옵티컬 GPU 인터커넥트 시장 : 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the optical GPU interconnect market size is projected to expand from USD 1.93 billion in 2025 and USD 2.70 billion in 2026 to USD 11.38 billion by 2031, registering a CAGR of 33.30% between 2026 and 2031.

This report is Segmented by Product Type (Optical Transceivers, Active Optical Cables, and More), Interconnect Level (Chip-To-Chip, Board-To-Board and Rack-Level, and More), Fiber Mode (Single-Mode Fiber, and Multimode Fiber), Data Rate (Less Than 40 Gbps, 40 To 100 Gbps, and More), Application (Data Communication, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global Opitcal GPU Interconnect Market Trends and Insights

Rising AI Training and Inference Bandwidth Demand

AI training clusters expanded from thousands to tens of thousands of GPUs through 2025, and inference systems are now moving in the same direction as reasoning-heavy models become more common. This matters because data movement, not computation alone, now consumes much of the energy inside modern GPU systems. That shift makes interconnect bandwidth a practical limit on cluster design, which directly supports demand across the optical GPU interconnect market. Industry discussions around optical I/O also show that inference workloads increasingly need the same low-latency fabric once associated mainly with training deployments. The result is a broader demand base for optical links, as future spending is no longer tied solely to frontier model training in the optical GPU interconnect market.

Copper Interconnect Power and Reach Limits in GPU Clusters

Copper links face rising signal loss as speed and distance increase, and that physical limit is now affecting system layout in large GPU clusters. NVIDIA explained that, in the NVL72 rack, copper runs at NVLink speeds were limited to very short distances, which is why switch placement had to remain tightly constrained inside the chassis. As systems scale from one rack to eight racks, optics move from a useful option to a basic requirement in the optical GPU interconnect market. Research in npj Nanophotonics also found that copper-based scale-up networks cap coherent domains at far lower XPU counts than optical links, which changes how designers think about future cluster size. Power use adds another reason for the shift, because copper-heavy interconnects consume rack power that operators would rather reserve for compute in the optical graphics processing unit (GPU) interconnect market.

High Cost of Advanced Photonic Packaging and Test

The cost profile of co-packaged optics is much higher than that of standard pluggable modules in the optical GPU interconnect market. Packaging combines CMOS electronics, silicon photonics, and III-V materials, making assembly more difficult and keeping unit economics elevated. Testing adds a second problem because silicon photonics workflows still require several insertions from the wafer stage to the final package, and those flows are not yet optimized for very large volumes. Fiber-to-waveguide alignment also demands precision that is hard to automate fully, so throughput gains do not come as quickly as they did in earlier transceiver cycles. This slows broad enterprise adoption in the optical GPU interconnect market even though hyperscalers are already willing to absorb higher early-stage costs.

Other drivers and restraints analyzed in the detailed report include:

1. Hyperscale Data Center Migration To 800G and 1.6T Architectures
2. Co-Packaged Optics Adoption In Next-Generation GPU Platforms
3. Thermal Management Constraints in Co-Packaged Designs

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Optical Transceivers held 51.47% of the product type segment in 2025, giving them the leading revenue position in the optical GPU interconnect market. Their lead came from the large installed base of pluggable 400G and 800G modules already supporting deployed AI fabric capacity. That dominance says more about the maturity of current deployments than any long-term limit on optical integration. Pluggables still fit many near-term buildouts because they remain familiar, scalable, and easier to service than newer formats. They also continue to benefit from supply chains that are more established than those for deeply integrated optical packages.

Active Optical Cables stayed relevant for rack-to-rack links where transceiver density mattered less than clean, power-aware short-reach connectivity. Cable Assemblies and Optical Connectors also remained essential because the optical GPU interconnect market depends on physical fiber distribution, patching, and cluster-level installation layers, not only on the transceiver module itself. Embedded Optical Modules are projected to grow at a 34.29% CAGR through 2031, which makes them the fastest-growing product group in the optical GPU interconnect market. That growth reflects the shift from front-panel optics to near-package and co-packaged integration as cluster radix expands beyond what copper can handle. A 2025 Nature Photonics study on 3D photonic integration reinforced this direction by showing ultra-low-energy, high-bandwidth interchip links that copper cannot match at similar reach.

Board-to-Board and Rack-Level links held 48.84% of the interconnect segment in 2025, making them the largest current layer in the optical GPU interconnect market. Their position reflected the scale of deployed Ethernet and InfiniBand fabrics that still rely on large volumes of rack-connected optical ports. Metro and Long-Haul DCI occupied a secondary position because they provide connectivity between campuses and distributed compute locations rather than the dense internal fabric within each training cluster. Even so, DCI remains relevant because AI compute is spreading across more sites to manage power, cooling, and land limits. The largest revenue pool today still sits where current hyperscale buildouts require the highest port counts.

Chip-to-Chip is projected to record the fastest CAGR of 33.89% through 2031, signaling the next structural shift in the optical GPU interconnect market. Marvell has argued that passive copper traces stop scaling well beyond 100Gbps per lane, which is why optical links begin to matter even inside a rack. Ayar Labs demonstrated this direction at OFC 2025 with a UCIe Optical I/O Retimer Chiplet that delivered 1.024Tbps per optical port and 8.192Tbps per package. Those benchmarks show why chip-level optics are becoming central to long-range product positioning in the optical GPU interconnect market. The optical GPU interconnect industry is now moving from a board-focused scaling model to one that places more value on photonic IC design, chiplet integration, and advanced packaging.

Complete Report Scope:

• By Product Type
  • Optical Transceivers
  • Active Optical Cables
  • Embedded Optical Modules
  • Cable Assemblies
  • Optical Connectors
• By Interconnect Level
  • Chip-to-Chip
  • Board-to-Board and Rack-Level
  • Metro and Long-Haul DCI
• By Fiber Mode
  • Single-Mode Fiber
  • Multimode Fiber
• By Data Rate
  • Less Than 40 Gbps
  • 40 to 100 Gbps
  • 100 to 400 Gbps
  • Above 400 Gbps
• By Application
  • Data Communication
  • Telecommunication
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • India
    • Southeast Asia
    • Rest of Asia-Pacific
  • South America
  • Middle East and Africa

Geography Analysis

North America held 46.32% of the optical GPU interconnect market in 2025, maintaining its position as the largest regional revenue base. The region led because Google, Microsoft, Meta, Amazon, and other major operators continued to expand AI infrastructure at a scale not matched elsewhere. North American demand also moved early into commercial CPO adoption, with NVIDIA's Spectrum-X Photonics Ethernet switch entering production in May 2026 and early users including CoreWeave, Lambda, and Oracle Cloud Infrastructure. That early deployment profile gave the region an advantage in both spending and real-world validation across the optical GPU interconnect market. South America remained smaller, but Brazil and Chile grew in importance as hyperscalers expanded their regional data center footprints.

Europe held a meaningful share of the optical GPU interconnect market because Germany, the United Kingdom, and France continued to build AI training and inference capacity. Enterprise buyers in Europe also placed greater emphasis on interoperability, making multi-vendor standards more important to procurement confidence. OIF's live 800ZR interoperability demonstration at OFC 2026 directly addressed that need in a region where buyers often avoid dependence on a single-vendor stack. The Middle East and Africa remained earlier-stage, but sovereign AI programs and greenfield builds in Gulf states created room for direct adoption of newer 800G architectures without the burden of large legacy refresh cycles.

Asia-Pacific is projected to grow at a 34.27% CAGR through 2031, which makes it the fastest-growing geography in the optical GPU interconnect market. The region benefits from manufacturing depth, strong optoelectronics capabilities, and a wider base of public and private investment in AI infrastructure. Japan also gained strategic weight as NTT worked on a USD 500 million optical network fund tied to AI data center infrastructure and its broader all-photonics roadmap. South Korea and parts of Southeast Asia are also emerging as secondary hubs, broadening the future revenue map for the optical graphics processing unit (GPU) interconnect market.

1. Broadcom Inc.
2. Cisco Systems, Inc.
3. NVIDIA Corporation
4. Intel Corporation
5. Marvell Technology, Inc.
6. Coherent Corp.
7. Lumentum Holdings Inc.
8. Ciena Corporation
9. Nokia Corporation
10. Infinera Corporation
11. Corning Incorporated
12. CommScope Holding Company, Inc.
13. Amphenol Corporation
14. Sumitomo Electric Industries, Ltd.
15. Furukawa Electric Co., Ltd.
16. TE Connectivity Ltd.
17. Ayar Labs, Inc.
18. Ranovus Inc.
19. Samtec, Inc.
20. POET Technologies Inc.
21. Innolight Technology Co., Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Rising AI Training and Inference Bandwidth Demand
  • 4.2.2 Copper Interconnect Power and Reach Limits in GPU Clusters
  • 4.2.3 Hyperscale Data Center Migration to 800G and 1.6T Architectures
  • 4.2.4 Co-Packaged Optics Adoption in Next-Generation GPU Platforms
  • 4.2.5 Optical I/O Roadmaps from Leading GPU and Switch Vendors
  • 4.2.6 Fiber-Dense Rack and Row Architectures for Disaggregated Compute
• 4.3 Market Restraints
  • 4.3.1 High Cost of Advanced Photonic Packaging and Test
  • 4.3.2 Thermal Management Constraints in Co-Packaged Designs
  • 4.3.3 Yield and Reliability Challenges in Heterogeneous Integration
  • 4.3.4 Standards and Interoperability Maturity Gaps
• 4.4 Impact of Macroeconomic Factors on the Market
• 4.5 Industry Value Chain Analysis
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Threat of New Entrants
  • 4.8.2 Bargaining Power of Suppliers
  • 4.8.3 Bargaining Power of Buyers
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry
• 4.9 Pricing Analysis

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Product Type
  • 5.1.1 Optical Transceivers
  • 5.1.2 Active Optical Cables
  • 5.1.3 Embedded Optical Modules
  • 5.1.4 Cable Assemblies
  • 5.1.5 Optical Connectors
• 5.2 By Interconnect Level
  • 5.2.1 Chip-to-Chip
  • 5.2.2 Board-to-Board and Rack-Level
  • 5.2.3 Metro and Long-Haul DCI
• 5.3 By Fiber Mode
  • 5.3.1 Single-Mode Fiber
  • 5.3.2 Multimode Fiber
• 5.4 By Data Rate
  • 5.4.1 Less Than 40 Gbps
  • 5.4.2 40 to 100 Gbps
  • 5.4.3 100 to 400 Gbps
  • 5.4.4 Above 400 Gbps
• 5.5 By Application
  • 5.5.1 Data Communication
  • 5.5.2 Telecommunication
• 5.6 By Geography
  • 5.6.1 North America
    • 5.6.1.1 United States
    • 5.6.1.2 Canada
    • 5.6.1.3 Mexico
  • 5.6.2 Europe
    • 5.6.2.1 Germany
    • 5.6.2.2 United Kingdom
    • 5.6.2.3 France
    • 5.6.2.4 Italy
    • 5.6.2.5 Rest of Europe
  • 5.6.3 Asia-Pacific
    • 5.6.3.1 China
    • 5.6.3.2 Japan
    • 5.6.3.3 South Korea
    • 5.6.3.4 India
    • 5.6.3.5 Southeast Asia
    • 5.6.3.6 Rest of Asia-Pacific
  • 5.6.4 South America
  • 5.6.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Positioning Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Broadcom Inc.
  • 6.4.2 Cisco Systems, Inc.
  • 6.4.3 NVIDIA Corporation
  • 6.4.4 Intel Corporation
  • 6.4.5 Marvell Technology, Inc.
  • 6.4.6 Coherent Corp.
  • 6.4.7 Lumentum Holdings Inc.
  • 6.4.8 Ciena Corporation
  • 6.4.9 Nokia Corporation
  • 6.4.10 Infinera Corporation
  • 6.4.11 Corning Incorporated
  • 6.4.12 CommScope Holding Company, Inc.
  • 6.4.13 Amphenol Corporation
  • 6.4.14 Sumitomo Electric Industries, Ltd.
  • 6.4.15 Furukawa Electric Co., Ltd.
  • 6.4.16 TE Connectivity Ltd.
  • 6.4.17 Ayar Labs, Inc.
  • 6.4.18 Ranovus Inc.
  • 6.4.19 Samtec, Inc.
  • 6.4.20 POET Technologies Inc.
  • 6.4.21 Innolight Technology Co., Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment