½ÃÀ庸°í¼­
»óǰÄÚµå
1687271

¼¼°èÀÇ Æ÷Åä´Ð ÁýÀûȸ·Î ½ÃÀå : Á¡À¯À² ºÐ¼®, »ê¾÷ µ¿Çâ ¹× Åë°è, ¼ºÀå ¿¹Ãø(2025-2030³â)

Photonic Integrated Circuit - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: Mordor Intelligence | ÆäÀÌÁö Á¤º¸: ¿µ¹® | ¹è¼Û¾È³» : 2-3ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    




¡á º¸°í¼­¿¡ µû¶ó ÃֽŠÁ¤º¸·Î ¾÷µ¥ÀÌÆ®ÇÏ¿© º¸³»µå¸³´Ï´Ù. ¹è¼ÛÀÏÁ¤Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

¼¼°èÀÇ Æ÷Åä´Ð ÁýÀûȸ·Î ½ÃÀå ±Ô¸ð´Â 2025³â 182¾ï ´Þ·¯·Î ¿¹ÃøµÇ¸ç, ¿¹Ãø±â°£ Áß(2025-2030³â) CAGR 20.47%·Î È®´ëµÇ¾î, 2030³â¿¡´Â 461¾ï 9,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

Photonic Integrated Circuit-Market-IMG1

¿ëµµ È®´ë°¡ ±¤ÁýÀûȸ·Î ½ÃÀåÀ» °ßÀÎ

ÁÖ¿ä ÇÏÀ̶óÀÌÆ®

  • Æ÷Åä´Ð ÁýÀûȸ·Î(PIC) ½ÃÀåÀº Åë½ÅÀ̳ª µ¥ÀÌÅͼ¾ÅÍ¿¡¼­ÀÇ ¿ëµµ È®´ë¿¡ ÀÇÇØ °­·ÂÇÑ ¼ºÀåÀ» ÀÌ·ç°í ÀÖ½À´Ï´Ù.
  • È¿À²¼º °³¼±: PIC´Â Å©¸®Æ¼Äà ¿ëµµÀÇ Àü·Â ¼Òºñ¸¦ ÃÖ¼Ò 50% ÁÙÀÔ´Ï´Ù.
  • Á֯ļö ¿ìÀ§: PICÀÇ Á֯ļö´Â ¸¶ÀÌÅ©·Î ÀÏ·ºÆ®·Î´Ð½ºÀÇ 1,000¹è¿¡¼­ 1¸¸¹è ³ô½À´Ï´Ù.
  • º¸´Ù ³ôÀº ¿¡³ÊÁö È¿À²: ÀÌ ±â¼úÀº ±âÁ¸ÀÇ ICº¸´Ù ¿¡³ÊÁö È¿À²ÀÌ ¿ì¼öÇϸ鼭 ÈξÀ ³ôÀº Á֯ļö¸¦ Áö¿øÇÕ´Ï´Ù.

Åë½Å ¹× µ¥ÀÌÅͼ¾ÅͿ뵵°¡ ¼ºÀåÀÇ ¿øµ¿·Â

ÁÖ¿ä ÇÏÀ̶óÀÌÆ®

  • Åë½ÅÀº °í¼Ó ÀÎÅÍ³Ý Åë½Å ½Ã½ºÅÛ¿¡ ´ëÇÑ ¼ö¿ä°¡ ³ô¾ÆÁü¿¡ µû¶ó PICÀÇ Ã¤¿ëÀÌ ³Ð¾îÁö°í ÀÖ½À´Ï´Ù.
  • °ø°£ ¹× ºñ¿ë Àý¾à: ±¤Åë½Å ½Ã½ºÅÛ¿¡ ³»ÀåµÈ PIC´Â °ø°£, Àü·Â ¹× ºñ¿ëÀ» ´ëÆø Àý°¨ÇÕ´Ï´Ù.
  • ¿ë·® Áõ°­ : ÀÌ ±â¼ú¿¡ ÀÇÇØ Æ®·£½º¹Ì¼ÇÀÇ ¿ë·®ÀÌ Áõ°¡ÇÏ´Â °Í°ú µ¿½Ã¿¡, »õ·Î¿î ±â´ÉÀ» ½ÇÇöÇÒ ¼ö ÀÖ½À´Ï´Ù.
  • µ¥ÀÌÅͼ¾ÅÍ Çõ½Å : µ¥ÀÌÅͼ¾ÅÍÀÇ Àå°Å¸® Åë½Å ³×Æ®¿öÅ©¸¦ À§ÇÑ ÇÏÀ̺긮µå Æ÷Åä´Ð½º´Â Æ÷Åä´Ð µ¥ÀÌÅ͸¦ Àü±â ½ÅÈ£·Î º¯È¯Çϰí ó¸®ÇÏ¿© Æ÷Åä´Ð ½ºÀ§Äª ÄÄÆ÷³ÍÆ®·ÎÀÇ ÀüȯÀ» ÃËÁøÇÕ´Ï´Ù.
  • ÅõÀÚ¿Í Á¶»ç°¡ ¼ÒÇüÈ­¸¦ ÃßÁø: PICÀÇ ¼ÒÇüÈ­´Â ÀÚµ¿Â÷, Ç×°ø, Åë½Å µîÀÇ ºÎ¹®À¸·Î ÃßÁøµÇ°í ÀÖ½À´Ï´Ù.
  • ÃÖ±ÙÀÇ Áøº¸: 2020³â 8¿ù, ¿¬±¸ÀÚ´Â ÃÖ´ë 11Gbit/sÀÇ ½ºÀ§Äª ¼Óµµ¸¦ °¡Áö´Â ÃÖ¼ÒÀÇ ¿ÂĨ ±¤ º¯Á¶±â¸¦ °³¹ßÇß½À´Ï´Ù.
  • MitsubishiÀÇ Çõ½Å : ÀÌ È¸»ç´Â ÇÁ·Î¼¼¼­ÀÇ ±â´ÉÀ» È®ÀåÇϱâ À§ÇÑ »õ·Î¿î ½Ç¸®ÄÜ Æ÷Åä´Ð½º ºôµù ºí·ÏÀ» ޱ¸Çϰí ÀÖ½À´Ï´Ù.
  • ¼¾¼­¿Í °èÃø¿¡ À־ÀÇ »õ·Î¿î ¿ëµµ : ADAS(÷´Ü ¿îÀü Áö¿ø ½Ã½ºÅÛ)¿ëÀÇ LiDAR¸¦ Æ÷ÇÔÇÑ ±¤ ¼¾¼­·Î PICÀÇ »ç¿ëÀÌ Áõ°¡Çϰí ÀÖ¾î, ½ÃÀåÀ» µÞ¹ÞħÇϰí ÀÖ½À´Ï´Ù. ±â°è³ª °Ë»ç µîÀÇ »ê¾÷¿¡¼­ °íÁ¤¹Ðµµ °Å¸® ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ´Â °Íµµ, ½ÃÀå ¼ºÀå¿¡ ±â¿©Çϰí ÀÖ½À´Ï´Ù.
  • IntelÀÇ ÅõÀÚ : Mobileye´Â 2025³â±îÁö Â÷¼¼´ë LiDAR ±â¼ú¿¡ PIC¸¦ ä¿ëÇÒ ¿¹Á¤ÀÔ´Ï´Ù.
  • »õ·Î¿î Á¦ÈÞ : Tower Semiconductor´Â AnelloPhotonics¿Í Á¦ÈÞÇÏ¿© ÀÚµ¿Â÷ LiDAR ¹× ±âŸ¸¦ À§ÇØ Àú¼Õ½Ç ½Ç¸®ÄÜ ±¤ µµÆÄ·Î ±â¼úÀ» °³¹ßÇϰí ÀÖ½À´Ï´Ù.
  • ½ÃÀå ¿ªÇаú ¹Ì·¡ Àü¸Á: Àü·«Àû ÆÄÆ®³Ê½Ê°ú Àμö°¡ ½ÃÀåÀ» Á¤ÀÇÇϰí, °¢ ȸ»ç´Â »õ·Î¿î °è¾àÀ» ȹµæÇÏ°í ´Ù¾çÇÑ ºÎ¹®¿¡ ÁøÃâÇϰí ÀÖ½À´Ï´Ù.
  • ÆÄÆ®³Ê½Ê ÁÖµµÀÇ ¼ºÀå: 2022³â 3¿ù Ansys¿Í GlobalFoundries(GF)´Â Æ÷Åä´Ð ¼³°è ´É·ÂÀ» °­È­Çϱâ À§ÇØ Á¦ÈÞÇß½À´Ï´Ù.
  • Àå±âÀûÀÎ ¿¹Ãø : AlibabaÀÇ DAMO Academy´Â ½Ç¸®ÄÜ Æ÷Åä´Ð ĨÀÌ 5-10³â À̳»¿¡ ´Ù¾çÇÑ ÄÄÇ»ÅÍ »ê¾÷¿¡¼­ ÀüÀÚ Ä¨À» ´ëüÇÒ °ÍÀ̶ó°í ¿¹ÃøÇß½À´Ï´Ù.

Æ÷Åä´Ð ÁýÀûȸ·Î ½ÃÀå µ¿Çâ

µ¥ÀÌÅͼ¾ÅÍ ºÎ¹®ÀÌ ½ÃÀåÀ» µ¶Á¡

Æ÷Åä´Ð ÁýÀûȸ·Î(PIC) ½ÃÀåÀ» ¼±µµÇÏ´Â °ÍÀº µ¥ÀÌÅͼ¾ÅͿ뵵À¸·Î 2021³â ½ÃÀå Á¡À¯À²ÀÇ 67.88%¸¦ Â÷ÁöÇÕ´Ï´Ù.

  • Æ®·¡ÇÈ ±ÞÁõ : CiscoÀÇ Cloud Index¿¡¼­´Â 2021³â±îÁö ºÏ¹Ì¿¡¼­ ¿¬°£ 7.7ZBÀÇ Å¬¶ó¿ìµå Æ®·¡ÇÈÀÌ ¹ß»ýÇÒ °ÍÀ¸·Î ¿¹ÃøÇϰí ÀÖÀ¸¸ç, È¿À²ÀûÀÎ µ¥ÀÌÅÍ Ã³¸®¿¡ ´ëÇÑ ¿ä±¸ÀÇ °íÁ¶¸¦ ºÎ°¢Çϰí ÀÖ½À´Ï´Ù.
  • µ¥ÀÌÅͼ¾ÅÍÀÇ ÁýÁß: ¹Ì±¹¿¡´Â ¾à 2,600°³ÀÇ µ¥ÀÌÅͼ¾ÅͰ¡ ÀÖÀ¸¸ç, ÀÌ´Â ¼¼°è ÀüüÀÇ 33%¿¡ ÇØ´çÇÕ´Ï´Ù.
  • °øµ¿ Çõ½Å : IBM, Intel, Cisco µîÀÇ ±â¾÷ÀÌ ÇÐ°è ¹× Á¤ºÎ¿Í Çù·ÂÇÏ¿© PIC ±â¹Ý ¼Ö·ç¼ÇÀ» °³¹ßÇϰí ÀÖ½À´Ï´Ù.
  • ¼ºÀå ¿¹Ãø : ÀÌ ºÎ¹®Àº 2021³â 54¾ï 2,964¸¸ ´Þ·¯¿¡¼­ 2027³â¿¡´Â 174¾ï 8,597¸¸ ´Þ·¯·Î ¼ºÀåÇØ CAGR 19.96%°¡ µÉ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

¾Æ½Ã¾ÆÅÂÆò¾çÀÌ Å« ¼ºÀåÀ» È®ÀÎ

¾Æ½Ã¾ÆÅÂÆò¾çÀº PIC ½ÃÀå¿¡¼­ °¡Àå ±Þ¼ºÀåÇϰí ÀÖ´Â Áö¿ªÀ¸·Î, ±â¼úÀÇ Áøº¸¿Í ÅõÀÚ Áõ°¡¿¡ ÀÇÇØ 2022-2027³âÀÇ CAGRÀº 23.36%°¡ µÉ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

  • ½ÃÀå ±ÞÁõ: ¾Æ½Ã¾ÆÅÂÆò¾ç PIC ½ÃÀåÀº 2021³â 16¾ï 1,515¸¸ ´Þ·¯¿¡¼­ 2027³â¿¡´Â 61¾ï 5,074¸¸ ´Þ·¯·Î ¼ºÀåÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.
  • Çõ½ÅÀûÀÎ ºê·¹ÀÌÅ© ½º·ç: 2021³â 11¿ù, Àϸ®³ëÀÌ ´ëÇÐÀÇ Á¶»çÆÀÀº À½ÆÄ¸¦ »ç¿ëÇØ ºûÀ» ºÐ¸® ¹× Á¶Á¤ÇÏ´Â ¼ÒÇü Æ÷Åä´Ð ȸ·Î¸¦ ÀÛ¼ºÇß½À´Ï´Ù.
  • Àü·«Àû ÆÄÆ®³Ê½Ê: 2022³â Ansys¿Í GFÀÇ Á¦ÈÞ¿Í °°ÀÌ ÀÌ Áö¿ªÀÇ µ¥ÀÌÅͼ¾ÅÍ¿Í ½´ÆÛÄÄÇ»ÆÃÀ» À§ÇÑ Æ÷Åä´Ð ¼³°èÀÇ Áøº¸¸¦ ÃßÁøÇϰí ÀÖ½À´Ï´Ù.
  • Á¤ºÎÀÇ Áö¿ø: ¿ÂŸ¸®¿À Æ÷Åä´Ð½º »ê¾÷ ³×Æ®¿öÅ© µîÀÇ °ü¹Î ÀÌ´Ï¼ÅÆ¼ºê°¡, ÀÌ Áö¿ªÀÇ PIC Çõ½ÅÀ» µÞ¹ÞħÇϰí ÀÖ½À´Ï´Ù.

Æ÷Åä´Ð ÁýÀûȸ·Î »ê¾÷ °³¿ä

°æÀï ±¸µµ ºÐ¼® : Æ÷Åä´Ð ÁýÀûȸ·Î(PIC) ½ÃÀåÀº ¼Ò¼öÀÇ ¼¼°è ±â¾÷¿¡ ÀÇÇØ Áö¹èµÇ°í ÀÖÀ¸¸ç, Neophotonics Corporation, Poet Technologies, II-VI Incorporated, Intel Corporation µîÀÇ ±â¾÷ÀÌ ½ÃÀåÀ» ÁÖµµÇϰí ÀÖ½À´Ï´Ù.

±â¼úÀû ¸®´õ½Ê : ÁÖ¿ä ±â¾÷Àº ¿¬±¸ °³¹ß¿¡ ¸¹Àº ÅõÀÚ¸¦ ½Ç½ÃÇÏ°í ±â¼ú Çõ½Å°ú ¼ÒÇüÈ­¿¡ ÁÖ·ÂÇϰí ÀÖ½À´Ï´Ù. ¿¹¸¦ µé¾î II-VI IncorporatedÀÇ °íÈ¿À² ´Ù±â´É ¸ÞŸ ·»Áî´Â ÃʼÒÇü ±¤ ¼¾¼­ ¿ëÀ¸·Î ¼³°èµÇ¾ú½À´Ï´Ù.

Àü·«Àû ÆÄÆ®³Ê½Ê : Çù¾÷Àº ½ÃÀå¿¡¼­ ¸®´õ½ÊÀ» À¯ÁöÇÏ´Â ÇÙ½ÉÀÔ´Ï´Ù. Ansys¿Í GF¿ÍÀÇ ÆÄÆ®³Ê½ÊÀº ±× ¿¹ÀÌ¸ç Æ÷Åä´Ð½º ¼³°è ´É·ÂÀ» ºÎ¹® Ⱦ´ÜÀûÀ¸·Î È®´ëÇϰí ÀÖ½À´Ï´Ù.

¹Ì·¡ ¼º°øÀ» À§ÇÑ Àü·«: PIC ½ÃÀå¿¡¼­ ¹Ì·¡ ¼º°øÀ» ¸ñÇ¥·Î ÇÏ´Â ±â¾÷Àº ¸î °¡Áö Áß¿äÇÑ Àü·«¿¡ ÁÖ·ÂÇØ¾ß ÇÕ´Ï´Ù.

R&D ÅõÀÚ: R&D ÅõÀÚ: PIC ±â¼úÀÇ Áøº¸, ƯÈ÷ ¼ÒÇüÈ­ ¹× ÅëÇÕ¿¡ ´ëÇÑ ÅõÀÚ´Â ¸Å¿ì Áß¿äÇÕ´Ï´Ù.

ºñ¿ë È¿À²ÀûÀÎ ¼Ö·ç¼Ç: Á¦Á¶ ºñ¿ëÀ» ³·Ãß°í È®À强À» ³ôÀÌ·Á¸é Á¦Á¶ ´É·ÂÀ» È®´ëÇØ¾ß ÇÕ´Ï´Ù.

ÆÄÆ®³Ê½Ê ¹× Çù·Â °ü°è: POET Technologies ¹× Liobate Technologies¿Í °°Àº Àü·«Àû ÆÄÆ®³Ê½ÊÀº º¸´Ù ½Å¼ÓÇÑ Á¦Ç° °³¹ßÀ» °¡´ÉÇÏ°Ô ÇÕ´Ï´Ù.

´Ù¾çÈ­: ÀÚµ¿Â÷, Ç×°ø¿ìÁÖ, ¹ÙÀÌ¿À¸ÞµðÄà »ê¾÷ µî ±âÁ¸ ºÎ¹®À» ³Ñ¾î¼± »õ·Î¿î ¿ëµµ¸¦ °³Ã´ÇÔÀ¸·Î½á »õ·Î¿î ½ÃÀå ±âȸ°¡ ¿­¸³´Ï´Ù.

±âŸ ÇýÅÃ

  • ¿¢¼¿ Çü½Ä ½ÃÀå ¿¹Ãø(ME) ½ÃÆ®
  • 3°³¿ù°£ÀÇ ¾Ö³Î¸®½ºÆ® ¼­Æ÷Æ®

¸ñÂ÷

Á¦1Àå ¼­·Ð

  • Á¶»çÀÇ ÀüÁ¦Á¶°Ç°ú ½ÃÀå Á¤ÀÇ
  • Á¶»ç ¹üÀ§

Á¦2Àå Á¶»ç ¹æ¹ý

Á¦3Àå ÁÖ¿ä ¿ä¾à

Á¦4Àå ½ÃÀå ÀλçÀÌÆ®

  • ½ÃÀå °³¿ä
  • »ê¾÷ÀÇ ¸Å·Â - Porter's Five Forces ºÐ¼®
    • °ø±Þ±â¾÷ÀÇ Çù»ó·Â
    • ¼ÒºñÀÚÀÇ Çù»ó·Â
    • ½Å±Ô Âü°¡¾÷üÀÇ À§Çù
    • °æÀï ±â¾÷°£ °æÀï °ü°è
    • ´ëüǰÀÇ À§Çù
  • ÁÖ¿ä °Å½Ã °æÁ¦ ¿äÀÎÀÌ ½ÃÀå¿¡ ¹ÌÄ¡´Â ¿µÇâ Æò°¡

Á¦5Àå ½ÃÀå ¿ªÇÐ

  • ½ÃÀå ¼ºÀå ÃËÁø¿äÀÎ
    • Åë½Å ¹× µ¥ÀÌÅͼ¾ÅÍ¿¡¼­ÀÇ ¿ëµµ ¼ºÀå
    • PIC ¼ÒÇüÈ­¸¦ À§ÇÑ ÅõÀÚ¿Í ¿¬±¸
    • ¿ëµµÀÇ È®´ë°¡ ±¤ÁýÀûȸ·Î ½ÃÀåÀ» °ßÀÎ
    • ¼¾¼­¿Í °èÃø¿¡ À־ÀÇ »õ·Î¿î ¿ëµµ
  • ½ÃÀåÀÇ °úÁ¦
    • ±âÁ¸ IC¿¡ ´ëÇÑ ¼ö¿ä °è¼Ó
    • ±¤ ³×Æ®¿öÅ©ÀÇ ¿ë·® ºÎÁ·

Á¦6Àå ½ÃÀå ¼¼ºÐÈ­

  • ¿ø·á À¯Çüº°
    • III-V Àç·á
    • ´Ï¿Àºê»ê¸®Æ¬
    • ½Ç¸®Ä« ¿Â ½Ç¸®ÄÜ
    • ±âŸ
  • ÅëÇÕ ÇÁ·Î¼¼½ºº°
    • ÇÏÀ̺긮µå
    • ¸ð³î¸®½Ä
  • ¿ëµµº°
    • Åë½Å
    • ¹ÙÀÌ¿À¸ÞµðÄÃ
    • µ¥ÀÌÅͼ¾ÅÍ
    • ±âŸ ¿ëµµ(±¤ÇÐ ¼¾¼­(LiDAR), °èÃø ±â±â)
  • Áö¿ªº°
    • ºÏ¹Ì
    • À¯·´
    • ¾Æ½Ã¾Æ
    • È£ÁÖ ¹× ´ºÁú·£µå
    • ¶óƾ¾Æ¸Þ¸®Ä«
    • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«

Á¦7Àå °æÀï ±¸µµ

  • ±â¾÷ ÇÁ·ÎÆÄÀÏ
    • NeoPhotonics Corporation
    • POET Technologies
    • II-VI Incorporated
    • Infinera Corporation
    • Intel Corporation
    • Cisco Systems Inc.
    • Source Photonics Inc.
    • Lumentum Holdings
    • Caliopa(Huawei Technologies Co. Ltd)
    • Effect Photonics
    • Colorchip Ltd

Á¦8Àå ÅõÀÚ ºÐ¼®

Á¦9Àå ½ÃÀåÀÇ ¹Ì·¡

JHS

The Photonic Integrated Circuit Market size is estimated at USD 18.20 billion in 2025, and is expected to reach USD 46.19 billion by 2030, at a CAGR of 20.47% during the forecast period (2025-2030).

Photonic Integrated Circuit - Market - IMG1

Growing Applications Drive Photonic Integrated Circuit Market

Key Highlights

  • The Photonic Integrated Circuit (PIC) market is experiencing robust growth due to expanding applications in telecommunications and data centers. PICs provide superior performance compared to traditional integrated circuits, offering advantages like higher speed, increased bandwidth, and improved power efficiency. These benefits make PICs a disruptive technology for short-range connections in data centers and long-haul optical communication networks.
  • Efficiency improvement: PICs reduce power consumption in critical applications by at least 50%.
  • Frequency advantage: PIC frequencies are 1,000 to 10,000 times higher than those of microelectronics.
  • Higher energy efficiency: The technology supports much higher frequencies while being more energy-efficient than traditional ICs.

Telecommunications and Data Center Applications Fuel Growth:

Key Highlights

  • Telecommunications is seeing widespread PIC adoption due to the growing demand for high-speed internet communication systems. With mobile data usage expanding by about 40% annually, PICs play a key role in meeting bandwidth needs. North America leads in mobile data consumption, with traffic forecasted to reach 48 GB per month per smartphone by the end of 2023.
  • Space and cost savings: PICs integrated into optical communication systems provide significant space, power, and cost reductions.
  • Capacity enhancement: The technology increases transmission capacity while enabling new functionalities.
  • Data center innovations: Hybrid photonics for long-haul communication networks in data centers convert photonic data to electrical signals for processing, facilitating the shift towards photonic switching components.
  • Investments and Research Drive Miniaturization: The push for miniaturizing PICs is driven by sectors like automotive, aeronautics, and telecommunications. Companies are developing smaller, cost-effective, and reliable PICs for use in devices like spectrometers and LiDAR.
  • Recent advances: In August 2020, researchers developed the smallest on-chip optical modulator with a switching speed of up to 11 Gbit/s.
  • Mitsubishi's innovations: The company is exploring new silicon photonics building blocks to extend processor capabilities.
  • Emerging Applications in Sensors and Metrology: The rising use of PICs in optical sensors, including LiDAR for Advanced Driver Assistance Systems (ADAS), is boosting the market. The increasing demand for high-precision distance sensors in industries like machinery and inspection contributes to market growth.
  • Intel's investment: Mobileye plans to use PICs in its next-gen LiDAR technology by 2025.
  • New collaborations: Tower Semiconductor's partnership with AnelloPhotonics is developing low-loss Silicon Optical Waveguide technology for automotive LiDAR and other applications.
  • Market Dynamics and Future Outlook: Strategic partnerships and acquisitions define the market, with companies securing new contracts and expanding into different sectors. The future of the PIC market looks promising, with silicon photonic chips expected to become widespread in high-speed data transmission between data centers over the next three years.
  • Partnership-driven growth: In March 2022, Ansys and GlobalFoundries (GF) partnered to enhance photonic design capabilities.
  • Long-term predictions: Alibaba's DAMO Academy predicts silicon photonic chips will replace electronic chips in various computer industries within 5-10 years.

Photonic Integrated Circuit Market Trends

Data Center Segment Dominates Market

Data center applications are leading the Photonic Integrated Circuit (PIC) market, accounting for 67.88% of the market share in 2021. This dominance is driven by the need for high-speed data transmission and the rapid expansion of cloud computing infrastructure.

  • Traffic surge: Cisco's Cloud Index forecasts North America generating 7.7 ZB of cloud traffic annually by 2021, highlighting the growing need for efficient data processing.
  • Data center concentration: The U.S. has about 2,600 data centers, representing 33% of the global total, creating a sizable market for PIC solutions.
  • Collaborative innovation: Companies like IBM, Intel, and Cisco are developing PIC-based solutions in collaboration with academia and government.
  • Growth forecast: The segment is projected to grow from USD 5,429.64 million in 2021 to USD 17,485.97 million by 2027, with a CAGR of 19.96%.

Asia-Pacific Witness Major Growth

Asia-Pacific is the fastest-growing region in the PIC market, expected to achieve a CAGR of 23.36% between 2022 and 2027, driven by technological advancements and increasing investment.

  • Market surge: The Asia-Pacific PIC market is forecasted to grow from USD 1,615.15 million in 2021 to USD 6,150.74 million by 2027.
  • Innovative breakthroughs: In November 2021, researchers at the University of Illinois created a miniature photonic circuit using sound waves to isolate and regulate light.
  • Strategic partnerships: Collaborations like the one between Ansys and GF in 2022 are driving advancements in photonic design for data centers and supercomputing in the region.
  • Government support: Public-private initiatives, such as the Ontario Photonics Industry Network, are boosting PIC innovation in the region.

Photonic Integrated Circuit Industry Overview

Competitive Landscape Analysis: The Photonic Integrated Circuit (PIC) market is dominated by a few global players, with companies such as Neophotonics Corporation, Poet Technologies, II-VI Incorporated, and Intel Corporation leading the market. These companies have strong geographical presence and robust market shares, shaping the competitive landscape of the industry.

Technological leadership: Leading companies invest heavily in research and development, focusing on innovation and miniaturization. For example, II-VI Incorporated's high-efficiency multifunctional metalenses are designed for ultracompact optical sensors.

Strategic partnerships: Collaborations are key to maintaining market leadership. Ansys' partnership with GF is one example, expanding photonic design capabilities across sectors.

Strategies for Future Success: Companies aiming for future success in the PIC market should focus on several critical strategies:

R&D investment: Investing in the advancement of PIC technology, particularly in miniaturization and integration, is crucial.

Cost-effective solutions: Expanding manufacturing capabilities to lower production costs and improve scalability is necessary.

Partnerships and collaborations: Strategic partnerships like POET Technologies' with Liobate Technologies will enable faster product development.

Diversification: Exploring new applications beyond traditional sectors, including automotive, aerospace, and biomedical industries, will open new market opportunities.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Consumers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Intensity of Competitive Rivalry
    • 4.2.5 Threat of Substitute Products
  • 4.3 Assessment of the Impact of Key Macroeconomic Factors on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Growing Applications in Telecommunications and Data Centers
    • 5.1.2 Investments and Research to Miniaturize the PICs
    • 5.1.3 Growing Applications Drive Photonic Integrated Circuit Market
    • 5.1.4 Emerging Applications in Sensors and Metrology
  • 5.2 Market Challenges
    • 5.2.1 Continued Demand for Traditional ICs
    • 5.2.2 Optical Networks Capacity Crunch

6 MARKET SEGMENTATION

  • 6.1 By Type of Raw Material
    • 6.1.1 III-V Material
    • 6.1.2 Lithium Niobate
    • 6.1.3 Silica-on-silicon
    • 6.1.4 Other Raw Materials
  • 6.2 By Integration Process
    • 6.2.1 Hybrid
    • 6.2.2 Monolithic
  • 6.3 By Application
    • 6.3.1 Telecommunications
    • 6.3.2 Biomedical
    • 6.3.3 Data Centers
    • 6.3.4 Other Applications (Optical Sensors (LiDAR), Metrology)
  • 6.4 By Geography
    • 6.4.1 North America
    • 6.4.2 Europe
    • 6.4.3 Asia
    • 6.4.4 Australia and New Zealand
    • 6.4.5 Latin America
    • 6.4.6 Middle East and Africa

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 NeoPhotonics Corporation
    • 7.1.2 POET Technologies
    • 7.1.3 II-VI Incorporated
    • 7.1.4 Infinera Corporation
    • 7.1.5 Intel Corporation
    • 7.1.6 Cisco Systems Inc.
    • 7.1.7 Source Photonics Inc.
    • 7.1.8 Lumentum Holdings
    • 7.1.9 Caliopa (Huawei Technologies Co. Ltd)
    • 7.1.10 Effect Photonics
    • 7.1.11 Colorchip Ltd

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET

ºñ±³¸®½ºÆ®
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
»óǰ ºñ±³Çϱâ
Àüü»èÁ¦