열경화성 성형 재료 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the thermoset molding compound market size is projected to be USD 11.88 billion in 2025, USD 12.67 billion in 2026, and reach USD 17.45 billion by 2031, growing at a CAGR of 6.62% from 2026 to 2031.

This report is Segmented by Resin Type (Epoxy, Melamine Formaldehyde, Urea Formaldehyde, and More), Fiber Reinforcement (Glass Fiber, Carbon Fiber, and More), Application (Electrical and Electronics, Automotive, Aerospace, Construction, and More), and Geography (Asia-Pacific, North America, Europe, South America, and Middle-East and Africa). The Market Forecasts are Provided in Terms of Value (USD).

Global Thermoset Molding Compound Market Trends and Insights

Growing Use in Electrical and Electronics

Thermal-management requirements for 800-volt EV inverters and 5G base stations are driving epoxy specifications toward thermal conductivities above 0.80 W/m/K and dielectric constants below 4.0. Hybrid hBN-AlN filler systems now deliver UL 94 V-0 flame ratings without halogens, supporting data-center power supplies that must pass 105°C continuous-use tests. China's printed-circuit-board output is forecast to hit USD 54.6 billion by 2026, sustaining epoxy demand for FR-4 and high-frequency laminates. Semiconductor packaging for AI accelerators increasingly favors cycloaliphatic epoxies with glass-transition temperatures above 150°C, eroding phenolic share. Shorter qualification cycles, now under 12 months, reward suppliers offering digital simulation and in-house rapid prototyping capabilities.

Automotive and Aerospace Lightweighting Push

European fleet CO2 ceilings of 95 g/km are compelling OEMs to shift brackets, crossbeams, and battery enclosures from steel to glass-fiber phenolic and carbon-fiber epoxy, trimming vehicle mass by up to 50%. BASF's spray transfer molding process enables Class-A body panels in 3-minute cycles, eliminating paint-bake ovens and cutting energy usage 40%. In aerospace, HexPly M51 prepreg cures in 40 minutes at 180°C, reducing autoclave energy 30% and unlocking single-shift throughput. Korea's supply chain is piloting glass-mat thermoplastic bumper beams that threaten phenolic sheet-molding compounds in non-structural zones. Across mobility platforms, lightweighting ties directly to regulatory credits and extended battery range, enhancing the thermoset molding compound market value proposition.

Poor Recyclability and End of Life Costs

Irreversible cross-linking confines most thermoset scrap to landfill or costly pyrolysis, where gate fees run USD 200-400 per tonne, double virgin material value. EU Directive 2018/851 targets 70% composite recovery by 2030, yet mechanical grinding downgrades materials to low-value fillers. A single 3-MW wind turbine yields 20 tonnes of blade waste, and Europe expects 14,000 blade retirements, straining landfill space in Germany and Denmark. Design-for-disassembly adds USD 50-100 per vehicle in labor, discouraging OEM adoption unless extended producer responsibility regimes expand. Vitrimer plants require USD 50 million investment, affordable only for integrated resin majors, slowing near-term penetration.

Other drivers and restraints analyzed in the detailed report include:

1. Renewable Energy Composite Demand Surge
2. Infrastructure Prefabs Adopting High Durability Compounds
3. Formaldehyde Based Compound HSE Risks

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Phenolic resins delivered 28.02% of the Thermoset Molding Compound market share in 2025 on the back of friction materials and EV motor housings. The Thermoset Molding Compound market size for phenolics is projected to advance modestly as emission-controlled variants secure appliance interiors. Epoxy is pacing ahead at a 7.02% CAGR through 2031 on demand for AI semiconductor packaging and 15-MW wind-blade skins. Polyester BMC trails in cost-sensitive sanitary ware, while melamine and urea derivatives fade under emission scrutiny.

Epoxy formulators are commercializing cycloaliphatic grades with Tg above 150°C and 1% moisture uptake, aligning with AI accelerator packages. China's phenolic output surpassed 1.60 million tons in 2024, led by Shandong Shengquan with 25% share, underscoring Asia's cost edge. Niche systems such as vinyl-ester and diallyl phthalate occupy corrosion-resistant and high-voltage insulation segments, respectively, at 2-5X price premiums, which the thermoset molding compound industry absorbs where failure is not an option.

Geography Analysis

Asia-Pacific anchored 45.72% of the Thermoset Molding Compound market revenue in 2025 and is projected to rise at a 7.43% CAGR to 2031, propelled by China's 4.0 million-ton epoxy capacity and surging offshore wind installations. Indian anti-dumping duties are catalyzing domestic resin projects linked to a USD 1.4 trillion infrastructure pipeline. Japanese OEMs are adopting PM-5700 phenolic compounds in EV gears, targeting USD 13 million sales by 2030. Korean programs around long-fiber thermoplastics signal emerging substitution threats, yet the thermoset molding compound market in the region remains resilient on mandated flame performance.

North America faces supply tightness after U.S. anti-dumping margins on Chinese epoxy, shifting procurement to Mexico and Canada, while domestic capacity lags 40% below prior import volumes. Hexcel's USD 1.89 billion sales in 2025 underscore aerospace pull, and Arkema's Kentucky Forane 1233zd plant backs domestic wind-blade recyclability initiatives.

Europe balances 0.1 ppm (parts per million) formaldehyde thresholds with 70% composite recycling mandates, pressuring phenolic incumbents to innovate or exit. Germany and Denmark confront blade-waste surges, accelerating vitrimer research collaborations. South America and Middle East-Africa remain smaller but growth-oriented, emphasizing corrosion-resistant vinyl-ester systems for petrochemical and water infrastructure.

1. Arkema
2. Ashland
3. BASF
4. Chang Chun Group
5. Core Molding Technologies
6. CSP
7. DIC Corporation
8. Hexcel Corporation
9. Hexion Inc.
10. Huntsman
11. IDI Composites International
12. Menzolit
13. Mitsubishi Gas Chemical Next Company, Inc.
14. Momentive
15. Owens Corning
16. Plenco
17. Polynt SpA
18. POLYTEC HOLDING AG
19. Resonac Holdings Corporation
20. Scott Bader Company Ltd
21. Sumitomo Bakelite Co., Ltd.
22. Toray Advanced Composites

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 Introduction

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 Research Methodology

3 Executive Summary

4 Market Landscape

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Growing use in electrical and electronics
  • 4.2.2 Automotive and aerospace lightweighting push
  • 4.2.3 Renewable-energy composite demand surge
  • 4.2.4 Infrastructure prefabs adopting high-durability compounds
  • 4.2.5 Regional epoxy capacity build-up post anti-dumping duties
  • 4.2.6 Dynamic-covalent/vitrimer technologies enabling recyclability
• 4.3 Market Restraints
  • 4.3.1 Poor recyclability/end-of-life costs
  • 4.3.2 Formaldehyde-based compound HSE risks
  • 4.3.3 Protectionist trade barriers disrupting supply chains
  • 4.3.4 Emergent thermoplastic composites cannibalising low-temperature uses
• 4.4 Value Chain Analysis
• 4.5 Porter's Five Forces
  • 4.5.1 Bargaining Power of Suppliers
  • 4.5.2 Bargaining Power of Buyers
  • 4.5.3 Threat of New Entrants
  • 4.5.4 Threat of Substitutes
  • 4.5.5 Competitive Rivalry

5 Market Size and Growth Forecasts (Value)

• 5.1 By Resin Type
  • 5.1.1 Epoxy
  • 5.1.2 Phenolic
  • 5.1.3 Polyester
  • 5.1.4 Melamine Formaldehyde
  • 5.1.5 Urea Formaldehyde
  • 5.1.6 Other Thermoset Resins
• 5.2 By Fiber Reinforcement
  • 5.2.1 Glass Fiber
  • 5.2.2 Carbon Fiber
  • 5.2.3 Other Reinforcements
• 5.3 By Application
  • 5.3.1 Electrical and Electronics
  • 5.3.2 Automotive
  • 5.3.3 Aerospace
  • 5.3.4 Construction
  • 5.3.5 Consumer Goods
  • 5.3.6 Other Applications
• 5.4 By Geography
  • 5.4.1 Asia-Pacific
    • 5.4.1.1 China
    • 5.4.1.2 Japan
    • 5.4.1.3 India
    • 5.4.1.4 South Korea
    • 5.4.1.5 ASEAN Countries
    • 5.4.1.6 Rest of Asia-Pacific
  • 5.4.2 North America
    • 5.4.2.1 United States
    • 5.4.2.2 Canada
    • 5.4.2.3 Mexico
  • 5.4.3 Europe
    • 5.4.3.1 Germany
    • 5.4.3.2 United Kingdom
    • 5.4.3.3 France
    • 5.4.3.4 Italy
    • 5.4.3.5 Spain
    • 5.4.3.6 Russia
    • 5.4.3.7 Rest of Europe
  • 5.4.4 South America
    • 5.4.4.1 Brazil
    • 5.4.4.2 Argentina
    • 5.4.4.3 Rest of South America
  • 5.4.5 Middle East and Africa
    • 5.4.5.1 Saudi Arabia
    • 5.4.5.2 South Africa
    • 5.4.5.3 Rest of Middle East and Africa

6 Competitive Landscape

• 6.1 Strategic Developments
• 6.2 Market Share(%)/ Ranking Analysis
• 6.3 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
  • 6.3.1 Arkema
  • 6.3.2 Ashland
  • 6.3.3 BASF
  • 6.3.4 Chang Chun Group
  • 6.3.5 Core Molding Technologies
  • 6.3.6 CSP
  • 6.3.7 DIC Corporation
  • 6.3.8 Hexcel Corporation
  • 6.3.9 Hexion Inc.
  • 6.3.10 Huntsman
  • 6.3.11 IDI Composites International
  • 6.3.12 Menzolit
  • 6.3.13 Mitsubishi Gas Chemical Next Company, Inc.
  • 6.3.14 Momentive
  • 6.3.15 Owens Corning
  • 6.3.16 Plenco
  • 6.3.17 Polynt SpA
  • 6.3.18 POLYTEC HOLDING AG
  • 6.3.19 Resonac Holdings Corporation
  • 6.3.20 Scott Bader Company Ltd
  • 6.3.21 Sumitomo Bakelite Co., Ltd.
  • 6.3.22 Toray Advanced Composites

7 Market Opportunities and Future Outlook

• 7.1 White-space and Unmet-Need Assessment