MEMS 압력 센서 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the MEMS pressure sensor market size is expected to grow from USD 2.67 billion in 2025 to USD 2.82 billion in 2026 and is forecast to reach USD 3.74 billion by 2031 at 5.77% CAGR over 2026-2031.

This report is Segmented by Application (Medical, Automotive, Industrial, and More), Type (Silicon Piezoresistive, and Silicon Capacitive), Technology (Gauge, Absolute, and Differential), Pressure Range (Below 10 KPa, 10 KPa - 100 KPa, and Above 100 KPa), and Geography (North America, Europe, Asia-Pacific, Middle East and Africa, South America). The Market Forecasts are Provided in Terms of Value (USD).

Global MEMS Pressure Sensors Market Trends and Insights

Growing Adoption of Advanced Driver Assistance Systems (ADAS)

MEMS pressure sensors now underpin brake-line monitoring, thermal loops in electric vehicle battery packs, and altitude-assisted navigation. Devices must withstand temperatures ranging from -40 °C to 150 °C and deliver a millisecond response, prompting automakers to specify ASIL-rated parts. Silicon-capacitive die architectures help vendors achieve <0.1% full-scale linearity and under-2 µA standby current, supporting multi-sensor arrays without draining vehicle 48 V networks.

Proliferation of IoT-Enabled Consumer Electronics

Smartphones, wearables, and smart-home gadgets embed barometric sensors measuring no larger than 2 mm2 to derive floor-level positioning, indoor climate cues, and fitness metrics. Bosch Sensortec's BMP581 consumes only 1.3 µA at 1 Hz while sustaining +-30 Pa accuracy, exemplifying the low-power benchmark consumers now expect.

Complexity of Integrating Multiple Interface Standards

Automakers face mixed I2C, SPI, SENT, and I3C buses within a single ECU, forcing the allocation of extra microcontroller resources and prolonging validation cycles by up to 12 months. Each protocol also demands separate cybersecurity and functional-safety documentation, straining engineering budgets and delaying platform launches.

Other drivers and restraints analyzed in the detailed report include:

1. Rapid Industrial Automation and Industry 4.0 Rollout
2. Rising Miniaturization in Medical Devices
3. Price Erosion Due to Intensifying Competition

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

The MEMS pressure sensor market size for the automotive sector reached USD 1.02 billion in 2025, accounting for a 38.25% share, driven by TPMS, brake-line diagnostics, and EV thermal loops. OEMs now request sensors with self-test routines and over-the-air firmware capability, enhancing fleet maintenance analytics. The MEMS pressure sensor market share for medical devices remains smaller in 2025 but displays a 6.07% CAGR outlook, driven by continuous glucose monitors and implantable cardiovascular platforms that require sub-millimeter form factors.

Industrial automation utilizes LoRa-enabled pressure nodes to reduce maintenance costs by 30%, while aerospace programs require radiation-hardened units for launch vehicles. Consumer electronics are extending barometric sensing to augmented-reality headsets, targeting an elevation accuracy of +-0.5 m indoors.

Silicon-capacitive elements accounted for 52.96% of 2025 revenue, with the MEMS pressure sensor market size for this type projected to expand at a 7.57% annual rate. Their superior linearity and drift of -40 °C to 125 °C, below 0.05%/°C, suit safety-critical ADAS and medical tools. Piezoresistive dies remain preferred for legacy analog ECUs due to their simple signal chains, but temperature-induced leakage limits their use in extreme environments.

The adoption of through-silicon-via interposers enables the 3D stacking of ASICs under the diaphragm, thereby shrinking the Z-height and boosting EMI immunity. Silicon-carbide piezoresistive prototypes now withstand temperatures exceeding 300 °C, paving the way for future deployment in gas turbines and down-hole drilling.

Complete Report Scope:

• By Application
  • Medical
  • Automotive
  • Industrial
  • Aerospace and Defense
  • Consumer Electronics
• By Type
  • Silicon Piezoresistive
  • Silicon Capacitive
• By Technology
  • Gauge
  • Absolute
  • Differential
• By Pressure Range
  • Below 10 kPa
  • 10 kPa - 100 kPa
  • Above 100 kPa
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Russia
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Rest of Asia-Pacific
  • Middle East and Africa
    • Middle East
      • Saudi Arabia
      • United Arab Emirates
      • Rest of Middle East
    • Africa
      • South Africa
      • Egypt
      • Rest of Africa
  • South America
    • Brazil
    • Argentina
    • Rest of South America

Geography Analysis

Asia-Pacific commanded 49.10% of 2025 revenue and is on course to clock 6.56% CAGR through 2031. Strong smartphone assembly, expanding EV production, and government semiconductor incentives sustain momentum. China's localization drive channels capital into domestic fabs, while Japan and South Korea refine front-end process know-how for advanced packaging.

North America ranks second; defense, aerospace, and medical regulations favor high-margin sensor designs. U.S. CHIPS Act grants underwrite new 300 mm MEMS lines, de-risking supply for critical sectors. Europe remains steady, thanks to Germany's automotive core and stringent environmental regulations that drive sensor upgrades in industrial machinery. The Middle East and Africa register early traction in oil-rig and desalination plants that require harsh-environment sensors, whereas South America's growth is tied to vehicle output in Brazil and Argentina. Region-specific safety and data-privacy mandates occasionally complicate the reuse of cross-border design, nudging vendors to localize their firmware stacks.

1. Robert Bosch GmbH (Bosch Sensortec)
2. STMicroelectronics N.V.
3. Murata Manufacturing Co., Ltd.
4. Infineon Technologies AG
5. Honeywell International Inc.
6. Sensata Technologies, Inc.
7. Amphenol Advanced Sensors (Amphenol Corporation)
8. Omron Corporation
9. Alps Alpine Co., Ltd.
10. Goertek Inc.
11. TE Connectivity Ltd.
12. NXP Semiconductors N.V.
13. InvenSense Inc. (TDK Corporation)
14. ROHM Co., Ltd.
15. Melexis NV
16. Texas Instruments Incorporated
17. First Sensor AG (TE Connectivity)
18. SiTime Corporation
19. MEMSensing Microsystems Co., Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 NTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Impact of Macroeconomic Factors
• 4.3 Technology Snapshot
• 4.4 Overview of the Use of Parylene in MEMS Pressure Sensors
• 4.5 Industry Value Chain Analysis
• 4.6 Porter's Five Forces Analysis
  • 4.6.1 Bargaining Power of Suppliers
  • 4.6.2 Bargaining Power of Buyers
  • 4.6.3 Threat of New Entrants
  • 4.6.4 Threat of Substitutes
  • 4.6.5 Intensity of Competitive Rivalry

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Growing Adoption of Advanced Driver Assistance Systems (ADAS)
  • 5.1.2 Proliferation of IoT-Enabled Consumer Electronics
  • 5.1.3 Rapid Industrial Automation and Industry 4.0 Rollout
  • 5.1.4 Rising Miniaturization in Medical Devices
  • 5.1.5 Emerging Demand for Drone-Based Atmospheric Sensing
  • 5.1.6 MEMS Foundry-as-a-Service Accelerating Start-Up Innovation
• 5.2 Market Restraints
  • 5.2.1 Complexity of Integrating Multiple Interface Standards
  • 5.2.2 Price Erosion Due to Intensifying Competition
  • 5.2.3 Supply Chain Risks in Advanced Wafer Bonding Materials
  • 5.2.4 Calibration Drift Under High Cycle Fatigue Conditions

6 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 6.1 By Application
  • 6.1.1 Medical
  • 6.1.2 Automotive
  • 6.1.3 Industrial
  • 6.1.4 Aerospace and Defense
  • 6.1.5 Consumer Electronics
• 6.2 By Type
  • 6.2.1 Silicon Piezoresistive
  • 6.2.2 Silicon Capacitive
• 6.3 By Technology
  • 6.3.1 Gauge
  • 6.3.2 Absolute
  • 6.3.3 Differential
• 6.4 By Pressure Range
  • 6.4.1 Below 10 kPa
  • 6.4.2 10 kPa - 100 kPa
  • 6.4.3 Above 100 kPa
• 6.5 By Geography
  • 6.5.1 North America
    • 6.5.1.1 United States
    • 6.5.1.2 Canada
    • 6.5.1.3 Mexico
  • 6.5.2 Europe
    • 6.5.2.1 Germany
    • 6.5.2.2 United Kingdom
    • 6.5.2.3 France
    • 6.5.2.4 Russia
    • 6.5.2.5 Rest of Europe
  • 6.5.3 Asia-Pacific
    • 6.5.3.1 China
    • 6.5.3.2 Japan
    • 6.5.3.3 India
    • 6.5.3.4 South Korea
    • 6.5.3.5 Australia
    • 6.5.3.6 Rest of Asia-Pacific
  • 6.5.4 Middle East and Africa
    • 6.5.4.1 Middle East
      • 6.5.4.1.1 Saudi Arabia
      • 6.5.4.1.2 United Arab Emirates
      • 6.5.4.1.3 Rest of Middle East
    • 6.5.4.2 Africa
      • 6.5.4.2.1 South Africa
      • 6.5.4.2.2 Egypt
      • 6.5.4.2.3 Rest of Africa
  • 6.5.5 South America
    • 6.5.5.1 Brazil
    • 6.5.5.2 Argentina
    • 6.5.5.3 Rest of South America

7 COMPETITIVE LANDSCAPE

• 7.1 Market Concentration
• 7.2 Strategic Moves
• 7.3 Market Share Analysis
• 7.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
  • 7.4.1 Robert Bosch GmbH (Bosch Sensortec)
  • 7.4.2 STMicroelectronics N.V.
  • 7.4.3 Murata Manufacturing Co., Ltd.
  • 7.4.4 Infineon Technologies AG
  • 7.4.5 Honeywell International Inc.
  • 7.4.6 Sensata Technologies, Inc.
  • 7.4.7 Amphenol Advanced Sensors (Amphenol Corporation)
  • 7.4.8 Omron Corporation
  • 7.4.9 Alps Alpine Co., Ltd.
  • 7.4.10 Goertek Inc.
  • 7.4.11 TE Connectivity Ltd.
  • 7.4.12 NXP Semiconductors N.V.
  • 7.4.13 InvenSense Inc. (TDK Corporation)
  • 7.4.14 ROHM Co., Ltd.
  • 7.4.15 Melexis NV
  • 7.4.16 Texas Instruments Incorporated
  • 7.4.17 First Sensor AG (TE Connectivity)
  • 7.4.18 SiTime Corporation
  • 7.4.19 MEMSensing Microsystems Co., Ltd.

8 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 8.1 White-Space and Unmet-Need Assessment