SMD(표면 실장 부품) LED 패키지 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the SMD lED package market size is projected to be USD 7.26 billion in 2025, USD 7.49 billion in 2026, and reach USD 9.05 billion by 2031, growing at a CAGR of 3.86% from 2026 to 2031.

This report is Segmented by Power Class (Low Power, Mid Power, High Power, and Ultra-High Power), Emission Type (Visible, Infrared, and Ultraviolet), Primary Material (Substrates, Encapsulation, Bonding, and Phosphors), Application (General Lighting, Automotive, Display, and Specialty), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global SMD (Surface Mount Device) LED Package Market Trends and Insights

Growing Adoption of Miniaturized Consumer Electronics

Wearable and smartphone designers are shrinking footprints below 1 mm2, forcing SMD LED package makers to deliver sub-0.5 mm z-heights, tighter binning and power densities that hold color shift under 3 MacAdam steps across -10 °C to +60 °C ambient. VueReal's EcoVue transfer process reached commercial volumes in 2025, enabling the Garmin Fenix 8 Pro to feature full-color micro-LED displays with 30% lower drain than OLED backlights and 10,000-nit outdoor brightness. AUO and Samsung Display each confirmed dedicated micro-LED lines for 2028 start-ups, signaling long-term demand visibility even at a three-to-five-times cost premium over liquid-crystal alternatives. Thermal loads remain critical; Aismalibar's phase-change die attach breaks 200 W m-1 K-1 to disperse hotspot gradients. As bezels shrink in consumer devices, these ultrathin packages unlock incremental board space for antennas and sensors, sustaining the driver's positive CAGR.

Increasing Demand for Automotive LED Lighting

Original equipment manufacturers (OEMs) are moving from static beams to matrix headlights that dim specific emitters in milliseconds, a shift that elevates package requirements for single-chip addressability and junction temperatures below 100 °C. The LUXEON Altilon SMD-A debuted in 2025 with a 433 µm profile, meeting United Nations Regulation 123 criteria for adaptive driving beams in 2026 model-year vehicles. Down-board, Lumissil's IS32LT3365 integrates 48 constant-current channels and ISO 26262 diagnostics, while Diodes Incorporated's AL5958Q adds 16-bit dimming and electromagnetic-interference spread-spectrum features. These electronics, combined with ceramic substrates and sintered-silver attachments, achieve a thermal resistance below 2.5 K W-1, widening the TAM for high-power devices in premium sedans and sport-utility vehicles.

Thermal Management and Heat Dissipation Challenges

Packages exceeding 3 W often drive junctions above 125 °C, halving lumen maintenance to L70 within 30,000 hours and risking catastrophic failure. COFAN's vertical carbon-nanotube interface hits 1,500 W m-1 K-1 conductivity yet adds USD 0.50-1.00 per unit, too expensive for general illumination. Even Lumileds' thermal pad architecture only supports 3.5 W, restricting ultra-high-power adoption to automotive and stadium lighting. Unless passive materials fall to commodity cost levels, thermal bottlenecks will continue to shave 0.6 percentage points off the sector's CAGR.

Other drivers and restraints analyzed in the detailed report include:

1. Stringent Energy Efficiency Regulations
2. Rising Deployment of Smart Lighting Infrastructure
3. High Initial Capital Expenditure for Advanced Packaging Lines

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

High-power devices (1-3 W) are set to outpace the broader SMD LED package market at a 4.22% CAGR through 2031 as matrix headlights and high-bay fixtures need single-chip dimming and ceramic thermal paths. The SMD LED package market size for this class will therefore expand faster than mid-power incumbents, which held a 30.29% revenue position in 2025. Mid-power remains indispensable in retrofit lamps where efficacy targets hover near 140 lm W-1, yet low-power devices slip toward indicator niches as OLED and micro-LED displays cannibalize backlight slots. Ultra-high-power (more than 3 W) stays confined to applications with forced-air or liquid cooling, given the severe 125 °C junction ceiling that halves service life.

Automotive specifications amplify demand for high-power formats that stack luminous flux above 450 lm with z-heights under 450 µm. Diodes Incorporated's AL5958Q and Lumissil's IS32LT3365 drivers supply 48 dimmable channels that OEMs leverage for glare-free adaptive driving beams in 2026 cars. This drivetrain of optics, drivers and power management sustains the SMD LED package market share momentum for high-power variants while mid-power packages defend commercial downlights, a dichotomy set to widen as DLC thresholds ratchet upward in North America.

Visible emitters still generate 87.38% of 2025 sales, but UV devices now post the highest slope, rising at a 4.57% CAGR on public-health and water-treatment mandates. The SMD LED package market size tied to UV applications benefits from municipal disinfection plants that replace mercury lamps with 265 nm arrays offering 40% operating-cost cuts. Infrared holds steady around biometric sensing and driver-monitoring, giving suppliers portfolio breadth that cushions pricing swings. Visible packages will continue to dominate shipment counts, yet their growth moderates as efficiency gains approach physical limits and lighting retrofits near saturation.

The arrival of 200 mW UV-C parts from ams OSRAM in late 2026 underscores mainstream acceptance. TrendForce already valued the UV segment at USD 215 million in 2026, up 10% year-over-year, and infrastructure funding pipelines suggest a multi-year capex wave in healthcare and building-air purification. As quantum-dot phosphors push color-rendering of visible products, UV adoption keeps advancing on its separate demand cycle, reinforcing a dual-track outlook across emission types.

Geography Analysis

Asia Pacific accounted for 66.85% of global SMD LED package revenue in 2025 and is projected to widen its lead, with a 4.16% CAGR through 2031. Chinese provinces such as Guangdong apply procurement quotas reserving 40% of municipal lighting bids for domestic SMEs, guaranteeing local offtake while new facilities in Hunan and Fujian extend substrate self-sufficiency. Regional Comprehensive Economic Partnership tariff relief further integrates Japanese and South Korean chip output with Vietnamese and Thai packaging, shortening lead times and hardening the regional supply moat.

North America and Europe collectively contributed roughly one-quarter of 2025 turnover, but growth remains subdued, constrained by saturation in general illumination and longer commercial-fixture replacement cycles. Even so, policy tightening continues to push value toward high-efficacy parts. The DesignLights Consortium's SSL V6.0 Premium tier and Europe's A-grade ≥ lm/W label require OEM bills of materials to adopt ceramic boards and advanced phosphors, cushioning average selling prices despite flattish volumes. Municipal smart-lighting installations, demonstrated by Telensa's Gloucestershire rollout and Tridonic's Darmstadt project, create upgrade waves that modestly offset slowdowns in retrofit sockets.

South America, the Middle East and Africa together hold a small share of global sales but supply-chain localization incentives lift pockets of demand. Vietnam's USD 500 million Bac Ninh LED cluster and India's Production-Linked Incentive of 4-6% on incremental sales lure Taiwanese and Korean suppliers into joint ventures. While absolute volumes stay small, regional subsidies peel some assembly away from coastal China, increasing fragmentation and lifting landed costs for global luminaire brands that once relied on single-country sourcing.

1. Nichia Corporation
2. ams-OSRAM AG
3. Lumileds Holding B.V.
4. Cree LED (SGH Company)
5. Samsung Electronics Co., Ltd.
6. LG Innotek Co., Ltd.
7. Seoul Semiconductor Co., Ltd.
8. Everlight Electronics Co., Ltd.
9. Epistar Corporation
10. Lite-On Technology Corporation
11. Stanley Electric Co., Ltd.
12. Harvatek Corporation
13. Toyoda Gosei Co., Ltd.
14. NationStar Optoelectronics Co., Ltd.
15. Lextar Electronics Corporation
16. Bridgelux Inc.
17. Dominant Opto Technologies Sdn. Bhd.
18. HC Semitek Corporation
19. Rohm Co., Ltd.
20. Citizen Electronics Co., Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Growing Adoption of Miniaturized Consumer Electronics
  • 4.2.2 Increasing Demand for Automotive LED Lighting
  • 4.2.3 Stringent Energy Efficiency Regulations
  • 4.2.4 Rising Deployment of Smart Lighting Infrastructure
  • 4.2.5 Integration of Micro-LED Hybrid Packages into Wearables
  • 4.2.6 Supply-Chain Localization Incentives in Emerging Economies
• 4.3 Market Restraints
  • 4.3.1 Thermal Management and Heat Dissipation Challenges
  • 4.3.2 High Initial CapEx for Advanced Packaging Lines
  • 4.3.3 Rapid Price Erosion and Margin Pressure
  • 4.3.4 Environmental Restrictions on Antimony-based Encapsulants
• 4.4 Industry Value-Chain Analysis
• 4.5 Technology Analysis
• 4.6 Regulatory Landscape
• 4.7 Impact of Macroeconomic Factors on the Market
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Power Class
  • 5.1.1 Low Power (Less than 0.5 W)
  • 5.1.2 Mid Power (0.5-1 W)
  • 5.1.3 High Power (1-3 W)
  • 5.1.4 Ultra-High Power (More than 3 W)
• 5.2 By Emission Type
  • 5.2.1 Visible LED Packages
  • 5.2.2 Infrared (IR) LED Packages
  • 5.2.3 Ultraviolet (UV) LED Packages
• 5.3 By Primary Material
  • 5.3.1 Substrates
  • 5.3.2 Encapsulation
  • 5.3.3 Bonding / Die-Attach
  • 5.3.4 Phosphors / Coatings
• 5.4 By Application / End-Use
  • 5.4.1 General Lighting (Residential, Commercial, Industrial, Street)
  • 5.4.2 Automotive Lighting
  • 5.4.3 Display and Backlighting
  • 5.4.4 Specialty / Niche (Horticulture, Medical, UV Disinfection)
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 South America
    • 5.5.2.1 Brazil
    • 5.5.2.2 Argentina
    • 5.5.2.3 Rest of South America
  • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 United Kingdom
    • 5.5.3.3 France
    • 5.5.3.4 Italy
    • 5.5.3.5 Spain
    • 5.5.3.6 Rest of Europe
  • 5.5.4 Asia-Pacific
    • 5.5.4.1 China
    • 5.5.4.2 Japan
    • 5.5.4.3 India
    • 5.5.4.4 South Korea
    • 5.5.4.5 Australia and New Zealand
    • 5.5.4.6 Rest of Asia-Pacific
  • 5.5.5 Middle East
    • 5.5.5.1 Saudi Arabia
    • 5.5.5.2 United Arab Emirates
    • 5.5.5.3 Rest of Middle East
  • 5.5.6 Africa
    • 5.5.6.1 South Africa
    • 5.5.6.2 Egypt
    • 5.5.6.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Nichia Corporation
  • 6.4.2 ams-OSRAM AG
  • 6.4.3 Lumileds Holding B.V.
  • 6.4.4 Cree LED (SGH Company)
  • 6.4.5 Samsung Electronics Co., Ltd.
  • 6.4.6 LG Innotek Co., Ltd.
  • 6.4.7 Seoul Semiconductor Co., Ltd.
  • 6.4.8 Everlight Electronics Co., Ltd.
  • 6.4.9 Epistar Corporation
  • 6.4.10 Lite-On Technology Corporation
  • 6.4.11 Stanley Electric Co., Ltd.
  • 6.4.12 Harvatek Corporation
  • 6.4.13 Toyoda Gosei Co., Ltd.
  • 6.4.14 NationStar Optoelectronics Co., Ltd.
  • 6.4.15 Lextar Electronics Corporation
  • 6.4.16 Bridgelux Inc.
  • 6.4.17 Dominant Opto Technologies Sdn. Bhd.
  • 6.4.18 HC Semitek Corporation
  • 6.4.19 Rohm Co., Ltd.
  • 6.4.20 Citizen Electronics Co., Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-need Assessment