스마트 파워 : 시장 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the smart power market size is expected to grow from USD 188.28 billion in 2025 to USD 208.85 billion in 2026 and is forecast to reach USD 350.65 billion by 2031 at 10.92% CAGR over 2026-2031.

This report is Segmented by Product (Wireless Chargers, Energy Management Systems), Technology (Inductive/Magnetic Resonance, Radio Frequency/Infrared, and More), Application (Consumer Electronics, Automotive and E-Mobility, and More), End User (OEMs/Device Manufacturers, and More), Power Device Type (Power Management ICs, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global Smart Power Market Trends and Insights

Rising Adoption of Wireless Charging in Consumer Electronics

Qi2 certification in early 2024 reduced magnetic misalignment losses below 5%, a milestone that made 15-watt inductive pads practical for tablets and laptops. Apple and Samsung shipped more than 250 million Qi2-enabled phones in 2024, catalyzing a USD 4 billion accessory ecosystem. Automakers followed, adding in-cab charging pads that curb cable wear and accent premium interiors. Hotel groups are embedding Qi2 modules in approximately half a million guest rooms by 2026 to enhance convenience and reduce maintenance costs. The switch away from wired ports also supports sealed, water-resistant designs for industrial IoT devices, boosting unit demand in harsh-environment segments.

Proliferation of Power Management ICs in 5G Smartphones and IoT Devices

Standalone 5G networks double the number of power amplifiers per phone, lifting PMIC die area and value content. Flagship chipsets that shipped in late 2024 incorporate dynamic voltage scaling, which saves 25% of battery life, driving adoption across mid-range tiers in 2025. IoT edge nodes, forecast to reach 30 billion units by 2030, require a sub-1-microamp sleep current, prompting semiconductor manufacturers to develop nanowatt converters. India earmarked USD 2 billion to localize PMIC fabrication, shortening supply chains for regional handset brands. Safety standard IEC 62368-1 tightens fault protection rules, sending more control functions inside the PMIC and raising the bill-of-materials value.

High Cost of Wide-Bandgap Materials Such as GaN and SiC

SiC wafers priced near USD 1,500 for 150-millimeter diameters in 2024 contrast sharply against USD 300 silicon equivalents, squeezing module margins and confining adoption to premium drivetrain and industrial categories. With three vendors controlling more than 70% of boule capacity, multi-year supply deals lock in elevated pricing through 2027. GaN epitaxy yields of 85% on 200-millimeter substrates still trail the 95% target for mainstream consumer cost points, resulting in defect premiums that brands ultimately pass on to consumers. Material costs form 40-50% of the finished SiC MOSFET expense, limiting large-scale price drops unless breakthroughs in crystal growth occur. Lead times of 12-18 months push automakers to dual-source silicon and SiC inverters, diluting volume leverage.

Other drivers and restraints analyzed in the detailed report include:

1. Rapid Growth of Electric Vehicles Requiring High-Efficiency Power Electronics
2. Government Incentives for Smart Grid Modernization
3. Interoperability and Standards Fragmentation

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Wireless chargers held a 42.55% share of the smart power market size in 2025, driven by more than 800 million accessory shipments. Energy management systems are forecast to outpace at a 12.05% CAGR through 2031, leveraging time-of-use tariff optimization in homes and demand-response automation in commercial buildings. California and Texas utilities installed 2 million smart thermostats during 2024 under flexibility programs that reward peak-load curtailment. Machine-learning algorithms within new platforms can reduce building energy intensity by up to 25%, enhancing payback and generating recurring software revenue. Wireless charging is now being incorporated into furniture sold to hospitality and office clients, yet handset replacement cycles that stretch beyond three years temper accessory reorder volume.

The ongoing rooftop solar boom accelerates demand for intelligent inverters and controllers that integrate batteries into virtual power plants. Residential solar-plus-storage installs in the United States exceeded 500,000 units in 2024, each requiring multi-port energy hubs that orchestrate generation, storage, and flexible loads. Corporates pursue ISO 50001 certification, driving procurement of systems that deliver granular monitoring and automatic fault detection. Wireless chargers migrate beyond phones into two-in-one laptops and handheld gaming devices, but saturation in the premium smartphone tier suggests slower incremental growth compared with energy management rollouts.

Inductive and magnetic resonance technologies accounted for 54.60% of 2025 revenue, primarily due to the deployment of Qi2 across flagship smartphones. Still, wide-bandgap power electronics are expected to post a 14.10% CAGR, the fastest among technology buckets. SiC modules now feature in more than 60% of new 800-volt EV platforms, delivering efficiency gains that cascade into smaller batteries and longer driving range. GaN transistors power 100-watt USB-C chargers that are 40% lighter than silicon-based units, securing design slots with accessory leaders. Data-center operators are testing GaN power stages for 48-volt server racks, aiming for 98% conversion efficiency, which could significantly reduce the cooling load.

Radio frequency and infrared wireless power transfer remain niche, with a share under 5%, confined to asset tracking and medical implant use. Yet the first 1-watt over-the-air certification received in 2024 hints at expanded retail signage and warehouse sensor opportunities. Inductive pads retain dominance in near-field charging as coil coupling surpasses 85% and supports metal device housings. Nonetheless, the march toward higher switching frequencies enabled by GaN and SiC reduces coil dimensions, thereby curbing electromagnetic interference and enhancing form factor flexibility.

Complete Report Scope:

• By Product
  • Wireless Chargers
  • Energy Management Systems
• By Technology
  • Inductive / Magnetic Resonance
  • Radio Frequency / Infrared
  • Wide-Bandgap Power Electronics (GaN, SiC)
• By Application
  • Consumer Electronics
  • Automotive and E-Mobility
  • Industrial Automation
  • Residential and Commercial Energy Management
• By End User
  • OEMs / Device Manufacturers
  • Utilities and Energy Service Companies
  • Hospitality and Retail
  • Government and Defense
• By Power Device Type
  • Power Management ICs
  • Smart Power Modules
  • Discrete Wide-Bandgap Devices
  • Switching Mode Power Supplies
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • South America
    • Brazil
    • Mexico
    • Rest of South America
  • Europe
    • Germany
    • United Kingdom
    • France
    • Spain
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
    • Rest of Asia Pacific
  • Middle East and Africa
    • Middle East
      • Saudi Arabia
      • United Arab Emirates
      • Qatar
      • Turkey
      • Rest of Middle East
    • Africa
      • South Africa
      • Nigeria
      • Rest of Africa

Geography Analysis

The Asia Pacific region held 37.80% of 2025 revenue and is advancing at a 12.25% CAGR, the strongest among all regions. China produced more than 9 million battery electric vehicles that year, each loaded with SiC inverters and GaN chargers. India's Production Linked Incentive scheme propelled electronics output to USD 115 billion in 2024, supporting domestic PMIC fabs that reduce import reliance. Japan added 8 gigawatts of renewable capacity, sparking demand for 4 million residential energy systems that sync rooftop solar with grid signals. South Korea's semiconductor equipment exports surpassed USD 20 billion, reflecting capital outlays on advanced packaging of heterogeneous PMICs and processors.

North America and Europe each held a near 25% share. In the United States, the Inflation Reduction Act's USD 7,500 EV tax credit has accelerated sales of models featuring SiC drivetrains. Utilities installed 10 gigawatt-hours of grid-scale batteries in 2024, each using multi-megawatt inverters built on SiC power stages. Europe's REPowerEU has earmarked EUR 43 billion (USD 47 billion) for the digitization of distribution networks through 2028. The Energy Performance of Buildings Directive, effective from 2025, mandates smart readiness indicators that promote integrated management systems in new construction.

The Middle East and Africa contributed under 10% but enjoy pockets of high growth, especially in Gulf Cooperation Council smart meter rollouts and South African renewable tenders that demand advanced grid-support inverters. Latin America remains an emerging opportunity as Brazil and Mexico explore time-of-use tariffs and utility-backed rooftop solar credits that encourage energy management system uptake. Although advanced semiconductor fabrication is limited in these regions, policy incentives for distributed renewables create downstream demand for smart power hardware and software.

1. Texas Instruments Incorporated
2. Infineon Technologies AG
3. STMicroelectronics N.V.
4. ON Semiconductor Corporation
5. Qualcomm Incorporated
6. Apple Inc.
7. Samsung Electronics Co., Ltd.
8. LG Electronics Inc.
9. Huawei Technologies Co., Ltd.
10. Nokia Corporation
11. Anker Innovations Technology Co., Ltd.
12. Belkin International, Inc.
13. Logitech International S.A.
14. ZAGG Inc. (mophie)
15. Energous Corporation
16. Ossia Inc.
17. Powermat Technologies Ltd.
18. Dialog Semiconductor GmbH
19. Navitas Semiconductor Corporation
20. Efficient Power Conversion Corporation
21. GaN Systems Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Rising Adoption of Wireless Charging in Consumer Electronics
  • 4.2.2 Proliferation of Power Management ICs in 5G Smartphones and IoT Devices
  • 4.2.3 Rapid Growth of Electric Vehicles Requiring High-Efficiency Power Electronics
  • 4.2.4 Government Incentives for Smart Grid Modernization
  • 4.2.5 Integration of Smart Power Modules into Modular Furniture
  • 4.2.6 AI-Enhanced Power Management Algorithms Reducing Standby Losses
• 4.3 Market Restraints
  • 4.3.1 High Cost of Wide-Bandgap Materials such as GaN and SiC
  • 4.3.2 Interoperability and Standards Fragmentation
  • 4.3.3 Thermal Management Challenges in High-Density PMICs
  • 4.3.4 Tariff Volatility on Semiconductor Components
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Impact of Macroeconomic Factors on the Market
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Consumers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitute Products
  • 4.8.5 Intensity of Competitive Rivalry
• 4.9 Wireless Charger Embedded Furniture Trend Analysis
• 4.10 Investment Analysis

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Product
  • 5.1.1 Wireless Chargers
  • 5.1.2 Energy Management Systems
• 5.2 By Technology
  • 5.2.1 Inductive / Magnetic Resonance
  • 5.2.2 Radio Frequency / Infrared
  • 5.2.3 Wide-Bandgap Power Electronics (GaN, SiC)
• 5.3 By Application
  • 5.3.1 Consumer Electronics
  • 5.3.2 Automotive and E-Mobility
  • 5.3.3 Industrial Automation
  • 5.3.4 Residential and Commercial Energy Management
• 5.4 By End User
  • 5.4.1 OEMs / Device Manufacturers
  • 5.4.2 Utilities and Energy Service Companies
  • 5.4.3 Hospitality and Retail
  • 5.4.4 Government and Defense
• 5.5 By Power Device Type
  • 5.5.1 Power Management ICs
  • 5.5.2 Smart Power Modules
  • 5.5.3 Discrete Wide-Bandgap Devices
  • 5.5.4 Switching Mode Power Supplies
• 5.6 By Geography
  • 5.6.1 North America
    • 5.6.1.1 United States
    • 5.6.1.2 Canada
    • 5.6.1.3 Mexico
  • 5.6.2 South America
    • 5.6.2.1 Brazil
    • 5.6.2.2 Mexico
    • 5.6.2.3 Rest of South America
  • 5.6.3 Europe
    • 5.6.3.1 Germany
    • 5.6.3.2 United Kingdom
    • 5.6.3.3 France
    • 5.6.3.4 Spain
    • 5.6.3.5 Italy
    • 5.6.3.6 Rest of Europe
  • 5.6.4 Asia Pacific
    • 5.6.4.1 China
    • 5.6.4.2 India
    • 5.6.4.3 Japan
    • 5.6.4.4 Australia
    • 5.6.4.5 South Korea
    • 5.6.4.6 Rest of Asia Pacific
  • 5.6.5 Middle East and Africa
    • 5.6.5.1 Middle East
      • 5.6.5.1.1 Saudi Arabia
      • 5.6.5.1.2 United Arab Emirates
      • 5.6.5.1.3 Qatar
      • 5.6.5.1.4 Turkey
      • 5.6.5.1.5 Rest of Middle East
    • 5.6.5.2 Africa
      • 5.6.5.2.1 South Africa
      • 5.6.5.2.2 Nigeria
      • 5.6.5.2.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as Available, Strategic Information, Market Rank/Share for Key Companies, Products and Services, and Recent Developments)
  • 6.4.1 Texas Instruments Incorporated
  • 6.4.2 Infineon Technologies AG
  • 6.4.3 STMicroelectronics N.V.
  • 6.4.4 ON Semiconductor Corporation
  • 6.4.5 Qualcomm Incorporated
  • 6.4.6 Apple Inc.
  • 6.4.7 Samsung Electronics Co., Ltd.
  • 6.4.8 LG Electronics Inc.
  • 6.4.9 Huawei Technologies Co., Ltd.
  • 6.4.10 Nokia Corporation
  • 6.4.11 Anker Innovations Technology Co., Ltd.
  • 6.4.12 Belkin International, Inc.
  • 6.4.13 Logitech International S.A.
  • 6.4.14 ZAGG Inc. (mophie)
  • 6.4.15 Energous Corporation
  • 6.4.16 Ossia Inc.
  • 6.4.17 Powermat Technologies Ltd.
  • 6.4.18 Dialog Semiconductor GmbH
  • 6.4.19 Navitas Semiconductor Corporation
  • 6.4.20 Efficient Power Conversion Corporation
  • 6.4.21 GaN Systems Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment