박막 봉지 : 시장 점유율 분석, 산업 동향, 통계, 성장 예측(2025-2030년)

The thin film encapsulation market size was valued at USD 0.35 billion in 2025 and is forecast to reach USD 1.05 billion by 2030, reflecting a robust 20.78% CAGR.

Rapid adoption of flexible OLED displays, surging demand for bendable consumer devices, and aggressive capacity additions in Asia-Pacific have kept the growth trajectory steep. Manufacturers are prioritizing atomic layer deposition (ALD) barriers that achieve water-vapor transmission rates below 10-6 g/m2/day, enabling longer device lifetimes while preserving form-factor flexibility. Automotive mandates for curved cockpit displays and medical certification of roll-to-roll ALD films are widening application scope, even as precursor shortages and capital-intensive Gen-6 ALD lines present headwinds. Competitive intensity is rising as Chinese firms, buoyed by "New Display" subsidies, scale output and erode Korean dominance.

Global Thin Film Encapsulation Market Trends and Insights

AMOLED capacity expansions in South Korea and China are fueling ALD-TFE tool orders

Samsung Display allocated USD 3 billion for an 8.6-generation IT OLED line targeting 2026 production, while BOE committed USD 8.7 billion for a comparable plant. These projects multiplied purchase orders for ALD encapsulation tools because the technology offers uniform, pinhole-free barriers at low temperatures, a necessity for next-generation IT and automotive panels. Heightened competition has revived Korean shipment leadership but simultaneously broadened ALD demand across Asia-Pacific foundries.

Automotive curved-display mandates in the EU and North America

Regulatory guidance favoring seamless instrument clusters has sparked accelerated design-ins of curved OLED dashboards. These modules need encapsulation stacks that withstand vibration, UV exposure, and -40 °C cycling. Samsung's adoption of tandem OLED with advanced moisture barriers exemplified the shift, positioning the firm to capture revenue as total automotive display spend is forecast to overtake monitor panel sales by 2026.

High CapEx of Gen-6 ALD cluster lines

Next-generation ALD stacks demand more than USD 100 million per line, sidelining mid-tier producers and slowing technology diffusion. Many Asian fabs still amortize older cluster tools, complicating upgrade economics even where yield benefits are clear. This cost barrier delays uniform adoption of best-in-class encapsulation across the thin film encapsulation market.

Other drivers and restraints analyzed in the detailed report include:

1. Roll-to-roll ALD unlocking certified medical wearables
2. EU carbon-neutral BIPV push boosting inorganic barriers
3. Reliability failures under -40 °C automotive cycling

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

ALD recorded a 26.4% CAGR outlook while PECVD held 39.3% revenue in 2024, illustrating a transition phase within the thin film encapsulation market. ALD films reached water-vapor rates at 10-6 g/m2/day that extend OLED life spans and support foldable substrates. Roll-to-roll ALD upgraded throughput to web speeds suitable for wearable production, while spatial ALD is overcoming substrate-size limits. PECVD remains preferred for rigid panels needing high volume. VTE and OVPD continue in niche emissive stacks where material compatibility overrides barrier extremity. Low-temperature ALD chemistries awarded by SID in 2023 unlocked polyimide substrates for mass foldables, deepening the technology mix. Consequently, ALD tool providers enjoy record order backlogs, lifting regional supplier ecosystems across South Korea, China, and the United States.

The thin film encapsulation market continues to rely on PECVD for cost-sensitive SKUs because the reactors integrate seamlessly with legacy TFT lines. Inkjet encapsulation printing, spearheaded by Kateeva, decreased organic material waste and enabled patterned barriers for smartwatch dials. VTE retains relevance for small-area microdisplays where device yield trumps throughput. With spatial ALD crossing 15 gen substrates in pilot tests, the competitive landscape between PECVD and ALD is expected to tighten, driving hybrid production floors that leverage both methods.

Hybrid stacks combining parylene C with ALD Al2O3 secured 47.3% sales in 2024, thanks to a proven balance of stress relief and moisture blocking. These dyads achieved sub-105 g/m2/day WVTR while sustaining flex cycles exceeding 10,000 bends, a specification demanded by premium smartphones. Single-layer barriers, however, now post the fastest 29.1% CAGR because silbione-blended hybrimer films offer comparable protection at half the deposition sequence length, cutting takt time for rollable panels.

Inorganic multi-layers deliver unmatched oxygen resistance but risk crack formation under tensile stress, limiting adoption in foldables. Organic multi-layers excel in bendability yet rarely reach lifetime targets alone. Commercial lines consequently calibrate layer architecture by product class: smartphones accept hybrid dyads, automotive clusters need triple inorganic caps, while e-textiles increasingly lean on advanced organic chemistries. Component suppliers respond with modular material kits that harmonize refractive index, modulus, and stickiness across adjoining layers, ensuring line reliability beyond 90% yield.

Thin Film Encapsulation Market is Segmented by Technology (Plasma-Enhanced Chemical Vapor Deposition, Atomic Layer Deposition, and More), by Layer Structure (Inorganic Multilayer Barriers, Organic Multilayer Barriers, and More), by Application (Flexible OLED Displays, and More), by Deposition Equipment Type (Cluster PECVD Systems, and More), by End-Use Industry (Consumer Electronics, Renewable Energy, and More), and by Geography.

Geography Analysis

Asia-Pacific retained 69.5% revenue share in 2024, driven by South Korea's and China's fab expansions and integrated supply ecosystems. Government incentives covering encapsulation capital costs accelerated ALD cluster installations, while Korean players pivoted toward high-value products and tandem stacks to defend margins. Regional tooling and chemical suppliers co-located near fabs, shortening qualification cycles and reinforcing dominance across the thin film encapsulation market.

Europe posted healthy gains built on automotive and BIPV demand. Strict EU vehicle safety directives accelerated curved OLED cockpit adoption, and carbon-neutral building rules spurred ALD barrier uptake in solar facades. Research consortia advanced low-temperature ALD precursors, aligning performance with circular-economy objectives.

The Middle East and Africa exhibited the highest 27.2% CAGR outlook from a small base, as nations like the UAE and Saudi Arabia funded electronics clusters to diversify their economies. Harsh desert climates necessitated robust encapsulation for display and solar products, creating premium demand for ALD-based inorganic layers. Technology transfer partnerships with Asian OEMs seeded local capacity, reducing single-region dependency for global brands.

North America maintained influence through materials science leadership and equipment exports despite limited panel production. Automotive mandates and quantum-dot microLED research and development anchored demand for specialized barrier know-how, while roll-to-roll ALD startups leveraged venture funding to commercialize wearable lines. Regional fabs collaborated with universities on machine-learning process control, enhancing film uniformity and throughput.

1. Samsung SDI Co., Ltd.
2. LG Chem Ltd.
3. Universal Display Corporation
4. Applied Materials Inc.
5. Veeco Instruments Inc.
6. 3M Inc.
7. Toray Industries Inc.
8. Kateeva
9. BASF (Rolic) AG
10. Meyer Burger Technology AG
11. Encapsulix SAS
12. Forge Nano Inc.
13. Aixtron SE
14. Angstrom Engineering Inc.
15. Forge Nano Inc.
16. Beneq Oy
17. Picosun Oy
18. Canon Tokki Corporation
19. AP Systems
20. EMD Electronics (Merck KGaA)
21. Idemitsu Kosan Co.
22. Encapsulix SAS
23. Wonik IPS
24. Vitriflex Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 AMOLED Capacity Expansions in South Korea and China Fueling ALD-TFE Tool Orders
  • 4.2.2 Automotive Curved-Display Mandates in EU and NA
  • 4.2.3 Roll-to-Roll ALD Unlocking Certified Medical Wearables
  • 4.2.4 EU Carbon-Neutral BIPV Push Boosting Inorganic Barriers
  • 4.2.5 SID Award-Winning Low-Temp ALD Materials Enabling Foldables
  • 4.2.6 China "New Display" Subsidies Covering Encapsulation Capex
• 4.3 Market Restraints
  • 4.3.1 High Capex of Gen-6 ALD Cluster Lines
  • 4.3.2 Reliability Failures under -40 °C Automotive Cycling
  • 4.3.3 Competition from Ultra-Thin Flexible Glass
  • 4.3.4 Precursor Supply Bottlenecks (e.g., DEZ)
• 4.4 Value Chain Analysis
• 4.5 Regulatory and Technological Outlook
• 4.6 Key Performance Indicators Benchmarked
• 4.7 Porter's Five Forces
  • 4.7.1 Threat of New Entrants
  • 4.7.2 Bargaining Power of Buyers
  • 4.7.3 Bargaining Power of Suppliers
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Intensity of Competitive Rivalry
• 4.8 Assessment of Impact of Macroeconomic factors on the Market

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Technology
  • 5.1.1 Plasma-Enhanced Chemical Vapor Deposition (PECVD)
  • 5.1.2 Atomic Layer Deposition (ALD)
  • 5.1.3 Inkjet Printing
  • 5.1.4 Vacuum Thermal Evaporation (VTE)
  • 5.1.5 Organic Vapor Phase Deposition (OVPD)
  • 5.1.6 Roll-to-Roll ALD
  • 5.1.7 Other Emerging Techniques (Parylene, Sol-Gel)
• 5.2 By Layer Structure
  • 5.2.1 Inorganic Multilayer Barriers
  • 5.2.2 Organic Multilayer Barriers
  • 5.2.3 Hybrid (Organic+Inorganic) Barriers
  • 5.2.4 Single-Layer Encapsulation
• 5.3 By Application
  • 5.3.1 Flexible OLED Displays
  • 5.3.2 Thin-Film Photovoltaics
  • 5.3.3 Flexible OLED Lighting
  • 5.3.4 Wearable and Medical Electronics
  • 5.3.5 Automotive Displays and Lighting
  • 5.3.6 Quantum-Dot and MicroLED Devices
  • 5.3.7 Printed Sensors and IoT Devices
• 5.4 By Deposition Equipment Type
  • 5.4.1 Cluster PECVD Systems
  • 5.4.2 Inkjet Encapsulation Printers
  • 5.4.3 ALD Reactors
  • 5.4.4 Roll-to-Roll Vacuum Systems
  • 5.4.5 Laser-Assisted Deposition Tools
• 5.5 By End-Use Industry
  • 5.5.1 Consumer Electronics
  • 5.5.2 Renewable Energy
  • 5.5.3 Automotive and Transportation
  • 5.5.4 Healthcare and Wearables
  • 5.5.5 Industrial and Aerospace
• 5.6 By Geography
  • 5.6.1 North America
    • 5.6.1.1 United States
    • 5.6.1.2 Canada
    • 5.6.1.3 Mexico
  • 5.6.2 South America
    • 5.6.2.1 Brazil
    • 5.6.2.2 Argentina
    • 5.6.2.3 Rest of South America
  • 5.6.3 Europe
    • 5.6.3.1 Germany
    • 5.6.3.2 France
    • 5.6.3.3 United Kingdom
    • 5.6.3.4 Italy
    • 5.6.3.5 Rest of Europe
  • 5.6.4 Asia-Pacific
    • 5.6.4.1 China
    • 5.6.4.2 South Korea
    • 5.6.4.3 Japan
    • 5.6.4.4 India
    • 5.6.4.5 Rest of Asia-Pacific
  • 5.6.5 Middle East and Africa
    • 5.6.5.1 Middle East
    • 5.6.5.1.1 Saudi Arabia
    • 5.6.5.1.2 United Arab Emirates
    • 5.6.5.1.3 Turkey
    • 5.6.5.1.4 Rest of Middle East
    • 5.6.5.2 Africa
    • 5.6.5.2.1 South Africa
    • 5.6.5.2.2 Nigeria
    • 5.6.5.2.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
  • 6.4.1 Samsung SDI Co., Ltd.
  • 6.4.2 LG Chem Ltd.
  • 6.4.3 Universal Display Corporation
  • 6.4.4 Applied Materials Inc.
  • 6.4.5 Veeco Instruments Inc.
  • 6.4.6 3M Inc.
  • 6.4.7 Toray Industries Inc.
  • 6.4.8 Kateeva
  • 6.4.9 BASF (Rolic) AG
  • 6.4.10 Meyer Burger Technology AG
  • 6.4.11 Encapsulix SAS
  • 6.4.12 Forge Nano Inc.
  • 6.4.13 Aixtron SE
  • 6.4.14 Angstrom Engineering Inc.
  • 6.4.15 Forge Nano Inc.
  • 6.4.16 Beneq Oy
  • 6.4.17 Picosun Oy
  • 6.4.18 Canon Tokki Corporation
  • 6.4.19 AP Systems
  • 6.4.20 EMD Electronics (Merck KGaA)
  • 6.4.21 Idemitsu Kosan Co.
  • 6.4.22 Encapsulix SAS
  • 6.4.23 Wonik IPS
  • 6.4.24 Vitriflex Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment