세계의 IO-Link 시장(-2032년) : 유형별, 구성요소별, 용도별, 산업별, 지역별

Global IO-Link Market Research Report Information By Type (IO-link Wired, IO-link Wireless), By Component (IO-link Master, IO-link Devices, Sensor Nodes, Modules, Actuators, RFID Read Heads, Others), By Application (Machine Tool, Handling & Assembly, Automation, Intralogistics, Packaging), By Industry Vertical (Oil & Gas, Energy & Power, Automotive, Aerospace & Defense, Pharmaceuticals, Food & Beverages, Chemicals, Others)And By Region (North America, Europe, Asia-Pacific, And Rest Of The World) Forecast Till 2032

Market Overview

According to MRFR, the global IO-Link market has grown rapidly in recent years. It is predicted to reach 75,750.3 million by 2032, with a CAGR of 20.1% from 2025 to 2032.

IO-Link connects the next generation of Industry 4.0 devices. IO-Link is an IEC-compliant, serial, bidirectional point-to-point connection for signal transfer and power delivery. IO-Link adds intelligence to industrial factories by linking the field level to the automation system. IO-Link is global, clever, and simple to install and use. IO-Link solutions enable the field-level connecting of sensors and actuators to the control network. This IEC-approved protocol is powerful but easy to install and operate, making it a popular choice for industrial applications. IO-Link solutions offer a wide range of sensor types of thanks to their tiny packages and pin configurability, which simplifies designs and lowers costs. The company also provides tiny IO-link line drivers with high-voltage I/O channels to fulfill the physical layer requirements of sensor and actuator systems used in manufacturing and process automation applications. These devices offer a diverse set of adjustable system features and operations in difficult conditions.

Market Segment insights

The IO-Link Market is segmented by type, which comprises IO-Link Wired and IO-Link Wireless.

The market is segmented by component, which comprises IO-link Master, IO-link Devices, Sensor Nodes, Modules, Actuators, RFID Read Heads, and Others.

Machine Tool, Handling & Assembly, Automation, Intralogistics, and Packaging are the application-based IO-Link market segments.

The market is segmented by industry verticals, which include oil and gas, energy and power, automotive, aerospace and defense, pharmaceuticals, food and beverages, chemicals, and others.

Regional insights

In 2022, the North American IO-Link Market led the market. IO-Link technology has grown in popularity across industries due to its ability to improve automation, efficacy, and diagnostics. Furthermore, the U.S. IO-Link market had the biggest market share, while Canada's Armor Materials market was the fastest expanding in North America.

The European IO-Link market has the second-largest market share. The area benefits from a robust industrial infrastructure, a focus on cutting-edge manufacturing technologies, and a high need for effective and adaptive automation solutions.

The Asia-Pacific IO-Link Market is predicted to develop at the quickest CAGR between 2023 and 2032. The region is known for its thriving industrial sectors, which include consumer goods, electronics, and autos. These industries are implementing IO-Link technology to enhance production process control, real-time monitoring, and flexibility.

Major Players

Major participants in the IO-Link market include Balluff GmbH, ifm electronic GmbH, Banner Engineering Corp., SICK AG, Siemens, Emerson Electric Co., Rockwell Automation, Inc., Pepperl+Fuchs, Hans Turck GmbH & Co. KG, Omron Corporation, and others.

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

2 MARKET INTRODUCTION

• 2.1 DEFINITION
• 2.2 SCOPE OF THE STUDY
• 2.3 RESEARCH OBJECTIVE
• 2.4 MARKET STRUCTURE

3 RESEARCH METHODOLOGY

• 3.1 OVERVIEW
• 3.2 DATA FLOW
  • 3.2.1 DATA MINING PROCESS
• 3.3 PURCHASED DATABASE:
• 3.4 SECONDARY SOURCES:
  • 3.4.1 SECONDARY RESEARCH DATA FLOW:
• 3.5 PRIMARY RESEARCH:
  • 3.5.1 PRIMARY RESEARCH DATA FLOW:
  • 3.5.2 PRIMARY RESEARCH: NUMBER OF INTERVIEWS CONDUCTED
  • 3.5.3 PRIMARY RESEARCH: REGIONAL COVERAGE
• 3.6 APPROACHES FOR MARKET SIZE ESTIMATION:
  • 3.6.1 CONSUMPTION NET TRADE APPROACH
  • 3.6.2 REVENUE ANALYSIS APPROACH
• 3.7 DATA FORECASTING
  • 3.7.1 DATA FORECASTING TECHNIQUE
• 3.8 DATA MODELING
  • 3.8.1 MICROECONOMIC FACTOR ANALYSIS:
  • 3.8.2 DATA MODELING:
• 3.9 TEAMS AND ANALYST CONTRIBUTION

4 MARKET DYNAMICS

• 4.1 INTRODUCTION
• 4.2 DRIVERS
  • 4.2.1 SHIFT TOWARDS INDUSTRY 4.0
  • 4.2.2 ABILITY TO OPTIMIZE ENERGY USAGE AND REDUCING OPERATIONAL COSTS
  • 4.2.3 STANDARDIZATION & INTEROPERABILITY ENHANCEMENTS DEVELOPMENTS IN THE IO-LINK MARKET
  • 4.2.4 DRIVERS IMPACT ANALYSIS
• 4.3 RESTRAINTS
  • 4.3.1 LATENCY SENSITIVITY IN TIME-CRITICAL APPLICATIONS
  • 4.3.2 CYBER RISKS ASSOCIATED WITH AUTOMATION SYSTEMS
• 4.4 OPPORTUNITIES
  • 4.4.1 INCREASING ADOPTION OF IO-LINK IN AUTOMOTIVE INDUSTRY
  • 4.4.2 INCREASED USE IN ROBOTICS & COLLABORATIVE ROBOTS (COBOTS)
• 4.5 MARKET TRENDS
  • 4.5.1 ADOPTION OF WIRELESS IO-LINK
  • 4.5.2 RISING DEMAND FOR REMOTE MONITORING & CLOUD CONNECTIVITY
• 4.6 COVID-19 IMPACT ANALYSIS IO-LINK MARKET
  • 4.6.1 IMPACT ON OVERALL ICT
  • 4.6.2 IMPACT ON IO-LINK MARKET
  • 4.6.3 IMPACT ON SUPPLY CHAIN OF IO-LINK MARKET
  • 4.6.4 IMPACT ON MARKET DEMAND OF IO-LINK MARKET
  • 4.6.5 IMPACT ON PRICING OF IO-LINK MARKET

5 MARKET FACTOR ANALYSIS

• 5.1 SUPPLY CHAIN ANALYSIS
  • 5.1.1 COMPONENT MANUFACTURERS AND DEVICE PRODUCTION
  • 5.1.2 SYSTEM INTEGRATION & INDUSTRIAL AUTOMATION
  • 5.1.3 DISTRIBUTORS AND RESELLERS
  • 5.1.4 END USERS
• 5.2 PORTER'S FIVE FORCES MODEL
  • 5.2.1 THREAT OF NEW ENTRANTS
  • 5.2.2 BARGAINING POWER OF SUPPLIERS
  • 5.2.3 THREAT OF SUBSTITUTES
  • 5.2.4 BARGAINING POWER OF BUYERS
  • 5.2.5 INTENSITY OF RIVALRY

6 GLOBAL IO-LINK MARKET, BY TYPE

• 6.1 OVERVIEW
• 6.2 IO-LINK WIRED
• 6.3 IO-LINK WIRELESS

7 GLOBAL IO-LINK MARKET, BY COMPONENT

• 7.1 OVERVIEW
• 7.2 IO-LINK MASTERS
  • 7.2.1 PROFINET
  • 7.2.2 ETHERNEVIP
  • 7.2.3 MODBUS-TCP
  • 7.2.4 ETHERCAT
  • 7.2.5 MULTIPROTOCOL
  • 7.2.6 OTHERS
• 7.3 IO-LINK DEVICES
  • 7.3.1 SENSOR NODES
    • 7.3.1.1 POSITION SENSORS
    • 7.3.1.2 TEMPERATURE SENSORS
    • 7.3.1.3 PRESSURE SENSORS
    • 7.3.1.4 VIBRATION SENSORS
    • 7.3.1.5 OTHERS
  • 7.3.2 MODULES
  • 7.3.3 ACTUATORS
  • 7.3.4 RFID READ HEADS AND OTHERS

8 GLOBAL IO-LINK MARKET, BY INDUSTRY

• 8.1 OVERVIEW
• 8.2 PROCESS INDUSTRIES
  • 8.2.1 OIL & GAS
  • 8.2.2 CHEMICALS
  • 8.2.3 ENERGY & POWER
• 8.3 DISCRETE INDUSTRIES
  • 8.3.1 AUTOMOTIVE
  • 8.3.2 AEROSPACE & DEFENSE
  • 8.3.3 SEMICONDUCTORS & ELECTRONICS
  • 8.3.4 MACHINE MANUFACTURING
  • 8.3.5 PACKAGING
• 8.4 HYBRID INDUSTRIES
  • 8.4.1 PHARMACEUTICALS
  • 8.4.2 METALS & MINING
  • 8.4.3 FOOD & BEVERAGES
  • 8.4.4 CEMENT AND GLASS

9 GLOBAL IO-LINK MARKET, BY APPLICATION

• 9.1 OVERVIEW
• 9.2 MACHINE TOOLS
• 9.3 HANDLING AND ASSEMBLY AUTOMATION SYSTEMS
• 9.4 INTRALOGISTICS SOLUTIONS
• 9.5 PACKAGING AUTOMATION SOLUTIONS

10 GLOBAL IO LINK MARKET, BY REGION

• 10.1 OVERVIEW
  • 10.1.1 GLOBAL IO LINK MARKET, BY REGION, 2018-2032 (USD MILLION)
• 10.2 NORTH AMERICA
  • 10.2.1 US
  • 10.2.2 CANADA
  • 10.2.3 MEXICO
• 10.3 EUROPE
  • 10.3.1 GERMANY
  • 10.3.2 UK
  • 10.3.3 FRANCE
  • 10.3.4 RUSSIA
  • 10.3.5 ITALY
  • 10.3.6 SPAIN
  • 10.3.7 REST OF EUROPE
• 10.4 ASIA PACIFIC
  • 10.4.1 CHINA
  • 10.4.2 INDIA
  • 10.4.3 JAPAN
  • 10.4.4 SOUTH KOREA
  • 10.4.5 MALAYSIA
  • 10.4.6 THAILAND
  • 10.4.7 INDONESIA
  • 10.4.8 REST OF ASIA PACIFIC
• 10.5 SOUTH AMERICA
  • 10.5.1 BRAZIL
  • 10.5.2 ARGENTINA
  • 10.5.3 REST OF SOUTH AMERICA
• 10.6 MIDDLE EAST AND AFRICA
  • 10.6.1 GCC COUNTRIES
  • 10.6.2 SOUTH AFRICA
  • 10.6.3 REST OF MIDDLE EAST AND AFRICA

11 COMPETITIVE LANDSCAPE

• 11.1 INTRODUCTION
• 11.2 COMPETITIVE BENCHMARKING
• 11.3 VENDOR SHARE ANALYSIS
• 11.4 RECENT DEVELOPMENTS
  • 11.4.1 PRODUCT DEVELOPMENT

12 COMPANY PROFILES

• 12.1 TURCK INDIA AUTOMATION PVT. LTD.
  • 12.1.1 COMPANY OVERVIEW
  • 12.1.2 FINANCIAL OVERVIEW
  • 12.1.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • 12.1.4 KEY DEVELOPMENTS
  • 12.1.5 SWOT ANALYSIS
  • 12.1.6 KEY STRATEGIES
• 12.2 IFM ELECTRONICS.
  • 12.2.1 COMPANY OVERVIEW
  • 12.2.2 FINANCIAL OVERVIEW
  • 12.2.3 PRODUCTS/SERVICES/SOLUTIONS OFFERED
  • 12.2.4 KEY DEVELOPMENTS
  • 12.2.5 SWOT ANALYSIS
  • 12.2.6 KEY STRATEGIES
• 12.3 OMRON
  • 12.3.1 COMPANY OVERVIEW
  • 12.3.2 FINANCIAL OVERVIEW
  • 12.3.3 PRODUCTS/SERVICES/SOLUTIONS OFFERED
  • 12.3.4 KEY DEVELOPMENTS
  • 12.3.5 SWOT ANALYSIS
  • 12.3.6 KEY STRATEGIES
• 12.4 SIEMENS
  • 12.4.1 COMPANY OVERVIEW
  • 12.4.2 FINANCIAL OVERVIEW
  • 12.4.3 PRODUCTS/SERVICES/SOLUTIONS OFFERED
  • 12.4.4 KEY DEVELOPMENTS
  • 12.4.5 SWOT ANALYSIS
  • 12.4.6 KEY STRATEGIES
• 12.5 FESTO.
  • 12.5.1 COMPANY OVERVIEW
  • 12.5.2 FINANCIAL OVERVIEW
  • 12.5.3 PRODUCTS/SERVICES/SOLUTIONS OFFERED
  • 12.5.4 KEY DEVELOPMENTS
  • 12.5.5 SWOT ANALYSIS
  • 12.5.6 KEY STRATEGIES
• 12.6 SENSATA TECHNOLOGIES.
  • 12.6.1 COMPANY OVERVIEW
  • 12.6.2 FINANCIAL OVERVIEW
  • 12.6.3 PRODUCTS/SERVICES/SOLUTIONS OFFERED
  • 12.6.4 KEY DEVELOPMENTS
  • 12.6.5 SWOT ANALYSIS
  • 12.6.6 KEY STRATEGIES
• 12.7 ENDRESS+HAUSER
  • 12.7.1 COMPANY OVERVIEW
  • 12.7.2 FINANCIAL OVERVIEW
  • 12.7.3 PRODUCTS/SERVICES/SOLUTIONS OFFERED
  • 12.7.4 SWOT ANALYSIS
  • 12.7.5 KEY STRATEGIES
• 12.8 BANNER ENGINEERING.
  • 12.8.1 COMPANY OVERVIEW
  • 12.8.2 FINANCIAL OVERVIEW
  • 12.8.3 PRODUCTS OFFERED
  • 12.8.4 KEY DEVELOPMENTS
  • 12.8.5 SWOT ANALYSIS
  • 12.8.6 KEY STRATEGIES
• 12.9 ROCKWELL AUTOMATION
  • 12.9.1 COMPANY OVERVIEW
  • 12.9.2 FINANCIAL OVERVIEW
  • 12.9.3 PRODUCTS/SERVICES/SOLUTIONS OFFERED
  • 12.9.4 KEY DEVELOPMENTS
  • 12.9.5 SWOT ANALYSIS
  • 12.9.6 KEY STRATEGIES
• 12.10 PEPPERL+FUCHS
  • 12.10.1 COMPANY OVERVIEW
  • 12.10.2 FINANCIAL OVERVIEW
  • 12.10.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • 12.10.4 KEY DEVELOPMENTS
  • 12.10.5 SWOT ANALYSIS
  • 12.10.6 KEY STRATEGIES
• 12.11 SMC CORPORATION
  • 12.11.1 COMPANY OVERVIEW
  • 12.11.2 FINANCIAL OVERVIEW
  • 12.11.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • 12.11.4 KEY DEVELOPMENTS
  • 12.11.5 SWOT ANALYSIS
  • 12.11.6 KEY STRATEGIES
• 12.12 BELDEN INC
  • 12.12.1 COMPANY OVERVIEW
  • 12.12.2 FINANCIAL OVERVIEW
  • 12.12.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • 12.12.4 KEY DEVELOPMENTS
  • 12.12.5 SWOT ANALYSIS
  • 12.12.6 KEY STRATEGIES
• 12.13 STMICROELECTRONICS
  • 12.13.1 COMPANY OVERVIEW
  • 12.13.2 FINANCIAL OVERVIEW
  • 12.13.3 PRODUCTS OFFERED
  • 12.13.4 SWOT ANALYSIS
  • 12.13.5 KEY STRATEGIES
• 12.14 ANALOG DEVICES, INC.
  • 12.14.1 COMPANY OVERVIEW
  • 12.14.2 FINANCIAL OVERVIEW
  • 12.14.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • 12.14.4 KEY DEVELOPMENTS
  • 12.14.5 SWOT ANALYSIS
  • 12.14.6 KEY STRATEGIES
• 12.15 SICK AG.
  • 12.15.1 COMPANY OVERVIEW
  • 12.15.2 FINANCIAL OVERVIEW
  • 12.15.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • 12.15.4 KEY DEVELOPMENTS
  • 12.15.5 SWOT ANALYSIS
  • 12.15.6 KEY STRATEGIES