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세계의 아날로그 및 믹스 시그널 IP(AMS IP) 시장 : 설계, 제품, 최종사용자 산업, 지역별 - 성장, 동향, 예측(2018-2023년)

Analog and Mixed Signal IP Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)

리서치사 Mordor Intelligence Pvt Ltd
발행일 2021년 01월 상품 코드 635793
페이지 정보 영문
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세계의 아날로그 및 믹스 시그널 IP(AMS IP) 시장 : 설계, 제품, 최종사용자 산업, 지역별 - 성장, 동향, 예측(2018-2023년) Analog and Mixed Signal IP Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)
발행일 : 2021년 01월 페이지 정보 : 영문

본 상품은 영문 자료로 한글과 영문목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

믹스 시그널 기술에 의해 아날로그 데이터가 디지털 데이터로 변환됩니다. 세계의 아날로그/믹스 시그널 IP(AMS IP) 시장은 2018-2023년의 조사기간에 14.2%의 CAGR로 추이할 것으로 예측됩니다.

세계의 아날로그/믹스 시그널 IP(AMS IP) 시장에 대해 조사했으며, 시장 개요, 설계·제품·최종사용자 산업·지역별 시장 동향, 시장 규모 추이와 예측, 성장요인·저해요인 및 시장 기회 분석, 경쟁 구도, 주요 기업 개요 등의 정보를 정리하여 전해드립니다.

목차

제1장 서론

  • 주요 조사 성과
  • 조사의 전제조건
  • 시장 정의
  • 조사 결과

제2장 조사 방법

제3장 개요

제4장 시장 역학

  • 시장 개요
  • 시장 성장 촉진요인
    • AMS 블록의 재이용성 향상
    • AMS IP의 용도 증가
  • 시장 성장 저해요인
    • 성능, 파라미터, 설계에서 디지털 IP의 높은 유연성
  • Porter의 산업 분석
    • 구매기업의 교섭력
    • 공급기업의 교섭력
    • 신규 진출업체의 위협
    • 대체품의 위협
    • 경쟁 기업 간 경쟁 관계

제5장 아날로그

  • 설계별
    • 펌 IP
    • 하드 IP
  • 제품별
    • 아날로그-디지털(A/D) 변환기
    • 디지털-아날로그(D/A) 변환기
    • 고주파
    • 전력 관리 모듈
    • 데이터 변환기
    • 기타
  • 최종사용자 산업별
    • 소비자
    • 모바일
    • 자동차
    • 통신
    • 기타
  • 지역별
    • 북미
    • 유럽
    • 아시아태평양
    • 라틴아메리카
    • 중동·아프리카

제6장 기업 개요

  • SAVARTI
  • Synopsys, Inc.
  • Rambus.com.
  • Forza Silicon Corporation
  • Alphacore Inc.
  • MIPS Technologies Inc.
  • Chipus Microelectronics
  • Moortec Semiconductor Ltd

제7장 투자 분석

제8장 시장 전망

KSA 18.05.18

The analog and mixed signal IP market is expected to register a CAGR of 14.5% during the forecast period from 2021 to 2026. Over the past decade, the integrated circuits have become increasingly complex and expensive. The industry started to embrace new design and reuse methodologies that are collectively referred to as system-on-chip (SoC), System-in-Package (SiP), and System-on-Board (SoB) design. With this shift toward miniaturization, the companies incorporating such solutions started facing the challenges for the re-usage and integration issues encountered in this paradigm shift. To solve such problems, IP blocks emerged as the most prominent solution for the industry end-users.

  • The growth of 5G technology is expected to unleash a massive IoT ecosystem that would allow networks to serve billions of connected devices worldwide. For Instance, according to Ericsson's mobility report, more than 10 million 5G mobile subscriptions are anticipated globally by the end of 2019. This is indicative of the fact that the market is poised to grow throughout the forecast period.
  • As per the National Cable and Telecommunications Association, the number of connected devices is expected to reach 50.1 billion in 2020 compared to that of 34.8 billion connected devices in 2018. Every IoT or IIoT device contains sophisticated microchip designs that permit devices to achieve remote connectivity. Moreover, as the IoT is poised to grow significantly, it is expected to impact the growth of the semiconductor industry.
  • As CMOS technologies are scaling to higher densities, the ability to design and integrate the complex mixed-signal and RF intellectual property (IP) is becoming a reality. Moreover, RF and analog/mixed-signal (RF-AMS) IP content is the next significant enhancement to the system-on-a-chip (SoC) design. However, very few products using this level of integration have been announced.
  • Further, in November 2019, Accellera Systems Initiative which is an electronics industry organization that is focused on the adoption and development of electronic design automation and intellectual property standards announced the formation of the Universal Verification Methodology Analog/Mixed-Signal Working Group. The primary aim of the new group is to develop a measure that will provide a unified analog/mixed-signal verification methodology that will be based on UVM to improve the verification of AMS integrated circuits and systems.
  • The current semiconductor market's downturn is primarily owing to the recent virus outbreak's impact on the entire industry. The lockdowns that have been enforced by the spread of COVID-19 across the globe have not only affected the manufacturing of devices but have also dragged the consumer's demand. Although the full impact of the COVID-19 is still unknown, the effect across the electronics value chain, starting from the materials to final products, will be affected significantly. The COVID-19 is also highlighting the potential risks and vulnerability of the current electronics and semiconductor value chain. It is challenging the industry to consider the transformation of its global supply chain model, which, to a certain extent, will affect analog and mixed signal IP market.

Key Market Trends

Telecommunication is Expected Hold a Significant Share

  • Telecommunication infrastructure is one of the key factors driving the market, primarily owing to the advent of the 4G network and some parts of the 5G network. Manufacturers of wireless infrastructure, especially 4G and 5G networks, are continuously reducing the size and cost of their newly installed wireless infrastructure while holding towards the high standards of performance, functionality, and quality of service.
  • 5G Infrastructure is expected to revolutionize the domain of various broadband services and is expected to empower connectivity across multiple end-user verticals. According to GSMA, around 45% urban coverage level has been achieved for 5G networks in the new deployment trails. Countries like China and India are also planning to implement the 5G network by 2020, and the development of 5G networks requires large amounts of capital investment in 5G capable infrastructure.
  • Significant players like Intel have announced a new system on chip (SoC) designed specifically for next-generation mobile base stations in Jan 2019. Similarly, Copper-clad laminate (CCL) specialist Iteq expects orders for 5G infrastructure to pull in from China. The country is investing significantly in the development and deployment of 5G services with the government and local players like Huawei actively taking part
  • Zinwell, a leading manufacturer of wired and wireless broadcast and broadband communication equipment has integrated MaxLinear's AirPHY multi-gigabit modem technology with jjPlus's latest 65W magnetic resonant wireless power module integrated with analog mixed-signal IP into its 3rd generation ZRA-003 device, which can transfer power and gigabit data through glass windows or structural walls up to 20cm thick. The solution will enhance the demand of the analog mixed-signal IP integration as the solution will enable 4G/LTE or 5G millimeter wave wireless broadband service with gigabit speeds.

North America is Expected to Hold the Largest Market Share

  • The demand for the analog and digital mixed-signal IP is driven by the growing utilization of these products as building blocks. The telecommunication sector in the US has been actively investing in 5G infrastructure. The end-user industry in the country accounts for the significant portion of the global consumption of 5G technology. In the North American region, the US dominates the regional 5G market, regarding investment, adoption, and applications.
  • The nature of the 5G superfast wireless networks is expected to provide the needed primary impetus to the telecom industry, which has been experiencing slow growth. The US Telecom Association has estimated that the US telecom operators are expected to spend around USD 104 billion by 2025. It is expected to be essential for the telecom service providers to upgrade existing 4G networks to the upcoming 5G standards and, consequently, execute the full installation of 5G wireless services.
  • In October 2019, Analogue announced the launch of its Analogue Game Boy Pocket, which is a modern version of the retro-gaming device. The critical component the company has introduced is the second FPGA (apart from one for image processing to deliver high-resolution image on its 10X high-resolution display compared to the original Game Boy). This second FPGA enables the retro-gaming community to build and port their cores to run other games on the Pocket, similar to how the MiSTER FPGA device works.
  • Canada is expected to provide sufficient expenditure and funding for its military programs (including clothing). The Canadian government has been focusing on the Integrated Soldier System Project, which is assimilating the soldier suit with electronic devices, weapons, and feed communication among soldiers as they move through the battlefield. This is expected to impact the market's growth positively in the region.

Competitive Landscape

The analog and mixed signal IP is quite fragmented as the global players are engaged in integrating the signal in various applications like consumer electronics, automotive, etc., which gives an intense rivalry among the competitors. Key players are Cadence Design Systems Inc., Taiwan Semiconductor Manufacturing Company Limited, Global foundries Inc., and Samsung Electronics Co. Ltd.

  • May 2020 - Synopsys, Inc. announced the broadest portfolio of high-quality IP on TSMC's 5nm process technology for high-performance computing system-on-chips (SoCs). The DesignWare IP portfolio on the TSMC process, encompassing interface IP for the most widely used high-speed protocols and foundation IP, accelerates the development of SoCs for high-end cloud computing, AI accelerators, networking, and storage applications.
  • February 2020 - Marvell and Analog Devices, Inc. announced a technology collaboration is leveraging Marvell's 5G digital platform and ADI's wideband RF transceiver technology to deliver fully optimized solutions for 5G base stations. As part of the partnership, the companies will offer fully integrated 5G digital front-end (DFE) ASIC solutions with tightly coupled RF transceivers. They will collaborate to develop next-generation Radio Unit (RU) solutions, including baseband and RF technology optimized for a diverse set of functional splits and architectures.

Reasons to Purchase this report:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Industry Value Chain Analysis
  • 4.3 Industry Attractiveness - Porter's Five Force Analysis
    • 4.3.1 Threat of New Entrants
    • 4.3.2 Bargaining Power of Buyers/Consumers
    • 4.3.3 Bargaining Power of Suppliers
    • 4.3.4 Threat of Substitute Products
    • 4.3.5 Intensity of Competitive Rivalry

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increasing Reusability of AMS Block
    • 5.1.2 Growing Prevalence of Wireless Communications
  • 5.2 Market Restraints
    • 5.2.1 Complexity and Sensitivity of Analog/Mixed-Signal (AMS) design

6 MARKET SEGMENTATION

  • 6.1 By Design
    • 6.1.1 Firm IP
    • 6.1.2 Hard IP
  • 6.2 By Product
    • 6.2.1 A2D and D2A Converter
    • 6.2.2 Power Management Modules
    • 6.2.3 RF
    • 6.2.4 Other Products
  • 6.3 End-user Industry
    • 6.3.1 Consumer Electronics
    • 6.3.2 Telecommunication
    • 6.3.3 Automotive
    • 6.3.4 Industrial
    • 6.3.5 Other End-user Industries
  • 6.4 Geography
    • 6.4.1 North America
    • 6.4.2 Europe
    • 6.4.3 Asia-Pacific
    • 6.4.4 Latin America
    • 6.4.5 Middle East & Africa

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Cadence Design Systems Inc.
    • 7.1.2 Taiwan Semiconductor Manufacturing Company Limited
    • 7.1.3 Global foundries Inc.
    • 7.1.4 Samsung Electronics Co. Ltd.
    • 7.1.5 Synopsys Inc.
    • 7.1.6 ARM Holdings PLC
    • 7.1.7 Xilinx Inc.
    • 7.1.8 Intel Corporation
    • 7.1.9 Analog Devices Inc.
    • 7.1.10 Maxim Integrated Products Inc.
    • 7.1.11 Texas Instruments Limited

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET

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