자동차용 PCB 시장 평가 : 유형별, 용도별, 지역별 기회 및 예측(2017-2031년)

Global automotive PCB market is projected to witness a CAGR of 6.85% during the forecast period 2024-2031, growing from USD 8.62 billion in 2023 to USD 14.65 billion in 2031. The market has experienced significant growth in recent years and is expected to maintain a strong pace of expansion in the coming years as well.

The printed circuit board (PCB) in automobiles is a complicated circuit framework utilized in vehicles/trucks to control most electronic tasks. In addition, it is utilized in automobiles and consists of printed pathways connecting ICs, transistors, and resistors to one another. Additionally, this kind of circuit board is utilized in several advanced automotive features, including entertainment and navigation systems, HUD ADAS system control modules (engine management systems and fuel regulators), antilock brake systems, and more. Electronic component manufacturers and original equipment manufacturers of automobiles are expanding their use in automobiles.

The PCB circuit boards were only used for basic headlights, wipers, and many other things. However, it has been observed in every vehicle feature, application, and component, including powertrain components, to enhance safety and ease of driving. Additionally, due to their ability to withstand extreme temperatures and vibrations, the leading automotive manufacturing companies use flexi-rigid, HDI-type printed circuit boards in a variety of applications.

The primary driving factor for the automotive PCB market is the demand for connected cars and electric vehicles rising rapidly. The automotive industry is substantially transforming with the rise of connected and electric vehicles.

For instance, in December 2022, Polaris signed a contract with AT&T to connect select off-road 2023 models in North America via the RIDE COMMAND+ Plug-In accessory device. RIDE COMMAND+ allows riders to remotely monitor key vehicle information through the Polaris app. This development drives automotive PCB market growth during the forecast period.

Increasing Use of Advanced and Comfort Features in Vehicles to Boost Market Growth

The developing tendency towards cutting-edge innovation-based vehicles, including lightweight ones, is projected to drive worldwide car printed circuit board market development. As the spine of electronic parts in vehicles, PCB makers are likewise adjusting to the changing climate and contributing vigorously to match the recurrence that will uphold the high-level elements and solace that will be utilized in vehicles later. In addition, equipment for charging, energy storage, power distribution, voltage conversion, and other applications will be enhanced by the forthcoming autonomous vehicles, connected vehicles, and new energy vehicles. Both consumers and automakers are placing a greater emphasis on vehicle dependability and safety. In automotive applications, PCBs are made to withstand extreme operating conditions like temperature fluctuations, vibrations, and moisture while also meeting stringent safety standards. The safe operation of various vehicle systems is ensured by the engineering of these boards, which are designed to provide high reliability and long-term performance. It is anticipated that these measures and features will boost the global market.

For example, in April 2022, PT Infineon Technologies Batam Indonesia, which is a fully owned subsidiary of Infineon Technologies Corp., will expand its production capacity in Indonesia by 2024. This will make Batam site the second largest from Infineon Technologies Corp. after their Melaka, Malaysia, plant for automotive PCBs.

Growing Adoption of Electric and Hybrid Passenger Vehicles Boost the Market Growth

Based on vehicle type, the market is projected to be divided into passenger cars and commercial vehicles. The automotive PCB market is expected to be dominated by the passenger car segment over the forecast period, which currently holds the largest share of the global market. The global market is expanding due to several factors, including the rising demand for electric and autonomous vehicles, the rising demand for safety and comfort features among millennials, and the rising need for a safe and comfortable driving experience. The traveler vehicle portion is likewise seeing a huge shift towards electric and half-and-half vehicles because of ecological worries and unofficial laws; this improvement drives market development during the figure time frame.

For example, in July 2022, Meiko Electronics Co., Ltd. announced the acquisition of NEC Embedded Products, Ltd., which is a manufacturer of computers, peripheral devices, software, and printers, to strengthen and spread its electronics manufacturing services business.

Companies Focus on a Wide Range of Product Offerings to Gain Competitive Edge

Meiko Electronics, Nippon Mektron, and TTM Technologies are among the major players operating in the automotive PCB market. The manufacturing of advanced automotive PCBs is the primary focus of PCB manufacturers worldwide. Meiko Gadgets is one of the main PCB makers that gives best-in-class items to the auto business for applications, for example, powertrains, wellbeing frameworks, Advanced Driver Assistance System (ADAS), and lighting frameworks. The business of designing, manufacturing, and selling printed circuit boards and other auxiliary electronics has been pioneered by the company. To support global vehicle manufacturers, the company began offering a wide range of products, including double-sided/multi-layer through-hole, HDI, flexible, flex-rigid, high electric current, heat dissipation, embedded devices, solder stencils, PCB testers, imaging devices, and imaging systems.

For example, in April 2023, Infineon AG announced that it had collaborated with Schweizer Electronic AG (Schweizer) to develop more efficient silicon carbide (SiC) chips for automotive solutions. Companies are developing a solution to embed Infineon's 1200 V CoolSiC chips directly onto printed circuit boards (PCBs). This will increase the range of EVs and reduce the total system cost.

Increasing Adoption of ADAS Feature in Vehicles Boost the Market Growth

The market is fragmented into ADAS, body and solace, infotainment, and others in view of use type. The high-level driver help framework fragment holds the biggest portion of the overall industry and is supposed to lead all through the figure period. The development of ADAS features and vehicle implementation has increased over the past few years. Additionally, different government bodies have commanded the security elements and, as of now, have guidelines connected with the counter-stopping mechanism, airbags, tire pressure checking, and numerous others. Additionally, the ADAS market is expanding due to consumers' preference for high-end features and rising disposable income. They will assist with generating interest for the printed circuit board in the car market. Infotainment systems, body, and comfort also play a significant role in the market's expansion. The developing interest for inside highlights, for example, dashboard switches, sound system and sound parts, computerized screens and HUD show frameworks, locally available radar frameworks, route frameworks, and installed diagnostics, will develop essentially throughout the next few years.

For instance, in July 2022, Medico Electronics Co., Ltd. announced that the company had acquired the shares (100% equities) of NEC Embedded Products, Ltd. Under the acquisition, the company will provide customers with the best products and services. NECEP is capable of handling orders for a wide variety of electrical and electronic equipment, utilizing its embedded product development capabilities and cutting-edge technologies.

Asia-Pacific Dominates the Global Automotive PCB Market

Asia-Pacific is exerting its dominance in the global automotive PCB market, propelled by its thriving automotive sector and escalating vehicle manufacturing activities. After COVID-19, consumers' preference for personal mobility will rise, necessitating a greater demand for automotive sales and printed circuit boards. During the forecast period, the region's market growth will likely be aided by the increasing use of electric and autonomous vehicles, as well as the growing acceptance of important government initiatives.

For instance, in January 2022, Asia-Pacific emerged as a dominant force in the automotive PCB market, driven by its significant car production rates. The surge in demand for advanced automotive components fuels growth, positioning Asia-Pacific with a major share in this market segment.

Future Market Scenario (2024-2031F)

Increasing Scaling down and High-Thickness Interconnect (HDI) PCBs: There's a rising pattern toward cutting back and HDI PCBs as vehicle hardware gets more complex. These make it possible to fit more parts into smaller spaces, which improves performance and lets cars use modern features without getting bigger.

Adaptable and Unbending Flex PCBs: Adaptable and unbending flex PCBs are turning out to be more famous because of their capacity to oblige restricted spaces and complex calculations in vehicle plans. They are ideal for the dynamic and adaptable electronic requirements of contemporary automobiles because they offer increased reliability even in challenging environments.

Expanded Utilization of Cutting-Edge Materials: Auto PCBs are progressively embracing complex materials, for example, high recurrence covers and metal substrates, to further develop heat dispersal, solidness, and execution. Power electronics, particularly in electric and hybrid automobiles, require these materials in great quantities.

Key Players Landscape and Outlook

Key participants in the automotive PCB market include BREDA LORETT SRL, Dayco, Fukoku Korea Co. Ltd., Gates Corporation, and GT Automotive. Continuous innovation characterizes this landscape, as these companies compete to outperform one another in terms of performance, energy efficiency, and unique features. The market prognosis remains positive, owing to increased demand for high-quality gaming, AI, and professional workloads. Automotive PCB manufacturers are concerned with supply chain resilience, energy efficiency, and environmental practices, which will likely define the industry's future. Collaborations and developing technologies are projected to increase competition in this fast-paced market.

In August 2022, Meiko Electronics Co. Ltd. acquired the automotive electronics business of NEC Corporation, NEC Embedded Products. Ltd. for JPY 11 billion to bolster its Electronic Manufacturing Services (EMS) business.

In June 2022, Hitachi Astemo Ltd. introduced a new compact and energy-saving inverter technology that integrates all the power electronics on a printed circuit board with inverter circuit components. This technology is specifically developed for EVs.

Table of Contents

1.Research Methodology

2.Project Scope & Definitions

3.Executive Summary

4.Voice of Customer

• 4.1.Mode of Brand Awareness
• 4.2.Factors Considered in Purchase Decisions
  • 4.2.1.Features and Other Value-Added Service
  • 4.2.2.Efficiency of Solutions
  • 4.2.3.After-Sales Support
• 4.3.Consideration of Privacy and Safety Regulations

5.Global Automotive PCB Market Outlook, 2017-2031F

• 5.1.Market Size & Forecast
  • 5.1.1.By Value
• 5.2.By Type
  • 5.2.1.Single or Double Layer
  • 5.2.2.Multi-Layer
  • 5.2.3.High-Density Interconnect
  • 5.2.4.Flexible PCB
  • 5.2.5.Others
• 5.3.By Application
  • 5.3.1.Automotive
  • 5.3.2.Machinery
  • 5.3.3.Transportation
  • 5.3.4.Others
• 5.4.By Region
  • 5.4.1.North America
  • 5.4.2.Europe
  • 5.4.3.Asia-Pacific
  • 5.4.4.South America
  • 5.4.5.Middle East and Africa
• 5.5.By Company Market Share (%), 2023

6.Global Automotive PCB Market Outlook, By Region, 2017-2031F

• 6.1.North America*
  • 6.1.1.Market Size & Forecast
    • 6.1.1.1.By Value
  • 6.1.2.By Type
    • 6.1.2.1.Single or Double Layer
    • 6.1.2.2.Multi-Layer
    • 6.1.2.3.High-Density Interconnect
    • 6.1.2.4.Flexible PCB
    • 6.1.2.5.Others
  • 6.1.3.By Application
    • 6.1.3.1.Automotive
    • 6.1.3.2.Machinery
    • 6.1.3.3.Transportation
    • 6.1.3.4.Others
  • 6.1.4.United States*
    • 6.1.4.1.Market Size & Forecast
      • 6.1.4.1.1.By Value
    • 6.1.4.2.By Type
      • 6.1.4.2.1.Single or Double Layer
      • 6.1.4.2.2.Multi-Layer
      • 6.1.4.2.3.High-Density Interconnect
      • 6.1.4.2.4.Flexible PCB
      • 6.1.4.2.5.Others
    • 6.1.4.3.By Application
      • 6.1.4.3.1.Automotive
      • 6.1.4.3.2.Machinery
      • 6.1.4.3.3.Transportation
      • 6.1.4.3.4.Others
  • 6.1.5.Canada
  • 6.1.6.Mexico

All segments will be provided for all regions and countries covered

• 6.2.Europe
  • 6.2.1.Germany
  • 6.2.2.France
  • 6.2.3.Italy
  • 6.2.4.United Kingdom
  • 6.2.5.Russia
  • 6.2.6.Netherlands
  • 6.2.7.Spain
  • 6.2.8.Turkey
  • 6.2.9.Poland
• 6.3.Asia-Pacific
  • 6.3.1.India
  • 6.3.2.China
  • 6.3.3.Japan
  • 6.3.4.Australia
  • 6.3.5.Vietnam
  • 6.3.6.South Korea
  • 6.3.7.Indonesia
  • 6.3.8.Philippines
• 6.4.South America
  • 6.4.1.Brazil
  • 6.4.2.Argentina
• 6.5.Middle East and Africa
  • 6.5.1.Saudi Arabia
  • 6.5.2.UAE
  • 6.5.3.South Africa

7.Market Mapping, 2023

• 7.1.By Type
• 7.2.By Application
• 7.3.By Device Type
• 7.4.By Industry
• 7.5.By Region

8.Macro Environment and Industry Structure

• 8.1.Demand Supply Analysis
• 8.2.Import Export Analysis
• 8.3.Value Chain Analysis
• 8.4.PESTEL Analysis
  • 8.4.1.Political Factors
  • 8.4.2.Economic System
  • 8.4.3.Social Implications
  • 8.4.4.Technological Advancements
  • 8.4.5.Environmental Impacts
  • 8.4.6.Legal Compliances and Regulatory Policies (Statutory Bodies Included)
• 8.5.Porter's Five Forces Analysis
  • 8.5.1.Supplier Power
  • 8.5.2.Buyer Power
  • 8.5.3.Substitution Threat
  • 8.5.4.Threat From New Entrant
  • 8.5.5.Competitive Rivalry

9.Market Dynamics

• 9.1.Growth Drivers
• 9.2.Growth Inhibitors (Challenges and Restraints)

10.Key Players Landscape

• 10.1.Competition Matrix of Top Five Market Leaders
• 10.2.Market Revenue Analysis of Top Five Market Leaders (in %, 2023)
• 10.3.Mergers and Acquisitions/Joint Ventures (If Applicable)
• 10.4.SWOT Analysis (For Five Market Players)
• 10.5.Patent Analysis (If Applicable)

11.Case Studies

12.Key Players Outlook

• 12.1.TTM Technologies
  • 12.1.1.Company Details
  • 12.1.2.Key Management Personnel
  • 12.1.3.Products and Services
  • 12.1.4.Financials (As reported)
  • 12.1.5.Key Market Focus and Geographical Presence
  • 12.1.6.Recent Developments
• 12.2.Schweizer Electronic AG
• 12.3.Rogers Corporation
• 12.4.Multi-Fineline Electronix
• 12.5.Chin Poon Industrial Company Limited
• 12.6.Ventec International Group Ltd.
• 12.7.Nippon Mektron

Companies mentioned above DO NOT hold any order as per market share and can be changed as per information available during research work.

13.Strategic Recommendations

14.About Us & Disclaimer