GPU용 ABF 기판 시장 : 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the ABF substrate market for GPUs size is expected to grow from USD 3.78 billion in 2025 to USD 4.16 billion in 2026 and is forecast to reach USD 8.89 billion by 2031 at 16.40% CAGR over 2026-2031.

This report is Segmented by Package Type (Standard FC-BGA, Advanced FC-BGA for 2. 5D/Chiplet GPUs), Layer Count (Up To 8, and More), Application (Data Center AI and HPC, Consumer and Gaming, Professional Visualization and Workstation, and More), End Use (Cloud and Hyperscale/HPC, Pcs and Gaming Systems, and Workstations, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Insights and Trends of ABF Substrate Market For GPUs

AI GPU Package Complexity Is Raising ABF Content per Device

Each new GPU generation uses more substrate area than the one before it, so the ABF substrate market for GPUs is expanding through content growth as well as shipment growth. The draft notes that NVIDIA H100 needed 12 or more ABF layers in a package above 120 x 120 mm, while Blackwell B200 pushed packaging complexity further with CoWoS-L and a package footprint above 800 mm2, showing how advanced AI accelerators keep moving toward larger and denser package structures. NVIDIA also confirmed that Vera Rubin entered full production in June 2026, and that step lifts the technical baseline again for suppliers serving the ABF substrate market for GPUs because Rubin brings more demanding package rules into a production setting rather than a future design discussion. The same draft states that hyperscalers installed more than 1.2 million AI accelerator units in 2025, each using 4 to 6 FC-BGA substrates at power draw above 700 watts, which means thermal and electrical demands are rising at the same time as unit demand. In the ABF substrate market for GPUs, this creates a structural multiplier because every new high-end accelerator consumes more advanced substrate content than earlier compute platforms did. That is why the demand pull in the ABF substrate market for GPUs is not tied only to headline GPU volume, but also to the steady increase in substrate content per device.

Chiplet and Multi-Die Architectures Are Expanding Substrate Area

Chiplet design has moved into the center of AI compute packaging, and that shift keeps the ABF substrate market for GPUs focused on larger substrate bodies and more complex routing rules. The draft cites ISSCC 2025 for a scalable heterogeneous 2.5D system across 20 chiplets, and that example shows how multi-die integration depends on advanced substrates that can carry more interconnect density across wider package areas. Intel's Foveros and EMIB packaging platforms also reinforce this direction, because both rely on advanced substrate structures as the electrical and mechanical base for heterogeneous integration in leading compute packages. The practical effect for the ABF substrate market for GPUs is that substrate lines below the top layer-count threshold are pushed away from the best AI programs even if they remain relevant for lower-tier products. The draft also notes AMD's qualification of a 2.5D panel-based Elevated Fanout Bridge interconnect with PTI in May 2026, which adds another route through which advanced packaging can continue to raise substrate area and layer needs. In the ABF substrate market for GPUs, chiplet adoption therefore changes the minimum acceptable specification for suppliers rather than simply lifting performance at the top end.

Extreme Capital Intensity Limits New Entrants

A commercial FC-BGA plant at 50,000 panels per month needs USD 800 million to USD 1 billion and a 30 to 36 month qualification period before revenue begins, so the ABF substrate market for GPUs remains difficult for new entrants to penetrate. The draft also states that above-14-layer production involves more than 60 sequential manufacturing steps and only 75 to 80% cumulative panel yields, which means a meaningful portion of output is lost before shipment and early ramp economics stay weak. Qualification standards and reliability protocols extend this problem because testing requirements add months between physical build-out and commercial revenue. The draft links this barrier to the fact that 2024 and 2025 capacity additions came from incumbent brownfield sites rather than greenfield challengers, reinforcing the position of established suppliers. U.S. policy support has started to address this through the National Advanced Packaging Manufacturing Program, with the Department of Commerce finalizing USD 1.4 billion in awards in 2025, including USD 300 million for advanced substrate and materials research, but the draft makes clear that research support does not equal immediate high-volume qualified ABF capacity. In the ABF substrate market for GPUs, capital access alone therefore does not solve entry barriers because qualification time, yield learning, and customer trust still determine when new capacity becomes usable.

Other drivers and restraints analyzed in the detailed report include:

1. Hyperscaler and OEM Long-Term Supply Agreements Are De-Risking Capacity
2. Advanced AI Server Refresh Cycles Are Increasing High-Layer FC-BGA Demand
3. Yield Loss at High Layer Counts Delays Commercial Ramp-Up

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Advanced FC-BGA substrates for 2.5D and chiplet GPUs held 56.88% of the ABF substrate market size in 2025, and the same package group remained the fastest-growing type through 2031 as leading AI platforms standardized on more demanding package formats. In the ABF substrate market for GPUs, this segment has moved into the center of value creation because large-body packages, tighter routing tolerance, and higher build-up layer counts are now basic requirements for top AI accelerator programs rather than optional performance upgrades. Standard FC-BGA still serves consumer and lower-tier professional GPUs, where cost per layer and lead time remain more important than the highest possible performance envelope. That said, the draft makes clear that the addressable space for standard formats is narrowing as even midrange AI inference products begin to adopt advanced packaging to support higher memory bandwidth and more complex routing paths.

The ABF substrate industry also faces a customer lock-in effect inside this segment because once a line is qualified for a specific chiplet rule set, switching becomes slow and expensive. The draft states that requalification usually takes 18 to 24 months, which gives incumbents a durable pricing and relationship advantage that the share figure alone does not fully show. AMD's qualification of a panel-based Elevated Fanout Bridge interconnect with PTI in May 2026 reinforces the same direction, because ecosystem development keeps pointing toward advanced package structures rather than back to simpler substrate formats. Compliance demands under advanced substrate reliability standards also keep raising the technical floor, so the ABF substrate market for GPUs rewards suppliers that can combine process stability, customer trust, and volume discipline in high-end FC-BGA lines. For that reason, package type in the ABF substrate market for GPUs is not only a product grouping, but also a useful marker of which suppliers sit closest to the most defensible and best-funded demand streams.

Above-16-layer substrates are projected to grow at 16.76% annually through 2031, making this the clearest expansion tier in the ABF substrate market for GPUs as routing density keeps outpacing what simpler stacks can support. The draft notes that Hopper, Blackwell, and Vera Rubin all pushed layer requirements higher, which shows that this is a continuing design direction rather than a one-cycle response to temporary AI demand pressure. The 9-to-16-layer range remained the production backbone for mid-tier AI GPUs, consumer gaming, and workstation products in 2025 because those products still balance complexity against cost and thermal limits. Up-to-8-layer products stayed relevant at the entry end, but the draft also shows that this part of the mix remains under margin pressure as manufacturers steer capacity and engineering attention toward higher-value layer configurations.

This segmentation also acts as a proxy for competitive depth in the ABF substrate market for GPUs because high-layer output depends on yield discipline across more than 60 process steps. The draft states that 20-plus-layer production typically delivers only 75 to 80% panel yields, which means scrap remains high and ramp difficulty becomes part of the pricing structure for the segment. Ibiden's JPY 500 billion (USD 3.08 billion) investment plan for FY2026 through FY2028, centered on the Gama and Ono plants, was directed at high-performance IC package substrates and signals where leading suppliers expect the deepest value concentration to remain. In the ABF substrate industry, the ability to qualify and produce above-16-layer and 20-plus-layer flows at acceptable yields separates suppliers with true AI-grade positioning from those serving only adjacent or lower-complexity programs. That is why layer count in the ABF substrate market for GPUs does more than describe structure complexity, it also shows which part of the market carries the most defensible customer relationships and the strongest pricing power.

Complete Report Scope:

• By Package Type
  • Standard FC-BGA Substrates
  • Advanced FC-BGA Substrates for 2.5D/Chiplet GPUs
• By Layer Count
  • Up to 8 Layers
  • 9 to 16 Layers
  • Above 16 Layers
• By Application
  • Data Center AI and HPC GPUs
  • Consumer and Gaming GPUs
  • Professional Visualization and Workstation GPUs
  • Automotive and Edge AI GPUs
• By End Use
  • Cloud, Hyperscale, Enterprise Data Centers, and HPC
  • PCs, Gaming Systems, and Workstations
  • Automotive and ADAS/Autonomous Compute
  • Telecom, Industrial, and Edge AI Systems
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • India
    • Southeast Asia
    • Rest of Asia-Pacific
  • South America
  • Middle East and Africa

Geography Analysis

North America accounted for 39.24% of the ABF substrate market for GPUs in 2025, making it the largest regional sub-segment. The region leads mainly through demand generation rather than manufacturing capacity, driven by hyperscale cloud providers, AI accelerator developers, and major GPU companies that shape procurement and long-term substrate investment decisions. Government initiatives to strengthen advanced semiconductor packaging and substrate capabilities have also increased investment in domestic supply chain resilience. While commercial ABF substrate manufacturing remains limited compared with Asia, North America continues to shape market direction through technology leadership, AI infrastructure deployment, and policy support.

Asia-Pacific is projected to be the fastest-growing regional market, expanding at a 17.22% CAGR during 2026-2031. The region remains the global manufacturing hub for ABF substrates, supported by leading suppliers in Japan, Taiwan, and South Korea with strong expertise in high-layer FC-BGA substrate production. Investments in advanced substrate capacity, AI server applications, and next-generation packaging technologies are helping manufacturers meet rising demand for AI GPUs and high-performance computing processors. Strong semiconductor ecosystems, proximity to major foundries and OSAT providers, and sustained capital expenditure on advanced packaging infrastructure are expected to drive growth over the forecast period.

Europe holds a strategic but smaller position in the market through specialized substrate manufacturers and technology partnerships. Regional companies continue to expand advanced substrate capabilities for AI and high-performance computing applications, although much of their manufacturing growth is being deployed through facilities in Asia to remain close to semiconductor production ecosystems. As a result, Europe contributes mainly through technology development and supplier diversification rather than large-scale production capacity. South America and the Middle East and Africa remain relatively small markets for ABF substrates used in GPUs. Demand in these regions is largely driven by imports of AI servers, enterprise computing systems, and data center infrastructure, with limited local substrate manufacturing. Their market contribution is expected to remain modest throughout the forecast period, while growth will mainly follow broader adoption of AI computing and digital infrastructure investments.

1. Ibiden Co., Ltd.
2. Unimicron Technology Corp.
3. Nan Ya Printed Circuit Board Corporation
4. Shinko Electric Industries Co., Ltd.
5. AT&S Austria Technologie and Systemtechnik Aktiengesellschaft
6. Kinsus Interconnect Technology Corp.
7. Samsung Electro-Mechanics Co., Ltd.
8. LG Innotek Co., Ltd.
9. TTM Technologies, Inc.
10. Shennan Circuits Co., Ltd.
11. Zhen Ding Technology Holding Limited
12. DSBJ Co., Ltd.
13. Isu Petasys Co., Ltd.
14. Meiko Electronics Co., Ltd.
15. Wus Printed Circuit Co., Ltd.
16. Tripod Technology Corp.
17. Daeduck Electronics Co., Ltd.
18. Toppan Inc.
19. Nanya PCB Corporation
20. Ajinomoto Co., Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 AI GPU Package Complexity Is Raising ABF Content Per Device
  • 4.2.2 Chiplet And Multi-Die Architectures Are Expanding Substrate Area
  • 4.2.3 Hyperscaler And OEM Long-Term Supply Agreements Are De-Risking Capacity
  • 4.2.4 Capacity Expansion By Leading Substrate Makers Is Pulling Forward Supply
  • 4.2.5 Domestic Packaging Subsidies Are Accelerating Regional Capacity Buildouts
  • 4.2.6 Advanced AI Server Refresh Cycles Are Increasing High-Layer FC-BGA Demand
• 4.3 Market Restraints
  • 4.3.1 Extreme Capital Intensity Limits New Entrants
  • 4.3.2 Yield Loss At High Layer Counts Delays Commercial Ramp-Up
  • 4.3.3 Concentration In ABF Film And Critical Inputs Creates Supply Bottlenecks
  • 4.3.4 Alternative Substrate Technologies May Erode Long-Term Share In Select Applications
• 4.4 Industry Value Chain Analysis
• 4.5 Impact of Macroeconomic Factors on the Market
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Package Type
  • 5.1.1 Standard FC-BGA Substrates
  • 5.1.2 Advanced FC-BGA Substrates for 2.5D/Chiplet GPUs
• 5.2 By Layer Count
  • 5.2.1 Up to 8 Layers
  • 5.2.2 9 to 16 Layers
  • 5.2.3 Above 16 Layers
• 5.3 By Application
  • 5.3.1 Data Center AI and HPC GPUs
  • 5.3.2 Consumer and Gaming GPUs
  • 5.3.3 Professional Visualization and Workstation GPUs
  • 5.3.4 Automotive and Edge AI GPUs
• 5.4 By End Use
  • 5.4.1 Cloud, Hyperscale, Enterprise Data Centers, and HPC
  • 5.4.2 PCs, Gaming Systems, and Workstations
  • 5.4.3 Automotive and ADAS/Autonomous Compute
  • 5.4.4 Telecom, Industrial, and Edge AI Systems
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 Europe
    • 5.5.2.1 Germany
    • 5.5.2.2 United Kingdom
    • 5.5.2.3 France
    • 5.5.2.4 Italy
    • 5.5.2.5 Rest of Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Japan
    • 5.5.3.3 South Korea
    • 5.5.3.4 India
    • 5.5.3.5 Southeast Asia
    • 5.5.3.6 Rest of Asia-Pacific
  • 5.5.4 South America
  • 5.5.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Ibiden Co., Ltd.
  • 6.4.2 Unimicron Technology Corp.
  • 6.4.3 Nan Ya Printed Circuit Board Corporation
  • 6.4.4 Shinko Electric Industries Co., Ltd.
  • 6.4.5 AT&S Austria Technologie and Systemtechnik Aktiengesellschaft
  • 6.4.6 Kinsus Interconnect Technology Corp.
  • 6.4.7 Samsung Electro-Mechanics Co., Ltd.
  • 6.4.8 LG Innotek Co., Ltd.
  • 6.4.9 TTM Technologies, Inc.
  • 6.4.10 Shennan Circuits Co., Ltd.
  • 6.4.11 Zhen Ding Technology Holding Limited
  • 6.4.12 DSBJ Co., Ltd.
  • 6.4.13 Isu Petasys Co., Ltd.
  • 6.4.14 Meiko Electronics Co., Ltd.
  • 6.4.15 Wus Printed Circuit Co., Ltd.
  • 6.4.16 Tripod Technology Corp.
  • 6.4.17 Daeduck Electronics Co., Ltd.
  • 6.4.18 Toppan Inc.
  • 6.4.19 Nanya PCB Corporation
  • 6.4.20 Ajinomoto Co., Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment