Government incentives through India Semiconductor Mission
  • 10.2.4 SOUTH KOREA
    • 10.2.4.1 Presence of major semiconductor manufacturers like Samsung and SK hynix
  • 10.2.5 TAIWAN
    • 10.2.5.1 Leadership in semiconductor manufacturing
  • 10.2.6 REST OF ASIA PACIFIC
• 10.3 NORTH AMERICA
  • 10.3.1 US
    • 10.3.1.1 Strong semiconductor, aerospace, and defense industries
  • 10.3.2 CANADA
    • 10.3.2.1 Expansion of technology infrastructure
  • 10.3.3 MEXICO
    • 10.3.3.1 Emergence as manufacturing hub to drive demand
• 10.4 EUROPE
  • 10.4.1 GERMANY
    • 10.4.1.1 Growth in automotive manufacturing and ADAS integration
  • 10.4.2 ITALY
    • 10.4.2.1 Industrial automation and IoT electronics growth
  • 10.4.3 FRANCE
    • 10.4.3.1 High investment in medical electronics demanding hermetic ceramic packages
  • 10.4.4 UK
    • 10.4.4.1 Government initiatives for semiconductor sovereignty
  • 10.4.5 SPAIN
    • 10.4.5.1 Support for local semiconductor and electronics production
  • 10.4.6 REST OF EUROPE
• 10.5 MIDDLE EAST & AFRICA
  • 10.5.1 GCC COUNTRIES
    • 10.5.1.1 Saudi Arabia
      • 10.5.1.1.1 Saudi Arabia's Vision 2030 spurs investment
    • 10.5.1.2 UAE
      • 10.5.1.2.1 National Strategy for Advanced Industries (Operation 300bn)
    • 10.5.1.3 Rest of GCC countries
    • 10.5.1.4 South Africa
      • 10.5.1.4.1 Expansion in automotive component manufacturing
    • 10.5.1.5 Rest of Middle East & Africa
• 10.6 SOUTH AMERICA
  • 10.6.1 ARGENTINA
    • 10.6.1.1 Industrial modernization and import substitution
  • 10.6.2 BRAZIL
    • 10.6.2.1 Growing industrial and consumer electronics production
  • 10.6.3 REST OF SOUTH AMERICA

11 COMPETITIVE LANDSCAPE

• 11.1 INTRODUCTION
• 11.2 KEY PLAYER STRATEGIES/RIGHT TO WIN
• 11.3 MARKET SHARE ANALYSIS, 2024
• 11.4 REVENUE ANALYSIS, 2021-2024
• 11.5 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2024
  • 11.5.1 STARS
  • 11.5.2 EMERGING LEADERS
  • 11.5.3 PERVASIVE PLAYERS
  • 11.5.4 PARTICIPANTS
  • 11.5.5 COMPANY FOOTPRINT: KEY PLAYERS, 2024
    • 11.5.5.1 Company footprint
    • 11.5.5.2 Region footprint
    • 11.5.5.3 Material footprint
    • 11.5.5.4 Packaging technology footprint
    • 11.5.5.5 End-use industry footprint
• 11.6 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2024
  • 11.6.1 PROGRESSIVE COMPANIES
  • 11.6.2 RESPONSIVE COMPANIES
  • 11.6.3 DYNAMIC COMPANIES
  • 11.6.4 STARTING BLOCKS
  • 11.6.5 COMPETITIVE BENCHMARKING
    • 11.6.5.1 Detailed list of key startups/SMEs
    • 11.6.5.2 Competitive benchmarking of key startups/SMEs
• 11.7 BRAND/PRODUCT COMPARISON
• 11.8 COMPANY VALUATION AND FINANCIAL METRICS
• 11.9 COMPETITIVE SCENARIO AND TRENDS
  • 11.9.1 DEALS
  • 11.9.2 EXPANSIONS
  • 11.9.3 OTHER DEVELOPMENTS

12 COMPANY PROFILES

• 12.1 KEY PLAYERS
  • 12.1.1 KYOCERA CORPORATION
    • 12.1.1.1 Business overview
    • 12.1.1.2 Products/Solutions/Services offered
    • 12.1.1.3 Recent developments
      • 12.1.1.3.1 Deals
      • 12.1.1.3.2 Expansions
    • 12.1.1.4 MnM view
      • 12.1.1.4.1 Key strengths
      • 12.1.1.4.2 Strategic choices
      • 12.1.1.4.3 Weaknesses and competitive threats
  • 12.1.2 CERAMTEC GMBH
    • 12.1.2.1 Business overview
    • 12.1.2.2 Products/Solutions/Services offered
    • 12.1.2.3 MnM view
      • 12.1.2.3.1 Key strengths
      • 12.1.2.3.2 Strategic choices
      • 12.1.2.3.3 Weaknesses and competitive threats
  • 12.1.3 COORSTEK
    • 12.1.3.1 Business overview
    • 12.1.3.2 Products/Solutions/Services offered
    • 12.1.3.3 Recent developments
      • 12.1.3.3.1 Others
    • 12.1.3.4 MnM view
      • 12.1.3.4.1 Key strengths
      • 12.1.3.4.2 Strategic choices
      • 12.1.3.4.3 Weaknesses and competitive threats
  • 12.1.4 MORGAN ADVANCED MATERIALS
    • 12.1.4.1 Business overview
    • 12.1.4.2 Products/Solutions/Services offered
    • 12.1.4.3 Recent developments
      • 12.1.4.3.1 Others
    • 12.1.4.4 MnM view
      • 12.1.4.4.1 Key strengths
      • 12.1.4.4.2 Strategic choices
      • 12.1.4.4.3 Weaknesses and competitive threats
  • 12.1.5 NGK INSULATORS, LTD.
    • 12.1.5.1 Business overview
    • 12.1.5.2 Products/Solutions/Services offered
    • 12.1.5.3 MnM view
      • 12.1.5.3.1 Key strengths
      • 12.1.5.3.2 Strategic choices
      • 12.1.5.3.3 Weaknesses and competitive threats
  • 12.1.6 MARUWA CO., LTD.
    • 12.1.6.1 Business overview
    • 12.1.6.2 Products/Solutions/Services offered
    • 12.1.6.3 MnM view
      • 12.1.6.3.1 Key strengths
      • 12.1.6.3.2 Strategic choices
      • 12.1.6.3.3 Weaknesses and competitive threats
  • 12.1.7 AGC INC.
    • 12.1.7.1 Business overview
    • 12.1.7.2 Products/Solutions/Services offered
    • 12.1.7.3 Recent developments
      • 12.1.7.3.1 Others
    • 12.1.7.4 MnM view
      • 12.1.7.4.1 Key strengths
      • 12.1.7.4.2 Strategic choices
      • 12.1.7.4.3 Weaknesses and competitive threats
  • 12.1.8 MATERION CORPORATION
    • 12.1.8.1 Business overview
    • 12.1.8.2 Products/Solutions/Services offered
    • 12.1.8.3 MnM view
      • 12.1.8.3.1 Key strengths
      • 12.1.8.3.2 Strategic choices
      • 12.1.8.3.3 Weaknesses and competitive threats
  • 12.1.9 TOKUYAMA CORPORATION
    • 12.1.9.1 Business overview
    • 12.1.9.2 Products/Solutions/Services offered
    • 12.1.9.3 Recent developments
      • 12.1.9.3.1 Expansions
    • 12.1.9.4 MnM view
      • 12.1.9.4.1 Key strengths
      • 12.1.9.4.2 Strategic choices
      • 12.1.9.4.3 Weaknesses and competitive threats
  • 12.1.10 FERROTEC CORPORATION
    • 12.1.10.1 Business overview
    • 12.1.10.2 Products/Solutions/Services offered
    • 12.1.10.3 Recent developments
      • 12.1.10.3.1 Expansions
    • 12.1.10.4 MnM view
      • 12.1.10.4.1 Key strengths
      • 12.1.10.4.2 Strategic choices
      • 12.1.10.4.3 Weaknesses and competitive threats
• 12.2 OTHER PLAYERS
  • 12.2.1 GREAT CERAMIC
  • 12.2.2 ADTECH CERAMICS
  • 12.2.3 XIAMEN MASCERA TECHNOLOGY CO., LTD.
  • 12.2.4 ORTECH, INC.
  • 12.2.5 ADVANCED CERAMIC MATERIALS
  • 12.2.6 STC MATERIAL SOLUTIONS
  • 12.2.7 NISHIMURA ADVANCED CERAMICS CO., LTD.
  • 12.2.8 JAPAN FINE CERAMICS CO., LTD.
  • 12.2.9 WUXI SPECIAL CERAMIC ELECTRICAL CO., LTD.
  • 12.2.10 JINGHUI INDUSTRY LTD.
  • 12.2.11 FUJIAN HUAQING ELECTRONIC MATERIAL TECHNOLOGY CO., LTD.
  • 12.2.12 HEBEI SUOYI NEW MATERIAL TECHNOLOGY CO., LTD.
  • 12.2.13 NTK CERATEC CO., LTD.
  • 12.2.14 XIAMEN INNOVACERA ADVANCED MATERIALS CO., LTD
  • 12.2.15 XIAMEN FINE CERAMICS TECHNOLOGY CO., LTD.

13 APPENDIX

• 13.1 DISCUSSION GUIDE
• 13.2 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
• 13.3 CUSTOMIZATION OPTIONS
• 13.4 RELATED REPORTS
• 13.5 AUTHOR DETAILS