모바일 DRAM 시장 : 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the mobile DRAM market size stood at USD 33.84 billion in 2025 and is forecast to reach USD 64.71 billion by 2031, growing at a CAGR of 10.84% from 2026 to 2031.

This report is Segmented by Generation (LPDDR3, LPDDR4 and LPDDR4X, LPDDR5 and LPDDR5X, and LPDDR6), Package Capacity (Up To 4 GB, 4 GB To 8 GB, 8 GB To 16 GB, and Above 16 GB), Package Configuration (Discrete LPDDR Packages, Package-On-Package, Multi-Chip Packages, and More), and Geography (North America, Europe, Asia-Pacific, and Rest of the World). The Market Forecasts are Provided in Terms of Value (USD).

Global Mobile DRAM Market Trends and Insights

AI Smartphones Increasing Per-Device LPDDR Demand

The mobile DRAM market is seeing a clear rise in per-device memory demand as on-device AI moves from headline features into shipping products across the premium smartphone tier. Flagship configurations averaged 12 GB in 2025, and those same platforms are moving toward 18 GB by 2028 as generative AI tasks, real-time image processing, and always-on neural features require a larger and faster local memory pool. This shift matters because AI features depend on sustained high-bandwidth access and low power draw, not only on raw capacity, so suppliers that improve both speed and efficiency are better placed to capture premium programs. SK hynix said its 1c LPDDR6, validated in March 2026, delivers 33% faster data processing and 20% better power efficiency than LPDDR5X at speeds above 10.7 Gbps, directly targeting smartphones and tablets built for on-device AI workloads. The result is a wider performance and pricing gap between premium AI phones and legacy entry devices, making the mobile DRAM market more polarized than during earlier DRAM generation transitions.

LPDDR Expansion Into AI Servers

The mobile DRAM market is also expanding beyond handsets as LPDDR architectures move into AI server and accelerator designs that prioritize bandwidth and power efficiency over older DDR-centric configurations. AWS adopted LPDDR5X in its Arm-based Graviton4 server chip, and Microsoft integrated LPDDR5X into its Arm-based Cobalt 100 processor because it can materially reduce power use while increasing bandwidth relative to DDR5. Intel's Crescent Island AI inference GPU uses 160 GB of LPDDR5X, and Qualcomm's AI200 and AI250 server accelerators support up to 768 GB of LPDDR, which shows that mobile memory design expertise now has a direct path into data center hardware. Demand from NVIDIA's Vera Rubin platform alone was estimated at 6 billion GB of LPDDR in 2027, slightly above the combined smartphone LPDDR procurement of Apple and Samsung that year, underscoring how quickly this new demand pool is scaling. Because this demand source did not exist in mainstream mobile planning a few years ago, it is tightening wafer allocation and raising the strategic value of suppliers that can qualify products for both device and server environments.

HBM And DDR5 Allocation Crowding Out LPDDR Wafer Capacity

The biggest near-term brake on the mobile DRAM market is that HBM and DDR5 are taking wafer space that would otherwise support LPDDR output for smartphones, tablets, and related edge platforms. HBM production carries a 3-to-1 wafer capacity trade-off compared to standard DRAM, so each incremental HBM push tightens LPDDR availability even as nominal LPDDR demand conditions improve. SK hynix reached near-produce-and-ship inventory status in late 2025, while LPDDR5X delivery times stretched to 26 to 39 weeks across parts of the supply chain, underscoring how narrow the available cushion had become. New fab additions from Samsung's Pyeongtaek complex and SK hynix's expansion pipeline are not expected to bring structural relief before 2027, so the early part of the forecast period remains exposed to allocation pressure. This keeps prices firm and delays volume realization, allowing the mobile DRAM market to grow in value faster than in physical shipments.

Other drivers and restraints analyzed in the detailed report include:

1. 5G Premiumization Raising LPDDR Demand
2. LPDDR4X Scarcity Forcing Refresh To Higher Generations
3. Smartphone Cost Pressure Slowing Upgrade Cycle

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

LPDDR5 and LPDDR5X held 57.8% of the mobile DRAM market size in 2025, which kept this generation at the center of revenue even before LPDDR6 reached commercial scale. Their position reflects the fact that flagship smartphones, AI PCs, and emerging AI server designs already treat this generation as the working bandwidth baseline for advanced workloads. LPDDR4X still accounted for 42% of total bit output in 2025, but Samsung's exit from new supply is shifting the revenue center of gravity away from legacy products and toward newer nodes. The August 2025 JEDEC framework also set a common compliance floor, which made it harder for older generations to stay relevant in premium chipset road maps.

LPDDR6 is the fastest-growing generation at a 12.9% CAGR through 2031, and that pace reflects how quickly high-end device and platform designs are preparing for the next shift in memory performance. SK hynix presented a 1c LPDDR6 design at IEEE ISSCC 2026 with 14.4 Gb/s per pin, 33% higher bandwidth, and more than 20% better energy efficiency than LPDDR5X, which strengthens its early position in the next wave of flagship qualifications. Samsung presented a 12nm-class LPDDR6 architecture at the same conference with 12.8 Gb/s per pin and a 21% power efficiency improvement, and it later sent LPDDR6X samples to Qualcomm, which shows how quickly the competitive bar is moving. LPDDR3 now has only limited relevance in legacy embedded and industrial use cases, so the mobile DRAM market is increasingly defined by the migration path from LPDDR4X to LPDDR5X and then to LPDDR6.

Complete Report Scope:

• By Generation
  • LPDDR3
  • LPDDR4 and LPDDR4X
  • LPDDR5 and LPDDR5X
  • LPDDR6
• By Package Capacity
  • Up to 4 GB
  • 4 GB to 8 GB
  • 8 GB to 16 GB
  • Above 16 GB
• By Package Configuration
  • Discrete LPDDR Packages
  • Package-on-Package
  • Multi-Chip Packages (MCP)
  • System-in-Package (SiP)
• By Geography
  • North America
  • Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Taiwan
    • Rest of Asia-Pacific
  • Rest of the World

Geography Analysis

Asia-Pacific held 61.1% of the mobile DRAM market share in 2025 and is projected to grow at an 11.5% CAGR through 2031, which keeps the region at the center of both supply and demand. South Korea remains the core production base through Samsung's Pyeongtaek complexes and SK hynix's M15X and planned M17 expansion path, while China is building its role through CXMT's LPDDR5X ramp and wider domestic qualification. CXMT reached a 7.7% share of the global DRAM market in the fourth quarter of 2025, according to data cited in its 2026 IPO prospectus, which confirmed a structural change below the leading supplier group. Taiwan adds a critical packaging layer because its ecosystem supports both Package-on-Package and System-in-Package integration programs for global customers across advanced mobile designs. Micron broke ground on a JPY 1.5 trillion (USD 9.3 billion) Hiroshima expansion in July 2026, and the project included up to JPY 500 billion (USD 3.1 billion) in support from Japan's Ministry of Economy, Trade and Industry, which reinforces Japan's role as a secondary regional anchor.

North America's position in the mobile DRAM market is shaped more by technology road maps and hyperscaler demand than by current production share. Micron said it plans to invest more than USD 250 billion in United States manufacturing through 2035 and aims for 40% of its DRAM output to come from domestic fabs, although major new mobile-relevant supply will arrive after 2027. Europe is more demand driven, with software-defined vehicles and advanced driver assistance systems pulling LPDDR5X into centralized cockpit and compute platforms. Compliance requirements under automotive safety and cybersecurity frameworks give European demand a steadier base than consumer electronics cycles alone.

In the rest of the world, the mobile DRAM market remains tied mainly to smartphone adoption and 5G rollout rather than to local chip production. South America, the Middle East and Africa, and parts of South Asia are still consumer demand centers, so their memory content trend depends heavily on what global handset brands can source at workable price points. CXMT's LPDDR4X and LPDDR5 products have already entered Android supply chains that serve these regions, including brands with strong positions in sub-Saharan Africa. Gulf markets are also starting to add automotive memory demand as electric vehicle imports bring more ADAS-equipped models that rely on LPDDR5X-class in-vehicle memory.

1. Samsung Electronics Co., Ltd.
2. SK hynix Inc.
3. Micron Technology, Inc.
4. ChangXin Memory Technologies, Inc.
5. Nanya Technology Corporation
6. Integrated Silicon Solution, Inc.
7. Elite Semiconductor Microelectronics Technology Inc.
8. AP Memory Technology Corporation
9. Etron Technology, Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 AI Smartphones Increasing Per-Device LPDDR Content
  • 4.2.2 5G Premiumization Raising LPDDR5 and LPDDR5X Adoption
  • 4.2.3 LPDDR Expansion Into AI Servers and Client Modules
  • 4.2.4 Software-Defined Vehicles and ADAS Raising Automotive Design-Ins
  • 4.2.5 LPDDR4X Scarcity Forcing Refresh Cycles
  • 4.2.6 Ultra-Thin Notebooks and AI PCs Favoring Soldered LPDDR
• 4.3 Market Restraints
  • 4.3.1 High Supplier Concentration Amplifying Pricing Volatility
  • 4.3.2 HBM and DDR5 Allocation Crowding Out Mobile DRAM Supply
  • 4.3.3 Advanced Node Yield and Qualification Risk Delaying LPDDR6 Cost Down
  • 4.3.4 Smartphone Cost Pressure Slowing Penetration in Low and Mid-Tier Devices
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Impact of Macroeconomic Factors on the Market
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Generation
  • 5.1.1 LPDDR3
  • 5.1.2 LPDDR4 and LPDDR4X
  • 5.1.3 LPDDR5 and LPDDR5X
  • 5.1.4 LPDDR6
• 5.2 By Package Capacity
  • 5.2.1 Up to 4 GB
  • 5.2.2 4 GB to 8 GB
  • 5.2.3 8 GB to 16 GB
  • 5.2.4 Above 16 GB
• 5.3 By Package Configuration
  • 5.3.1 Discrete LPDDR Packages
  • 5.3.2 Package-on-Package
  • 5.3.3 Multi-Chip Packages (MCP)
  • 5.3.4 System-in-Package (SiP)
• 5.4 By Geography
  • 5.4.1 North America
  • 5.4.2 Europe
  • 5.4.3 Asia-Pacific
    • 5.4.3.1 China
    • 5.4.3.2 Japan
    • 5.4.3.3 South Korea
    • 5.4.3.4 Taiwan
    • 5.4.3.5 Rest of Asia-Pacific
  • 5.4.4 Rest of the World

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Samsung Electronics Co., Ltd.
  • 6.4.2 SK hynix Inc.
  • 6.4.3 Micron Technology, Inc.
  • 6.4.4 ChangXin Memory Technologies, Inc.
  • 6.4.5 Nanya Technology Corporation
  • 6.4.6 Integrated Silicon Solution, Inc.
  • 6.4.7 Elite Semiconductor Microelectronics Technology Inc.
  • 6.4.8 AP Memory Technology Corporation
  • 6.4.9 Etron Technology, Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment