전자 접착제 : 시장 점유율 분석, 산업 동향, 통계, 성장 예측(2025-2030년)

The Electronics Adhesives Market size is estimated at USD 6.51 billion in 2025, and is expected to reach USD 10.03 billion by 2030, at a CAGR of 9.04% during the forecast period (2025-2030).

Rising component miniaturization, wider surface-mount technology (SMT) penetration, and rapid adoption of advanced displays are the primary forces guiding this progress. Demand momentum is reinforced by high-density packaging that increases interconnect counts while amplifying thermal loads, positioning adhesives as indispensable thermal and mechanical buffers between ever-smaller device features. Manufacturers are also prioritizing fast-curing chemistries that cut cycle times in high-volume lines, especially across Asian contract manufacturing hubs. At the same time, sustainability regulations are prompting shifts toward PFAS-free, bio-based, and low-VOC formulations that do not compromise long-term reliability. Taken together, these themes illustrate an electronics adhesives market whose growth is both volume-driven and value-driven, with innovative products commanding share premiums in applications requiring elevated heat resistance and optical purity.

Global Electronics Adhesives Market Trends and Insights

Surge in High-Density Packaging

High-density packaging pushes bond lines toward micron-level tolerances, demanding adhesives with tight-viscosity windows, controlled outgassing, and elastic moduli that absorb differential expansion among stacked die. Wafer-level packaging (WLP) and 3D integration expose joints to reflow excursions that peak near 260 °C, a threshold met by newly formulated epoxy-siloxane hybrids. DELO's latest wafer-level range sustains that temperature while maintaining flow behavior suitable for precision jetting heads. Robust materials have broadened beyond smartphones into advanced driver-assistance systems (ADAS) control units and compact industrial sensors, both of which mirror consumer device space constraints.

Increase in Demand for Surface-Mount Technology Requiring Adhesives

SMT once filled cost-reduction roles but now enables ultra-fine-pitch assembly where component clearances fall below solder paste tolerances. Underfill adhesives redistribute thermo-mechanical stress in flip-chip packages and arrest tin-whisker propagation, cutting field-failure rates in wearable electronics. Automotive infotainment boards add further requirements for vibration damping and 1,000-hour thermal-cycling durability, elevating demand for specialty epoxy-polyimide blends. Equipment makers respond with high-throughput jet dispensers and dual-stage thermal/UV curing stations that shrink in-line takt times by up to 40%, reinforcing adhesive uptake throughout the electronics adhesives market.

Volatility in Epoxy and Acrylate Feedstock Prices

Epichlorohydrin supply disruptions and freight surcharges pushed spot epoxy prices to multi-year highs, crimping gross margins for small formulators. The U.S. International Trade Commission's ruling against certain Asian epoxy imports introduced additional tariffs that filtered into contract renegotiations within weeks. Composite-grade resin producers responded with EUR 150-200 per-ton price hikes, directly raising adhesive cost bases. While top-tier vendors hedge via multi-year supply deals, regional specialists face working-capital strain that may curb innovation pace.

Other drivers and restraints analyzed in the detailed report include:

1. Increasing Mini-LED and Micro-LED Backlighting Adoption
2. Growing Technological Advancements in Electronic Adhesives
3. Stringent VOC and RoHS/REACH Compliance Costs

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Epoxy resins remained paramount, accounting for 30.19% of 2024 revenue within the electronics adhesives market. Their high cohesive strength, dielectric stability, and resistance to harsh fluids keep them entrenched in under-the-hood automotive modules and industrial drives. Meanwhile, acrylic chemistries, expanding at an 11.19% CAGR, offer faster light-plus-heat curing and greater substrate flexibility, features prized by smartphone lens-stack bonding. Bio-based epoxy initiatives, leveraging lignin and vegetable-oil derivatives, aim to cut carbon footprints without sacrificing 260 °C peak-temperature capability. Across specialty assembly houses, hybrid epoxy-acrylate blends are gaining traction where manufacturers need snap-cure attributes in a single formulation. This interplay of legacy robustness and emerging agility underscores the diverse formulation roadmap powering the electronics adhesives market.

Second-tier polyurethane systems address vibration-rich settings such as battery modules that face road-surface shocks, whereas silicone and cyanoacrylate niches persist for high-temperature power devices and rapid fixturing. Regulatory attention on bisphenol-A diglycidyl ether is nudging epoxy suppliers toward alternative monomers, yet long-term demand fundamentals remain intact. Manufacturers continue to differentiate through proprietary toughening agents that widen operating windows from -55 °C to 175 °C, thereby cementing epoxy's leadership even as acrylic volumes accelerate.

Electrically conductive grades delivered 43.90% of 2024 sales, proving indispensable wherever solder voids threaten circuit continuity. Silver-flake epoxies dominate flip-chip die-attach, while nickel-loaded versions offer cost-effective EMI shielding for 5G antennas. UV-curing adhesives, scaling at a 12.04% CAGR, compress line tact times to seconds and enable in-situ optical inspection, elevating first-pass yields in camera module factories. Thermally conductive variants, infused with aluminum nitride or boron nitride fillers, dissipate up to 5 W/mK, extending LED lumen maintenance and inverter uptime.

Non-conductive structural epoxies sustain demand where isolation from high-voltage traces is non-negotiable, notably in traction inverters and data-center power supplies. Hybrid dual-cure products that combine UV pre-gelling with thermal post-cure are emerging as the go-to option for complex three-dimensional assemblies. The breadth of performance profiles available today strengthens the electronics adhesives market, giving designers latitude to optimize electrical, thermal, and optical parameters simultaneously.

The Electronics Adhesives Market Report is Segmented by Resin Type (Epoxy, Acrylic, and More), Product Type (Electrically Conductive, Thermally Conductive, and More), Application (Conformal Coating, Surface Mounting, and More), End-User Industry (Consumer Hardware, IT Hardware, and More), and Geography (Asia-Pacific, North America, Europe, and More). The Market Forecasts are Provided in Terms of Value (USD).

Geography Analysis

Asia-Pacific contributed 58.69% of 2024 revenue, making it the single largest regional pillar of the electronics adhesives market. Mainland China raised electronics output by 11.3% in 2024 through state grants for advanced packaging lines and local wafer-level underfill capacity expansions. Thailand and Vietnam absorbed fresh foreign direct investment after the United States granted selected tariff exemptions on electronics imports from April 2025, redirecting assembly programs into ASEAN clusters. The region's integrated supply base-from resin reactors to fully automated SMT lines-compresses lead times and reinforces its cost leadership.

North America's reshoring narrative gained momentum via the CHIPS and Science Act, which allocates USD 52 billion toward domestic wafer fabrication. This upstream capital outlay is stimulating downstream adhesive demand for clean-room-grade underfills and liquid thermal interface materials. Canada's Quebec corridor likewise hosts new printed-electronics pilot plants that prioritize bio-based chemistries, mirroring sustainability pushes seen in Europe.

Europe is charting an electronics adhesives market size rebound as its own EU Chips Act strengthens local microelectronic value chains. Environmental regulations, including progressive PFAS limitations, are galvanizing R&D into fluorine-free lubricious fillers. Germany's automotive Tier 1s are qualifying debondable grades for dashboard displays, while Scandinavian EMS providers emphasize low-temperature curing to shrink energy footprints.

South America and the Middle East and Africa represent emerging frontiers. Brazil's Manaus free-trade zone is broadening consumer-electronic assembly, opening opportunities for mid-viscosity acrylics tailored to tropical humidity. The United Arab Emirates is positioning itself as a regional logistics hub, pairing free-zone incentives with AI-centered R&D parks that could seed localized adhesive blending plants. Though smaller today, these geographies add diversification prospects for firms eager to de-risk concentration within traditional production centers.

1. 3M
2. Arkema
3. Avery Dennison
4. BASF
5. DELO
6. Dow
7. Dymax Corporation
8. H.B. Fuller Company
9. Henkel AG and Co. KGaA
10. Huntsman International LLC.
11. ITW Engineered Polymers
12. Master Bond Inc.
13. NAMICS CORPORATION
14. Panacol-Elosol GmbH
15. Parker Hannifin Corp
16. Permabond LLC
17. Pidilite Industries Ltd.
18. Shin-Etsu Chemical Co., Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 Introduction

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 Research Methodology

3 Executive Summary

4 Market Landscape

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Surge in High-Density Packaging Demand
  • 4.2.2 Increase in Demand for Surface Mount Technology requiring Adhesives
  • 4.2.3 Increasing Mini-LED and Micro-LED Backlighting Adoption
  • 4.2.4 Growing Technological Advancements in Electronic Adhesives
  • 4.2.5 Expansion of Consumer Electronics Production
• 4.3 Market Restraints
  • 4.3.1 Volatility in Epoxy and Acrylate Feedstock Prices
  • 4.3.2 Stringent VOC and RoHS/REACH Compliance Costs
  • 4.3.3 Thermal-Mismatch Failures in Ultra-Thin Flexible Substrates
• 4.4 Value Chain Analysis
• 4.5 Porter's Five Forces
  • 4.5.1 Bargaining Power of Suppliers
  • 4.5.2 Bargaining Power of Buyers
  • 4.5.3 Threat of New Entrants
  • 4.5.4 Threat of Substitutes
  • 4.5.5 Degree of Competition

5 Market Size and Growth Forecasts (Value)

• 5.1 By Resin Type
  • 5.1.1 Epoxy
  • 5.1.2 Acrylic
  • 5.1.3 Polyurethane
  • 5.1.4 Other Resin Types (Silicone, Cyanoacrylate, etc.)
• 5.2 By Product Type
  • 5.2.1 Electrically Conductive
  • 5.2.2 Thermally Conductive
  • 5.2.3 UV Curing
  • 5.2.4 Other Product Types (Non-conductive, etc.)
• 5.3 By Application
  • 5.3.1 Conformal Coating
  • 5.3.2 Surface Mounting
  • 5.3.3 Encapsulation
  • 5.3.4 Wire Tacking
  • 5.3.5 Other Applications (Underfill, Die-Attach)
• 5.4 By End-user Industry
  • 5.4.1 Consumer Hardware
  • 5.4.2 IT Hardware
  • 5.4.3 Automotive
  • 5.4.4 Other End-user Industries (Industrial and Power Electronics, etc.)
• 5.5 By Geography
  • 5.5.1 Asia-Pacific
    • 5.5.1.1 China
    • 5.5.1.2 Japan
    • 5.5.1.3 India
    • 5.5.1.4 South Korea
    • 5.5.1.5 ASEAN Countries
    • 5.5.1.6 Rest of Asia-Pacific
  • 5.5.2 North America
    • 5.5.2.1 United States
    • 5.5.2.2 Canada
    • 5.5.2.3 Mexico
  • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 United Kingdom
    • 5.5.3.3 France
    • 5.5.3.4 Italy
    • 5.5.3.5 Spain
    • 5.5.3.6 Russia
    • 5.5.3.7 NORDIC Countries
    • 5.5.3.8 Rest of Europe
  • 5.5.4 South America
    • 5.5.4.1 Brazil
    • 5.5.4.2 Argentina
    • 5.5.4.3 Rest of South America
  • 5.5.5 Middle-East and Africa
    • 5.5.5.1 Saudi Arabia
    • 5.5.5.2 South Africa
    • 5.5.5.3 Rest of Middle-East and Africa

6 Competitive Landscape

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share(%)/Ranking Analysis
• 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
  • 6.4.1 3M
  • 6.4.2 Arkema
  • 6.4.3 Avery Dennison
  • 6.4.4 BASF
  • 6.4.5 DELO
  • 6.4.6 Dow
  • 6.4.7 Dymax Corporation
  • 6.4.8 H.B. Fuller Company
  • 6.4.9 Henkel AG and Co. KGaA
  • 6.4.10 Huntsman International LLC.
  • 6.4.11 ITW Engineered Polymers
  • 6.4.12 Master Bond Inc.
  • 6.4.13 NAMICS CORPORATION
  • 6.4.14 Panacol-Elosol GmbH
  • 6.4.15 Parker Hannifin Corp
  • 6.4.16 Permabond LLC
  • 6.4.17 Pidilite Industries Ltd.
  • 6.4.18 Shin-Etsu Chemical Co., Ltd.

7 Market Opportunities and Future Outlook

• 7.1 White-space and Unmet-Need Assessment