비교리스트

 카트 문의
시장보고서
상품코드
1332090

세계의 고밀도 인터커넥트(HDI) PCB 시장 - 예측(-2032년)

High Density Interconnect PCB Market Research Report - Forecast till 2032
발행일: | 리서치사: Market Research Future | 페이지 정보: 영문 100 Pages | 배송안내 : 즉시배송

    
    
    



※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

세계 고밀도 인터커넥트(HDI) PCB 시장 규모는 2023년부터 2032년까지 CAGR로 17.3%의 높은 성장이 예상됩니다.

지역별 인사이트

아시아태평양은 예측 기간 동안 시장에서 큰 비중을 차지할 것으로 예상됩니다.

기술 혁신에 대한 관심 증가, 특히 중국 및 일본과 같은 국가들의 연구개발에 대한 관심 증가와 정부의 지원은 사업 부문 확대를 촉진하는 요인으로 작용하고 있습니다. 다양한 최종 용도 분야에서 미래 용도를 고려하는 인쇄 회로 기판의 연구 및 개발에 대한 꾸준한 시도는 예측 기간 동안 시장 발전을 촉진할 것으로 예상됩니다.

이 보고서는 세계 고밀도 인터커넥트(HDI) PCB 시장에 대해 조사 분석했으며, 시장 역학, 지역 및 부문 분석, 기업 개요 등의 정보를 제공합니다.

목차

제1장 주요 요약

  • 시장 매력 분석
    • 세계의 고밀도 인터커넥트(HDI) PCB 시장 : 상호접속 층별
    • 세계의 고밀도 인터커넥트(HDI) PCB 시장 : 용도별
    • 세계의 고밀도 인터커넥트(HDI) PCB 시장 : 지역별

제2장 시장 서론

제3장 조사 방법

제4장 시장 역학

  • 서론
  • 성장 촉진요인
    • 고밀도 인터커넥트 기술 혜택 증대
    • 복잡한 전자기기의 HDI PCB 수요 증가
    • 회로 미세화에 대한 수요 상승
    • 성장 촉진요인의 영향 분석
  • 과제
    • 우주 용도용 PCB로의 HDI 기술 도입
    • 5G 기술과 관련된 PCB 설계 과제
    • 대량 생산에서 ALV HDI가 직면하는 과제
    • 성장 억제요인의 영향 분석
  • 기회
    • HDI PCB 기술 진보
    • PCB 설계자 성장 기회로서의 5G 기술
    • 가전제품 수요 증가
  • COVID-19의 영향
    • 반도체 산업에 대한 영향
    • 의료 전자 산업에 대한 영향
    • 세계의 PCB 공급망에 대한 영향
    • 공급망 디지털화의 요구 상승

제5장 시장 요인 분석

  • 밸류체인 분석/공급망 분석
  • Porter's Five Forces 분석 모델

제6장 세계의 고밀도 인터커넥트(HDI) PCB 시장 : 상호접속 층별

  • 서론
  • 1층(1+N+1) HDI
  • 2층 이상의(2+N+2) HDI
  • 전층 HDI

제7장 세계의 고밀도 인터커넥트(HDI) PCB 시장 : 용도별

  • 서론
  • 가전제품
  • 자동차
  • 군·방위
  • 의료
  • 산업/제조
  • 기타

제8장 세계의 고밀도 인터커넥트(HDI) PCB 시장 규모 추정과 예측 : 지역별

  • 서론
  • 북미
    • 시장 추정과 예측 : 국가별(2018-2032년)
    • 시장 추정과 예측 : 상호접속 층별(2018-2032년)
    • 시장 추정과 예측 : 용도별(2018-2032년)
    • 미국
    • 시장 추정과 예측 : 상호접속 층별(2018-2032년)
    • 시장 추정과 예측 : 용도별(2018-2032년)
    • 캐나다
    • 시장 추정과 예측 : 상호접속 층별(2018-2032년)
    • 시장 추정과 예측 : 용도별(2018-2032년)
    • 멕시코
    • 시장 추정과 예측 : 상호접속 층별(2018-2032년)
    • 시장 추정과 예측 : 용도별(2018-2032년)
  • 유럽
    • 시장 추정과 예측 : 국가별(2018-2032년)
    • 시장 추정과 예측 : 상호접속 층별(2018-2032년)
    • 시장 추정과 예측 : 용도별(2018-2032년)
    • 영국
    • 독일
    • 프랑스
    • 기타 유럽
  • 아시아태평양
    • 시장 추정과 예측 : 국가별(2018-2032년)
    • 시장 추정과 예측 : 상호접속 층별(2018-2032년)
    • 시장 추정과 예측 : 용도별(2018-2032년)
    • 중국
    • 일본
    • 인도
    • 기타 아시아태평양
  • 중동 및 아프리카
    • 시장 추정과 예측 : 상호접속 층별(2018-2032년)
    • 시장 추정과 예측 : 용도별(2018-2032년)
  • 남미
    • 시장 추정과 예측 : 상호접속 층별(2018-2032년)
    • 시장 추정과 예측 : 용도별(2018-2032년)

제9장 경쟁 상황

  • 서론
  • 주요 발전과 성장 전략
  • 경쟁 벤치마크
  • 벤더 점유율 분석(2021년)

제10장 기업 개요

  • UNIMICRON, EPEC, LLC
  • TTM TECHNOLOGIES INC.
  • RAYMING TECHNOLOGY
  • HITECH CIRCUITS
  • NCAB GROUP CORPORATION
  • MILLENNIUM CIRCUITS LIMITED
  • TRIPOD TECHNOLOGY
  • ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED
  • AKM MEADVILLE
  • MEIKO ELECTRONICS CO., LTD.
  • SIERRA CIRCUITS INC.
  • COMPEQ MANUFACTURING CO., LTD.
  • AT & S(AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT)
  • ADVANCED CIRCUITS
  • DAP CORPORATION
ksm 23.08.25

Market Overview

High-Density Interconnect PCB Market is projected to exhibit a significant CAGR of 17.3% during the review period 2023 - 2032. HDI is a truncation for High Density Interconnector, which is a circuit board with a moderately high line circulation density that utilizes miniature visually impaired and covered opening innovation. It is vital in improving electrical execution and bringing down the weight and size of hardware. HDI PCB plans push the limits of innovation, and key market organizations are at the very front of the development, meeting the most tough particulars. The interest for HDI PCB fabricating has been growing because of innovative leap forwards and the various benefits HDI PCBs accommodate high-tech applications. Squeezing more innovation into less space with less layers limits numerous PCB makers who need particular gear and the capacity for cutting edge highlights, better lines, and tighter resiliences. HDI printed circuit board plans utilize complex elements, for example, miniature vias, blind vias, through in-cushion, and stacked and staggered vias to expand board region while upgrading execution and convenience.

Market Segment Insights

By Interconnection Layers, the High Density Interconnect (HDI) PCB market has been categorized as 1 Layer (1+N+1) HDI, 2 or more layers (2+N+2) HDI, and All Layers HDI. During the projected period, the demand for All Layers HDI segment is expected to grow rapidly.

Based on Application, the High Density Interconnect (HDI) PCB market has been segmented into Consumer Electronics, Automotive, Military and Defense, Healthcare, Industrial/ Manufacturing, and Others. During the projected period, the automotive segment is expected to rise rapidly.

Regional Insights

Asia Pacific is expected to have a significant share of the High Density Interconnect PCB Market during the projected period.

The rising utilization of printed circuit sheets in the hardware, aviation, IT, and telecom, modern, and auto businesses is driving business sector extension regarding esteem deals. Developing interest for innovation, more noteworthy interest in Research and development by undertakings in nations like China and Japan, and government backing are a portion of the drivers driving business sector extension. Consistent endeavors in printed circuit board Research and development to examine forthcoming applications in various end-use areas are supposed to drive market development during the projected period. Developing interest for printed circuit sheets in view of the expanded utilization of modern gadgets is supposed to drive market extension during the gauge time frame. China, for instance, has a muddled modern chain that incorporates copper foil, glass fiber, tar, copper-clad covers, and PCBs as its last part. The market has extended significantly more as Western nations' longing for Asian purchaser hardware has taken off.

Major Players

The major players in the global High Density Interconnect (HDI) PCB are Compeq Manufacturing Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unimicron, Tripod Technology, and Zhen Ding Tech. Unimicron, Epec, LLC, TTM Technologies Inc., RayMing Technology, HiTech Circuits, NCAB Group Corporation, Millennium Circuits Limited, Tripod Technology, AKM Meadville, Meiko Electronics Co., Ltd., Sierra Circuits Inc., Compeq Manufacturing Co., Ltd., Advanced Circuits, and DAP Corporation.

TABLE OF CONTENTS

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

  • 1.1. MARKET ATTRACTIVENESS ANALYSIS
    • 1.1.1. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY INTERCONNECTION LAYERS
    • 1.1.2. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY APPLICATION
    • 1.1.3. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY REGION

2. MARKET INTRODUCTION

  • 2.1. DEFINITION
  • 2.2. SCOPE OF THE STUDY
  • 2.3. MARKET STRUCTURE
  • 2.4. KEY BUYING CRITERIA
  • 2.5. MACRO FACTOR INDICATOR ANALYSIS

3. RESEARCH METHODOLOGY

  • 3.1. RESEARCH PROCESS
  • 3.2. PRIMARY RESEARCH
  • 3.3. SECONDARY RESEARCH
  • 3.4. MARKET SIZE ESTIMATION
  • 3.5. FORECAST MODEL
  • 3.6. LIST OF ASSUMPTIONS

4. MARKET DYNAMICS

  • 4.1. INTRODUCTION
  • 4.2. DRIVERS
    • 4.2.1. INCREASING BENEFITS OF HIGH DENSITY INTERCONNECT TECHNOLOGY
    • 4.2.2. RISING DEMAND OF HDI PCBS IN COMPLEX ELECTRONIC DEVICES
    • 4.2.3. GROWING DEMAND FOR CIRCUIT MINIATURIZATION
    • 4.2.4. DRIVERS IMPACT ANALYSIS
  • 4.3. CHALLENGES
    • 4.3.1. INTRODUCING HDI TECHNOLOGY IN PCB FOR SPACE APPLICATION
    • 4.3.2. 5G TECHNOLOGY RELATED PCB DESIGN CHALLENGES
    • 4.3.3. CHALLENGES FACED IN ANY-LAYER INTERCONNECTION HIGH DENSITY (ALV HDI) IN MASS PRODUCTIONS
    • 4.3.4. RESTRAINTS IMPACT ANALYSIS
  • 4.4. OPPORTUNITIES
    • 4.4.1. TECHNOLOGICAL ADVANCEMENT IN HDI PCB
    • 4.4.2. 5G TECHNOLOGY AS A GROWTH OPPORTUNITY FOR PCB DESIGNERS
    • 4.4.3. RISING DEMAND FOR CONSUMER ELECTRONICS
  • 4.5. IMPACT OF COVID-19
    • 4.5.1. IMPACT ON SEMICONDUCTOR INDUSTRY
    • 4.5.2. IMPACT ON THE MEDICAL ELECTRONIC INDUSTRY
    • 4.5.3. IMPACT ON GLOBAL PCB SUPPLY CHAIN
    • 4.5.4. RISING NEED FOR DIGITALIZATION OF THE SUPPLY CHAIN

5. MARKET FACTOR ANALYSIS

  • 5.1. VALUE CHAIN ANALYSIS/SUPPLY CHAIN ANALYSIS
  • 5.2. PORTER'S FIVE FORCES MODEL
  • 5.3. BARGAINING POWER OF SUPPLIERS
  • 5.4. BARGAINING POWER OF BUYERS
  • 5.5. THREAT OF NEW ENTRANTS
  • 5.6. THREAT OF SUBSTITUTES
  • 5.7. INTENSITY OF RIVALRY

6. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY INTERCONNECTION LAYERS

  • 6.1. INTRODUCTION
  • 6.2. 1 LAYER (1+N+1) HDI
  • 6.3. 2 OR MORE LAYERS (2+N+2) HDI
  • 6.4. ALL LAYERS HDI

7. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY APPLICATION

  • 7.1. INTRODUCTION
  • 7.2. CONSUMER ELECTRONICS
  • 7.3. AUTOMOTIVE
  • 7.4. MILITARY AND DEFENSE
  • 7.5. HEALTHCARE
  • 7.6. INDUSTRIAL/ MANUFACTURING
  • 7.7. OTHERS

8. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET SIZE ESTIMATION & FORECAST, BY REGION

  • 8.1. INTRODUCTION
  • 8.2. NORTH AMERICA
    • 8.2.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032
    • 8.2.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.2.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.2.4. US
    • 8.2.5. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.2.6. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.2.7. CANADA
    • 8.2.8. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.2.9. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.2.10. MEXICO
    • 8.2.11. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.2.12. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
  • 8.3. EUROPE
    • 8.3.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032
    • 8.3.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.3.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.3.4. UK
      • 8.3.4.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.3.4.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.3.5. GERMANY
      • 8.3.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.3.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.3.6. FRANCE
      • 8.3.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.3.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.3.7. REST OF EUROPE
      • 8.3.7.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.3.7.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
  • 8.4. ASIA-PACIFIC
    • 8.4.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032
    • 8.4.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.4.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.4.4. CHINA
      • 8.4.4.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.4.4.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.4.5. JAPAN
      • 8.4.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.4.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.4.6. INDIA
      • 8.4.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.4.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.4.7. REST OF ASIA-PACIFIC
      • 8.4.7.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.4.7.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
  • 8.5. MIDDLE EAST & AFRICA
    • 8.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
  • 8.6. SOUTH AMERICA
    • 8.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

9. COMPETITIVE LANDSCAPE

  • 9.1. INTRODUCTION
  • 9.2. KEY DEVELOPMENTS & GROWTH STRATEGIES
  • 9.3. COMPETITOR BENCHMARKING
  • 9.4. VENDOR SHARE ANALYSIS, 2021(% SHARE)

10. COMPANY PROFILES

  • 10.1. UNIMICRON, EPEC, LLC
    • 10.1.1. COMPANY OVERVIEW
    • 10.1.2. FINANCIAL OVERVIEW
    • 10.1.3. SOLUTION/SERVICES OFFERED
    • 10.1.4. KEY DEVELOPMENTS
    • 10.1.5. SWOT ANALYSIS
    • 10.1.6. KEY STRATEGIES
  • 10.2. TTM TECHNOLOGIES INC.
    • 10.2.1. COMPANY OVERVIEW
    • 10.2.2. FINANCIAL OVERVIEW
    • 10.2.3. SOLUTION/SERVICES OFFERED
    • 10.2.4. KEY DEVELOPMENTS
    • 10.2.5. SWOT ANALYSIS
    • 10.2.6. KEY STRATEGIES
  • 10.3. RAYMING TECHNOLOGY
    • 10.3.1. COMPANY OVERVIEW
    • 10.3.2. FINANCIAL OVERVIEW
    • 10.3.3. SOLUTION/SERVICES OFFERED
    • 10.3.4. KEY DEVELOPMENTS
    • 10.3.5. SWOT ANALYSIS
    • 10.3.6. KEY STRATEGIES
  • 10.4. HITECH CIRCUITS
    • 10.4.1. COMPANY OVERVIEW
    • 10.4.2. FINANCIAL OVERVIEW
    • 10.4.3. SOLUTION/SERVICES OFFERED
    • 10.4.4. KEY DEVELOPMENTS
    • 10.4.5. SWOT ANALYSIS
    • 10.4.6. KEY STRATEGIES
  • 10.5. NCAB GROUP CORPORATION
    • 10.5.1. COMPANY OVERVIEW
    • 10.5.2. FINANCIAL OVERVIEW
    • 10.5.3. SOLUTION/SERVICES OFFERED
    • 10.5.4. KEY DEVELOPMENTS
    • 10.5.5. SWOT ANALYSIS
    • 10.5.6. KEY STRATEGIES
  • 10.6. MILLENNIUM CIRCUITS LIMITED
    • 10.6.1. COMPANY OVERVIEW
    • 10.6.2. FINANCIAL OVERVIEW
    • 10.6.3. SOLUTION/SERVICES OFFERED
    • 10.6.4. KEY DEVELOPMENTS
    • 10.6.5. SWOT ANALYSIS
    • 10.6.6. KEY STRATEGIES
  • 10.7. TRIPOD TECHNOLOGY
    • 10.7.1. COMPANY OVERVIEW
    • 10.7.2. FINANCIAL OVERVIEW
    • 10.7.3. SOLUTION/SERVICES OFFERED
    • 10.7.4. KEY DEVELOPMENTS
    • 10.7.5. SWOT ANALYSIS
    • 10.7.6. KEY STRATEGIES
  • 10.8. ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED
    • 10.8.1. COMPANY OVERVIEW
    • 10.8.2. FINANCIAL OVERVIEW
    • 10.8.3. SOLUTION/SERVICES OFFERED
    • 10.8.4. KEY DEVELOPMENTS
    • 10.8.5. SWOT ANALYSIS
    • 10.8.6. KEY STRATEGIES
  • 10.9. AKM MEADVILLE
    • 10.9.1. COMPANY OVERVIEW
    • 10.9.2. FINANCIAL OVERVIEW
    • 10.9.3. SOLUTION/SERVICES OFFERED
    • 10.9.4. KEY DEVELOPMENTS
    • 10.9.5. SWOT ANALYSIS
    • 10.9.6. KEY STRATEGIES
  • 10.10. MEIKO ELECTRONICS CO., LTD.
    • 10.10.1. COMPANY OVERVIEW
    • 10.10.2. FINANCIAL OVERVIEW
    • 10.10.3. SOLUTION/SERVICES OFFERED
    • 10.10.4. KEY DEVELOPMENTS
    • 10.10.5. SWOT ANALYSIS
    • 10.10.6. KEY STRATEGIES
  • 10.11. SIERRA CIRCUITS INC.
    • 10.11.1. COMPANY OVERVIEW
    • 10.11.2. FINANCIAL OVERVIEW
    • 10.11.3. SOLUTION/SERVICES OFFERED
    • 10.11.4. KEY DEVELOPMENTS
    • 10.11.5. SWOT ANALYSIS
    • 10.11.6. KEY STRATEGIES
  • 10.12. COMPEQ MANUFACTURING CO., LTD.
    • 10.12.1. COMPANY OVERVIEW
    • 10.12.2. FINANCIAL OVERVIEW
    • 10.12.3. SOLUTION/SERVICES OFFERED
    • 10.12.4. KEY DEVELOPMENTS
    • 10.12.5. SWOT ANALYSIS
    • 10.12.6. KEY STRATEGIES
  • 10.13. AT & S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT)
    • 10.13.1. COMPANY OVERVIEW
    • 10.13.2. FINANCIAL OVERVIEW
    • 10.13.3. SOLUTION/SERVICES OFFERED
    • 10.13.4. KEY DEVELOPMENTS
    • 10.13.5. SWOT ANALYSIS
    • 10.13.6. KEY STRATEGIES
  • 10.14. ADVANCED CIRCUITS
    • 10.14.1. COMPANY OVERVIEW
    • 10.14.2. FINANCIAL OVERVIEW
    • 10.14.3. SOLUTION/SERVICES OFFERED
    • 10.14.4. KEY DEVELOPMENTS
    • 10.14.5. SWOT ANALYSIS
    • 10.14.6. KEY STRATEGIES
  • 10.15. DAP CORPORATION
    • 10.15.1. COMPANY OVERVIEW
    • 10.15.2. FINANCIAL OVERVIEW
    • 10.15.3. SOLUTION/SERVICES OFFERED
    • 10.15.4. KEY DEVELOPMENTS
    • 10.15.5. SWOT ANALYSIS
    • 10.15.6. KEY STRATEGIES
비교리스트
0 건의 상품을 선택 중
상품 비교하기
전체삭제