시장보고서
상품코드
1801272

세계의 무선 모듈 시장 : 모듈 유형별, 용도별, 산업별, 지역별(-2035년)

Global Wireless Modules Market Research Report by Module Type, by Application, by Industry Vertical, and by Region Forecast till 2035

발행일: | 리서치사: Market Research Future | 페이지 정보: 영문 317 Pages | 배송안내 : 즉시배송

    
    
    



※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

세계 무선 모듈 시장 규모는 예측 기간 동안 13.3%의 견고한 CAGR로 성장하여 2035년에는 524억 7,690만 달러에 달할 것으로 예상됩니다.

무선 모듈은 전자 시스템에 무선 통신 기능을 통합하기 위해 설계된 독립형 하드웨어 장치입니다. Wi-Fi, 블루투스, LTE 등의 프로토콜을 지원하며, CE 제품부터 미션 크리티컬한 산업용 네트워크까지 다양한 장치와 애플리케이션 간의 효율적인 데이터 교환을 가능하게 합니다.

무선 모듈 시장은 IoT의 보급과 스마트 기기의 급증으로 큰 성장을 이루고 있습니다. Wi-Fi는 여전히 IoT 연결에 가장 많이 활용되는 기술입니다. Wi-Fi 6/6E도 널리 사용되고 있으며, Wi-Fi 7은 멀티링크 운영 등의 혁신을 통해 최대 46Gbps의 초고속을 실현하고 있습니다. Bluetooth Low Energy 및 5G RedCap과 같은 보완적인 기술은 신뢰성이 높고 저전력으로 비용 효율적인 연결을 가능하게 하며, 스마트홈, 산업 자동화, 헬스케어, 기업 네트워크 등 다양한 IoT 애플리케이션을 지원합니다.

지역별 분석

미국은 북미 시장의 주요 견인차이며, IoT는 주로 스마트홈, 도시 이동성, 에너지 절약 인프라에 통합되어 있습니다. 북미 시장은 주로 미국(2024년 37억 9,680만 달러)이 주도하고 있으며, 캐나다가 3억 710만 달러를 추가하고 있습니다. 정부의 스마트 빌딩에 대한 막대한 투자와 5G의 빠른 보급으로 헬스케어, 제조, 물류 전반에 걸쳐 폭넓은 도입을 추진하고 있습니다.

유럽 시장은 주로 지속가능한 환경의 필요성과 인더스트리 4.0의 채택에 의해 형성되고 있습니다. 독일이 9억 6,060만 달러로 1위, 프랑스가 5억 1,540만 달러, 영국이 3억 9,470만 달러로 그 뒤를 잇고 있습니다. 에너지 관리, 재생에너지 통합, 예지보전을 위한 무선 사용은 제조 및 유틸리티 사업에서 무선 사용 산업을 확대했습니다.

아시아태평양은 무선 모듈의 가장 큰 소비 지역이며, 중국, 일본, 한국은 산업 자동화 및 스마트 인프라의 최전선에 있습니다. 스마트홈, 모빌리티, 공장의 IoT 도입은 일본의 Society 5.0이나 Digital India와 같은 정부 프로그램에 의해 촉진되어 왔습니다. 중국이 28억 6,580만 달러로 1위를 차지했으며, 일본(10억 8,100만 달러), 인도(7억 6,410만 달러), 한국(3억 9,700만 달러)이 뒤를 잇고 있습니다.

세계의 무선 모듈 시장을 조사했으며, 시장의 정의와 개요, 시장 성장에 영향을 미치는 각종 영향요인 분석, 시장 규모 추정과 예측, 각종 부문별·지역별·주요 국가별 분석, 경쟁 환경, 주요 기업 개요 등의 정보를 정리하여 전해드립니다.

목차

제1장 주요 요약

제2장 시장 개요

제3장 조사 방법

제4장 시장 역학

  • 성장 촉진요인
    • IoT 보급과 스마트 디바이스의 대두
    • 고속 연결을 위한 5G 및 Wi-Fi 7 도입
    • 스마트 시티와 인프라 프로젝트 확대
  • 성장 억제요인
    • 전력 소비 문제
    • 초기 도입 비용
    • 데이터 보안과 프라이버시에 관한 우려
  • 기회
    • 재생에너지와 분산형 전력망으로의 전환
    • 스마트 팩토리와 로봇 연결성 향상
  • 동향
    • Wi-Fi+Bluetooth 모듈로의 전환
    • 고성능 애플리케이션의 Wi-Fi 7 채용
  • COVID-19의 영향 분석

제5장 시장 요인 분석

  • 공급망 분석
  • Porter's Five Forces 분석

제6장 추가 인사이트

  • 시장 동향 : 무선 모듈
  • 시장 동향 : Wi-Fi 모듈
  • 시장 동향 : Bluetooth Low Energy(BLE) 모듈

제7장 세계의 무선 모듈 시장 : 모듈 유형별

  • Wi-Fi+Bluetooth 모듈
    • Wi-Fi 7·Bluetooth V5.4
    • Wi-Fi 7·Bluetooth V5.3
    • Wi-Fi 6·Bluetooth V5.4
    • Wi-Fi 6·Bluetooth LE 5.4
    • Wi-Fi 6 E·Bluetooth 5.4
    • Wi-Fi 5·Bluetooth 5.2
    • 기타
  • Wi-Fi 모듈
  • Bluetooth 모듈
    • 클래식 Bluetooth 모듈
    • Bluetooth LE 모듈
    • 듀얼 모드 Bluetooth 모듈
    • 오디오 스트리밍 모듈
    • 장거리 Bluetooth 모듈
  • 초광대역 모듈
    • 유형 2BP(일반적 IoT 디바이스)
    • 유형 2DK(태그 및 트래커)
    • 유형 2AB(UWB+BLE 콤보)
  • LORAWAN 모듈
  • RAMP ISM 모듈
  • 셀룰러 모듈
    • LTE-M 모듈
    • NB-IoT 모듈
    • 5G 모듈
    • 4G LTE 모듈
  • GNSS 측위 및 타이밍 모듈
  • IoT 모듈

제8장 세계의 무선 모듈 시장 : 용도별

  • 예측 보수
  • 커넥티드 필드 서비스
  • 콜드체인 모니터링
  • 환경 모니터링
  • 의료기기/피트니스 기기
  • 산업용 센서 네트워크
  • 빌딩 자동화
  • 비콘
  • 센서
  • 스마트 시티
  • 스마트 팩토리
  • 텔레매틱스
  • 자산 추적
  • 스마트 미터링
  • 기타

제9장 세계의 무선 모듈 시장 : 산업별

  • 농업
  • 건설
  • 물류·창고
  • 소매·E-Commerce
  • 헬스케어
  • 에너지 및 유틸리티
  • 운송
  • 반도체
  • 가전제품
  • 자동차
  • 기타

제10장 세계의 무선 모듈 시장 : 지역별

  • 개요
  • 북미
    • 미국
    • 캐나다
    • 멕시코
  • 유럽
    • 독일
    • 프랑스
    • 영국
    • 이탈리아
    • 스페인
    • 기타
  • 아시아태평양
    • 중국
    • 일본
    • 인도
    • 한국
    • 말레이시아
    • 태국
    • 인도네시아
    • 기타
  • 남미
    • 브라질
    • 아르헨티나
    • 기타
  • 중동 및 아프리카
    • GCC 국가
    • 남아프리카공화국
    • 기타

제11장 경쟁 구도

  • 경쟁 대시보드
  • 기업 시장 점유율 분석
  • 중국과 대만의 EMS 기업 점유율 분석(Wi-Fi+BLE 모듈)
  • Wi-Fi 및 BLE 모듈 총매출
  • 공개 기업 주식 : 요약
  • 비교 분석 : 주요 기업 재무
  • 주요 전개·성장 전략

제12장 기업 개요

  • MURATA MANUFACTURING CO. LTD.
  • SHENZHEN FEASYCOM CO., LTD.
  • QUECTEL
  • EZURIO
  • TEXAS INSTRUMENTS
  • TELIT CINTERION
  • PANASONIC INDUSTRIAL
  • SILICON LABORATORIES
  • MICROCHIP TECHNOLOGY INC.
  • U-BLOX AG
  • FN-LINK TECHNOLOGY LIMITED
  • CANSEC WIRELESS
  • NORDIC SEMICONDUCTOR
  • SHENZHEN RF-STAR TECHNOLOGY CO., LTD.
  • SHENZHEN OFEIXIN TECHNOLOGY CO., LTD
  • SHENZHEN BILIAN ELECTRONIC CO., LTD.
  • WISTRON NEWEB CORP
  • ASIARF CO., LTD.
  • USI GLOBAL
  • SHANGHAI MXCHIP INFORMATION TECHNOLOGY CO., LTD.
KSM 25.09.08

Global Wireless Modules Market Research Report by Module Type [Wi-Fi + Bluetooth Modules, Wi-Fi Modules, Bluetooth Modules, Ultra-Wideband Modules, LoRaWAN Modules, Range Amplified MultiPoint (RAMP) ISM Modules, Cellular Modules, GNSS Positioning and Timing Modules, Internet of Things (loT) Modules], by Application (Predictive Maintenance, Connected Field Services, Cold Chain Monitoring, Environmental Monitoring, Medical/ Fitness Devices, Industrial Sensor Networks, Building Automation, Beacons, Sensors, Smart City, Smart Factory, Telematics, Asset Tracking, Smart Metering, Others), by Industry Vertical (Agriculture, Construction, Logistics and Warehousing, Retail and E-Commerce, Healthcare, Energy and Utilities, Transportation, Semiconductors, Consumer Electronics, Automotive, Others), and by Region (North America, Europe, Asia Pacific, Middle East Africa, South America) Forecast till 2035

Industry Overview

The global wireless modules market is anticipated to attain USD 52,476.9 million by 2035, expanding at a robust CAGR of 13.3% over the forecast period. A wireless module is a self-contained hardware unit designed to embed wireless communication capabilities into electronic systems. By supporting protocols such as Wi-Fi, Bluetooth, and LTE, these modules allow efficient data exchange across devices and applications, ranging from consumer electronics to mission-critical industrial networks.

The wireless modules market is experiencing tremendous growth, to a large extent, due to the rising IoT adoption and the proliferation of smart devices. Wi-Fi keeps being the most utilized technology for IoT connectivity. Wi-Fi 6/6E is also being used extensively, and Wi-Fi 7 is giving very high speeds of up to 46 Gbps with the help of such innovations as Multi-Link Operation. Complementary technologies such as Bluetooth Low Energy and 5G RedCap enable reliable, low-power, and cost-effective connectivity, supporting a diverse range of IoT applications across smart homes, industrial automation, healthcare, and enterprise networks.

Major Company Development

By strategic product launches and a major repositioning, Ezurio has advanced its wireless connectivity dominance in 2024. The year began with Laird Connectivity reintroducing itself as Ezurio in March, uniting its expertise with Boundary Devices to strengthen industry-focused solutions. By June, Ezurio launched the Sona NX611, a Wi-Fi 6 module engineered to boost IIoT performance. The BL54L10 Series was revealed in November, incorporating Bluetooth LE, 802.15.4, and NFC through Nordic's nRF54 silicon as a trio for the best performance and security. With the help of innovation, efficiency, and enhanced wireless communication capabilities, the company not only continues its journey of being one of the best but also commits itself to the mission of powering diverse IoT applications.

Key Players

Major players in the global wireless modules market are Murata Manufacturing Co. Ltd., Shenzhen Feasycom Co., Ltd., Quectel, Ezurio, Texas Instruments, Telit Cinterion, Panasonic Industrial, Silicon Laboratories, Microchip Technology Inc., U-blox AG, FN-LINK TECHNOLOGY LIMITED, Cansec Wireless, Nordic Semiconductor, Shenzhen RF-star Technology Co., Ltd., Shenzhen Ofeixin Technology Co., Ltd, Shenzhen Bilian Electronic Co., Ltd., Wistron NeWeb Corp., AsiaRF Co., Ltd., USI Global, and Shanghai MXCHIP Information Technology Co., Ltd.

Report Attribute Details

Market Size 2035 USD 52,476.9 Million

CAGR (2025-2035) 13.3%

Base Year 2024

Market Forecast Period 2025-2035

Historical Data 2019-2024

Industry Segmentations

By Module Type: Wi-Fi + Bluetooth Modules - 14.9%, Wi-Fi Modules - 13.3%.

By Application: Predictive Maintenance - 12.3%, Connected Field Services - 14.0%.

By Industry Vertical: Agriculture - 8.2%, Construction - 12.7%.

Regional Analysis

The US is the main driver for the North American market, where IoT is being integrated mainly in smart homes, urban mobility, and energy-efficient infrastructure. The North American market is largely shaped by the US at USD 3,796.8 million in 2024, with Canada adding USD 307.1 million. The government's heavy investment in smart buildings and the accelerated rollout of 5G are driving widespread adoption across healthcare, manufacturing, and logistics.

Europe is the wireless modules market, shaped mainly by the need for a sustainable environment and the adoption of Industry 4.0. Germany leads at USD 960.6 million, followed by France at USD 515.4 million and the UK at USD 394.7 million. The wireless usage for energy management, renewable integration, and predictive maintenance has broadened the industry of manufacturing and utilities in which wireless is being used.

The APAC region is the largest consumer of wireless modules, while China, Japan, and South Korea are at the forefront of industrial automation and smart infrastructure. The IoT adoption in smart homes, mobility, and factories has been encouraged by government programs like Society 5.0 in Japan and Digital India. China tops the market with USD 2,865.8 million, supported by Japan (USD 1,008.1 million), India (USD 764.1 million), and South Korea (USD 397.0 million).

South America's demand is expanding through smart agriculture, urban IoT projects, and automotive automation. Brazil's precision farming programs, Argentina's smart grid initiatives, and Colombia's innovation districts are accelerating adoption. Wireless modules are becoming critical for enhancing efficiency in energy, logistics, and connected vehicles across the continent.

MEA's growth is tied to large-scale smart city initiatives like Saudi Arabia's NEOM and the UAE's Dubai 2040 vision. Wireless modules are powering smart grids, connected mobility, and Industry 4.0 applications across manufacturing and construction. Heavy investments in 5G, renewable energy systems, and autonomous transport are driving long-term adoption in the region.

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

2 MARKET INTRODUCTION

  • 2.1 DEFINITION
  • 2.2 SCOPE OF THE STUDY
  • 2.3 RESEARCH OBJECTIVE
  • 2.4 MARKET STRUCTURE

3 RESEARCH METHODOLOGY

  • 3.1 OVERVIEW
  • 3.2 DATA FLOW
    • 3.2.1 DATA MINING PROCESS
  • 3.3 PURCHASED DATABASE:
  • 3.4 SECONDARY SOURCES:
    • 3.4.1 SECONDARY RESEARCH DATA FLOW:
  • 3.5 PRIMARY RESEARCH:
    • 3.5.1 PRIMARY RESEARCH DATA FLOW:
    • 3.5.2 PRIMARY RESEARCH: NUMBER OF INTERVIEWS CONDUCTED
    • 3.5.3 PRIMARY RESEARCH: REGIONAL COVERAGE
  • 3.6 APPROACHES FOR MARKET SIZE ESTIMATION:
    • 3.6.1 CONSUMPTION & NET TRADE APPROACH
    • 3.6.2 REVENUE ANALYSIS APPROACH
  • 3.7 DATA FORECASTING
    • 3.7.1 DATA FORECASTING TECHNIQUE
  • 3.8 DATA MODELING
    • 3.8.1 MICROECONOMIC FACTOR ANALYSIS:
    • 3.8.2 DATA MODELING:
  • 3.9 TEAMS AND ANALYST CONTRIBUTION

4 MARKET DYNAMICS

  • 4.1 OVERVIEW
  • 4.2 DRIVERS
    • 4.2.1 RISING IOT ADOPTION & SMART DEVICES
    • 4.2.2 DEPLOYMENT OF 5G & WI-FI 7 FOR HIGH-SPEED CONNECTIVITY
    • 4.2.3 EXPANSION OF SMART CITIES & INFRASTRUCTURE PROJECTS
  • 4.3 RESTRAINTS
    • 4.3.1 POWER CONSUMPTION ISSUES
    • 4.3.2 HIGH INITIAL DEPLOYMENT COST
    • 4.3.3 DATA SECURITY & PRIVACY CONCERNS
  • 4.4 OPPORTUNITIES
    • 4.4.1 SHIFT TOWARD RENEWABLE ENERGY AND DECENTRALIZED POWER GRIDS
    • 4.4.2 RISE IN SMART FACTORIES & ROBOTICS CONNECTIVITY
  • 4.5 TRENDS
    • 4.5.1 TRANSITION TO WI-FI + BLUETOOTH MODULES
    • 4.5.2 WI-FI 7 ADOPTION IN HIGH-PERFORMANCE APPLICATIONS
  • 4.6 COVID-19 IMPACT ANALYSIS
    • 4.6.1 IMPACT ON SEMICONDUCTOR MANUFACTURERS
    • 4.6.2 IMPACT ON WIRELESS MODULES MARKET
    • 4.6.3 IMPACT OF MARKET DEMAND
    • 4.6.4 IMPACT OF MARKET PRICING

5 MARKET FACTOR ANALYSIS

  • 5.1 SUPPLY CHAIN ANALYSIS
    • 5.1.1 RAW MATERIAL SOURCING & COMPONENT MANUFACTURING
    • 5.1.2 WIRELESS MODULES DEVELOPMENT AND MANUFACTURING
    • 5.1.3 DISTRIBUTION CHANNELS
    • 5.1.4 CUSTOMERS/END USERS
  • 5.2 PORTER'S FIVE FORCE ANALYSIS
    • 5.2.1 THREAT OF NEW ENTRANTS
    • 5.2.2 BARGAINING POWER OF SUPPLIERS
    • 5.2.3 THREAT OF SUBSTITUTES
    • 5.2.4 BARGAINING POWER OF BUYERS
    • 5.2.5 INTENSITY OF RIVALRY

6 ADDITIONAL INSIGHTS

  • 6.1 WIRELESS MODULES MARKET TRENDS
  • 6.2 WIFI MODULES MARKET TRENDS
  • 6.3 BLUETOOTH LOW ENERGY (BLE) MODULES MARKET TRENDS

7 GLOBAL WIRELESS MODULES MARKET, BY MODULE TYPE

  • 7.1 INTRODUCTION
  • 7.2 WI-FI + BLUETOOTH MODULES
    • 7.2.1 WI-FI 7 AND BLUETOOTH V5.4
    • 7.2.2 WI-FI 7 AND BLUETOOTH V5.3
    • 7.2.3 WI-FI 6 AND BLUETOOTH V5.4
    • 7.2.4 WI-FI 6 AND BLUETOOTH LE 5.4
    • 7.2.5 WI-FI 6E AND BLUETOOTH 5.4
    • 7.2.6 WI-FI 5 AND BLUETOOTH 5.2
    • 7.2.7 OTHERS
  • 7.3 WI-FI MODULES
  • 7.4 BLUETOOTH MODULES
    • 7.4.1 CLASSIC BLUETOOTH MODULES
    • 7.4.2 BLUETOOTH LE MODULES
    • 7.4.3 DUAL-MODE BLUETOOTH MODULES
    • 7.4.4 AUDIO STREAMING MODULES
    • 7.4.5 LONG-RANGE BLUETOOTH MODULES
  • 7.5 ULTRA-WIDEBAND MODULES
    • 7.5.1 TYPE 2BP (GENERAL IOT DEVICES)
    • 7.5.2 TYPE 2DK (TAGS AND TRACKERS)
    • 7.5.3 TYPE 2AB (UWB+BLE COMBO)
  • 7.6 LORAWAN MODULES
  • 7.7 RANGE AMPLIFIED MULTIPOINT (RAMP) ISM MODULES
  • 7.8 CELLULAR MODULES
    • 7.8.1 LTE-M MODULES
    • 7.8.2 NB-IOT MODULES
    • 7.8.3 5G MODULES
    • 7.8.4 4G LTE MODULES
  • 7.9 GNSS POSITIONING AND TIMING MODULES
  • 7.10 INTERNET OF THINGS (IOT) MODULES

8 GLOBAL WIRELESS MODULES MARKET, BY APPLICATION

  • 8.1 INTRODUCTION
  • 8.2 PREDICTIVE MAINTENANCE
  • 8.3 CONNECTED FIELD SERVICES
  • 8.4 COLD CHAIN MONITORING
  • 8.5 ENVIRONMENTAL MONITORING
  • 8.6 MEDICAL/ FITNESS DEVICES
  • 8.7 INDUSTRIAL SENSOR NETWORKS
  • 8.8 BUILDING AUTOMATION
  • 8.9 BEACONS
  • 8.10 SENSORS
  • 8.11 SMART CITY
  • 8.12 SMART FACTORY
  • 8.13 TELEMATICS
  • 8.14 ASSET TRACKING
  • 8.15 SMART METERING
  • 8.16 OTHERS

9 GLOBAL WIRELESS MODULES MARKET, BY INDUSTRY VERTICAL

  • 9.1 INTRODUCTION
  • 9.2 AGRICULTURE
  • 9.3 CONSTRUCTION
  • 9.4 LOGISTICS AND WAREHOUSING
  • 9.5 RETAIL AND E-COMMERCE
  • 9.6 HEALTHCARE
  • 9.7 ENERGY AND UTILITIES
  • 9.8 TRANSPORTATION
  • 9.9 SEMICONDUCTORS
  • 9.10 CONSUMER ELECTRONICS
  • 9.11 AUTOMOTIVE
  • 9.12 OTHERS

10 GLOBAL WIRELESS MODULES MARKET, BY REGION

  • 10.1 OVERVIEW
  • 10.2 NORTH AMERICA
    • 10.2.1 US
    • 10.2.2 CANADA
    • 10.2.3 MEXICO
  • 10.3 EUROPE
    • 10.3.1 GERMANY
    • 10.3.2 FRANCE
    • 10.3.3 UK
    • 10.3.4 ITALY
    • 10.3.5 SPAIN
    • 10.3.6 REST OF EUROPE
  • 10.4 ASIA PACIFIC
    • 10.4.1 CHINA
    • 10.4.2 JAPAN
    • 10.4.3 INDIA
    • 10.4.4 SOUTH KOREA
    • 10.4.5 MALAYSIA
    • 10.4.6 THAILAND
    • 10.4.7 INDONESIA
    • 10.4.8 REST OF ASIA-PACIFIC
  • 10.5 SOUTH AMERICA
    • 10.5.1 BRAZIL
    • 10.5.2 ARGENTINA
    • 10.5.3 REST OF SOUTH AMERICA
  • 10.6 MIDDLE EAST AFRICA
    • 10.6.1 GCC COUNTRIES
    • 10.6.2 SOUTH AFRICA
    • 10.6.3 REST OF MIDDLE EAST AFRICA

11 COMPETITIVE LANDSCAPE

  • 11.1 INTRODUCTION
  • 11.2 COMPETITOR DASHBOARD
    • 11.2.1 COMPETITOR DASHBOARD - WIRELESS MODULES
    • 11.2.2 COMPETITOR DASHBOARD - BLE AND WI-FI MODULE
  • 11.3 COMPANY MARKET SHARE ANALYSIS, 2024
    • 11.3.1 GLOBAL WIRELESS MODULES - COMPANY MARKET SHARE ANALYSIS, 2024
    • 11.3.2 GLOBAL WIFI MODULES - COMPANY MARKET SHARE ANALYSIS, 2024
    • 11.3.3 GLOBAL BLE MODULES COMPANY MARKET SHARE ANALYSIS, 2024
  • 11.4 CHINA AND TAIWAN (WIFI + BLE MODULES) EMS COMPANY SHARE ANALYSIS
    • 11.4.1 CHINA AND TAIWAN (BLE MODULES) EMS COMPANY SWOT ANALYSIS
    • 11.4.2 CHINA AND TAIWAN (WIFI MODULES) EMS COMPANY SWOT ANALYSIS
  • 11.5 WI-FI AND BLE MODULES TOTAL SALES
  • 11.6 PUBLIC PLAYERS STOCK SUMMARY
  • 11.7 COMPARATIVE ANALYSIS: KEY PLAYERS FINANCIAL
  • 11.8 KEY DEVELOPMENTS & GROWTH STRATEGIES
    • 11.8.1 NEW PRODUCT LAUNCH/ DEVELOPMENT
    • 11.8.2 PARTNERSHIP MERGER & ACQUISITION
    • 11.8.3 CONTRACTS & AGREEMENTS
    • 11.8.4 EXPANSIONS & INVESTMENTS

12 COMPANY PROFILES

  • 12.1 MURATA MANUFACTURING CO. LTD.
    • 12.1.1 COMPANY OVERVIEW
    • 12.1.2 FINANCIAL OVERVIEW
    • 12.1.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.1.4 KEY DEVELOPMENTS
    • 12.1.5 SWOT ANALYSIS
    • 12.1.6 KEY STRATEGIES
      • 12.1.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.2 SHENZHEN FEASYCOM CO., LTD.
    • 12.2.1 COMPANY OVERVIEW
    • 12.2.2 FINANCIAL OVERVIEW
    • 12.2.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.2.4 KEY DEVELOPMENTS
    • 12.2.5 SWOT ANALYSIS
    • 12.2.6 KEY STRATEGIES
      • 12.2.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.3 QUECTEL
    • 12.3.1 COMPANY OVERVIEW
    • 12.3.2 FINANCIAL OVERVIEW
    • 12.3.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.3.4 KEY DEVELOPMENTS
    • 12.3.5 SWOT ANALYSIS
    • 12.3.6 KEY STRATEGIES
      • 12.3.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.4 EZURIO
    • 12.4.1 COMPANY OVERVIEW
    • 12.4.2 FINANCIAL OVERVIEW
    • 12.4.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.4.4 KEY DEVELOPMENTS
    • 12.4.5 SWOT ANALYSIS
    • 12.4.6 KEY STRATEGIES
      • 12.4.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.5 TEXAS INSTRUMENTS
    • 12.5.1 COMPANY OVERVIEW
    • 12.5.2 FINANCIAL OVERVIEW
    • 12.5.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.5.4 KEY DEVELOPMENTS
    • 12.5.5 SWOT ANALYSIS
    • 12.5.6 KEY STRATEGIES
      • 12.5.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.6 TELIT CINTERION
    • 12.6.1 COMPANY OVERVIEW
    • 12.6.2 FINANCIAL OVERVIEW
    • 12.6.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.6.4 KEY DEVELOPMENTS
    • 12.6.5 SWOT ANALYSIS
    • 12.6.6 KEY STRATEGIES
      • 12.6.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.7 PANASONIC INDUSTRIAL
    • 12.7.1 COMPANY OVERVIEW
    • 12.7.2 FINANCIAL OVERVIEW
    • 12.7.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.7.4 KEY DEVELOPMENTS
    • 12.7.5 SWOT ANALYSIS
    • 12.7.6 KEY STRATEGIES
      • 12.7.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.8 SILICON LABORATORIES
    • 12.8.1 COMPANY OVERVIEW
    • 12.8.2 FINANCIAL OVERVIEW
    • 12.8.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.8.4 KEY DEVELOPMENTS
    • 12.8.5 SWOT ANALYSIS
    • 12.8.6 KEY STRATEGIES
      • 12.8.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.9 MICROCHIP TECHNOLOGY INC.
    • 12.9.1 COMPANY OVERVIEW
    • 12.9.2 FINANCIAL OVERVIEW
    • 12.9.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.9.4 KEY DEVELOPMENTS
    • 12.9.5 SWOT ANALYSIS
    • 12.9.6 KEY STRATEGIES
      • 12.9.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.10 U-BLOX AG
    • 12.10.1 COMPANY OVERVIEW
    • 12.10.2 FINANCIAL OVERVIEW
    • 12.10.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.10.4 KEY DEVELOPMENTS
    • 12.10.5 SWOT ANALYSIS
    • 12.10.6 KEY STRATEGIES
      • 12.10.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.11 FN-LINK TECHNOLOGY LIMITED
    • 12.11.1 COMPANY OVERVIEW
    • 12.11.2 FINANCIAL OVERVIEW
    • 12.11.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.11.4 KEY DEVELOPMENTS
    • 12.11.5 SWOT ANALYSIS
    • 12.11.6 KEY STRATEGIES
      • 12.11.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.12 CANSEC WIRELESS
    • 12.12.1 COMPANY OVERVIEW
    • 12.12.2 FINANCIAL OVERVIEW
    • 12.12.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.12.4 KEY DEVELOPMENTS
    • 12.12.5 SWOT ANALYSIS
    • 12.12.6 KEY STRATEGIES
      • 12.12.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.13 NORDIC SEMICONDUCTOR
    • 12.13.1 COMPANY OVERVIEW
    • 12.13.2 FINANCIAL OVERVIEW
    • 12.13.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.13.4 KEY DEVELOPMENTS
    • 12.13.5 SWOT ANALYSIS
    • 12.13.6 KEY STRATEGIES
      • 12.13.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.14 SHENZHEN RF-STAR TECHNOLOGY CO., LTD.
    • 12.14.1 COMPANY OVERVIEW
    • 12.14.2 FINANCIAL OVERVIEW
    • 12.14.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.14.4 KEY DEVELOPMENTS
    • 12.14.5 SWOT ANALYSIS
    • 12.14.6 KEY STRATEGIES
      • 12.14.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.15 SHENZHEN OFEIXIN TECHNOLOGY CO., LTD
    • 12.15.1 COMPANY OVERVIEW
    • 12.15.2 FINANCIAL OVERVIEW
    • 12.15.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.15.4 KEY DEVELOPMENTS
    • 12.15.5 SWOT ANALYSIS
    • 12.15.6 KEY STRATEGIES
      • 12.15.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.16 SHENZHEN BILIAN ELECTRONIC CO., LTD.
    • 12.16.1 COMPANY OVERVIEW
    • 12.16.2 FINANCIAL OVERVIEW
    • 12.16.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.16.4 KEY DEVELOPMENTS
    • 12.16.5 SWOT ANALYSIS
    • 12.16.6 KEY STRATEGIES
      • 12.16.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.17 WISTRON NEWEB CORP
    • 12.17.1 COMPANY OVERVIEW
    • 12.17.2 FINANCIAL OVERVIEW
    • 12.17.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.17.4 KEY DEVELOPMENTS
    • 12.17.5 SWOT ANALYSIS
    • 12.17.6 KEY STRATEGIES
      • 12.17.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.18 ASIARF CO., LTD.
    • 12.18.1 COMPANY OVERVIEW
    • 12.18.2 FINANCIAL OVERVIEW
    • 12.18.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.18.4 KEY DEVELOPMENTS
    • 12.18.5 SWOT ANALYSIS
    • 12.18.6 KEY STRATEGIES
      • 12.18.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.19 USI GLOBAL
    • 12.19.1 COMPANY OVERVIEW
    • 12.19.2 FINANCIAL OVERVIEW
    • 12.19.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.19.4 KEY DEVELOPMENTS
    • 12.19.5 SWOT ANALYSIS
    • 12.19.6 KEY STRATEGIES
      • 12.19.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
  • 12.20 SHANGHAI MXCHIP INFORMATION TECHNOLOGY CO., LTD.
    • 12.20.1 COMPANY OVERVIEW
    • 12.20.2 FINANCIAL OVERVIEW
    • 12.20.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • 12.20.4 KEY DEVELOPMENTS
    • 12.20.5 SWOT ANALYSIS
    • 12.20.6 KEY STRATEGIES
      • 12.20.6.1 KEY STRATEGIES - PRODUCTION FACILITIES AND EQUIPMENT
샘플 요청 목록
0 건의 상품을 선택 중
목록 보기
전체삭제