세계의 BTB(Board-to-board) 커넥터 시장 : 유형별, 커넥터 유형별, 피치별, 마운팅 방식별, 용도별, 최종사용자별, 지역별 - 예측(-2030년)

The global board-to-board connector market is anticipated to reach USD 12.42 billion in 2025 and USD 16.05 billion by 2030, exhibiting a CAGR of 5.3% during the forecast period. The increasing demand for industrial automation and robotics fuels the market growth as factories and production systems adopt more innovative, interconnected technologies. These connectors are crucial in enabling the reliable transmission of data, power, and signals between control units, sensors, and robotic components.

As industries transition to Industry 4.0, there is a growing demand for compact, vibration-resistant, and high-speed connectors that can withstand harsh operating environments. Robots, programmable logic controllers (PLCs), and automated machinery rely on these connectors for precision and efficiency, driving continuous adoption across manufacturing, logistics, and process automation sectors.

"1 mm to 2 mm segment is expected to hold the largest market share in 2030."

The 1 mm to 2 mm pitch segment in the board-to-board connector market is expected to dominate due to its optimal balance between miniaturization, signal integrity, and mechanical reliability. This pitch range is widely adopted in consumer electronics, industrial automation, and automotive applications where compact designs are critical without compromising electrical performance. Smaller pitches below 1 mm often face challenges in handling high current and ensuring durability, while larger pitches above 2 mm occupy more space and limit device miniaturization. The 1-2 mm range supports high-speed data transmission and reliable power delivery, making it suitable for advanced devices like IoT modules, wearables, and automotive control units. Additionally, manufacturers prefer this segment because it offers easier assembly, lower manufacturing complexity, and broad compatibility with existing PCB layouts. These factors collectively make the 1-2 mm segment the preferred choice for balancing performance, size, and cost efficiency across multiple industries.

"Automotive segment to grow at the fastest rate during the forecast period. "

The automotive segment is projected to grow the fastest in the board-to-board connector market due to the rapid adoption of electric vehicles (EVs), autonomous driving technologies, and advanced infotainment systems. Modern cars rely on numerous electronic control units (ECUs), sensors, and battery management systems that require compact, high-reliability connectors to ensure seamless power and data transmission. The shift toward connected and smart vehicles further boosts the demand for high-speed, vibration-resistant connectors that can withstand harsh automotive environments. Additionally, the growing investment in vehicle electrification, ADAS, and in-vehicle connectivity continues to drive the need for advanced board-to-board connector solutions in the automotive industry.

"US is expected to hold a significant market share in North America during the forecast period."

The US dominates the board-to-board connector market in North America due to its strong presence of leading manufacturers in the automotive, aerospace, defense, and electronics sectors. The country's advanced technological infrastructure and high adoption of automation, 5G, and IoT-enabled systems drive significant demand for reliable, high-speed interconnect solutions. Major players, such as TE Connectivity and Molex, have extensive operations and R&D facilities in the US, supporting innovation and large-scale production. Additionally, the growing use of electric vehicles, data centers, and industrial robotics further strengthens the US market position, making it the primary hub for board-to-board connector demand and development in North America.

In-depth interviews have been conducted with chief executive officers (CEOs), directors, and other executives from various key organizations operating in the board-to-board connector marketplace.

• By Company Type: Tier 1 - 40%, Tier 2 - 35%, and Tier 3 - 25%
• By Designation: C-level Executives - 45%, Directors - 35%, and Others - 20%
• By Region: North America - 45%, Europe - 25%, Asia Pacific - 20%, and RoW - 10%

The study includes an in-depth competitive analysis of these key players in the board-to-board connector market, with their company profiles, recent developments, and key market strategies.

Research Coverage

This research report categorizes the board-to-board connector market by type, connector type, pitch, mounting type, application, end user, and region (North America, Europe, Asia Pacific, RoW). The report provides detailed information on the significant factors influencing market growth, including drivers, restraints, challenges, and opportunities. A thorough analysis of the key industry players has provided insights into their business overview, solutions and services, key strategies, contracts, partnerships, and agreements. Product and service launches, acquisitions, and recent developments associated with the market. This report covers a competitive analysis of upcoming startups in the board-to-board connector ecosystem.

Reasons to Buy This Report

The report will assist market leaders and new entrants with information on the closest approximations of revenue numbers for the board-to-board connector market and its subsegments. It will also help stakeholders understand the competitive landscape and gain more insights to position their businesses better and plan suitable go-to-market strategies. The report also helps stakeholders understand the market pulse and provides information on key market drivers, restraints, challenges, and opportunities.

The report provides insights into the following pointers:

• Analysis of key drivers (expansion of 5G networks and high-speed data communication, increasing focus on industrial automation and robotics, rising deployment of Internet of Things devices), restraints (technological complexities associated with developing application-specific board-to-board connectors, environmental and regulatory compliance), opportunities (expansion of electric vehicles, increasing demand for rugged connectors), and challenges (signal integrity and high-speed data transmission, cost optimization and pricing pressure) influencing the growth of the board-to-board connector market.
• Product Development/Innovation: Detailed insights on upcoming technologies, research and development activities, and product launches in the board-to-board connector market
• Market Development: Comprehensive information about lucrative markets with an analysis of the board-to-board connector market across varied regions
• Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the board-to-board connector market
• Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players in the board-to-board connector market, such as TE Connectivity (Ireland), Amphenol Corporation (US), Hirose Electric Co. Ltd. (Japan), Molex (US), and Japan Aviation Electronics Industry, Ltd (Japan)

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 STUDY OBJECTIVES
• 1.2 MARKET DEFINITION
• 1.3 STUDY SCOPE
  • 1.3.1 MARKETS COVERED AND REGIONAL SCOPE
  • 1.3.2 INCLUSIONS AND EXCLUSIONS
  • 1.3.3 YEARS CONSIDERED
• 1.4 CURRENCY CONSIDERED
• 1.5 UNIT CONSIDERED
• 1.6 LIMITATIONS
• 1.7 STAKEHOLDERS
• 1.8 SUMMARY OF CHANGES

2 EXECUTIVE SUMMARY

• 2.1 MARKET HIGHLIGHTS AND KEY INSIGHTS
• 2.2 KEY MARKET PARTICIPANTS: MAPPING OF STRATEGIC DEVELOPMENTS
• 2.3 DISRUPTIVE TRENDS IN BOARD-TO-BOARD CONNECTOR MARKET
• 2.4 HIGH-GROWTH SEGMENTS
• 2.5 REGIONAL SNAPSHOT: MARKET SIZE, GROWTH RATE, AND FORECAST

3 PREMIUM INSIGHTS

• 3.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN BOARD-TO-BOARD CONNECTOR MARKET
• 3.2 BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE
• 3.3 BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH
• 3.4 BOARD-TO-BOARD CONNECTOR MARKET, BY END USER AND REGION
• 3.5 BOARD-TO-BOARD CONNECTOR MARKET, BY GEOGRAPHY

4 MARKET OVERVIEW

• 4.1 INTRODUCTION
• 4.2 MARKET DYNAMICS
  • 4.2.1 DRIVERS
    • 4.2.1.1 Rapid expansion of 5G networks and escalated demand for high-speed data communication
    • 4.2.1.2 Significant demand for industrial automation and robotics
    • 4.2.1.3 Elevated adoption of IoT devices
  • 4.2.2 RESTRAINTS
    • 4.2.2.1 Technological complexities in developing application-specific connectors
    • 4.2.2.2 High cost of environmental compliance
  • 4.2.3 OPPORTUNITIES
    • 4.2.3.1 Rising adoption of electric vehicles
    • 4.2.3.2 Increasing demand for rugged, durable, and field-reliable electronics and heavy-duty machinery
  • 4.2.4 CHALLENGES
    • 4.2.4.1 Signal integrity and high-speed data transmission challenges
    • 4.2.4.2 Cost optimization and pricing pressure
• 4.3 INTERCONNECTED MARKETS AND CROSS-SECTOR OPPORTUNITIES
• 4.4 STRATEGIC MOVES BY TIER-1/2/3 PLAYERS

5 INDUSTRY TRENDS

• 5.1 PORTER'S FIVE FORCES ANALYSIS
  • 5.1.1 INTENSITY OF COMPETITIVE RIVALRY
  • 5.1.2 BARGAINING POWER OF SUPPLIERS
  • 5.1.3 BARGAINING POWER OF BUYERS
  • 5.1.4 THREAT OF SUBSTITUTES
  • 5.1.5 THREAT OF NEW ENTRANTS
• 5.2 MACROECONOMICS OUTLOOK
  • 5.2.1 INTRODUCTION
  • 5.2.2 GDP TRENDS AND FORECAST
  • 5.2.3 TRENDS IN GLOBAL CONSUMER ELECTRONICS INDUSTRY
  • 5.2.4 TRENDS IN AUTOMOTIVE INDUSTRY
• 5.3 VALUE CHAIN ANALYSIS
• 5.4 ECOSYSTEM ANALYSIS
• 5.5 PRICING ANALYSIS
  • 5.5.1 PRICING RANGE OF BOARD-TO-BOARD CONNECTORS OFFERED BY KEY PLAYERS, BY PITCH, 2024
  • 5.5.2 AVERAGE SELLING PRICE TREND OF BOARD-TO-BOARD CONNECTORS, BY PITCH, 2020-2024
  • 5.5.3 AVERAGE SELLING PRICE TREND OF BOARD-TO-BOARD CONNECTORS, BY REGION, 2020-2024
• 5.6 TRADE ANALYSIS
  • 5.6.1 IMPORT SCENARIO (HS CODE 8536)
  • 5.6.2 EXPORT SCENARIO (HS CODE 8536)
• 5.7 KEY CONFERENCES AND EVENTS, 2026-2027
• 5.8 TARIFF ANALYSIS
• 5.9 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
• 5.10 INVESTMENT AND FUNDING SCENARIO
• 5.11 CASE STUDY ANALYSIS
  • 5.11.1 AUTOMOBILE MANUFACTURER ACHIEVES RELIABLE HIGH-SPEED COMMUNICATION BETWEEN ECUS USING BOARD-TO-BOARD CONNECTORS FROM JAE
  • 5.11.2 GCT DELIVERS GROUND-FIRST CONNECTOR SOLUTION FOR ENHANCED SYSTEM PROTECTION
  • 5.11.3 GCT DEVELOPS CUSTOMIZED PIN HEADER INSULATOR TO IMPROVE PCB ASSEMBLY ACCURACY
• 5.12 IMPACT OF 2025 US TARIFF ON BOARD-TO-BOARD CONNECTOR MARKET
  • 5.12.1 INTRODUCTION
  • 5.12.2 KEY TARIFF RATES
  • 5.12.3 PRICE IMPACT ANALYSIS
  • 5.12.4 IMPACT ON COUNTRIES/REGIONS
    • 5.12.4.1 US
    • 5.12.4.2 Europe
    • 5.12.4.3 Asia Pacific
  • 5.12.5 IMPACT ON END USERS

6 TECHNOLOGICAL ADVANCEMENTS, AI-DRIVEN IMPACT, PATENTS, AND INNOVATIONS

• 6.1 KEY EMERGING TECHNOLOGIES
  • 6.1.1 HIGH-SPEED DATA TRANSMISSION
  • 6.1.2 SURFACE-MOUNT TECHNOLOGY
• 6.2 COMPLEMENTARY TECHNOLOGIES
  • 6.2.1 CONNECTOR LOCKING AND LATCHING MECHANISM
  • 6.2.2 ELECTROMAGNETIC INTERFERENCE/RADIO FREQUENCY INTERFERENCE SHIELDING AND FILTERING
• 6.3 ADJACENT TECHNOLOGIES
  • 6.3.1 POWER DELIVERY AND MANAGEMENT
• 6.4 TECHNOLOGY/PRODUCT ROADMAP
  • 6.4.1 MID-TERM EVOLUTION (2027-2030): HIGH-SPEED & HYBRID ARCHITECTURES
  • 6.4.2 LONG-TERM OUTLOOK (2025-2035+): INTELLIGENT, ULTRA-MINIATURE & SUSTAINABLE SYSTEMS
• 6.5 PATENT ANALYSIS
• 6.6 IMPACT OF AI ON BOARD-TO-BOARD CONNECTOR MARKET
  • 6.6.1 TOP USE CASES AND MARKET POTENTIAL
  • 6.6.2 BEST PRACTICES FOLLOWED BY COMPANIES IN BOARD-TO-BOARD CONNECTOR MARKET
  • 6.6.3 CASE STUDIES RELATED TO AI IMPLEMENTATION IN BOARD-TO-BOARD CONNECTOR MARKET
  • 6.6.4 INTERCONNECTED/ADJACENT ECOSYSTEM AND IMPACT ON MARKET PLAYERS
  • 6.6.5 CLIENTS' READINESS TO ADOPT AI IN BOARD-TO-BOARD CONNECTOR MANUFACTURING

7 REGULATORY LANDSCAPE

• 7.1 REGIONAL REGULATIONS AND COMPLIANCE
  • 7.1.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • 7.1.2 INDUSTRY STANDARDS

8 CUSTOMER LANDSCAPE AND BUYER BEHAVIOR

• 8.1 DECISION-MAKING PROCESS
• 8.2 KEY STAKEHOLDERS AND BUYING CRITERIA
  • 8.2.1 KEY STAKEHOLDERS IN BUYING PROCESS
  • 8.2.2 BUYING CRITERIA
• 8.3 ADOPTION BARRIERS AND INTERNAL CHALLENGES
• 8.4 UNMET NEEDS OF VARIOUS END USERS

9 INNOVATION TRENDS IN BOARD-TO-BOARD TO CONNECTORS

• 9.1 INTRODUCTION
• 9.2 SHIFT TO HYBRID CONNECTORS
• 9.3 INTEGRATION WITH AI AND EDGE COMPUTING HARDWARE
• 9.4 DEVELOPMENT OF EMI-SHIELDED AND HIGH-SPEED CONNECTOR SOLUTIONS
• 9.5 MINIATURIZATION AND DEMAND FOR FINE-PITCH CONNECTORS
• 9.6 ADVANCEMENTS IN AUTOMATED TESTING AND INSPECTION DURING MANUFACTURING

10 BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE

• 10.1 INTRODUCTION
• 10.2 MALE CONNECTORS
  • 10.2.1 STACKED HEADERS
    • 10.2.1.1 Strong focus on designing compact and high-density devices to spike demand
  • 10.2.2 SHROUDED HEADERS
    • 10.2.2.1 Pressing need for secure, robust, and error-proof connections between boards and cables to foster segmental growth
• 10.3 SOCKETS
  • 10.3.1 INCREASING DEMAND FOR MULTI-BOARD ARCHITECTURES TO CREATE OPPORTUNITIES

11 BOARD-TO-BOARD CONNECTOR MARKET, BY CONNECTOR TYPE

• 11.1 INTRODUCTION
• 11.2 MEZZANINE CONNECTORS
  • 11.2.1 INCREASING DEMAND FOR COMPACT CONSUMER ELECTRONICS TO FUEL SEGMENTAL GROWTH
• 11.3 BACKPLANE CONNECTORS
  • 11.3.1 SURGING NEED FOR FASTER DATA TRANSMISSION TO STIMULATE SEGMENTAL GROWTH
• 11.4 OTHER CONNECTOR TYPES

12 BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH

• 12.1 INTRODUCTION
• 12.2 LESS THAN 1 MM
  • 12.2.1 0.80 MM
    • 12.2.1.1 Rising demand for ultra-compact electronics to support segmental growth
  • 12.2.2 0.65 MM
    • 12.2.2.1 Ongoing requirement for ultra-fine pitch connectors, maintaining signal integrity and mechanical stability to drive market
  • 12.2.3 OTHER FINE PITCH CATEGORIES
• 12.3 1 TO 2 MM
  • 12.3.1 1.00 MM
    • 12.3.1.1 Shrinking size of electronic devices to create growth opportunities
  • 12.3.2 1.27 MM
    • 12.3.2.1 Growing demand for high mechanical reliability in harsh environments to support segmental growth
  • 12.3.3 1.50 MM
    • 12.3.3.1 Excellence in balancing high current capacity with efficient space utilization to facilitate market growth
  • 12.3.4 2.00 MM
    • 12.3.4.1 Wide use in industrial, transportation, and aerospace applications to contribute to market growth
• 12.4 GREATER THAN 2 MM
  • 12.4.1 2.54 MM
    • 12.4.1.1 Elevating demand for industrial automation, power electronics, and rugged embedded systems to favor segmental growth
  • 12.4.2 3.00 MM
    • 12.4.2.1 Superior resistance to vibration and thermal stress to stimulate demand
  • 12.4.3 OTHER STANDARD PITCH CATEGORIES

13 BOARD-TO-BOARD CONNECTOR MARKET, BY MOUNTING TYPE

• 13.1 INTRODUCTION
• 13.2 SURFACE-MOUNT
  • 13.2.1 ABILITY TO SUPPORT HIGH-FREQUENCY SIGNALS AND DENSE CIRCUITRY TO BOOST DEMAND
• 13.3 THROUGH-HOLE
  • 13.3.1 RISING USE IN INDUSTRIAL EQUIPMENT, POWER SUPPLIES, AND MILITARY ELECTRONICS TO CONTRIBUTE TO MARKET GROWTH
• 13.4 PRESS-FIT
  • 13.4.1 POTENTIAL TO HANDLE HIGH CURRENTS AND FREQUENT MECHANICAL STRESS TO ACCELERATE DEMAND
• 13.5 HYBRID
  • 13.5.1 RISING DEMAND FOR HIGH-PERFORMANCE ELECTRONICS IN SPACE-CONSTRAINED ENVIRONMENTS TO PROPEL MARKET

14 BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION

• 14.1 INTRODUCTION
• 14.2 SIGNAL TRANSMISSION
  • 14.2.1 HIGH-SPEED/HIGH-FREQUENCY
    • 14.2.1.1 Escalating demand for high-performance computing to fuel market growth
  • 14.2.2 MIXED SIGNAL
    • 14.2.2.1 Growing need for compact multifunctional interconnects in industrial automation to fuel market growth
• 14.3 POWER DELIVERY
  • 14.3.1 ABILITY TO ENSURE STABLE POWER FLOW EVEN IN COMPACT ASSEMBLIES TO BOOST DEMAND
• 14.4 DATA COMMUNICATION
  • 14.4.1 GROWING INCLINATION TOWARD 5G, IOT, AND EDGE COMPUTING TO SPUR DEMAND

15 BOARD-TO-BOARD CONNECTOR MARKET, BY END USER

• 15.1 INTRODUCTION
• 15.2 CONSUMER ELECTRONICS
  • 15.2.1 RISING ADOPTION OF ULTRA-THIN AND COMPACT DEVICE DESIGNS TO SUPPORT MARKET GROWTH
• 15.3 INDUSTRIAL AUTOMATION
  • 15.3.1 ROBOTICS
    • 15.3.1.1 Rapid integration of smart sensors and AI-based control systems to drive market
  • 15.3.2 HUMANOID
    • 15.3.2.1 Increasing use of intelligent robots in logistics applications to fuel market growth
  • 15.3.3 FACTORY CONTROL SYSTEMS
    • 15.3.3.1 Transition toward connected automation to fuel growth
  • 15.3.4 INDUSTRIAL IOT DEVICES
    • 15.3.4.1 Expansion of smart factories to expedite market growth
• 15.4 TELECOMMUNICATIONS
  • 15.4.1 GLOBAL EXPANSION OF 5G NETWORKS TO SUPPORT MARKET GROWTH
• 15.5 AUTOMOTIVE
  • 15.5.1 INTERNAL COMBUSTION ENGINES
    • 15.5.1.1 Need for efficient communication and power distribution across complex powertrain architectures to drive market
  • 15.5.2 ELECTRIC VEHICLES
    • 15.5.2.1 Shift toward integrated electronic architectures to create growth opportunities
  • 15.5.3 SELF-DRIVING VEHICLES
    • 15.5.3.1 Surging adoption of autonomous driving technologies to boost demand
• 15.6 HEALTHCARE
  • 15.6.1 PRESSING NEED FOR PORTABILITY, CONNECTIVITY, AND REAL-TIME DATA HANDLING TO ACCELERATE MARKET GROWTH
• 15.7 AEROSPACE & DEFENSE
  • 15.7.1 AIRCRAFT
    • 15.7.1.1 Focus on simplifying wiring, reducing aircraft weight, and ensuring high performance to drive demand
  • 15.7.2 DRONES
    • 15.7.2.1 Increasing demand for autonomous and long-endurance drones to foster market growth
  • 15.7.3 WEAPONS & ELECTRONIC WARFARE SYSTEMS
    • 15.7.3.1 Surging demand for advanced and mechanically robust electronic warfare systems to stimulate market growth
  • 15.7.4 OTHER AEROSPACE & DEFENSE APPLICATIONS
• 15.8 OTHER END USERS

16 BOARD-TO-BOARD CONNECTOR MARKET, BY REGION

• 16.1 INTRODUCTION
• 16.2 NORTH AMERICA
  • 16.2.1 US
    • 16.2.1.1 Surging demand for cloud services with integration of AI models to accelerate market growth
  • 16.2.2 CANADA
    • 16.2.2.1 Evolving industrial and electronics landscape to create growth opportunities
  • 16.2.3 MEXICO
    • 16.2.3.1 Expansion of production facilities to boost demand
• 16.3 EUROPE
  • 16.3.1 GERMANY
    • 16.3.1.1 Growing focus of industrial sector on smart manufacturing to support market growth
  • 16.3.2 UK
    • 16.3.2.1 Increasing investments in data centers to foster market growth
  • 16.3.3 FRANCE
    • 16.3.3.1 Significant focus on expanding semiconductor packaging and electronic manufacturing capacity to boost demand
  • 16.3.4 ITALY
    • 16.3.4.1 Modernization of railway networks and industrial electronics to spur demand
  • 16.3.5 SPAIN
    • 16.3.5.1 Strong focus on strengthening domestic electronics manufacturing base to create opportunities
  • 16.3.6 NORDICS
    • 16.3.6.1 Rapid expansion of 5G and telecom infrastructure to accelerate demand
  • 16.3.7 REST OF EUROPE
• 16.4 ASIA PACIFIC
  • 16.4.1 CHINA
    • 16.4.1.1 Expansion of electronics and electric vehicle manufacturing ecosystem to expedite market growth
  • 16.4.2 JAPAN
    • 16.4.2.1 Strong focus of electronics manufacturers on miniaturization and precision engineering to support market growth
  • 16.4.3 SOUTH KOREA
    • 16.4.3.1 Rapid expansion of 5G and semiconductor ecosystem to facilitate demand
  • 16.4.4 INDIA
    • 16.4.4.1 Booming electronics manufacturing industry to contribute to market growth
  • 16.4.5 AUSTRALIA
    • 16.4.5.1 Ongoing renewable energy and smart grid infrastructure projects to drive market
  • 16.4.6 INDONESIA
    • 16.4.6.1 Growing inclination toward industrial automation to surge demand
  • 16.4.7 MALAYSIA
    • 16.4.7.1 Increasing investments in advanced packaging, automotive electronics, and smart devices to create opportunities
  • 16.4.8 THAILAND
    • 16.4.8.1 Growing emphasis on smart manufacturing to expedite demand
  • 16.4.9 VIETNAM
    • 16.4.9.1 Emphasis on expanding consumer electronics and industrial equipment manufacturing base to fuel demand
  • 16.4.10 REST OF ASIA PACIFIC
• 16.5 ROW
  • 16.5.1 MIDDLE EAST
    • 16.5.1.1 Saudi Arabia
      • 16.5.1.1.1 Focus on digital manufacturing and industrial automation to fuel market growth
    • 16.5.1.2 UAE
      • 16.5.1.2.1 Expansion of data centers, telecommunications networks, and IoT-enabled systems to spike demand
    • 16.5.1.3 Qatar
      • 16.5.1.3.1 Growth in IT infrastructure to drive demand
    • 16.5.1.4 Kuwait
      • 16.5.1.4.1 Modernization of energy and industrial infrastructure to favor market growth
    • 16.5.1.5 Oman
      • 16.5.1.5.1 Digital transformation of industrial sector to boost demand
    • 16.5.1.6 Bahrain
      • 16.5.1.6.1 Increasing investments in advanced manufacturing to propel market
    • 16.5.1.7 Rest of Middle East
  • 16.5.2 SOUTH AMERICA
    • 16.5.2.1 Growing renewable energy infrastructure to drive market
  • 16.5.3 AFRICA
    • 16.5.3.1 South Africa
      • 16.5.3.1.1 Growing renewable energy projects and booming power electronics sector to support market growth
    • 16.5.3.2 Rest of Africa

17 COMPETITIVE LANDSCAPE

• 17.1 OVERVIEW
• 17.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2021-2025
• 17.3 REVENUE ANALYSIS, 2020-2024
• 17.4 MARKET SHARE ANALYSIS, 2024
• 17.5 COMPANY VALUATION AND FINANCIAL METRICS
• 17.6 BRAND COMPARISON
  • 17.6.1 TE CONNECTIVITY
  • 17.6.2 AMPHENOL CORPORATION
  • 17.6.3 HIROSE ELECTRIC CO., LTD.
  • 17.6.4 MOLEX
  • 17.6.5 JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.
• 17.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2024
  • 17.7.1 STARS
  • 17.7.2 EMERGING LEADERS
  • 17.7.3 PERVASIVE PLAYERS
  • 17.7.4 PARTICIPANTS
  • 17.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2024
    • 17.7.5.1 Company footprint
    • 17.7.5.2 Region footprint
    • 17.7.5.3 Type footprint
    • 17.7.5.4 Connector type footprint
    • 17.7.5.5 Pitch footprint
    • 17.7.5.6 End user footprint
• 17.8 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2024
  • 17.8.1 PROGRESSIVE COMPANIES
  • 17.8.2 RESPONSIVE COMPANIES
  • 17.8.3 DYNAMIC COMPANIES
  • 17.8.4 STARTING BLOCKS
  • 17.8.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2024
    • 17.8.5.1 Detailed list of key startups/SMEs
    • 17.8.5.2 Competitive benchmarking of key startups/SMEs
• 17.9 COMPETITIVE SCENARIO
  • 17.9.1 PRODUCT LAUNCHES & ENHANCEMENTS
  • 17.9.2 DEALS
  • 17.9.3 EXPANSIONS

18 COMPANY PROFILES

• 18.1 KEY PLAYERS
  • 18.1.1 TE CONNECTIVITY
    • 18.1.1.1 Business overview
    • 18.1.1.2 Products/Solutions/Services offered
    • 18.1.1.3 Recent developments
      • 18.1.1.3.1 Product launches & enhancements
      • 18.1.1.3.2 Expansions
    • 18.1.1.4 MnM view
      • 18.1.1.4.1 Key strengths/Right to win
      • 18.1.1.4.2 Strategic choices
      • 18.1.1.4.3 Weaknesses/Competitive threats
  • 18.1.2 AMPHENOL CORPORATION
    • 18.1.2.1 Business overview
    • 18.1.2.2 Products/Solutions/Services offered
    • 18.1.2.3 Recent developments
      • 18.1.2.3.1 Product launches & enhancements
    • 18.1.2.4 MnM view
      • 18.1.2.4.1 Key strengths/Right to win
      • 18.1.2.4.2 Strategic choices
      • 18.1.2.4.3 Weaknesses/Competitive threats
  • 18.1.3 HIROSE ELECTRIC CO., LTD.
    • 18.1.3.1 Business overview
    • 18.1.3.2 Products/Solutions/Services offered
    • 18.1.3.3 Recent developments
      • 18.1.3.3.1 Product launches & enhancements
    • 18.1.3.4 MnM view
      • 18.1.3.4.1 Key strengths/Right to win
      • 18.1.3.4.2 Strategic choices
      • 18.1.3.4.3 Weaknesses/Competitive threats
  • 18.1.4 MOLEX, LLC
    • 18.1.4.1 Business overview
    • 18.1.4.2 Products/Solutions/Services offered
    • 18.1.4.3 Recent developments
      • 18.1.4.3.1 Product launches & enhancements
      • 18.1.4.3.2 Deals
      • 18.1.4.3.3 Expansions
    • 18.1.4.4 MnM view
      • 18.1.4.4.1 Key strengths/Right to win
      • 18.1.4.4.2 Strategic choices
      • 18.1.4.4.3 Weaknesses/Competitive threats
  • 18.1.5 JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.
    • 18.1.5.1 Business overview
    • 18.1.5.2 Products/Solutions/Services offered
    • 18.1.5.3 Recent developments
      • 18.1.5.3.1 Product launches & enhancements
    • 18.1.5.4 MnM view
      • 18.1.5.4.1 Key strengths/Right to win
      • 18.1.5.4.2 Strategic choices
      • 18.1.5.4.3 Weaknesses/Competitive threats
  • 18.1.6 SAMTEC
    • 18.1.6.1 Business overview
    • 18.1.6.2 Products/Solutions/Services offered
    • 18.1.6.3 Recent developments
      • 18.1.6.3.1 Product launches & enhancements
    • 18.1.6.4 MnM view
      • 18.1.6.4.1 Key strengths/Right to win
      • 18.1.6.4.2 Strategic choices
      • 18.1.6.4.3 Weaknesses/Competitive threats
  • 18.1.7 CSCONN CORPORATION
    • 18.1.7.1 Business overview
    • 18.1.7.2 Products/Solutions/Services offered
    • 18.1.7.3 MnM view
      • 18.1.7.3.1 Key strengths/Right to win
      • 18.1.7.3.2 Strategic choices
      • 18.1.7.3.3 Weaknesses/Competitive threats
  • 18.1.8 OMRON CORPORATION
    • 18.1.8.1 Business overview
    • 18.1.8.2 Products/Solutions/Services offered
    • 18.1.8.3 MnM view
      • 18.1.8.3.1 Key strengths/Right to win
      • 18.1.8.3.2 Strategic choices
      • 18.1.8.3.3 Weaknesses/Competitive threats
  • 18.1.9 KYOCERA CORPORATION
    • 18.1.9.1 Business overview
    • 18.1.9.2 Products/Solutions/Services offered
    • 18.1.9.3 Recent developments
      • 18.1.9.3.1 Product launches & enhancements
    • 18.1.9.4 MnM view
      • 18.1.9.4.1 Key strengths/Right to win
      • 18.1.9.4.2 Strategic choices
      • 18.1.9.4.3 Weaknesses/Competitive threats
  • 18.1.10 FIT HON TENG LIMITED
    • 18.1.10.1 Business overview
    • 18.1.10.2 Products/Solutions/Services offered
    • 18.1.10.3 Recent developments
      • 18.1.10.3.1 Expansions
    • 18.1.10.4 MnM view
      • 18.1.10.4.1 Key strengths/Right to win
      • 18.1.10.4.2 Strategic choices
      • 18.1.10.4.3 Weaknesses/Competitive threats
  • 18.1.11 HARTING TECHNOLOGY GROUP
    • 18.1.11.1 Business overview
    • 18.1.11.2 Products/Solutions/Services offered
    • 18.1.11.3 Recent developments
      • 18.1.11.3.1 Product launches & enhancements
      • 18.1.11.3.2 Deals
      • 18.1.11.3.3 Expansions
    • 18.1.11.4 MnM view
      • 18.1.11.4.1 Key strengths/Right to win
      • 18.1.11.4.2 Strategic choices
      • 18.1.11.4.3 Weaknesses/Competitive threats
• 18.2 OTHER PLAYERS
  • 18.2.1 3M
  • 18.2.2 HARWIN
  • 18.2.3 EPT GMBH
  • 18.2.4 KEL CORPORATION
  • 18.2.5 METZ CONNECT GMBH
  • 18.2.6 SMK CORPORATION
  • 18.2.7 ACES ELECTRONICS CO., LTD.
  • 18.2.8 AUK
  • 18.2.9 ROSENBERGER
  • 18.2.10 JST SALES AMERICA, INC.
  • 18.2.11 IRISO ELECTRONICS CO. LTD.
  • 18.2.12 YAMAICHI ELECTRONICS CO. LTD
  • 18.2.13 PHOENIX CONTACT
  • 18.2.14 DON CONNEX ELECTRONICS CO., LTD.
  • 18.2.15 WEITRONIC ENTERPRISE CO., LTD.
  • 18.2.16 AMTEK TECHNOLOGY CO., LTD.
  • 18.2.17 TAITEK COMPONENTS CO.,LTD.
  • 18.2.18 GREENCONN CO., LTD
  • 18.2.19 WCON ELECTRONICS (GUANGDONG) CO., LTD.
  • 18.2.20 KUNSHAN CONNECTORS ELECTRONICS CO., LTD.
  • 18.2.21 UNICORN ELECTRONICS COMPONENTS CO., LTD.
  • 18.2.22 OUPIIN GLOBAL
  • 18.2.23 CVILUX CORPORATION
  • 18.2.24 PLASTRON

19 RESEARCH METHODOLOGY

• 19.1 RESEARCH DATA
  • 19.1.1 SECONDARY AND PRIMARY RESEARCH
  • 19.1.2 SECONDARY DATA
    • 19.1.2.1 List of major secondary sources
    • 19.1.2.2 Key data from secondary sources
  • 19.1.3 PRIMARY DATA
    • 19.1.3.1 List of primary interview participants
    • 19.1.3.2 Key data from primary sources
    • 19.1.3.3 Key industry insights
    • 19.1.3.4 Breakdown of primaries
• 19.2 MARKET SIZE ESTIMATION
  • 19.2.1 TOP-DOWN APPROACH
  • 19.2.2 BOTTOM-UP APPROACH
  • 19.2.3 MARKET SIZE ESTIMATION METHODOLOGY
• 19.3 MARKET FORECAST APPROACH
  • 19.3.1 SUPPLY SIDE
  • 19.3.2 DEMAND SIDE
• 19.4 DATA TRIANGULATION
• 19.5 RESEARCH ASSUMPTIONS
• 19.6 RESEARCH LIMITATIONS
• 19.7 RISK ASSESSMENT

20 APPENDIX

• 20.1 INSIGHTS FROM INDUSTRY EXPERTS
• 20.2 DISCUSSION GUIDE
• 20.3 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
• 20.4 CUSTOMIZATION OPTIONS
• 20.5 RELATED REPORTS
• 20.6 AUTHOR DETAILS