모터 드라이버 IC 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the motor driver IC market size is projected to expand from USD 4.97 billion in 2025 and USD 5.34 billion in 2026 to USD 7.46 billion by 2031, registering a CAGR of 6.9% between 2026 and 2031.

This report is Segmented by Motor Type (Brushed DC Driver IC, Sic Driver IC, and More), End-Use Industry (Automotive, Industrial Automation and Robotics, Healthcare Equipment and More), Voltage Range (Up To 24 V, 25-48 V, 49-240 V, and Above 240 V), Semiconductor Material (Silicon, Silicon Carbide (SiC), and Gallium Nitride (GaN), and More), and Geography. Market Forecasts are Provided in Terms of Value (USD).

Global Motor Driver IC Market Trends and Insights

EV-Led Demand for High-Voltage Driver ICs

Battery-electric vehicle output is scaling quickly, and each high-voltage traction inverter now requires multi-phase gate drivers that tolerate junction temperatures above 175°C. Silicon-carbide MOSFETs satisfy this envelope at switching frequencies beyond what legacy IGBT drivers handle, letting OEMs downsize cooling loops and cable gauges. Commercial-vehicle electrification in California and the European Union further widens the opportunity because 800 V battery packs need reinforced-isolation drivers with creepage clearances exceeding IEC 60664-1 limits. Although demand is strong, qualified 200 mm SiC wafer capacity remains tight, extending lead times past half a year and inflating device ASPs, a bottleneck that entrenches suppliers with captive epitaxy lines.

Industrial Robotics and Automation Surge

Collaborative robots, automated guided vehicles, and high-speed CNC centers collectively drive the motor driver IC market, as each articulated joint embeds a three-phase servo loop. Factories in China, Japan, and South Korea dominate installation counts, yet North America and Europe are closing the gap with reshoring policies that reward productivity upgrades. Integrated safe-torque-off channels and EtherCAT-ready logic-shrinkboard real estate, while ISO 13849 compliance favors driver ICs with deterministic shutdown pathways. Vendors that can pre-certify functional-safety macrocells lock in design wins before value-engineering rivals can benchmark prototypes.

Automotive-Grade Safety Qualification Costs

Securing AEC-Q100 Grade 1 approval forces suppliers to perform 1 000-hour HTOL, THB, and ESD tests that collectively span up to two years and can cost more than USD 500 000 per product line. Layering ISO 26262 ASIL-D and SAE J3061 cybersecurity checks on top strains smaller fabless firms that lack the cash to absorb repeated test-lot failures. As a result, tier-1 module integrators gravitate toward incumbents with long automotive track records, consolidating purchasing power and throttling innovation at the low-volume edge of the motor driver IC market.

Other drivers and restraints analyzed in the detailed report include:

1. Rapid Adoption of BLDC Motors in Consumer and HVAC
2. Shift to Wide-Bandgap (SiC, GaN) Driver ICs
3. Semiconductor Supply-Chain Volatility

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

SiC driver ICs headline the performance story, outpacing the overall motor driver IC market with a projected 7.89% CAGR through 2031. The motor driver IC market size for SiC-based solutions rises as OEMs chase higher junction temperatures and switching speeds in 800 V traction and heavy-industrial drives. Brushless DC controllers remain the workhorse in volume terms, holding 46.94% revenue in 2025 across appliances, HVAC blowers, and low-to-mid-power factory equipment.

Continued cost erosion in coreless FET arrays keeps brushed-DC and stepper options alive in price-sensitive or legacy sockets, yet regulatory efficiency floors nudge even budget platforms toward three-phase topologies. Integration trends deepen as next-generation automotive microcontrollers embed gate-driver channels, a shift that trades discrete sockets for higher ASP monolithic devices. SiC, therefore, becomes the benchmark in premium tiers, while GaN pilots service 48 V accessories, and brushed-DC controllers settle into a long tail of maintenance and refurbishment demand.

Automotive platforms absorbed 37.53% of 2025 demand, and escalating battery-electric penetration keeps the segment on a 7.83% CAGR path. Each BEV typically installs 15-25 driver ICs for traction, battery-thermal loops, steering, and comfort functions, sustaining one of the deepest bill-of-materials stacks in the motor driver IC market. Industrial automation follows, with collaborative robots and automated warehouses installing dense clusters of servo loops that command premium diagnostics and deterministic latency.

Consumer electronics from cordless vacuums to high-end coffee machines embrace BLDC motors for acoustic and energy gains, generating stable mid-volume orders albeit at fierce cost targets. Medical equipment, although smaller in units, maintains high-margin pricing because life-support and surgical robots need ISO 13485 documentation and failure rates below single-digit FIT, bolstering the motor driver IC market share of vendors touting medical-grade process discipline.

Geography Analysis

Asia-Pacific commanded 52.53% of 2025 revenue because China dominates battery-electric car production while India unlocks fresh fab incentives for analog components. Joint-venture fabs in Japan and South Korea add capacity for automotive-grade SiC, supporting surging export volumes of industrial robots and infotainment modules. Local tier-1s choose domestic driver ICs whenever ISO 26262 and IATF 16949 paperwork aligns, reinforcing regional supply loops and shortening design-cycle feedback.

North America and Europe share a policy-led demand pattern where fleet-average CO2 caps compel OEMs to front-load EV investments. The CHIPS and Science Act dedicates USD 39 billion to fabrication subsidies, with analog multichip modules listed as priority categories, and Germany's EUR 3 billion semiconductor R and D pool steers grants toward automotive power electronics. These cash injections offset higher labor costs and de-risk long builds for motor driver IC suppliers that co-locate packaging and final test near customer plants.

South America achieves the fastest regional climb at 8.18% CAGR, anchored by Brazil's industrial modernization loans and Argentina's move to electrify mineral extraction. Mining haul trucks, conveyor lines, and process-plant pumps adopt BLDC and SiC drive packs to curb diesel usage, each installation embedding dozens of high-voltage driver ICs. Elsewhere, renewable megaprojects from Chile's Atacama solar corridor to Saudi Arabia's NEOM smart city specify electronically commutated pumps and HVAC systems, importing incremental demand into the motor driver IC market.

1. Allegro MicroSystems, Inc.
2. Alpha & Omega Semiconductor Ltd.
3. Analog Devices, Inc.
4. Diodes Incorporated
5. Infineon Technologies AG
6. Maxim Integrated Products, Inc.
7. Melexis NV
8. Microchip Technology Incorporated
9. Monolithic Power Systems, Inc.
10. NXP Semiconductors N.V.
11. ON Semiconductor Corporation
12. Panasonic Industry Co., Ltd.
13. Power Integrations, Inc.
14. Renesas Electronics Corporation
15. ROHM Co., Ltd.
16. Sanken Electric Co., Ltd.
17. Silergy Corp.
18. STMicroelectronics N.V.
19. Texas Instruments Incorporated
20. Toshiba Electronic Devices & Storage Corporation

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 EV-led demand for high-voltage driver ICs
  • 4.2.2 Industrial robotics and automation surge
  • 4.2.3 Rapid adoption of BLDC motors in consumer and HVAC
  • 4.2.4 Shift to wide-bandgap (SiC, GaN) driver ICs
  • 4.2.5 Embedded AI-based predictive-maintenance features
  • 4.2.6 Vehicle zonal-architecture reducing power stage BOM
• 4.3 Market Restraints
  • 4.3.1 Automotive-grade safety qualification costs
  • 4.3.2 Semiconductor supply-chain volatility
  • 4.3.3 Thermal limits in ultra-compact BLDC modules
  • 4.3.4 Smart-motor integration cannibalising low-power ICs
• 4.4 Impact of Macroeconomic Factors on the Market
• 4.5 Industry Value, Supply-Chain Analysis
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Threat of New Entrants
  • 4.8.2 Bargaining Power of Suppliers
  • 4.8.3 Bargaining Power of Buyers
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Motor Type
  • 5.1.1 Brushed DC driver IC
  • 5.1.2 Brushless DC driver IC
  • 5.1.3 Stepper motor driver IC
  • 5.1.4 SiC driver IC
  • 5.1.5 Rest of Motor Type
• 5.2 By End-use Industry
  • 5.2.1 Automotive
  • 5.2.2 Industrial automation and robotics
  • 5.2.3 Consumer electronics and appliances
  • 5.2.4 Healthcare equipment
  • 5.2.5 Rest of End-use Industry
• 5.3 By Voltage Range
  • 5.3.1 Up to 24 V
  • 5.3.2 25-48 V
  • 5.3.3 49-240 V
  • 5.3.4 Above 240 V
• 5.4 By Semiconductor Material
  • 5.4.1 Silicon
  • 5.4.2 Silicon Carbide (SiC)
  • 5.4.3 Gallium Nitride (GaN)
  • 5.4.4 Rest of Semiconductor Material
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 Europe
    • 5.5.2.1 Germany
    • 5.5.2.2 United Kingdom
    • 5.5.2.3 France
    • 5.5.2.4 Italy
    • 5.5.2.5 Rest of Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Japan
    • 5.5.3.3 India
    • 5.5.3.4 South Korea
    • 5.5.3.5 Australia
    • 5.5.3.6 Rest of Asia-Pacific
  • 5.5.4 South America
  • 5.5.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Allegro MicroSystems, Inc.
  • 6.4.2 Alpha & Omega Semiconductor Ltd.
  • 6.4.3 Analog Devices, Inc.
  • 6.4.4 Diodes Incorporated
  • 6.4.5 Infineon Technologies AG
  • 6.4.6 Maxim Integrated Products, Inc.
  • 6.4.7 Melexis NV
  • 6.4.8 Microchip Technology Incorporated
  • 6.4.9 Monolithic Power Systems, Inc.
  • 6.4.10 NXP Semiconductors N.V.
  • 6.4.11 ON Semiconductor Corporation
  • 6.4.12 Panasonic Industry Co., Ltd.
  • 6.4.13 Power Integrations, Inc.
  • 6.4.14 Renesas Electronics Corporation
  • 6.4.15 ROHM Co., Ltd.
  • 6.4.16 Sanken Electric Co., Ltd.
  • 6.4.17 Silergy Corp.
  • 6.4.18 STMicroelectronics N.V.
  • 6.4.19 Texas Instruments Incorporated
  • 6.4.20 Toshiba Electronic Devices & Storage Corporation

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-need Assessment