세계의 인터커넥트 및 수동 부품 시장(-2035년) : 제품 유형별, 기술별, 최종사용자별, 지역별

Global Interconnects and Passive Components Market Research Report by Product Type [Interconnects, Passive Components, Electromechanical Components (Emech)], by Technology [Optical Interconnects, Wireless Interconnects, High-Speed Connectors (USB, HDMI, etc.), 5G and Telecom Infrastructure, Surface Mount Technology (SMT) Components, MEMS-based Components (Micro-Electromechanical Systems), Smart Electromechanical Systems (IoT-enabled), Microactuators Robotics Integration, Others], by End User (Automotive, Consumer Electronics, Telecommunications, Industrial Equipment Manufacturing, Medical Devices Healthcare, Aerospace Defense, IT Data Centers, Power Generation Distribution, Robotics, Energy Utilities, Others), and by Region (North America, Europe, Asia Pacific, South America, Middle East & Africa) Forecast till 2035

Industry Overview

The global interconnects and passive components market is expected to attain a valuation of USD 267,673.81 million, growing steadily at a 5.0% CAGR over the forecast period. Interconnects refer to the physical connections, like connectors, sockets, and circuit traces, that allow communication between electronic modules. Passive components, on the other hand, include devices such as resistors, capacitors, and inductors that manage energy without amplifying or producing it. These elements ensure stability, efficiency, and functionality in electronic systems.

One of the most powerful growth drivers for the global Interconnects and Passive Components Market is the general installation of the 5G network. This change in technology makes the use of components with high performance that are able to handle data transmissions of huge volumes, low latency, and wide network coverage a must. The application of smart cities, autonomous mobility, industrial IoT, and digital healthcare is intensively increasing the needs of advanced antennas, base stations, and connectors.

Major Company Development

The main changes at Samsung Electro-Mechanics made the company's strategy widely known to be based on innovation and partnerships. The firm presented its MLCC for cars in February 2025 and new power inductors in September 2024. By signing a contract with AMD for the development of advanced data center substrates in July 2024, the company has taken the step to consolidate its leadership in technology. Prior to that, in January 2022, Hanwha Solutions obtained part of Samsung's wireless module business, indicating a significant restructuring move.

Key Players

Major competitors in the global interconnects and passive components market include KYOCERA Corporation, Murata Manufacturing Co., Ltd., Samsung Electro-Mechanics, TDK Corporation, TAIYO YUDEN, Molex Incorporated, Amphenol Corporation, Vishay Intertechnology Inc., TE Connectivity Corporation, and Hirose Electric Co.

Report Attribute Details

• Market Size 2035: USD 267,673.81 Million
• CAGR (2025-2035): 5.0%
• Base Year: 2024
• Market Forecast Period: 2025-2035

Industry Segmentations

• By Product Type: Interconnects - 6.0%, Passive Components - 4.5%.
• By Technology: Optical Interconnects - 4.8%, Wireless Interconnects - 4.2%.
• By End User: Automotive - 6.5%, Consumer Electronics - 4.6%.

Regional Analysis

The North American market is both mature and growing. The demand is mainly based on 5G, EVs, and advanced industrial systems. The FCC and DOE are among the government agencies that have a lead role in speeding up 5G rollouts and the EV sector. In 2024, North America sees strong performance, driven by the U.S. at USD 30.70 million alongside Canada's USD 3.80 million contribution.

Europe is said to be facing market growth that is heavily dependent on its far-reaching renewable energy programs and the vigor of its automotive industry. Just the car industry in Germany by itself is still creating great demand for high-quality parts used in advanced vehicles for a very long time to come. The European market highlights consistent demand, with the UK and France leading Germany in component consumption

Asia-Pacific is the most significant growth source, due to its consumer electronics manufacturing and IoT adoption, which are both globally dominant. China, Japan, South Korea, and Taiwan have a substantial presence in high-tech electronics, and increasing disposable incomes are the main drivers of local consumption. Asia-Pacific remains the growth leader, led by China's significant USD 34.11 million share, reinforced by Japan and India's rising demand.

Digital transformation across MEA is spurring demand for advanced interconnect and passive components. Saudi Arabia's investments in building ultra-fast networks and South Africa's electronics production capacity demonstrate the region's rising importance in global supply chains. Expansion across telecom and automotive segments supports further growth.

The South American market continues to grow steadily, with Brazil, Argentina, and Mexico leading investments in consumer electronics and telecom infrastructure. Brazil's digital economy initiatives and IoT promotion programs are creating strong demand for interconnect solutions. Rising smartphone penetration and energy-efficient technology adoption also contribute to expansion.

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

2 MARKET INTRODUCTION

• 2.1 DEFINITION
• 2.2 SCOPE OF THE STUDY
• 2.3 RESEARCH OBJECTIVE
• 2.4 MARKET STRUCTURE

3 RESEARCH METHODOLOGY

• 3.1 OVERVIEW
• 3.2 DATA FLOW
  • 3.2.1 DATA MINING PROCESS
• 3.3 PURCHASED DATABASE:
• 3.4 SECONDARY SOURCES:
  • 3.4.1 SECONDARY RESEARCH DATA FLOW:
• 3.5 PRIMARY RESEARCH:
  • 3.5.1 PRIMARY RESEARCH DATA FLOW:
  • 3.5.2 PRIMARY RESEARCH: NUMBER OF INTERVIEWS CONDUCTED
  • 3.5.3 PRIMARY RESEARCH: REGIONAL COVERAGE
• 3.6 APPROACHES FOR MARKET SIZE ESTIMATION:
  • 3.6.1 CONSUMPTION & NET TRADE APPROACH
  • 3.6.2 REVENUE ANALYSIS APPROACH
• 3.7 DATA FORECASTING
  • 3.7.1 DATA FORECASTING TECHNIQUE
• 3.8 DATA MODELING
  • 3.8.1 MICROECONOMIC FACTOR ANALYSIS:
  • 3.8.2 DATA MODELING:
• 3.9 TEAMS AND ANALYST CONTRIBUTION

4 MARKET DYNAMICS

• 4.1 INTRODUCTION
• 4.2 MARKET TRENDS AND GROWTH AFFECTING FACTORS
• 4.3 DRIVERS
  • 4.3.1 GROWING DEMAND FOR CONSUMER ELECTRONICS
  • 4.3.2 ADVANCEMENTS IN 5G AND IOT TECHNOLOGIES
  • 4.3.3 INCREASE IN AUTOMOTIVE ELECTRONICS
  • 4.3.4 SHIFT TOWARDS ENERGY-EFFICIENT SOLUTIONS
  • 4.3.5 RISING RD INVESTMENT IN SEMICONDUCTOR TECHNOLOGIES
• 4.4 RESTRAINTS
  • 4.4.1 SUPPLY CHAIN DISRUPTIONS
  • 4.4.2 HIGH MANUFACTURING COSTS
  • 4.4.3 STRINGENT REGULATORY REQUIREMENTS
  • 4.4.4 RAPID TECHNOLOGICAL CHANGES
  • 4.4.5 GLOBAL ECONOMIC UNCERTAINTY
• 4.5 OPPORTUNITY
  • 4.5.1 EXPANSION OF 5G INFRASTRUCTURE
  • 4.5.2 GROWTH IN EMERGING MARKETS
  • 4.5.3 INTEGRATION OF AI AND MACHINE LEARNING IN ELECTRONICS
  • 4.5.4 ENHANCEMENTS IN MINIATURIZATION AND PACKAGING TECHNOLOGIES
  • 4.5.5 INCREASED FOCUS ON SUSTAINABLE AND RECYCLABLE MATERIALS
• 4.6 IMPACT ANALYSIS OF COVID-19
  • 4.6.1 IMPACT ON OVERALL SEMICONDUCTOR
  • 4.6.2 IMPACT ON GLOBAL INTERCONNECTS AND PASSIVE COMPONENTS MARKET
  • 4.6.3 IMPACT ON SUPPLY CHAIN OF INTERCONNECTS AND PASSIVE COMPONENTS MARKET
  • 4.6.4 IMPACT ON MARKET DEMAND OF INTERCONNECTS AND PASSIVE COMPONENTS MARKET
  • 4.6.5 IMPACT ON PRICING OF INTERCONNECTS AND PASSIVE COMPONENTS MARKET

5 MARKET FACTOR ANALYSIS

• 5.1 VALUE CHAIN ANALYSIS
  • 5.1.1 DESIGN & DEVELOPMENT
  • 5.1.2 RAW MATERIAL SUPPLIERS
  • 5.1.3 COMPONENT MANUFACTURING
  • 5.1.4 SYSTEM INTEGRATION
  • 5.1.5 END USERS
• 5.2 PORTER'S FIVE FORCES MODEL
  • 5.2.1 THREAT OF NEW ENTRANTS
  • 5.2.2 BARGAINING POWER OF SUPPLIERS
  • 5.2.3 BARGAINING POWER OF BUYERS
  • 5.2.4 THREAT OF SUBSTITUTES
  • 5.2.5 INTENSITY OF RIVALRY

6 GLOBAL INTERCONNECTS AND PASSIVE COMPONENTS MARKET, BY PRODUCT TYPE

• 6.1 INTRODUCTION
• 6.2 INTERCONNECTS
• 6.3 PASSIVE COMPONENTS
• 6.4 ELECTROMECHANICAL COMPONENTS (EMECH)

7 GLOBAL INTERCONNECTS AND PASSIVE COMPONENTS MARKET, BY TECHNOLOGY

• 7.1 INTRODUCTION
• 7.2 OPTICAL INTERCONNECTS
• 7.3 WIRELESS INTERCONNECTS
• 7.4 HIGH-SPEED CONNECTORS (USB, HDMI, ETC.)
• 7.5 5G AND TELECOM INFRASTRUCTURE
• 7.6 SURFACE MOUNT TECHNOLOGY (SMT) COMPONENTS
• 7.7 MEMS-BASED COMPONENTS (MICRO ELECTROMECHANICAL SYSTEMS)
• 7.8 SMART ELECTROMECHANICAL SYSTEMS (IOT-ENABLED)
• 7.9 MICROACTUATORS & ROBOTICS INTEGRATION
• 7.10 OTHERS

8 GLOBAL INTERCONNECTS AND PASSIVE COMPONENTS MARKET, BY END USER

• 8.1 INTRODUCTION
• 8.2 AUTOMOTIVE
• 8.3 CONSUMER ELECTRONICS
• 8.4 TELECOMMUNICATIONS
• 8.5 INDUSTRIAL EQUIPMENT & MANUFACTURING
• 8.6 MEDICAL DEVICES & HEALTHCARE
• 8.7 AEROSPACE & DEFENSE
• 8.8 IT & DATA CENTERS
• 8.9 POWER GENERATION & DISTRIBUTION
• 8.10 ROBOTICS
• 8.11 ENERGY & UTILITIES
• 8.12 OTHERS

9 GLOBAL INTERCONNECTS AND PASSIVE COMPONENTS MARKET, BY REGION

• 9.1 INTRODUCTION
• 9.2 NORTH AMERICA
  • 9.2.1 US
  • 9.2.2 CANADA
  • 9.2.3 MEXICO
• 9.3 EUROPE
  • 9.3.1 GERMANY
  • 9.3.2 UK
  • 9.3.3 FRANCE
  • 9.3.4 RUSSIA
  • 9.3.5 ITALY
  • 9.3.6 SPAIN
  • 9.3.7 REST OF EUROPE
• 9.4 ASIA PACIFIC
  • 9.4.1 CHINA
  • 9.4.2 INDIA
  • 9.4.3 JAPAN
  • 9.4.4 SOUTH KOREA
  • 9.4.5 MALAYSIA
  • 9.4.6 THAILAND
  • 9.4.7 INDONESIA
  • 9.4.8 REST OF ASIA PACIFIC
• 9.5 SOUTH AMERICA
  • 9.5.1 BRAZIL
  • 9.5.2 ARGENTINA
  • 9.5.3 REST OF SOUTH AMERICA
• 9.6 MIDDLE EAST AFRICA
  • 9.6.1 GCC COUNTRIES
  • 9.6.2 SOUTH AFRICA
  • 9.6.3 REST OF MIDDLE EAST AFRICA

10 COMPETITIVE LANDSCAPE

• 10.1 INTRODUCTION
• 10.2 MARKET SHARE ANALYSIS, 2023
• 10.3 COMPETITOR DASHBOARD
• 10.4 PUBLIC PLAYERS STOCK SUMMARY
• 10.5 COMPARATIVE ANALYSIS: KEY PLAYERS FINANCIAL
• 10.6 KEY DEVELOPMENTS & GROWTH STRATEGIES
  • 10.6.1 NEW PRODUCT DEVELOPMENT, EXPANSION,
  • 10.6.2 MERGER AND ACQUISTION
  • 10.6.3 PARTNERSHIPS/ COLLABORATION/OTHERS/AGREEMENT/EXPANSION/INVESTMENT

11 COMPANY PROFILE

• 11.1 KYOCERA CORPORATION
  • 11.1.1 COMPANY OVERVIEW
  • 11.1.2 FINANCIAL OVERVIEW
  • 11.1.3 PRODUCTS OFFERED
  • 11.1.4 KEY DEVELOPMENTS
  • 11.1.5 SWOT ANALYSIS
  • 11.1.6 KEY STRATEGIES
• 11.2 MURATA MANUFACTURING CO., LTD.
  • 11.2.1 COMPANY OVERVIEW
  • 11.2.2 FINANCIAL OVERVIEW
  • 11.2.3 PRODUCTS OFFERED
  • 11.2.4 KEY DEVELOPMENTS
  • 11.2.5 SWOT ANALYSIS
  • 11.2.6 KEY STRATEGIES
• 11.3 SAMSUNG ELECTRO-MECHANICS
  • 11.3.1 COMPANY OVERVIEW
  • 11.3.2 FINANCIAL OVERVIEW
  • 11.3.3 PRODUCTS OFFERED
  • 11.3.4 KEY DEVELOPMENTS
  • 11.3.5 SWOT ANALYSIS
  • 11.3.6 KEY STRATEGIES
• 11.4 TDK CORPORATION
  • 11.4.1 COMPANY OVERVIEW
  • 11.4.2 FINANCIAL OVERVIEW
  • 11.4.3 PRODUCTS OFFERED
  • 11.4.4 KEY DEVELOPMENTS
  • 11.4.5 SWOT ANALYSIS
  • 11.4.6 KEY STRATEGIES
• 11.5 TAIYO YUDEN CO., LTD.
  • 11.5.1 COMPANY OVERVIEW
  • 11.5.2 FINANCIAL OVERVIEW
  • 11.5.3 PRODUCTS OFFERED
  • 11.5.4 KEY DEVELOPMENTS
  • 11.5.5 SWOT ANALYSIS
  • 11.5.6 KEY STRATEGIES
• 11.6 MOLEX INCORPORATED
  • 11.6.1 COMPANY OVERVIEW
  • 11.6.2 FINANCIAL OVERVIEW
  • 11.6.3 PRODUCTS OFFERED
  • 11.6.4 KEY DEVELOPMENTS
  • 11.6.5 SWOT ANALYSIS
  • 11.6.6 KEY STRATEGIES
• 11.7 AMPHENOL CORPORATION
  • 11.7.1 COMPANY OVERVIEW
  • 11.7.2 FINANCIAL OVERVIEW
  • 11.7.3 PRODUCTS OFFERED
  • 11.7.4 KEY DEVELOPMENTS
  • 11.7.5 SWOT ANALYSIS
  • 11.7.6 KEY STRATEGIES
• 11.8 VISHAY INTERTECHNOLOGY
  • 11.8.1 COMPANY OVERVIEW
  • 11.8.2 FINANCIAL OVERVIEW
  • 11.8.3 PRODUCTS OFFERED
  • 11.8.4 KEY DEVELOPMENTS
  • 11.8.5 SWOT ANALYSIS
  • 11.8.6 KEY STRATEGIES
• 11.9 TE CONNECTIVITY CORPORATION
  • 11.9.1 COMPANY OVERVIEW
  • 11.9.2 FINANCIAL OVERVIEW
  • 11.9.3 PRODUCTS OFFERED
  • 11.9.4 KEY DEVELOPMENTS
  • 11.9.5 SWOT ANALYSIS
  • 11.9.6 KEY STRATEGIES
• 11.10 HIROSE ELECTRIC CO.
  • 11.10.1 COMPANY OVERVIEW
  • 11.10.2 FINANCIAL OVERVIEW
  • 11.10.3 PRODUCTS OFFERED
  • 11.10.4 KEY DEVELOPMENTS
  • 11.10.5 SWOT ANALYSIS
  • 11.10.6 KEY STRATEGIES
• 11.11 DATA CITATIONS