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세계의 IC 디바이스용 기존 및 첨단 패키징 시장 : 세계의 IC 패키징 산업에 관한 종합 보고서

The Worldwide Conventional and Advanced Packaging Market for IC Devices: The Most Comprehensive Report Available on the Global IC Packaging Industry

리서치사 New Venture Research
발행일 2019년 12월 상품 코드 926854
페이지 정보 영문 385 Pages
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세계의 IC 디바이스용 기존 및 첨단 패키징 시장 : 세계의 IC 패키징 산업에 관한 종합 보고서 The Worldwide Conventional and Advanced Packaging Market for IC Devices: The Most Comprehensive Report Available on the Global IC Packaging Industry
발행일 : 2019년 12월 페이지 정보 : 영문 385 Pages

본 상품은 영문 자료로 한글과 영문목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

IC 시장은 2023년까지 4,250억 달러에 달할 것으로 예측됩니다.

세계의 IC(집적회로) 시장 및 IC용으로 개발된 많은 패키징 설계에 대해 조사했으며, IC 디바이스 종류별·패키징 카테고리별 출하량·매출·패키지 가격 예측에 의한 정량 분석, 첨단 IC 패키징 시장 및 상호 접속 솔루션 분석과 예측 등을 제공합니다.

제1장 서론

제2장 주요 요약

제3장 IC 디바이스 시장 분석

  • 세계의 IC 시장
  • 시장 예측 : 디바이스 종류별
  • 프로세서 디바이스 : MPU, MCU(4-bit, 8-bit, 16-bit, 32+-bit), DSP
  • 메모리 디바이스 : DRAM, SRAM, Flash, ROM/EPROM, EEPROM 및 기타
  • 로직 디바이스 : 디지털 바이폴러 디바이스, 표준 로직, 게이트 어레이, 스탠다드 셀 및 PLD, 디스플레이 드라이버 및 터치스크린 컨트롤러, 전용 로직(소비자, 컴퓨터, 통신, 자동차, 다목적 등)
  • 아날로그 디바이스 : 앰프 및 콤퍼레이터, 인터페이스, 전압 레귤레이터 및 레퍼런스, 데이터 컨버터, 특수 용도 아날로그(소비자, 컴퓨터, 통신, 자동차, 산업용 등)

제4장 IC 패키징 시장 분석

  • 세계의 IC 패키징 시장
  • IC 패키징 패밀리 설명과 예측

제5장 첨단 패키징 시장

  • 첨단 IC 패키징 시장 전체 예측
  • FOWLP(Fan Out Wafer Level Package)
  • Multi-Row QFN 패키징 동향과 예측
  • MCP(Multichip Packaging) 기술 개요
  • 스택형 멀티칩 패키징 시장 부문
  • 시스템 인 패키지 시장 부문

제6장 상호 접속 기술 및 솔루션

  • 상호 접속 기술 개요
  • 상호 접속 시장 예측
  • 와이어 본딩
  • 플립 칩
  • 플립 칩 패키징 시장 동향과 예측
  • 플립 칩 패키징 디바이스 시장 동향과 예측
  • 베어 다이 플립 칩 시장 동향과 예측
  • TSV(Si 관통 전극)

부록 : IC 패키징 용어집

KSM 20.03.13

Report Highlights

Worldwide Integrated Circuit Market Forecasts, 2018-2023:

  • By Device Type and Function
  • By Packaging Type
  • By Major World Region

Worldwide IC Packaging Market Forecasts, 2018-2023:

  • By Package Type
  • By IC Type
  • By I/O Range

Advanced Packaging Market Forecasts, 2018-2023:

  • For Fan-Out WLPs
  • For Multi-Row QFNs
  • For Stacked Multi-Chip Packaging
  • For System-in-Package Solutions

Interconnection Technologies Forecasts, 2018-2023:

  • For Wire Bonding by IC Packaging Type
  • For Flip Chip by IC Device Type and Packaging Type
  • For Through-Silicon Vias

Synopsis

‘The Worldwide Conventional and Advanced Packaging Market for IC Devices, 2019 Edition, a new report from New Venture Research (NVR) ’, examines the global marketplace of integrated circuits (ICs) and the many packaging designs developed for ICs. This comprehensive report presents detailed analysis of a vast and vibrant IC market that is expected to reach $425 billion by 2023. The 385-page report provides insightful analysis of major market trends affecting the IC industry, and presents more than 170 tables quantifying both the IC devices and IC packaging markets. In addition, dozens of graphical figures provide an alternative perspective for understanding the underlying data. The report provides extensive and detailed quantitative analysis with forecasts for unit shipments, revenues and package pricing for 30 separate IC device types as well as 14 major packaging categories comprising 44 IC packaging market segments.

Also covered are advanced IC packaging market segments and interconnection solutions. Virtually every table presents year-end data for 2018, plus five-year forecasts from 2019 through 2023.

The report is arranged into six chapters. An Introductory chapter (Chapter 1) and the Executive Summary (Chapter 2) present a short overview of the report with a description of its major conclusions and methodology. The remaining chapters focus on four major topics of discussion.

Chapter 3, Integrated Circuit Device Market Analysis, starts with a top-level view of the IC devices market with tables and figures detailing the market in terms of 30 distinct IC devices, plus additional segmentation by device functions (processors, logic, memory and analog), and major world regions. The chapter then presents unit shipment and revenue forecasts of each device type in terms of the packaging types used for each.

Worldwide IC Device Revenues, by Function, 2018-2023

Chapter 4, IC Packaging Market Analysis, examines the IC packaging market in deep granular detail. Tables provide historical data and forecasts of unit shipments, revenues and package ASP for 14 packaging "families" with additional segmentation based on the number of I/Os for the packaging types. Altogether, there are 44 market segments analyzed, each in terms of the IC devices embedded in the package.

Chapter 5: Advanced Packaging Markets, provides an in-depth discussion of the technologies and market trends of advanced packaging solutions:

  • Fan-out wafer-level packaging (FOWLP)
  • Multi-row QFN packaging (MRQFN)
  • Vertically stacked multichip packages: TSOPs, QFNs, FBGAs, and WLPs
  • System-in-packages (SiPs): package-on-packages, packagein-packages and multichip modules

Chapter 6: Interconnection Technologies and Solutions, provides a comprehensive examination of wire bonding and flip chip technology, in terms of both unit shipments and revenues. The analysis of flip chip markets includes forecasts of specific devices and packaging types. The chapter also examines the market potential of through-silicon vias (TSVs) for 2.5D and 3D packaging.

‘The Worldwide Conventional and Advanced Packaging Market for IC Devices, 2019 Edition’ continues NVR's leadership position in analyzing IC device markets and IC packaging products and technologies. This report is an effective and economical tool for any company interested in competing in the semiconductor industry or who may be simply looking for an aid in assessing the present and future of this dynamic industry.

About The Author

Jerry Watkins is an independent senior analyst with more than 20 years of direct experience in the field of market research and consulting. He has worked for leading research companies such as Frost & Sullivan, Lucid Information Services, and NSI Research, both in management and as a writer. Mr. Watkins has authored many syndicated reports, previously in the telecommunications and office automation sectors and more recently in the semiconductor industry, writing on subjects that include IC packaging and merchant embedded computing. He holds two university degrees, including a B.A. in History and an M.A. in International Studies, but he feels that market research best fulfills his lifelong passion for inquiry into difficult subject matter and making it comprehensible to a wide audience. Mr. Watkins has lived and worked in Silicon Valley for most of his career.

Table of Contents

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Integrated Circuit Device Market Analysis

  • Worldwide Integrated Circuit Market
    • Total Market Forecasts
    • Regional Market Trends and Forecasts
  • Market Forecasts by Device Type
  • Processor Devices: MPUs, MCUs (4-bit, 8-bit, 16-bit, 32+-bit), DSPs
  • Memory Devices: DRAM, SRAM, Flash, ROM/EPROM, EEPROM and Other
  • Logic Devices: Digital Bipolar Devices, Standard Logic, Gate Arrays, Standard Cell and PLDs, Display Drivers and Touch Screen Controllers, Special-Purpose Logic (Consumer, Computers, Communications, Automotive, Multipurpose and Other)
  • Analog Devices: Amplifiers and Comparators, Interfaces, Voltage Regulators and References, Data Converters, Application-Specific Analog (Consumer, Computers, Communications, Automotive, Industrial and Other)

Chapter 4: IC Packaging Market Analysis

  • Worldwide IC Packaging Market
    • Total IC Packaging Market Forecasts
    • Package Pricing Trends
    • IC Packaging Market by I/O Count
  • IC Package Families Descriptions and Forecasts
    • Dual In-Line Packaging (DIP) Market
    • Transistor Outline Packaging (TO) Market
    • Small Outline Transistor (SOT) Packaging Market
    • Small Outline Packaging (SO) Market
    • Thin Small Outline Packaging (TSOP) Market
    • Chip Carrier (CC) Market
    • Quad Flat Pack (QFP) Market
    • Dual Flat Pack No-Lead Packaging (DFN) Market
    • Quad Flat Pack No-Lead Packaging (QFN) Market
    • Pin Grid Array Packaging (PGA) Market
    • Ball Grid Array Packaging (BGA) Market
    • Fine Pitch Ball Grid Array Packaging (FBGA) Market
    • Wafer-Level Packaging (WLP) Market
    • Direct Chip Attached (DCA) Market

Chapter 5: Advanced Packaging Markets

  • Total Advanced IC Packaging Market Forecasts
  • Fan-Out Wafer-Level Packaging
    • Conventional WLPs versus Fan-Out WLPs
    • Fan-Out WLP Market Trends and Forecasts
  • Multi-Row QFN Packaging Trends and Forecasts
  • Overview of Multichip Packaging Technology (MCP)
    • Topic covers: Types of Multichip Packages, Benefits and Shortcomings,Multichip Packaging Challenges and Solutions, Techniques for Wafer Thinning
    • MCP Total Forecasts
  • Stacked Multichip Packaging Market Segments
    • Stacked TSOP Market Trends and Forecasts
    • Stacked QFN Market Trends and Forecasts
    • FBGA Market Trends and Forecasts
    • Stacked WLP Market Trends and Forecasts
  • System-in-Package Market Segments
    • Total SiP Market Trends and Forecasts
    • Package-on-Package Market Forecasts
    • Package-in-Package Market Forecasts
    • Multichip Modules Market Forecasts
    • Stacked WLPs within SiPs Market Forecasts

Chapter 6: Interconnection Technologies and Solutions

  • Interconnection Technologies Overview
  • Interconnection Market Forecasts
  • Wire Bonding
    • Wire Bonding Methods
    • Wire Materials
    • Wire Bonding Market Trends and Forecasts
  • Flip Chip
    • The Flip Chip Process
  • Flip Chip Packaging Market Trends and Forecasts
  • Flip Chip Package Device Market Trends and Forecasts
    • Flip Chip Devices: MPUs, 32+-bit MCUs, DSPs, Gate Arrays, Standard Cell and PLDs, Special-Purpose Logic (Consumer, Computer, Communications, Automotive, Multipurpose and Other), DRAM, SRAM, Flash, Application-Specific Analog (Computer, Communications)
  • Bare Die Flip Chip Market Trends and Forecasts
  • Through-Silicon Vias
    • Forecasts of the Through-Silicon Via Market Segment

Appendix Glossary of IC Packaging Terms

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