박형 웨이퍼 가공 및 다이싱 장비 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, thin wafer processing and Dicing Equipment market size in 2026 is estimated at USD 0.82 billion, growing from 2025 value of USD 0.77 billion with 2031 projections showing USD 1.11 billion, growing at 6.32% CAGR over 2026-2031.

This report is Segmented by Equipment Type (Thinning Equipment and Dicing Equipment), Application (Memory and Logic TSV, MEMS Devices, Power Devices, and More), Wafer Thickness (750 Mm, 120 Mm, and More), Wafer Size (<4 Inch, 5-6 Inch, and More), and Geography (North America, South America, Europe, Asia-Pacific, and More). The Market Forecasts are Provided in Terms of Value (USD).

Global Thin Wafer Processing And Dicing Equipment Market Trends and Insights

Rising Adoption of RFID, Smart Cards and Automotive Power ICs

Contactless payment cards and vehicle electrification require dies with thicknesses of <=120 µm for radio-frequency efficiency and thermal performance. Silicon-carbide traction inverters in battery-electric cars rely on wafers with thicknesses below 100 µm to reduce thermal resistance, which in turn drives demand for advanced grinding, CMP, and stress-relief modules. Automotive cockpit digitalization further boosts demand for high-performance SoCs that require precise thickness control and low-stress die singulation. As a result, OEMs specify narrower thickness tolerances and lower kerf widths, lifting average selling prices for premium thinning and plasma-dicing tools. This tailwind directly supports revenue expansion in the thin wafer processing and dicing equipment market.

Surge in 3D-IC TSV Memory and Logic Demand

Chipmakers are moving toward vertical integration to bypass the limits of planar scaling. TSV-stacked DRAM and chiplet-based CPUs require wafers to be thinned to <=50 µm, which traditional double-side grind systems cannot process without inducing warpage. Leading foundries have earmarked multi-billion-dollar budgets for 2nm logic ramps that include large batches of carrier-de-bond, laser-debond, and plasma-dicing tools. The shift amplifies throughput requirements: a single 2 nm fab can consume 60,000 300 mm wafers per month, each pass obligating ultra-clean singulation to protect TSV sidewalls. Consequently, equipment suppliers offering integrated metrology and real-time stress compensation gain share inside the thin wafer processing and dicing equipment market.

Wafer Warpage and Die-Cracking Yield Losses

Reducing wafer thickness below 100 µm magnifies internal stress gradients and accentuates post-grind bow, often exceeding +-80 µm on a 300 mm substrate. Bow-corrective carriers and chuck-level active compensation add cost and complexity yet remain essential, as yield losses from die cracking can reach 10-15% in aggressive TSV stacks. Plasma-based singulation introduces localized heating, which can worsen warp if chuck cooling is inadequate, necessitating closed-loop thermal management. Until defect-density metrics match those of 200 µm historical baselines, adoption curves for advanced thinning lines may progress in staged rollouts, dampening near-term revenue potential for the thin wafer processing and dicing equipment market.

Other drivers and restraints analyzed in the detailed report include:

1. Ongoing Miniaturization of Consumer Electronics
2. CAPEX Race Among Foundries for >=6 kW Laser Plasma Dicing Tools
3. High Upfront Cost of Advanced Thinning/Dicing Lines

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Dicing platforms captured 63.45% of the thin wafer processing and dicing equipment market share in 2025, reflecting the indispensable demand for die-singulation across both legacy and leading-edge nodes. Conventional blade systems still dominate high-volume consumer ICs, thanks to mature cost-per-cut metrics; however, plasma and stealth variants are registering double-digit yearly bookings as customers shift to wafer-level packages that cannot tolerate blade-induced microcracks. Thinning tools are expected to record a 7.06% CAGR, outpacing general equipment growth and signaling an architectural pivot toward sub-50 µm stacks. Integrated metrology, vibration-free stages, and AI-driven thickness feedback loops collectively raise ASPs, so the thinning segment already commands a greater revenue-per-unit ratio inside the thin wafer processing and dicing equipment market.

Market penetration parallels process-node divergence. Wafers targeted for advanced 3D integration often undergo back-grinding to a thickness of <=50 µm, followed by plasma dicing, a process that practically doubles the tool demand per wafer compared to traditional blade lines. Conversely, mature logic and analog fabs defer capex unless product performance mandates ultra-thin handling. Suppliers leverage modular chassis designs to retrofit legacy lines, shortening payback periods and expanding their total accessible Thin wafer processing and dicing equipment market size. In parallel, new entrants specializing in vacuum-less plasma chambers are courting compound semiconductor makers, nibbling away at the share of incumbents reliant on blade technology and driving competitive turnover.

Memory and logic TSV processes held 31.80% of the thin wafer processing and dicing equipment market size in 2025 due to the immediate 3D-stacking benefits within HBM modules used in AI server accelerators. Yet power semiconductors post the fastest 8.16% CAGR, fueled by traction inverters, onboard chargers, and renewables-linked power conversion that depend on wide-bandgap devices. These materials require ultra-clean kerf edges and present higher hardness, aligning perfectly with plasma and stealth dicing value propositions. As electric-vehicle unit shipments increase, tool demand intensifies far beyond proportional wafer counts, because SiC substrates typically break more blades and must transition to laser or plasma singulation early.

The power segment's capital appetite reshuffles growth share inside the thin wafer processing and dicing equipment market. Automotive OEM qualification regimes require multi-site redundancy, thereby increasing the number of equipment installations. Meanwhile, MEMS and RFID continue to experience mid-single-digit expansion, offering steady recurring parts sales for consumable-driven blade systems. CMOS image sensors are thriving in multi-camera smartphones and autonomous-driving ADAS systems; however, many CIS fabs are migrating to 200 mm lines, tempering unit value relative to 300 mm TSV logic. Suppliers that can span these divergent requirements with unified control software improve stickiness, supporting lifetime revenue per customer.

Complete Report Scope:

• By Equipment Type
  • Thinning Equipment
  • Dicing Equipment
    • Blade Dicing
    • Laser Ablation
    • Stealth Dicing
    • Plasma Dicing
• By Application
  • Memory and Logic (TSV)
  • MEMS Devices
  • Power Devices
  • CMOS Image Sensors
  • RFID
  • Others
• By Wafer Thickness
  • 750 µm
  • 120 µm
  • 50 µm
• By Wafer Size
  • <4 inch
  • 5-6 inch
  • 8 inch
  • 12 inch
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Europe
    • Germany
    • United Kingdom
    • France
    • Russia
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • South-East Asia
    • Rest of Asia-Pacific
  • Middle East and Africa
    • Middle East
      • Saudi Arabia
      • United Arab Emirates
      • Rest of Middle East
    • Africa
      • South Africa
      • Egypt
      • Rest of Africa

Geography Analysis

Asia-Pacific's 59.65% share in 2025 stems from Taiwan's foundry leadership, South Korea's memory output, and China's subsidy-backed capacity buildout. The region's 8.05% CAGR benefits from a wave of fab announcements, including plans for four 2nm facilities coming online by 2026, which alone call for 60,000 300mm wafers per month and intensive thin-wafer processing. Japanese equipment makers, such as DISCO and Tokyo Seimitsu, supply a majority of blade and stealth dicing systems, ensuring regional vendor proximity and after-sales service density that reinforce Asia-Pacific dominance in the thin wafer processing and dicing equipment market.

North America ranks second as U.S. industrial policy stimulates domestic production. Foundry expansions linked to CHIPS Act incentives require parity with Asian process performance, including the importation of advanced CMP, carrier-bond, and plasma-dicing technologies. Large capital commitments by multinational IDMs shorten payback periods for equipment vendors and diversify geographic revenue streams. Environmental, health, and safety regulations push fabs to adopt low-particulate plasma tools over blade systems, modestly nudging technical mixes sold into the North American Thin wafer processing and dicing equipment market.

Europe's semiconductor strategy skews toward automotive and industrial devices. Investments target silicon-carbide power fabs and advanced packaging pilot lines supported by the European Chips Act. Strict emissions guidelines within the European Union are accelerating the retirement of wet-chemistry thinning paths in favor of closed-loop, abrasive-less CMP and dry laser ablation systems, thereby fostering a premium niche for environmentally optimized tools. Although Europe's absolute wafer volume trails that of the Asia-Pacific and North America, its high-specification procurement profile lifts the average revenue per tool, sustaining its contribution to the global thin wafer processing and dicing equipment market.

1. Disco Corporation
2. Tokyo Seimitsu Co., Ltd. (ACCRETECH)
3. Advanced Dicing Technologies Ltd.
4. Plasma-Therm LLC
5. SPTS Technologies Ltd.
6. Han's Laser Technology Industry Group Co., Ltd.
7. ASM Laser Separation International B.V.
8. Suzhou Delphi Laser Co., Ltd.
9. Panasonic Holdings Corporation
10. Hitachi High-Tech Corporation
11. Applied Materials, Inc.
12. Lam Research Corporation
13. EV Group (EVG)
14. Veeco Instruments Inc.
15. Kulicke & Soffa Industries, Inc.
16. TAZMO Co., Ltd.
17. PVA TePla AG
18. Lintec Corporation
19. Synova SA
20. Nidec-Read Corporation
21. LASEA SA
22. 3D-Micromac AG
23. NAURA Technology Group Co., Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Rising adoption of RFID, smart cards and automotive power ICs
  • 4.2.2 Surge in 3D-IC (TSV) memory and logic demand
  • 4.2.3 Ongoing miniaturisation of consumer electronics
  • 4.2.4 CAPEX race among foundries for >=6 kW laser plasma dicing tools
  • 4.2.5 Subsidies for 3D-IC pilot lines in China and Europe
  • 4.2.6 Rapid uptake of plasma dicing for ultra-thin SiC power devices
• 4.3 Market Restraints
  • 4.3.1 Wafer warpage and die-cracking yield losses
  • 4.3.2 High upfront cost of advanced thinning/dicing lines
  • 4.3.3 Shortage of epi-ready ultra-thin SiC/GaN wafers
  • 4.3.4 Tightening environmental rules on laser ablation particulates
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Impact of Macroeconomic Factors on the Market
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Threat of New Entrants
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Bargaining Power of Suppliers
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Equipment Type
  • 5.1.1 Thinning Equipment
  • 5.1.2 Dicing Equipment
    • 5.1.2.1 Blade Dicing
    • 5.1.2.2 Laser Ablation
    • 5.1.2.3 Stealth Dicing
    • 5.1.2.4 Plasma Dicing
• 5.2 By Application
  • 5.2.1 Memory and Logic (TSV)
  • 5.2.2 MEMS Devices
  • 5.2.3 Power Devices
  • 5.2.4 CMOS Image Sensors
  • 5.2.5 RFID
  • 5.2.6 Others
• 5.3 By Wafer Thickness
  • 5.3.1 750 µm
  • 5.3.2 120 µm
  • 5.3.3 50 µm
• 5.4 By Wafer Size
  • 5.4.1 <4 inch
  • 5.4.2 5-6 inch
  • 5.4.3 8 inch
  • 5.4.4 12 inch
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 South America
    • 5.5.2.1 Brazil
    • 5.5.2.2 Argentina
    • 5.5.2.3 Rest of South America
  • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 United Kingdom
    • 5.5.3.3 France
    • 5.5.3.4 Russia
    • 5.5.3.5 Rest of Europe
  • 5.5.4 Asia-Pacific
    • 5.5.4.1 China
    • 5.5.4.2 Japan
    • 5.5.4.3 India
    • 5.5.4.4 South Korea
    • 5.5.4.5 South-East Asia
    • 5.5.4.6 Rest of Asia-Pacific
  • 5.5.5 Middle East and Africa
    • 5.5.5.1 Middle East
      • 5.5.5.1.1 Saudi Arabia
      • 5.5.5.1.2 United Arab Emirates
      • 5.5.5.1.3 Rest of Middle East
    • 5.5.5.2 Africa
      • 5.5.5.2.1 South Africa
      • 5.5.5.2.2 Egypt
      • 5.5.5.2.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global-level Overview, Market-level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Disco Corporation
  • 6.4.2 Tokyo Seimitsu Co., Ltd. (ACCRETECH)
  • 6.4.3 Advanced Dicing Technologies Ltd.
  • 6.4.4 Plasma-Therm LLC
  • 6.4.5 SPTS Technologies Ltd.
  • 6.4.6 Han's Laser Technology Industry Group Co., Ltd.
  • 6.4.7 ASM Laser Separation International B.V.
  • 6.4.8 Suzhou Delphi Laser Co., Ltd.
  • 6.4.9 Panasonic Holdings Corporation
  • 6.4.10 Hitachi High-Tech Corporation
  • 6.4.11 Applied Materials, Inc.
  • 6.4.12 Lam Research Corporation
  • 6.4.13 EV Group (EVG)
  • 6.4.14 Veeco Instruments Inc.
  • 6.4.15 Kulicke & Soffa Industries, Inc.
  • 6.4.16 TAZMO Co., Ltd.
  • 6.4.17 PVA TePla AG
  • 6.4.18 Lintec Corporation
  • 6.4.19 Synova SA
  • 6.4.20 Nidec-Read Corporation
  • 6.4.21 LASEA SA
  • 6.4.22 3D-Micromac AG
  • 6.4.23 NAURA Technology Group Co., Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-need Assessment