세계의 GaN 반도체 디바이스 시장, 예측(-2030년)

Market Overview

GaN Semiconductor Devices Market is expected to register a CAGR of 20.5 % during the forecast period. Gallium nitride (GaN) is a paired III/V direct bandgap semiconductor that is appropriate for high-power semiconductors equipped for working at high temperatures. It is an extremely hard, precisely stable wide bandgap semiconductor that fundamentally beats silicon-based devices with regards to breakdown strength, exchanging speed, warm conductivity, and on-opposition. GaN is starting to see reception because of its better properties over silicon devices, like amazing high-recurrence attributes. As worldwide requirement for energy expands, a transition to GaN innovation will assist with fulfilling need while downplaying fossil fuel byproducts. GaN plan and joining has been displayed to convey cutting edge power semiconductors with a carbon impression multiple times lower than more seasoned, more slow silicon chips.

The market for GaN semiconductor devices is expected to create in the future because of the rising utilization of electric and half-breed electric vehicles. A vehicle with an electric engine fueled by a battery that can be charged remotely is called an electric vehicle. Electric vehicles utilize high-proficiency power semiconductors and coordinated circuits made of gallium nitride semiconductors. GaN semiconductors devices offer a few advantages over silicon, including 3x the band hole and 10x the breakdown electric field strength in electric vehicle applications.

Market Segmentation

Based on Device, the GaN Semiconductor Devices Market is divided into Supply and Inverter, Transistor, Rectifier, Diode, Power IC, Amplifiers, Switching Systems, Lighting and Laser, and Others.

In terms of Vertical, the Market is classified into Automotive, Industrial, Defense & Aerospace, Consumer Electronics, Telecommunication, Medical and Others. The Type segment is further divided into Power semiconductors, RF semiconductors, and Opto semiconductors.

Regional Insights

As far as revenue, Asia-Pacific held the biggest portion of 46.9% in the GaN Semiconductor Devices Market in 2022 and is supposed to keep up with its predominance during the conjecture time frame. The presence of central participants and an emphasis on foundation improvement in the region add to market development. The Asia Pacific market for GaN semiconductor devices is expected to develop altogether over the figure period.

North America is expected to rule the GaN semiconductor devices market over the review period due to the huge consumptions made in gallium nitride semiconductor advancements and the region's far-reaching utilization of refined gadgets across a few business verticals. GaN-based power semiconductor gadget advancement drives by the public authority are expected to increment interest in MBE frameworks in North America.

Europe is supposed to observe the quickest development in the GaN Semiconductor Devices market during the conjecture time frame because of expansion popular for semiconductor devices from the military, crisis clinical benefits, and seaward oil and gas improvement.

The GaN semiconductor devices market in Rest of the World is expected to develop considerably over the conjecture period because of the huge speculations made in gallium nitride semiconductor advancements and the broad utilization of contemporary hardware in the region's various areas.

Major Players

The key players in the GaN semiconductor devices market are Fujitsu Ltd., Panasonic Coporation, Texas Instruments, Osram Opto-Semiconductors, Cree Incorporate, Toshiba, AixtronSE, Infineon Technologies, ROHM Company Limited, NXP Semiconductors, KoninklijkePhilips N.V., and Others.

TABLE OF CONTENTS

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY 16

• 1.1 MARKET ATTRACTIVENESS ANALYSIS 17
  • 1.1.1 GLOBAL GAN SEMICONDUCTOR DEVICES MARKET, BY DEVICE 17
  • 1.1.2 GLOBAL GAN SEMICONDUCTOR DEVICES MARKET, BY VERTICAL 18
  • 1.1.3 GLOBAL GAN SEMICONDUCTOR DEVICES MARKET, BY WAFER SIZE 19
  • 1.1.4 GLOBAL GAN SEMICONDUCTOR DEVICES MARKET, BY TYPE 20
  • 1.1.5 GLOBAL GAN SEMICONDUCTOR DEVICES MARKET, BY REGION 21

2 MARKET INTRODUCTION 22

• 2.1 DEFINITION 22
• 2.2 SCOPE OF THE STUDY 22
• 2.3 RESEARCH OBJECTIVE 22
• 2.4 MARKET STRUCTURE 23

3 RESEARCH METHODOLOGY 24

• 3.1 DATA MINING 24
• 3.2 SECONDARY RESEARCH 25
• 3.3 PRIMARY RESEARCH 25
  • 3.3.1 PRIMARY INTERVIEWS AND INFORMATION GATHERING PROCESS 26
  • 3.3.2 BREAKDOWN OF PRIMARY RESPONDENTS 26
• 3.4 RESEARCH METHODOLOGY FOR MARKET SIZE ESTIMATION 28
  • 3.4.1 BOTTOM-UP APPROACH 29
  • 3.4.2 TOP-DOWN APPROACH 29
• 3.5 DATA VALIDATION 30
• 3.6 ASSUMPTIONS & LIMITATIONS 30

4 MARKET DYNAMICS 31

• 4.1 INTRODUCTION 31
• 4.2 DRIVERS 32
  • 4.2.1 INCREASING ADOPTION OF GAN RF SEMICONDUCTOR DEVICES IN MILITARY 32
  • 4.2.2 DEMAND FOR GAN POWER SEMICONDUCTORS IN CONSUMER ELECTRONICS AND AUTOMOTIVE 32
• 4.3 RESTRAINT 33
  • 4.3.1 AVAILABILITY OF SUBSTITUTES 33
• 4.4 OPPORTUNITIES 33
  • 4.4.1 APPLICATIONS IN ELECTRIC AND HYBRID ELECTRIC VEHICLES 33
  • 4.4.2 ADVENT OF 5G NETWORK 34
• 4.5 COVID - 19 IMPACT ANALYSIS 34
  • 4.5.1 IMPACT ON SEMICONDUCTOR MANUFACTURERS 34
  • 4.5.2 IMPACT ON C0MPONENT MANUFACTURERS 34
  • 4.5.3 IMPACT ON DEVICES MANUFACTURERS 34
  • 4.5.4 IMPACT ON SUPPLY CHAIN DELAYS 34

5 MARKET FACTOR ANALYSIS 35

• 5.1 SUPPLY CHAIN ANALYSIS 35
  • 5.1.1 RAW MATERIALS 35
  • 5.1.2 GAN WAFER MANUFACTURING 36
  • 5.1.3 DEVICE MANUFACTURING 36
  • 5.1.4 DISTRIBUTION 36
  • 5.1.5 END USERS 36
• 5.2 PORTER'S FIVE FORCES MODEL 37
  • 5.2.1 BARGAINING POWER OF SUPPLIERS 37
  • 5.2.2 BARGAINING POWER OF BUYERS 38
  • 5.2.3 THREAT OF NEW ENTRANTS 38
  • 5.2.4 THREAT OF SUBSTITUTES 38
  • 5.2.5 INTENSITY OF RIVALRY 38

6 GLOBAL GAN SEMICONDUCTOR DEVICES MARKET, BY DEVICE 39

• 6.1 INTRODUCTION 39
• 6.2 TRANSISTOR 40
• 6.3 DIODE 40
• 6.4 RECTIFIER 40
• 6.5 POWER IC 40
• 6.6 SUPPLY AND INVERTER 40
• 6.7 AMPLIFIERS 41
• 6.8 LIGHTING AND LASER 41
• 6.9 SWITCHING SYSTEMS 41

7 GLOBAL GAN SEMICONDUCTOR DEVICES MARKET, BY VERTICAL 42

• 7.1 INTRODUCTION 42
• 7.2 AUTOMOTIVE 43
• 7.3 INDUSTRIAL 43
• 7.4 DEFENSE & AEROSPACE 43
• 7.5 CONSUMER ELECTRONICS 43
• 7.6 TELECOMMUNICATION 44
• 7.7 MEDICAL 44

8 GLOBAL GAN SEMICONDUCTOR DEVICES MARKET, BY WAFER SIZE 45

• 8.1 INTRODUCTION 45
• 8.2 2 INCH 46
• 8.3 4 INCH 46
• 8.4 6 INCH 46
• 8.5 MORE THAN 6 INCH 46

9 GLOBAL GAN SEMICONDUCTOR DEVICES MARKET, BY TYPE 47

• 9.1 INTRODUCTION 47
• 9.2 POWER SEMICONDUCTORS 48
• 9.3 RF SEMICONDUCTORS 48
• 9.4 OPTO SEMICONDUCTORS 48

10 GLOBAL GAN SEMICONDUCTOR DEVICES MARKET, BY REGION 49

• 10.1 INTRODUCTION 49
• 10.2 NORTH AMERICA 50
  • 10.2.1 US 53
  • 10.2.2 CANADA 55
  • 10.2.3 MEXICO 57
• 10.3 EUROPE 59
  • 10.3.1 GERMANY 62
  • 10.3.2 FRANCE 64
  • 10.3.3 UK 66
  • 10.3.4 ITALY 68
  • 10.3.5 SPAIN 70
  • 10.3.6 REST OF EUROPE 72
• 10.4 ASIA PACIFIC 74
  • 10.4.1 CHINA 77
  • 10.4.2 INDIA 79
  • 10.4.3 JAPAN 81
  • 10.4.4 SOUTH KOREA 83
  • 10.4.5 REST OF ASIA PACIFIC 85
• 10.5 ROW 87
  • 10.5.1 LATAM 90
  • 10.5.2 MEA 92

11 COMPETITIVE LANDSCAPE 94

• 11.1 COMPETITIVE OVERVIEW 94
• 11.2 COMPETITIVE BENCHMARKING 95
• 11.3 MARKET SHARE ANALYSIS 96
• 11.4 KEY DEVELOPMENTS & GROWTH STRATEGIES 96
  • 11.4.1 NEW PRODUCT LAUNCH/SERVICE DEPLOYMENT 96
  • 11.4.2 MERGER & ACQUISITION 97
  • 11.4.3 JOINT VENTURES 97
  • 11.4.4 EXPANSION 98

12 COMPANY PROFILES 99

• 12.1 KONINKLIJKE PHILIPS N.V. 99
  • 12.1.1 COMPANY OVERVIEW 99
  • 12.1.2 FINANCIAL OVERVIEW 100
  • 12.1.3 PRODUCTS OFFERED 100
  • 12.1.4 SWOT ANALYSIS 101
  • 12.1.5 KEY STRATEGY 101
• 12.2 QORVO 102
  • 12.2.1 COMPANY OVERVIEW 102
  • 12.2.2 FINANCIAL OVERVIEW 102
  • 12.2.3 PRODUCTS OFFERED 103
  • 12.2.4 SWOT ANALYSIS 103
  • 12.2.5 KEY STRATEGY 104
• 12.3 EFFICIENT POWER CONVERSION CORPORATION 105
  • 12.3.1 COMPANY OVERVIEW 105
  • 12.3.2 PRODUCTS OFFERED 105
  • 12.3.3 SWOT ANALYSIS 106
  • 12.3.4 KEY STRATEGY 106
• 12.4 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 107
  • 12.4.1 COMPANY OVERVIEW 107
  • 12.4.2 PRODUCTS OFFERED 107
  • 12.4.3 KEY DEVELOPMENTS 108
  • 12.4.4 SWOT ANALYSIS 108
  • 12.4.5 KEY STRATEGY 108
• 12.5 INTEL CORPORATION 109
  • 12.5.1 COMPANY OVERVIEW 109
  • 12.5.2 FINANCIAL OVERVIEW 110
  • 12.5.3 PRODUCTS OFFERED 110
  • 12.5.4 SWOT ANALYSIS 111
  • 12.5.5 KEY STRATEGY 111
• 12.6 GLOBALFOUNDRIES 112
  • 12.6.1 COMPANY OVERVIEW 112
  • 12.6.2 FINANCIAL OVERVIEW 112
  • 12.6.3 PRODUCTS OFFERED 112
  • 12.6.4 KEY DEVELOPMENTS 113
  • 12.6.5 SWOT ANALYSIS 113
  • 12.6.6 KEY STRATEGY 114
• 12.7 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP 115
  • 12.7.1 COMPANY OVERVIEW 115
  • 12.7.2 FINANCIAL OVERVIEW 115
  • 12.7.3 PRODUCTS OFFERED 116
  • 12.7.4 SWOT ANALYSIS 116
  • 12.7.5 KEY STRATEGY 116
• 12.8 FUJITSU LTD 117
  • 12.8.1 COMPANY OVERVIEW 117
  • 12.8.2 FINANCIAL OVERVIEW 118
  • 12.8.3 PRODUCTS OFFERED 118
  • 12.8.4 KEY DEVELOPMENTS 119
  • 12.8.5 SWOT ANALYSIS 119
  • 12.8.6 KEY STRATEGY 120
• 12.9 PANASONIC CORPORATION 121
  • 12.9.1 COMPANY OVERVIEW 121
  • 12.9.2 FINANCIAL OVERVIEW 122
  • 12.9.3 PRODUCTS OFFERED 122
  • 12.9.4 KEY DEVELOPMENTS 123
  • 12.9.5 SWOT ANALYSIS 123
  • 12.9.6 KEY STRATEGY 124
• 12.10 TEXAS INSTRUMENTS 125
  • 12.10.1 COMPANY OVERVIEW 125
  • 12.10.2 FINANCIAL OVERVIEW 126
  • 12.10.3 PRODUCTS OFFERED 127
  • 12.10.4 KEY DEVELOPMENTS 128
  • 12.10.5 SWOT ANALYSIS 128
  • 12.10.6 KEY STRATEGY 129
• 12.11 OSRAM OPTO-SEMICONDUCTORS 130
  • 12.11.1 COMPANY OVERVIEW 130
  • 12.11.2 FINANCIAL OVERVIEW 130
  • 12.11.3 PRODUCTS OFFERED 131
  • 12.11.4 KEY DEVELOPMENTS 131
  • 12.11.5 SWOT ANALYSIS 132
  • 12.11.6 KEY STRATEGY 132
• 12.12 WOLFSPEED, INC. 133
  • 12.12.1 COMPANY OVERVIEW 133
  • 12.12.2 FINANCIAL OVERVIEW 133
  • 12.12.3 PRODUCTS OFFERED 134
  • 12.12.4 KEY DEVELOPMENTS 134
  • 12.12.5 SWOT ANALYSIS 135
  • 12.12.6 KEY STRATEGY 135
• 12.13 TOSHIBA 136
  • 12.13.1 COMPANY OVERVIEW 136
  • 12.13.2 FINANCIAL OVERVIEW 136
  • 12.13.3 PRODUCTS OFFERED 137
  • 12.13.4 KEY DEVELOPMENTS 137
  • 12.13.5 SWOT ANALYSIS 138
  • 12.13.6 KEY STRATEGY 138
• 12.14 AIXTRON SE 139
  • 12.14.1 COMPANY OVERVIEW 139
  • 12.14.2 FINANCIAL OVERVIEW 140
  • 12.14.3 PRODUCTS OFFERED 140
  • 12.14.4 KEY DEVELOPMENTS 141
  • 12.14.5 SWOT ANALYSIS 142
  • 12.14.6 KEY STRATEGY 142
• 12.15 INFINEON TECHNOLOGIES 143
  • 12.15.1 COMPANY OVERVIEW 143
  • 12.15.2 FINANCIAL OVERVIEW 143
  • 12.15.3 PRODUCTS OFFERED 144
  • 12.15.4 KEY DEVELOPMENTS 144
  • 12.15.5 SWOT ANALYSIS 145
  • 12.15.6 KEY STRATEGY 145
• 12.16 ROHM COMPANY LIMITED 146
  • 12.16.1 COMPANY OVERVIEW 146
  • 12.16.2 FINANCIAL OVERVIEW 146
  • 12.16.3 PRODUCTS OFFERED 146
  • 12.16.4 KEY DEVELOPMENTS 147
  • 12.16.5 SWOT ANALYSIS 147
  • 12.16.6 KEY STRATEGY 148
• 12.17 NXP SEMICONDUCTORS 149
  • 12.17.1 COMPANY OVERVIEW 149
  • 12.17.2 FINANCIAL OVERVIEW 150
  • 12.17.3 PRODUCTS OFFERED 150
  • 12.17.4 KEY DEVELOPMENTS 151
  • 12.17.5 SWOT ANALYSIS 151
  • 12.17.6 KEY STRATEGY 152

13 APPENDIX 153

• 13.1 REFERENCES 153
• 13.2 RELATED REPORTS 153