아날로그 IC용 실리콘 웨이퍼 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the silicon wafer market for analog ICs industry size in terms of shipment volume is projected to be 1.51 Billion Square Inches in 2025, 1.55 Billion Square Inches in 2026, and reach 1.82 Billion Square Inches by 2031, growing at a CAGR of 3.25% from 2026 to 2031.

This report is Segmented by Wafer Diameter (Up To 150 Mm, 200 Mm, 300 Mm), Wafer Type (Prime Polished, Epitaxial, Silicon-On-Insulator, Specialty Silicon), End-User (Consumer Electronics, Industrial, Automotive, and More), and Geography (North America, Europe, Asia-Pacific, South America, Middle East, Africa). The Market Forecasts are Provided in Terms of Shipment Volume (Square Inches).

Insights and Trends of Silicon Wafer Market For Analog ICs

Capacity Expansion by 300 mm Foundries for Power-Efficient Analog ICs

Foundries are channeling multi-billion-dollar outlays into 300 mm lines targeting analog nodes above 28 nm, because larger wafers trim die costs even when yields lag those of leading-edge logic. GlobalWafers' USD 7.5 billion Texas project and Siltronic's EUR 2 billion German-Singapore plan illustrate the scale of this pivot. Texas Instruments is replicating the model in Richardson and Lehi, using CHIPS grants to offset the capital intensity. SEMI forecasts that analog, power, and discrete fabs will absorb more than USD 41 billion in equipment from 2026-2028. These investments position the silicon wafer market for analog ICs to shift its center of gravity toward 300 mm production by the end of the decade.

Growing Demand for High-Voltage PMICs in EV Fast-Charging

Fast-charging systems operating above 800 V require epitaxial silicon wafers with defect densities below 0.05 cm-2 to prevent catastrophic breakdown. Renesas, Analog Devices, and NXP have all introduced PMICs rated 42 V-60 V that meet ISO 26262 safety levels. The International Energy Agency expects EV sales to exceed 17 million units in 2025, amplifying substrate demand tied to 350 kW chargers. Specialty silicon suppliers that can guarantee tight control of resistivity are therefore securing long-term supply contracts with automotive IDMs.

Cyclical Capital Expenditure of Analog IDMs

Automotive and industrial customers adjust orders quickly, forcing analog IDMs to throttle fab utilization. Shin-Etsu Chemical reported softer 200 mm volumes after automotive inventory corrections in October 2025. In its 2024 filings, Texas Instruments announced the postponement of its tool installations. These cyclical delays exert downward pressure on wafer Average Selling Prices (ASPs) and significantly increase the risks associated with working capital for suppliers.

Other drivers and restraints analyzed in the detailed report include:

1. Analog Front-End Integration in 5G Massive-MIMO Radios
2. Transition to Wide-Bandgap Gate Drivers Requiring Ultra-Low Defect Wafers
3. Supply Tightness of High-Purity Polysilicon Feedstock

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

The 200 mm class captured 74.74% of the analog ICs silicon wafer market share in 2025. However, the 300 mm category is on track for a 3.89% CAGR to 2031 as Texas Instruments and GlobalWafers qualify power-efficient analog flows on larger substrates. Fab conversions exploit common lithography footprints, allowing analog IDMs to slice 30%-40% from die cost without node shrinks. Early adopters focus on PMICs and data-converter families whose layouts tolerate relaxed design rules, ensuring quick returns on 300 mm capex.

A residual niche of up to 150 mm persists for high-voltage thyristors and R&D pilots, but will continue to contract as equipment makers extend their toolsets to 200 mm refurb lines. Meanwhile, 200 mm capacity remains constrained; inventory swings in automotive cause short-term softness, yet industrial robot and renewable-energy demand continue to absorb mature-node supply. Over the forecast, rising 300 mm availability will rebalance the diameter mix, nudging the silicon wafer market for analog ICs toward a more diversified cost base.

Geography Analysis

Asia-Pacific commanded 67.77% of 2025 shipments, giving the region the largest share of the analog ICs silicon wafer market and a leading 4.06% CAGR through 2031. Capacity additions by Taiwan Semiconductor Manufacturing Company, Simgui, and SK Siltron are concentrated on 300 mm lines that support high-voltage PMICs and millimeter-wave RF chips. China's drive for domestic sourcing keeps demand resilient even when global cycles soften, while Japan's Rapidus project anchors a parallel push into mixed-signal nodes. Korea benefits from proximity to automotive electronics exporters that require mature-node reliability. The region's tight cluster of fabs and materials vendors shortens logistics cycles and reinforces its cost advantage.

North America held a mid-teens share in 2025 and is growing faster than the global average as CHIPS Act incentives de-risk new analog capacity. GlobalWafers, Texas Instruments, and Onsemi are building or expanding 300 mm plants that collectively aim to reach more than 1 million wafers per month by the late 2020s. Automotive, defense, and datacenter customers prefer domestic sourcing to hedge geopolitical risk and shorten qualification loops. These trends improve utilization of existing 200 mm lines while underpinning financing for new greenfield sites.

Europe maintained a low-double-digit share, helped by EU Chips Act subsidies supporting Infineon, STMicroelectronics, and GlobalFoundries' expansions. Germany's Dresden hub is emerging as a center for automotive-grade mixed-signal production, while Italy's Catania facility focuses on silicon-carbide epitaxy. The United Kingdom and France contribute specialty output for RF-SOI and sensor-grade wafers, yet rely on imports for prime polished volume. South America, the Middle East, and Africa together remain below a 5% share, though renewable-energy and telecom projects are creating niche demand that may invite local polishing or slicing operations later in the decade.

1. Shin-Etsu Chemical Co., Ltd.
2. SUMCO Corporation
3. GlobalWafers Co., Ltd.
4. Siltronic AG
5. SK Siltron Co., Ltd.
6. Wafer Works Corporation
7. Soitec S.A.
8. Siltronix Silicon Technologies
9. MEMC Electronic Materials Inc.
10. Shanghai Simgui Technology Co., Ltd.
11. Topsil Semiconductor Materials A/S
12. Okmetic Oyj
13. Addison Engineering, Inc.
14. Grinm Semiconductor Materials Co., Ltd.
15. GT Advanced Technologies Inc.
16. Wafer World Inc.
17. Coherent Corp. (II-VI)
18. Nova Electronic Materials
19. Elkem ASA
20. Mitsui Mining & Smelting Co., Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Capacity Expansion by 300 mm Foundries for Power-Efficient Analog ICs
  • 4.2.2 Growing Demand for High-Voltage PMICs in EV Fast-Charging
  • 4.2.3 Analog Front-End Integration in 5G Massive-MIMO Radios
  • 4.2.4 Transition to Wide-Bandgap Gate Drivers Requiring Ultra-Low Defect Wafers
  • 4.2.5 On-shoring Incentives under CHIPS and EU Chips Acts
  • 4.2.6 Adoption of AI-Based Process Control Reducing Scrap Rates
• 4.3 Market Restraints
  • 4.3.1 Cyclical Capital Expenditure of Analog IDMs
  • 4.3.2 Supply Tightness of High-Purity Polysilicon Feedstock
  • 4.3.3 Yield Challenges in >=200 mm SOI Wafers for mmWave RF
  • 4.3.4 Sustainability Pressures on Water and Energy Usage
• 4.4 Industry Value-Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technology Analysis
• 4.7 Impact of Macroeconomic Factors
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (SHIPMENT IN AREA)

• 5.1 By Wafer Diameter
  • 5.1.1 Up to 150 mm
  • 5.1.2 200 mm
  • 5.1.3 300 mm
• 5.2 By Wafer Type
  • 5.2.1 Prime Polished
  • 5.2.2 Epitaxial
  • 5.2.3 Silicon-on-Insulator (SOI)
  • 5.2.4 Specialty Silicon (High-Resistivity, Power, Sensor-Grade)
• 5.3 By End-user
  • 5.3.1 Consumer Electronics
    • 5.3.1.1 Mobile and Smartphones
    • 5.3.1.2 PCs and Servers
  • 5.3.2 Industrial
  • 5.3.3 Telecommunications
  • 5.3.4 Automotive
  • 5.3.5 Other End-user Applications
• 5.4 By Geography
  • 5.4.1 North America
    • 5.4.1.1 United States
    • 5.4.1.2 Canada
    • 5.4.1.3 Mexico
  • 5.4.2 Europe
    • 5.4.2.1 Germany
    • 5.4.2.2 United Kingdom
    • 5.4.2.3 France
    • 5.4.2.4 Rest of Europe
  • 5.4.3 Asia-Pacific
    • 5.4.3.1 China
    • 5.4.3.2 Japan
    • 5.4.3.3 India
    • 5.4.3.4 South Korea
    • 5.4.3.5 Taiwan
    • 5.4.3.6 Rest of Asia-Pacific
  • 5.4.4 South America
  • 5.4.5 Middle East
  • 5.4.6 Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Shin-Etsu Chemical Co., Ltd.
  • 6.4.2 SUMCO Corporation
  • 6.4.3 GlobalWafers Co., Ltd.
  • 6.4.4 Siltronic AG
  • 6.4.5 SK Siltron Co., Ltd.
  • 6.4.6 Wafer Works Corporation
  • 6.4.7 Soitec S.A.
  • 6.4.8 Siltronix Silicon Technologies
  • 6.4.9 MEMC Electronic Materials Inc.
  • 6.4.10 Shanghai Simgui Technology Co., Ltd.
  • 6.4.11 Topsil Semiconductor Materials A/S
  • 6.4.12 Okmetic Oyj
  • 6.4.13 Addison Engineering, Inc.
  • 6.4.14 Grinm Semiconductor Materials Co., Ltd.
  • 6.4.15 GT Advanced Technologies Inc.
  • 6.4.16 Wafer World Inc.
  • 6.4.17 Coherent Corp. (II-VI)
  • 6.4.18 Nova Electronic Materials
  • 6.4.19 Elkem ASA
  • 6.4.20 Mitsui Mining & Smelting Co., Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment