휴대폰 반도체 시장 : 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the mobile phone semiconductor market size in 2026 is estimated at USD 41.82 billion, growing from 2025 value of USD 37.67 billion with 2031 projections showing USD 70.49 billion, growing at 11.03% CAGR over 2026-2031.

This report is Segmented by Component (Mobile Processors, Memory ICs, Logic ICs, Analog ICs, Power Management ICs, RF ICs and Connectivity ICs, Display Driver ICs, Audio ICs, and Sensors), Technology Node ( 28 Nm), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global Mobile Phone Semiconductor Market Trends and Insights

Proliferation of 5G Smartphones

Surging shipment volumes of 5G handsets continue to propel the mobile phone semiconductor market onto a high-growth trajectory. Qualcomm's X85 modem delivers 10 Gbps peak throughput and incorporates AI-assisted signal processing, increasing RF front-end module dollar content by nearly 20% per unit. The leap from 4G to 5G requires multi-band power amplifiers, sub-6 GHz and mmWave antennas, and tighter thermal management, each of which adds die area. Samsung's Exynos Modem 5400 introduced satellite fallback in 2024, ensuring continuous connectivity in remote areas. These requirements amplify wafer starts at 7 nm for modems and at mature 28 nm for companion RF transceivers, underlining how a single handset SKU often pulls wafers from four distinct process nodes. Consequently, fab utilization at APAC foundries remains elevated, sustaining supply pressure that benefits the mobile phone semiconductor market.

Rising Adoption of On-Device AI/ML

AI inferencing is migrating on-device to reduce latency and maintain privacy, thereby increasing compute density targets for application processors. MediaTek's MT6825 demonstrated 40% energy savings compared to cloud-based inference, highlighting the cost advantages associated with local processing. Neural engines must coexist with CPUs, GPUs, image signal processors, and 5G basebands on a single substrate, driving chiplet-based SoC designs. Apple's latest A-series processor integrates AI accelerators that execute large language models locally, prompting Android vendors to pivot toward dedicated tensor units that deliver 45 TOPS. This functionality utilizes more SRAM and high-speed inter-chip interconnects, driving demand for advanced packaging that keeps logic and memory in proximity. The outcome is a wider silicon footprint per handset, reinforcing double-digit revenue expansion for the mobile phone semiconductor market.

Supply-Chain Cyclicality and Pricing Pressure

Memory and analog cycles inject volatility into the mobile phone semiconductor market. Micron's Q1 2025 revenue slipped 15% as DRAM prices softened, showing how a single quarter can erode margins across the value chain. Seasonal handset ramps amplify boom-bust swings, leaving tier-2 suppliers exposed to inventory shocks. Capacity builds, often funded during peak demand, flood the market just as demand normalizes. The resultant oversupply compresses average selling prices, yet simultaneously sparks consolidation that nudges the market toward higher concentration ratios over time.

Other drivers and restraints analyzed in the detailed report include:

1. Growing Memory Content Per Handset
2. High-Refresh OLED Displays
3. Geopolitical Export Restrictions

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Mobile processors retained a 32.80% market share of the mobile phone semiconductor market in 2025, underscoring their status as architectural hubs that coordinate AI inference, 5G connectivity, imaging pipelines, and sensor fusion within an increasingly compact board footprint. The mobile phone semiconductor market size associated with this component class is forecast to grow at an 10.88% CAGR through 2031, as chiplets and advanced packaging drive another wave of integration density. Sensors, the fastest-growing component group with a 12.60% CAGR, meet the rising demand for multimodal biometric authentication, air-quality tracking, and contextual awareness required by AI assistants.

Memory ICs anchor AI-native workloads through higher-bandwidth DRAM, while Logic ICs evolve into domain-specific accelerators that offload narrow AI kernels. Analog ICs still matter for signal conditioning even as digital take-over accelerates. Power management IC complexity increases with multi-standard fast charging and dynamic voltage scaling tailored to AI engines. RF and connectivity ICs now integrate Wi-Fi 7, Bluetooth 5.4, and soon satellite transceivers, swelling per-handset BOM. Display driver ICs incorporate variable refresh intelligence, and Audio ICs feature spatial playback and on-chip noise cancellation DSPs that align with trends in videogames and immersive media.

Complete Report Scope:

• By Component
  • Mobile Processors
  • Memory ICs
  • Logic ICs
  • Analog ICs
  • Power Management ICs
  • RF ICs and Connectivity ICs
  • Display Driver ICs
  • Audio ICs
  • Sensors (Motion sensors, Environmental Sensors, Positioning Sensors, Image Sensors, Biometric Sensors, etc.)
• By Technology Node
  • < 3 nm
  • 3 nm
  • 5 nm
  • 7 nm
  • 16 nm
  • 28 nm
  • > 28 nm
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Spain
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • India
    • Singapore
    • Australia
    • Rest of Asia-Pacific
  • Middle East and Africa
    • Middle East
      • Saudi Arabia
      • United Arab Emirates
      • Turkey
      • Rest of Middle East
    • Africa
      • South Africa
      • Nigeria
      • Egypt
      • Rest of Africa

Geography Analysis

The Asia-Pacific region held 53.90% of the mobile phone semiconductor market in 2025, driven by its deeply entrenched manufacturing clusters, government incentives, and proximity to handset assembly centers. China increased its installed wafer capacity by 13% to 8.6 million wafers per month in 2024, primarily at 28 nm nodes that supply power-management and connectivity devices. Taiwan dominates high-performance logic via TSMC, while Korea leads memory through Samsung and SK Hynix. India's ascent as a large-scale assembly hub is creating adjacent demand for local test and packaging, stamping the region with a forecast 12.05% CAGR that exceeds the global baseline.

North America's mobile phone semiconductor footprint hinges on design IP leadership and new fab investments catalyzed by the CHIPS Act. TSMC's Arizona plant began 4 nm production in early 2025, offering capacity to premium U.S. handset brands. Intel's USD 20 billion Ohio expansion envisions mobile-optimized capacity, although cost headwinds remain relatively higher compared to its Asian peers. The region benefits from tighter IP control and shorter R&D loops between design centers and advanced manufacturing lines.

Europe prioritizes strategic autonomy and environmental sustainability. The EU Chips Act aims for a 20% global market share by 2030, allocating more funds toward automotive and industrial chips than handsets. GlobalFoundries-UMC merger talks aim to consolidate 10% of othe worldwide contract capacity, providing a brand with geopolitical balance. The Middle East and Africa offer prospects for back-end assembly as mobile phone vendors diversify. South America remains a modest participant, capped at final assembly, yet improving trade pacts could eventually draw test and package operations.

1. Qualcomm Incorporated
2. MediaTek Inc.
3. Samsung Electronics Co., Ltd.
4. Apple Inc.
5. HiSilicon Technologies Co., Ltd.
6. UNISOC Technologies Co., Ltd.
7. Intel Corporation (Foundry Services)
8. Advanced Micro Devices, Inc.
9. NVIDIA Corporation
10. Texas Instruments Incorporated
11. Analog Devices, Inc.
12. Skyworks Solutions, Inc.
13. Qorvo, Inc.
14. Murata Manufacturing Co., Ltd.
15. NXP Semiconductors N.V.
16. STMicroelectronics N.V.
17. Infineon Technologies AG
18. Micron Technology, Inc.
19. SK hynix Inc.
20. Kioxia Corporation
21. Sony Semiconductor Solutions Corporation
22. ON Semiconductor Corporation
23. Dialog Semiconductor GmbH
24. Cirrus Logic, Inc.
25. Rohm Co., Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Proliferation of 5G smartphones
  • 4.2.2 Rising adoption of on-device AI/ML
  • 4.2.3 Growing memory content per handset
  • 4.2.4 High-refresh OLED displays
  • 4.2.5 Satellite connectivity enablement
  • 4.2.6 Fan-out wafer-level SiP adoption
• 4.3 Market Restraints
  • 4.3.1 Supply-chain cyclicality and pricing pressure
  • 4.3.2 Geopolitical export restrictions
  • 4.3.3 Sub-5 nm thermal/yield challenges
  • 4.3.4 OEM consolidation trimming TAM for tier-2 vendors
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Threat of New Entrants
  • 4.7.2 Bargaining Power of Buyers
  • 4.7.3 Bargaining Power of Suppliers
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Intensity of Competitive Rivalry
• 4.8 Impact of Macroeconomic Trends on the Market

5 MARKET SIZE AND GROWTH FORECASTS (VALUES)

• 5.1 By Component
  • 5.1.1 Mobile Processors
  • 5.1.2 Memory ICs
  • 5.1.3 Logic ICs
  • 5.1.4 Analog ICs
  • 5.1.5 Power Management ICs
  • 5.1.6 RF ICs and Connectivity ICs
  • 5.1.7 Display Driver ICs
  • 5.1.8 Audio ICs
  • 5.1.9 Sensors (Motion sensors, Environmental Sensors, Positioning Sensors, Image Sensors, Biometric Sensors, etc.)
• 5.2 By Technology Node
  • 5.2.1 < 3 nm
  • 5.2.2 3 nm
  • 5.2.3 5 nm
  • 5.2.4 7 nm
  • 5.2.5 16 nm
  • 5.2.6 28 nm
  • 5.2.7 > 28 nm
• 5.3 By Geography
  • 5.3.1 North America
    • 5.3.1.1 United States
    • 5.3.1.2 Canada
    • 5.3.1.3 Mexico
  • 5.3.2 South America
    • 5.3.2.1 Brazil
    • 5.3.2.2 Argentina
    • 5.3.2.3 Rest of South America
  • 5.3.3 Europe
    • 5.3.3.1 Germany
    • 5.3.3.2 United Kingdom
    • 5.3.3.3 France
    • 5.3.3.4 Italy
    • 5.3.3.5 Spain
    • 5.3.3.6 Rest of Europe
  • 5.3.4 Asia-Pacific
    • 5.3.4.1 China
    • 5.3.4.2 Japan
    • 5.3.4.3 South Korea
    • 5.3.4.4 India
    • 5.3.4.5 Singapore
    • 5.3.4.6 Australia
    • 5.3.4.7 Rest of Asia-Pacific
  • 5.3.5 Middle East and Africa
    • 5.3.5.1 Middle East
      • 5.3.5.1.1 Saudi Arabia
      • 5.3.5.1.2 United Arab Emirates
      • 5.3.5.1.3 Turkey
      • 5.3.5.1.4 Rest of Middle East
    • 5.3.5.2 Africa
      • 5.3.5.2.1 South Africa
      • 5.3.5.2.2 Nigeria
      • 5.3.5.2.3 Egypt
      • 5.3.5.2.4 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
  • 6.4.1 Qualcomm Incorporated
  • 6.4.2 MediaTek Inc.
  • 6.4.3 Samsung Electronics Co., Ltd.
  • 6.4.4 Apple Inc.
  • 6.4.5 HiSilicon Technologies Co., Ltd.
  • 6.4.6 UNISOC Technologies Co., Ltd.
  • 6.4.7 Intel Corporation (Foundry Services)
  • 6.4.8 Advanced Micro Devices, Inc.
  • 6.4.9 NVIDIA Corporation
  • 6.4.10 Texas Instruments Incorporated
  • 6.4.11 Analog Devices, Inc.
  • 6.4.12 Skyworks Solutions, Inc.
  • 6.4.13 Qorvo, Inc.
  • 6.4.14 Murata Manufacturing Co., Ltd.
  • 6.4.15 NXP Semiconductors N.V.
  • 6.4.16 STMicroelectronics N.V.
  • 6.4.17 Infineon Technologies AG
  • 6.4.18 Micron Technology, Inc.
  • 6.4.19 SK hynix Inc.
  • 6.4.20 Kioxia Corporation
  • 6.4.21 Sony Semiconductor Solutions Corporation
  • 6.4.22 ON Semiconductor Corporation
  • 6.4.23 Dialog Semiconductor GmbH
  • 6.4.24 Cirrus Logic, Inc.
  • 6.4.25 Rohm Co., Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment