질화갈륨(GaN) 기판 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the gaN substrate market size is expected to increase from USD 0.35 billion in 2025 to USD 0.39 billion in 2026 and reach USD 0.65 billion by 2031, growing at a CAGR of 10.77% over 2026-2031.

This report is Segmented by Substrate Type (GaN-On-Sapphire, GaN-On-Silicon, GaN-On-Silicon Carbide, Native GaN (GaN-On-GaN), and GaN-On-Diamond), Wafer Size (2 Inch, 4 Inch, 6 Inch, and More), Application (Laser Diodes, Radio-Frequency Devices, and More ), End-Use Industry (Consumer Electronics, Automotive and Transportation, and More), and Geography. Market Forecasts are Provided in Terms of Value (USD).

Global GaN Substrate Market Trends and Insights

Rising Adoption in EV On-Board Fast-Charging Systems

Electric-vehicle makers now specify GaN-based on-board chargers that hit 96% efficiency and 6 kW L-1 power density, results validated when Changan deployed Navitas GaNSafe devices in 2025. Subsequent 6.6 kW units from Inovance Automotive delivered 30% higher power density than silicon IGBTs and trimmed charger weight by 20%. Infineon's automotive-qualified 100 V GaN transistors cleared AEC-Q101 later in 2025, confirming that qualification hurdles have been overcome. Demand curves point to more than 1 million GaN chargers per year by 2028, a volume that motivates substrate suppliers to transition from 6-inch to 8-inch platforms. Native GaN and GaN-on-SiC suppliers, therefore, face a window to lock in long-term supply contracts with Tier-1 automotive integrators.

Surging Micro-LED Display Production Requiring Low-Defect Native GaN Wafers

Micro-LED fabs impose dislocation density ceilings of 104 cm-2, a level unreachable on GaN-on-sapphire. Hybrid ammonothermal and HVPE growth schemes now deliver free-standing GaN wafers that meet that threshold, enabling wafer-scale mass transfer of micro-LED arrays onto CMOS backplanes. Mitsubishi Chemical demonstrated 4-inch crystals under a NEDO program in 2025, aiming at 1 000 wafers per month and enabling panel luminance beyond 100 000 nits for outdoor augmented-reality headsets. Display houses are simultaneously refining sidewall passivation chemistries to keep non-radiative recombination in check, ensuring that substrate quality propagates to final brightness performance.

High Wafer Price Premium Versus Si and SiC Limiting Adoption in Cost-Sensitive Segments

Native GaN and GaN-on-SiC wafers still command USD 3 000-8 000 per 6-inch unit, five to ten times the tag on comparable silicon carbide wafers. Consumer and industrial designers therefore stick with silicon IGBTs or SiC MOSFETs, sacrificing modest efficiency gains to avoid heavy bill-of-materials penalties. Ammonothermal growth produces superb crystal quality but requires 3 000-bar autoclaves running for weeks, tying up capital and capping throughput. Laser-based wafer-reuse projects at Nagoya University demonstrate up to 10 recycles without degrading device metrics, yet commercial cycle times have not yet matched the cadence of conventional foundry flows.

Other drivers and restraints analyzed in the detailed report include:

1. Telecom 5G/6G PA Build-Out Accelerating Demand for High-Thermal-Conductivity GaN-on-SiC Substrates
2. Rapid Scale-Up of 6-Inch HVPE Free-Standing GaN Production Lowering Cost per cm2
3. Device-Yield Losses from Threading-Dislocation Clusters on 6-Inch Wafers

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

GaN-on-silicon held 31.19% of the GaN substrate market share in 2025, thanks to a seamless fit with 200 mm fabs and a sub-USD 200 cost per wafer. Innoscience ramped 8-inch lines from 13 000 to 20 000 wafers per month and targets 70 000 by 2030, underlining China's capacity lead. The GaN substrate market size for diamond-integrated variants is projected to grow at 11.24% CAGR through 2031 as bonding lowers thermal resistance below 10 mm2 K W-1 and enables power densities above 30 W mm-2 for phased-array radar.

Legacy GaN-on-sapphire maintains a foothold in general lighting, but share erodes as micro-LED and RF segments pivot to native GaN for defect control. GaN-on-SiC stays indispensable for high-heat telecom and defense systems, with Qorvo and Wolfspeed the default suppliers. Native GaN, though pricier, secures ultra-low dislocation counts for vertical power transistors and fine-pitch display backplanes, and Shin-Etsu's 300 mm QST composite route may bridge cost and quality gaps over the forecast horizon.

Six-inch inventory represented 42.82% of the GaN substrate market size in 2025 as HVPE reactors and CMP tools are fully depreciated at that diameter. This dominance is attributed to the maturity of six-inch manufacturing processes, which have achieved cost efficiency and scalability. Sumitomo Chemical's NEDO-backed line uses 100-300 µm h-1 deposition rates to keep cycle times competitive and pull defect density below 105 cm-2, ensuring high-quality substrates suitable for various applications. The 8-inch-and-above cohort is on track for 11.51% CAGR to 2031, catalyzed by Infineon's announcement of 300 mm GaN lines and Chinese IDMs mapping 70 000 wafers per month by 2030.

This growth is driven by increasing demand for larger substrates to support high-power, high-frequency applications, as well as advancements in manufacturing technologies. A proof-of-concept 8-inch free-standing GaN was demonstrated in early 2026, yet cracking and CMP time remain stumbling blocks, highlighting the challenges in scaling up production. Two- and four-inch wafers persist in R&D and niche RF applications, where smaller substrates are sufficient for specialized use cases. Meanwhile, 300 mm composite substrates position GaN for mainstream silicon fabs once economics tighten, paving the way for broader adoption in the semiconductor industry.

Geography Analysis

Asia-Pacific accounted for 41.33% of the GaN substrate market share in 2025. Chinese IDMs, supported by domestic capital investments and abundant gallium feedstock, continue to expand their 8-inch GaN-on-silicon production lines to meet growing demand. Japan, on the other hand, capitalizes on its advanced crystal growth expertise to produce free-standing native GaN substrates and to explore emerging diamond-bonded technologies. South Korea's display manufacturers are increasingly relying on native GaN substrates to advance their micro-LED technology roadmaps, while India's AGNIT Semiconductors is scaling up production under favorable tax incentives and government support programs.

North America combines its strong design leadership with increasing defense-related demand for GaN-on-SiC substrates. However, the region faces limitations in domestic substrate production capacity, currently limited to Kyma Technologies and small-scale university fabrication facilities. Europe's competitive edge lies in Belgium's Soitec EpiGaN unit, which plays a pivotal role in GaN substrate production across the region. Additionally, the European Union Chips Act provides significant funding aimed at achieving self-sufficiency in wide-bandgap semiconductor technologies.

The Middle East is emerging as the fastest-growing region, with a projected CAGR of 11.33% through 2031. Sovereign wealth funds in the region are actively stockpiling gallium and financing the establishment of greenfield substrate fabrication facilities. These efforts align with broader initiatives to support AI data centers and defense modernization programs. South America and Africa, while still in the early stages of development, hold potential for unlocking renewable energy-related GaN demand by the end of the decade. This growth is contingent on the establishment of regional fabrication capabilities to support local markets.

1. Sumitomo Electric Industries, Ltd.
2. Mitsubishi Chemical Corporation
3. Wolfspeed, Inc.
4. Shin-Etsu Chemical Co., Ltd.
5. SCIOCS Company, Ltd.
6. Kyma Technologies, Inc.
7. Suzhou Nanowin Science and Technology Co., Ltd.
8. PAM-Xiamen Powerway Advanced Material Co., Ltd.
9. Advanced Engineering Materials Limited
10. Dowa Electronics Materials Co., Ltd.
11. Nitride Semiconductors Co., Ltd.
12. EpiGaN N.V. (Soitec Belgium)
13. Suzhou GLC Semiconductor Co., Ltd.
14. CorEnergy Semiconductor Co., Ltd.
15. Dongguan Sino Crystal Semiconductor Co., Ltd.
16. Powdec K.K.
17. Homray Material Technology (Shenzhen) Co., Ltd.
18. Eta Research, Inc.
19. Rubicon Technology, Inc.
20. Sanan Semiconductor Technology Co., Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Rising Adoption in EV On-Board Fast-Charging Systems
  • 4.2.2 Surging Micro-LED Display Production Requiring Low-Defect Native GaN Wafers
  • 4.2.3 Telecom 5G/6G PA Build-Out Accelerating Demand for High-Thermal-Conductivity GaN-on-SiC Substrates
  • 4.2.4 Rapid Scale-Up of 6-Inch HVPE Free-Standing GaN Production Lowering Cost per cm2
  • 4.2.5 Government-Funded Wafer-Reuse (Laser-Slicing) Programs Slashing Substrate Cost by >40%
  • 4.2.6 Venture Investment in Diamond-Integrated GaN Substrates for Extreme Power Density
• 4.3 Market Restraints
  • 4.3.1 High Wafer Price Premium Versus Si and SiC Limiting Adoption in Cost-Sensitive Segments
  • 4.3.2 Device-Yield Losses from Threading-Dislocation Clusters on 6-Inch Wafers
  • 4.3.3 Supply-Chain Choke-Points in HVPE/Ammonothermal Equipment and Chlorine Gas
  • 4.3.4 Geopolitical Export-Control Risks on Gallium Feedstock After 2024 China Restrictions
• 4.4 Industry Value-Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Intensity of Competitive Rivalry
  • 4.7.2 Bargaining Power of Suppliers
  • 4.7.3 Bargaining Power of Buyers
  • 4.7.4 Threat of New Entrants
  • 4.7.5 Threat of Substitutes
• 4.8 Impact of Macroeconomic Factors on the Market

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Substrate Type
  • 5.1.1 GaN-on-Sapphire
  • 5.1.2 GaN-on-Silicon
  • 5.1.3 GaN-on-Silicon Carbide
  • 5.1.4 Native GaN (GaN-on-GaN)
  • 5.1.5 GaN-on-Diamond
• 5.2 By Wafer Size
  • 5.2.1 2 Inch
  • 5.2.2 4 Inch
  • 5.2.3 6 Inch
  • 5.2.4 8 Inch and Above
• 5.3 By Application
  • 5.3.1 Light-Emitting Diodes (LEDs)
  • 5.3.2 Laser Diodes
  • 5.3.3 Power Semiconductor Devices
  • 5.3.4 Radio-Frequency Devices
  • 5.3.5 Other Applications
• 5.4 By End-Use Industry
  • 5.4.1 Consumer Electronics
  • 5.4.2 Automotive and Transportation
  • 5.4.3 Telecommunications and Data Centers
  • 5.4.4 Industrial and Power
  • 5.4.5 Aerospace and Defense
  • 5.4.6 Healthcare and Life Sciences
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 South America
    • 5.5.2.1 Brazil
    • 5.5.2.2 Argentina
    • 5.5.2.3 Rest of South America
  • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 United Kingdom
    • 5.5.3.3 France
    • 5.5.3.4 Russia
    • 5.5.3.5 Rest of Europe
  • 5.5.4 Asia-Pacific
    • 5.5.4.1 China
    • 5.5.4.2 Japan
    • 5.5.4.3 India
    • 5.5.4.4 South Korea
    • 5.5.4.5 Australia
    • 5.5.4.6 Rest of Asia-Pacific
  • 5.5.5 Middle East
    • 5.5.5.1 Saudi Arabia
    • 5.5.5.2 United Arab Emirates
    • 5.5.5.3 Rest of Middle East
  • 5.5.6 Africa
    • 5.5.6.1 South Africa
    • 5.5.6.2 Egypt
    • 5.5.6.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Sumitomo Electric Industries, Ltd.
  • 6.4.2 Mitsubishi Chemical Corporation
  • 6.4.3 Wolfspeed, Inc.
  • 6.4.4 Shin-Etsu Chemical Co., Ltd.
  • 6.4.5 SCIOCS Company, Ltd.
  • 6.4.6 Kyma Technologies, Inc.
  • 6.4.7 Suzhou Nanowin Science and Technology Co., Ltd.
  • 6.4.8 PAM-Xiamen Powerway Advanced Material Co., Ltd.
  • 6.4.9 Advanced Engineering Materials Limited
  • 6.4.10 Dowa Electronics Materials Co., Ltd.
  • 6.4.11 Nitride Semiconductors Co., Ltd.
  • 6.4.12 EpiGaN N.V. (Soitec Belgium)
  • 6.4.13 Suzhou GLC Semiconductor Co., Ltd.
  • 6.4.14 CorEnergy Semiconductor Co., Ltd.
  • 6.4.15 Dongguan Sino Crystal Semiconductor Co., Ltd.
  • 6.4.16 Powdec K.K.
  • 6.4.17 Homray Material Technology (Shenzhen) Co., Ltd.
  • 6.4.18 Eta Research, Inc.
  • 6.4.19 Rubicon Technology, Inc.
  • 6.4.20 Sanan Semiconductor Technology Co., Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment