세계의 박막 회로 기판 시장(-2035년) : 재료 유형, 두께, 용도, 기술별

The Thin Film Circuit Substrate Market will expand at a 5.2% CAGR between 2025 and 2035, ultimately valuing USD 6,771.28 million by the end of the forecast period. The use of thin film substrates, which are also called advanced technologies, is the best way to ensure the performance of compact and reliable circuits in consumer electronics, automotive, aerospace, telecom, and medical devices.

Miniaturization and High-Performance Device Requirements

The modern consumer electronics are very demanding and want high-density and efficient circuit designs, so thin film substrates have become indispensable. For example, the use of pure alumina or aluminum nitride as a substrate material is a superior solution for the device's thermal management and further electrical performance at the same time. The coming of 5G, AI, and VR/AR will only continue to increase the demand for substrate.

Segment-wise Classification Overview

Material Type

• Polyimide - flexible film for portable devices
• Glass - stable platform for optical circuits
• FR-4 - standard insulated PCB material
• Silicon - core base for semiconductor ICs
• Ceramic - heat-resistant power substrate
• Metal - strong conductor for electronics
• Others - specialty engineered materials

Thickness

• Thin Film (<25 µm) - ultra-compact electronics
• Medium Film (25-100 µm) - versatile thickness
• Thick Film (>100 µm) - rugged, heavy-duty systems

Application

• Consumer Electronics - smartphones, wearables
• Automotive - EV and ADAS electronics
• Aerospace/Defense - mission-critical hardware
• Telecommunications - 5G and high-speed systems
• Healthcare - diagnostics and monitoring devices
• Others - broader industrial use

Technology

• PVD - uniform metal layer formation
• CVD - high-purity thin-film creation
• Printed/Hybrid - low-cost, scalable fabrication
• Etching - accurate micro-design structuring

North America and Europe are keeping pace through increased R&D spending, advancements in automotive electronics, and government-backed semiconductor initiatives. At the same time, the Asia-Pacific region is holding a solid lead in the worldwide market because of its extensive manufacturing base and quick technological progress. South America and the Middle East, and Africa regions can be considered as the markets that are still in the development phase.

Technological Advantage and Growth Drivers

The demand for small, energy-efficient electronic assemblies is giving thin film substrates a clear advantage across various fields such as consumer electronics, automotive, telecom, and healthcare. Moreover, these substrates are considered the most suitable for future devices because of their excellent thermal management, electrical insulation, and mechanical strength. The role of substrates has expanded significantly in the industrial sector due to innovations in deposition technologies and advanced materials like alumina and aluminum nitride.

Key Report Attributes

• Market Size 2024: USD 3676.8 Million
• Market Size 2035: USD 6,771.28 Million
• CAGR (2025-2035): 5.2%
• Base Year: 2024
• Market Forecast Period: 2025-2035

Market Segmentations Growth

• By Material Type: Polyimide - 6.2%, Glass - 5.1%.
• By Thickness: Thin Film - 5.6%, Medium Film - 5.1%.
• By Application: Consumer Electronics - 5.1%, Automotive - 5.4%.
• By Technology: Physical Vapor Deposition (PVD) - 5.2%, Chemical Vapor Deposition (CVD) - 5.3%.

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

• 1.1 MARKET OVERVIEW:
• 1.2 COMPETITIVE LANDSCAPE
• 1.3 FUTURE OUTLOOK

2 MARKET INTRODUCTION

• 2.1 DEFINITION
• 2.2 SCOPE OF THE STUDY
• 2.3 RESEARCH OBJECTIVE
• 2.4 MARKET STRUCTURE

3 RESEARCH METHODOLOGY

• 3.1 OVERVIEW
• 3.2 DATA FLOW
  • 3.2.1 DATA MINING PROCESS
• 3.3 PURCHASED DATABASE:
• 3.4 SECONDARY SOURCES:
  • 3.4.1 SECONDARY RESEARCH DATA FLOW:
• 3.5 PRIMARY RESEARCH:
  • 3.5.1 PRIMARY RESEARCH DATA FLOW:
  • 3.5.2 PRIMARY RESEARCH: NUMBER OF INTERVIEWS CONDUCTED
  • 3.5.3 PRIMARY RESEARCH: REGIONAL COVERAGE
• 3.6 APPROACHES FOR MARKET SIZE ESTIMATION:
  • 3.6.1 CONSUMPTION NET TRADE APPROACH
  • 3.6.2 REVENUE ANALYSIS APPROACH
• 3.7 DATA FORECASTING
  • 3.7.1 DATA FORECASTING TECHNIQUE
• 3.8 DATA MODELING
  • 3.8.1 MICROECONOMIC FACTOR ANALYSIS:
  • 3.8.2 DATA MODELING:
• 3.9 TEAMS AND ANALYST CONTRIBUTION

4 MARKET DYNAMICS

• 4.1 INTRODUCTION
• 4.2 MARKET TRENDS AND GROWTH AFFECTING FACTORS
• 4.3 DRIVERS
  • 4.3.1 INCREASING DEMAND FOR CONSUMER ELECTRONICS
  • 4.3.2 ADVANCEMENTS IN SEMICONDUCTOR TECHNOLOGY
  • 4.3.3 GROWTH IN RENEWABLE ENERGY APPLICATIONS
  • 4.3.4 MINIATURIZATION OF ELECTRONIC DEVICES
  • 4.3.5 RISING INVESTMENTS IN IOT AND SMART TECHNOLOGIES
• 4.4 RESTRAINTS
  • 4.4.1 HIGH PRODUCTION COSTS
  • 4.4.2 TECHNOLOGICAL COMPLEXITY
  • 4.4.3 LIMITED AVAILABILITY OF RAW MATERIALS
  • 4.4.4 MARKET SATURATION IN KEY REGIONS
  • 4.4.5 REGULATORY CHALLENGES
• 4.5 OPPORTUNITY
  • 4.5.1 EXPANSION IN AUTOMOTIVE ELECTRONICS
  • 4.5.2 ENHANCEMENTS IN FLEXIBLE ELECTRONICS
  • 4.5.3 INCREASED ADOPTION OF WEARABLE TECHNOLOGY
  • 4.5.4 EMERGENCE OF 5G INFRASTRUCTURE
  • 4.5.5 GROWTH OF MEDICAL ELECTRONICS APPLICATIONS

5 MARKET FACTOR ANALYSIS

• 5.1 SUPPLY CHAIN ANALYSIS
  • 5.1.1 RAW MATERIAL PROCUREMENT
  • 5.1.2 THIN FILM DEPOSITION & COATING
  • 5.1.3 PATTERNING & ETCHING
  • 5.1.4 SUBSTRATE FABRICATION & ASSEMBLY
  • 5.1.5 INSPECTION & QUALITY VALIDATION
  • 5.1.6 PACKAGING & CLEANROOM LOGISTICS
  • 5.1.7 DISTRIBUTION
• 5.2 PORTER'S FIVE FORCES MODEL
  • 5.2.1 THREAT OF NEW ENTRANTS - MODERATE
  • 5.2.2 BARGAINING POWER OF SUPPLIERS - MODERATE TO HIGH
  • 5.2.3 THREAT OF SUBSTITUTES - LOW TO MODERATE
  • 5.2.4 BARGAINING POWER OF BUYERS - HIGH
  • 5.2.5 INTENSITY OF RIVALRY - HIGH

6 THIN FILM CIRCUIT SUBSTRATE MARKET, BY MATERIAL TYPE

• 6.1 INTRODUCTION
• 6.2 MATERIAL TYPE

7 THIN FILM CIRCUIT SUBSTRATE MARKET, BY THICKNESS

• 7.1 INTRODUCTION
• 7.2 THIN FILM (BELOW 25 µM)
• 7.3 MEDIUM FILM (25 µM TO 100 µM)
• 7.4 THICK FILM (ABOVE 100 µM)

8 THIN FILM CIRCUIT SUBSTRATE MARKET, BY APPLICATION

• 8.1 INTRODUCTION
• 8.2 CONSUMER ELECTRONICS
• 8.3 AUTOMOTIVE
• 8.4 AEROSPACE AND DEFENSE
• 8.5 TELECOMMUNICATIONS
• 8.6 HEALTHCARE DEVICES

9 THIN FILM CIRCUIT SUBSTRATE MARKET, BY TECHNOLOGY

• 9.1 INTRODUCTION
• 9.2 PHYSICAL VAPOR DEPOSITION (PVD)
• 9.3 CHEMICAL VAPOR DEPOSITION (CVD)
• 9.4 PRINTED & HYBRID ELECTRONICS TECHNOLOGIES
• 9.5 ETCHING TECHNOLOGY

10 THIN FILM CIRCUIT SUBSTRATE MARKET, BY REGION

• 10.1 OVERVIEW
• 10.2 NORTH AMERICA
  • 10.2.1 USA
  • 10.2.2 CANADA
• 10.3 EUROPE
  • 10.3.1 GERMANY
  • 10.3.2 UK
  • 10.3.3 FRANCE
  • 10.3.4 RUSSIA
  • 10.3.5 ITALY
  • 10.3.6 SPAIN
  • 10.3.7 REST OF EUROPE
• 10.4 ASIA PACIFIC
  • 10.4.1 CHINA
  • 10.4.2 INDIA
  • 10.4.3 JAPAN
  • 10.4.4 SOUTH KOREA
  • 10.4.5 MALAYSIA
  • 10.4.6 THAILAND
  • 10.4.7 INDONESIA
  • 10.4.8 REST OF APAC
• 10.5 SOUTH AMERICA
  • 10.5.1 BRAZIL
  • 10.5.2 MEXICO
  • 10.5.3 ARGENTINA
  • 10.5.4 REST OF SOUTH AMERICA
• 10.6 MEA
  • 10.6.1 GCC COUNTRIES
  • 10.6.2 SOUTH AFRICA
  • 10.6.3 REST OF MEA

11 COMPETITIVE LANDSCAPE

• 11.1 INTRODUCTION
• 11.2 MARKET SHARE ANALYSIS, 2024
• 11.3 COMPETITOR DASHBOARD
• 11.4 KEY DEVELOPMENTS & GROWTH STRATEGIES

12 COMPANY PROFILES

• 12.1 CICOR GROUP
  • 12.1.1 COMPANY OVERVIEW
  • 12.1.2 FINANCIAL OVERVIEW
  • 12.1.3 PRODUCTS OFFERED
  • 12.1.4 SWOT ANALYSIS
  • 12.1.5 KEY STRATEGY
• 12.2 HIGHTEC MC AG
  • 12.2.1 COMPANY OVERVIEW
  • 12.2.2 PRODUCTS OFFERED
  • 12.2.3 SWOT ANALYSIS
• 12.3 VISHAY INTERTECHNOLOGY, INC.
  • 12.3.1 COMPANY OVERVIEW
  • 12.3.2 FINANCIAL OVERVIEW
  • 12.3.3 PRODUCTS OFFERED
  • 12.3.4 SWOT ANALYSIS
  • 12.3.5 KEY STRATEGY
• 12.4 LEONARDO S.P.A.
  • 12.4.1 COMPANY OVERVIEW
  • 12.4.2 FINANCIAL OVERVIEW
  • 12.4.3 PRODUCTS OFFERED
  • 12.4.4 SWOT ANALYSIS
• 12.5 MURATA MANUFACTURING CO., LTD.
  • 12.5.1 COMPANY OVERVIEW
  • 12.5.2 FINANCIAL OVERVIEW
  • 12.5.3 PRODUCTS OFFERED
  • 12.5.4 SWOT ANALYSIS
  • 12.5.5 KEY STRATEGY
• 12.6 JOHANSON TECHNOLOGY
  • 12.6.1 COMPANY OVERVIEW
  • 12.6.2 PRODUCTS OFFERED
  • 12.6.3 SWOT ANALYSIS
• 12.7 HOLY STONE ENTERPRISE CO., LTD.
  • 12.7.1 COMPANY OVERVIEW
  • 12.7.2 FINANCIAL OVERVIEW
  • 12.7.3 PRODUCTS OFFERED
  • 12.7.4 SWOT ANALYSIS
• 12.8 SICHUAN LIUFANG YUCHENG ELECTRONIC TECHNOLOGY CO., LTD
  • 12.8.1 COMPANY OVERVIEW
  • 12.8.2 PRODUCTS OFFERED
  • 12.8.3 SWOT ANALYSIS
• 12.9 XIAMEN UNIPRETEC CERAMIC TECHNOLOGY CO., LTD.
  • 12.9.1 COMPANY OVERVIEW
  • 12.9.2 PRODUCTS OFFERED
  • 12.9.3 SWOT ANALYSIS
• 12.10 KYOCERA CORPORATION
  • 12.10.1 COMPANY OVERVIEW
  • 12.10.2 FINANCIAL OVERVIEW
  • 12.10.3 PRODUCTS OFFERED
  • 12.10.4 SWOT ANALYSIS