HBM 정상 칩(KGD) 선별 및 테스트 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the HBM known-Good-Die (KGD) screening and Test Market size is expected to increase from USD 0.25 billion in 2025 to USD 0.32 billion in 2026 and reach USD 1.14 billion by 2031, growing at a CAGR of 28.93% over 2026-2031.

This report is Segmented by Test Stage (Wafer-Level Testing, and More), Tester Type (Memory Tester, and More), HBM Generation (HBM2 and HBM2E, HBM3, and More), Test Technology (Built-In Self-Test Based Screening, and More), Application (Equipment, and More), End-Use Industry (Memory Manufacturers, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global HBM Known-Good-Die (KGD) Screening and Test Market Trends and Insights

Rising AI Accelerator Demand Increasing KGD Screening Intensity

The HBM known-good-die (KGD) screening and test market is moving higher because AI accelerators now rely on HBM as a core performance building block rather than an optional memory upgrade. That shift raises the penalty for any die or stack failure, because defects can disrupt a much more expensive compute module rather than a stand-alone memory component. FormFactor stated in 2026 that AI and HBM are changing semiconductor test priorities by pushing more attention toward early defect removal, yield stability, and package-level cost protection. The same pressure is evident in how customers qualify devices, as stronger screening has become part of the commercial requirements for high-value AI hardware rather than a back-end quality preference. As AI server deployments widen, the HBM known-good-die (KGD) screening and test market is benefiting from both higher unit demand and more screening steps per device. This keeps test demand elevated even when wafer output growth alone does not fully explain the pace of equipment and capacity additions.

Shift-Left Test Strategies to Protect Multi-Die Yield

The HBM known-good-die (KGD) screening and test market is also being shaped by a clear move toward earlier screening points in the production flow. FormFactor noted in May 2026 that early test strategies are critical because they determine whether manufactured dies enter stacking as proven-qualified material, which protects downstream yield and costs. That logic becomes stronger as stacks move from fewer layers to 12- and 16-high designs, because a single weak die can compromise a much larger portion of the assembled value. Siemens EDA showed in April 2026 that HBM4 changes the test program architecture by shifting the base die toward a logic-foundry approach, making validation continuity across die, stack, and package stages more important. In practice, this means the HBM known-good-die (KGD) screening and test market is no longer centered solely on pass-or-fail screening at a single point in the line. It is increasingly organized around a sequence of protection gates that try to keep scrap from compounding as integration value rises.

High Cost of Advanced ATE and Probe Infrastructure

The HBM known-good-die (KGD) screening and test market still faces a meaningful barrier because advanced memory test, probing, and handling systems are expensive to qualify and difficult to deploy at scale. Advantest's December 2025 launch of the M5241 Memory Handler, with support for up to 512 parallel test sites and throughput up to 46,000 units per hour, shows how specialized the latest infrastructure has become. Aehr's August 2025 evaluation order also showed that new programs can require custom contactor design and unusually high current delivery, which adds another layer of development effort beyond standard test insertion. Technoprobe's 2025 Capital Market Day presentation further underscored the need for vertically integrated MEMS capabilities in advanced probe environments, suggesting that supply depth matters as much as simple equipment ownership. These conditions favor large memory manufacturers and well-qualified partners that can spread engineering costs across high volumes. Smaller participants can still enter the HBM known-good-die (KGD) screening and test market, but they often do so through narrower roles or service models rather than full in-house platform builds.

Other drivers and restraints analyzed in the detailed report include:

1. Higher HBM Stack Heights Raising Defect Containment Needs
2. Growing Use of Wafer-Level Burn-In for Latent Defect Removal
3. Limited Throughput at High Parallelism Levels

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Wafer-level testing held the largest share among test-stage segments at 44.13% in 2025, making it the first economic control point in the HBM known-good-die (KGD) screening and test market. That lead reflects the simple cost logic of the flow, since defects caught before stacking prevent more expensive material from moving into later process steps. FormFactor stated in 2026 that early screening determines whether manufactured dies reach stacking as qualified material, which gives wafer-level testing a direct role in downstream yield stability. In the HBM known-good-die (KGD) screening and test market, wafer-level decisions shape not only yield but also the capital, handling time, and package assembly effort committed to each future stack. This is why the segment remained the anchor stage even as validation demands broadened beyond the wafer.

The rest of the test-stage mix is still expanding because later validation points cannot be removed from advanced HBM programs. Package-level and system-level work remain relevant as HBM4 introduces a logic-foundry base die and a more complex integration path that wafer screening alone cannot fully cover. Stacked-die testing is the fastest-growing segment, with a 29.67% CAGR through 2031, underscoring the growing value of known-good-stack verification before final package assembly. The need grows as stack height increases and as customers seek more confidence before devices enter CoWoS and other advanced packaging flows. JEDEC's HBM4 framework supports this direction by formalizing more demanding stack configurations, which naturally widens the role of intermediate validation gates. For the HBM known-good-die (KGD) screening and test market, the stage mix is therefore widening around a clear idea, early screens save money, but later screens protect the much larger value created by stacking and integration.

Memory testers were the largest tester type segment in 2025, with a 38.23% share, supported by their roles across wafer test, functional screening, and qualification cycles spanning multiple HBM generations. Their lead comes from broad installed use and the fact that conventional memory testing remains central to day-to-day production decisions in the HBM known-good-die (KGD) screening and testing market. Advantest's product activity in late 2025 showed how vendors continue to strengthen this base, especially for high-performance AI memory devices that need higher parallelism and steadier throughput. Memory testers also remain relevant because each new HBM generation still requires a substantial body of electrical characterization and production-qualified test content. That keeps the segment firmly embedded in the HBM known-good-die (KGD) screening and test market even as newer methods gain ground.

Burn-in systems are the fastest-growing tester type, with a 29.58% CAGR through 2031, reflecting the shift toward earlier removal of latent defects in expensive AI and HBM devices. Aehr's 2025 evaluation order showed that customers are willing to test new wafer-level burn-in paths when the cost of downstream failure becomes too high to ignore. Burn-in is no longer treated only as a late reliability step, because in the HBM known-good-die (KGD) screening and test market it increasingly acts as a protection gate before advanced packaging locks in more value. Probe cards and wafer probe systems remain essential around this trend, since stronger screening still depends on accurate contact, stable current delivery, and repeatable mechanical performance. Technoprobe's 2025 expansion plans underline that suppliers also see a durable opportunity in the contact layer that supports these rising test loads. The result is a tester landscape where memory testers still lead today, but burn-in systems are closing the gap because their role is moving closer to the center of production economics.

Complete Report Scope:

• By Test Stage
  • Wafer-Level Testing
  • Stacked-Die Testing
  • Package-Level Testing
  • System-Level Testing
• By Tester Type
  • Memory Tester
  • Wafer Probe Systems
  • Probe Cards
  • Burn-In Systems
• By HBM Generation
  • HBM2 and HBM2E
  • HBM3
  • HBM3E
  • HBM4
• By Test Technology
  • Conventional Electrical Testing
  • Built-In Self-Test Based Screening
  • Wafer-Level Burn-In
  • Advanced Probe and Metrology-Assisted Test
• By Application
  • Artificial Intelligence and Machine Learning
  • High-Performance Computing
  • Gaming and Graphics Processing
  • Network and Communication Equipment
  • Automotive and Transportation
• By End-Use Industry
  • Memory Manufacturers
  • Integrated Device Manufacturers (IDMs)
  • Foundries
  • Outsourced Semiconductor Assembly and Test (OSAT)
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Taiwan
    • India
    • Rest of Asia-Pacific
  • South America
  • Middle East and Africa

Geography Analysis

Asia-Pacific commanded 83.49% of revenue in 2025, giving it the largest share of the HBM known-good-die (KGD) screening and testing market, and it is also the fastest-growing regional segment at a 29.78% CAGR through 2031. The region leads because HBM production, test equipment supply, and advanced packaging capacity are all concentrated there. South Korea remains the main anchor, since the leading HBM manufacturers drive most of the early qualification work and much of the demand for advanced screening systems. Taiwan plays a critical integration role through its foundry and packaging capacity, making its test infrastructure part of the wider HBM release path. Japan is strengthening its regional base through memory test, probe, and metrology capabilities, while China is still building local HBM test capacity from an earlier position on the qualification curve.

Asia-Pacific also benefits from policy support and equipment depth that reinforce its long-term position in the HBM known-good-die (KGD) screening and test market. Japan's semiconductor-related capital investment program totaled JPY 4.5 trillion (USD 30.1 billion) under the regular budget and JPY 6.3 trillion (USD 42.1 billion) under supplementary allocations as of December 2025. That spending environment helps sustain demand for test equipment, probe technology, and process capability across the regional supply chain. The HBM known-good-die (KGD) screening and test market is therefore not only concentrated in Asia-Pacific by production share, but also supported there by the deepest combination of manufacturing, integration, and supplier readiness. This creates a structural advantage that other regions are unlikely to close quickly.

North America held a smaller share in 2025, but it remains strategically important because hyperscaler demand and test program ownership influence how the HBM known-good-die (KGD) screening and test market evolves. The region is home to major equipment and solution providers, and it also shapes qualification requirements through the buying power of AI infrastructure customers. Aehr's wafer-level burn-in activity in California shows that North America can influence early-stage screening methods even without matching Asia-Pacific in direct HBM wafer output. Europe and South America remain smaller, though Europe keeps a meaningful role through probe and metrology specialists such as Technoprobe, while the Middle East and Africa are still early-stage participants whose relevance is linked more to downstream AI system demand than to upstream HBM screening capacity.

1. Teradyne Inc.
2. Advantest Corporation
3. FormFactor, Inc.
4. Cohu, Inc.
5. Keysight Technologies, Inc.
6. TECHWING INC.
7. DI Corporation
8. Shenzhen SEICHI Technologies Co., Ltd.
9. Wuhan Jingce Electronic Group Co., Ltd.
10. Suzhou Secote Precision Electronic Co., Ltd.
11. Chroma ATE Inc.
12. SPEA S.p.A.
13. Tokyo Electron Limited
14. Onto Innovation Inc.
15. Kulicke and Soffa Industries, Inc.
16. ASMPT Limited

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Rising AI Accelerator Demand Increasing KGD Screening Intensity
  • 4.2.2 Shift-Left Test Strategies to Protect Multi-Die Yield
  • 4.2.3 Higher HBM Stack Heights Raising Defect Containment Needs
  • 4.2.4 Growing Use of Wafer-Level Burn-In For Latent Defect Removal
  • 4.2.5 Tight Signal Integrity and Current Requirements Expanding Test Content
  • 4.2.6 HBM4 Qualification Complexity Increasing Pre-Stack Validation Spend
• 4.3 Market Restraints
  • 4.3.1 High Cost of Advanced ATE and Probe Infrastructure
  • 4.3.2 Limited Throughput at High Parallelism Levels
  • 4.3.3 Thermal and Power Delivery Constraints During Full-Rate Testing
  • 4.3.4 Yield Loss Risk From Over-Screening and False Rejects
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Threat of New Entrants
  • 4.7.2 Bargaining Power of Suppliers
  • 4.7.3 Bargaining Power of Buyers
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Intensity of Competitive Rivalry
• 4.8 Impact of Macroeconomic Factors on the Market

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Test Stage
  • 5.1.1 Wafer-Level Testing
  • 5.1.2 Stacked-Die Testing
  • 5.1.3 Package-Level Testing
  • 5.1.4 System-Level Testing
• 5.2 By Tester Type
  • 5.2.1 Memory Tester
  • 5.2.2 Wafer Probe Systems
  • 5.2.3 Probe Cards
  • 5.2.4 Burn-In Systems
• 5.3 By HBM Generation
  • 5.3.1 HBM2 and HBM2E
  • 5.3.2 HBM3
  • 5.3.3 HBM3E
  • 5.3.4 HBM4
• 5.4 By Test Technology
  • 5.4.1 Conventional Electrical Testing
  • 5.4.2 Built-In Self-Test Based Screening
  • 5.4.3 Wafer-Level Burn-In
  • 5.4.4 Advanced Probe and Metrology-Assisted Test
• 5.5 By Application
  • 5.5.1 Artificial Intelligence and Machine Learning
  • 5.5.2 High-Performance Computing
  • 5.5.3 Gaming and Graphics Processing
  • 5.5.4 Network and Communication Equipment
  • 5.5.5 Automotive and Transportation
• 5.6 By End-Use Industry
  • 5.6.1 Memory Manufacturers
  • 5.6.2 Integrated Device Manufacturers (IDMs)
  • 5.6.3 Foundries
  • 5.6.4 Outsourced Semiconductor Assembly and Test (OSAT)
• 5.7 By Geography
  • 5.7.1 North America
    • 5.7.1.1 United States
    • 5.7.1.2 Canada
    • 5.7.1.3 Mexico
  • 5.7.2 Europe
    • 5.7.2.1 Germany
    • 5.7.2.2 United Kingdom
    • 5.7.2.3 France
    • 5.7.2.4 Italy
    • 5.7.2.5 Rest of Europe
  • 5.7.3 Asia-Pacific
    • 5.7.3.1 China
    • 5.7.3.2 Japan
    • 5.7.3.3 South Korea
    • 5.7.3.4 Taiwan
    • 5.7.3.5 India
    • 5.7.3.6 Rest of Asia-Pacific
  • 5.7.4 South America
  • 5.7.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Teradyne Inc.
  • 6.4.2 Advantest Corporation
  • 6.4.3 FormFactor, Inc.
  • 6.4.4 Cohu, Inc.
  • 6.4.5 Keysight Technologies, Inc.
  • 6.4.6 TECHWING INC.
  • 6.4.7 DI Corporation
  • 6.4.8 Shenzhen SEICHI Technologies Co., Ltd.
  • 6.4.9 Wuhan Jingce Electronic Group Co., Ltd.
  • 6.4.10 Suzhou Secote Precision Electronic Co., Ltd.
  • 6.4.11 Chroma ATE Inc.
  • 6.4.12 SPEA S.p.A.
  • 6.4.13 Tokyo Electron Limited
  • 6.4.14 Onto Innovation Inc.
  • 6.4.15 Kulicke and Soffa Industries, Inc.
  • 6.4.16 ASMPT Limited

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment