세계의 웨이퍼 그라인더 시장(2025-2035년)

Wafer Grinder Market Size, Share & Trends Analysis Report by Type (Wafer Surface Grinder, and Wafer Edge Grinder), and by Application (Silicon Wafer, SiC Wafer, Sapphire Wafer, and Compound Semiconductors) Forecast Period (2024-2031)

Industry Overview

Wafer grinder market is projected to reach $1,235 million in 2035, from $710 million in 2024, witnessing a CAGR of 5.9% during the forecast period (2025-2035). The demand for compact, high-performance electronics, such as smartphones and IoT devices, necessitates thinner semiconductor wafers. Advancements in semiconductor technology and advanced wafer grinding technologies are essential for meeting the standards. The growth of 5G and IoT applications, expansion in automotive and aerospace industries, and a growing focus on sustainability and energy efficiency are additionally driving the demand for precision wafer grinding solutions. Wafer grinders that support eco-friendly production are gaining traction.

Market Dynamics

Rising Demand for Semiconductors

The rise in electronic devices, 5G technology, and IoT applications has significantly boosted the demand for high-performance semiconductors, and thus the market for wafer-grinding equipment. According to the Semiconductor Industry Association, in March 2024, global semiconductor sales rebounded to $527 billion, with nearly 1 trillion sold. It is expected the high profitability bodes well with double-digit growth annually in the year 2024. Its demand is augmented by both increased investment and high profitability. The semiconductor manufacturing private investments have been committed in advance after the CHIPS and Science Act. The US increased its semiconductor manufacturing capacity by tripling in just the last ten years since the enactment of CHIPS and taking in 28% of the entire global capital spending.

Advanced Technology Integration

Advanced technology integration involves combining grinding units with platforms to enhance wafer thinning precision and production scalability. For instance, in November 2023, Tokyo Electron launched Ulucus G, a 300mm wafer thinning system. It combines grinding with the LITHIUS Pro Z platform, with a focus on the production of higher-quality silicon wafers using less labor in mass production. It incorporates a scrub cleaning unit, spin wet etch unit, and single-wafer processing units.

Market Segmentation

• Based on the type, the market is segmented into wafer surface grinders and wafer edge grinders.
• Based on the application, the market is segmented into silicon wafers, SiC wafers, sapphire wafers, and compound semiconductors.

The Silicon Wafer segment is projected to Hold the Largest Market Share

Silicon wafers are thin semiconductor-grade silicon slices utilized as the base for semiconductor devices and integrated circuits. The silicon wafer is manufactured via the process of polishing surfaces for microfabrication, slicing silicon crystals into wafers, and growing high-purity silicon crystals. Wafers are employed in microelectromechanical systems, optoelectronics, and photovoltaics, and play an important role in research and development.

Wafer Surface Grinder Segment to Hold a Considerable Market Share

Wafer surface grinders are devices that ensure wafer surfaces come out flat and smooth with minimum thickness deviation and can minimize surface roughness to adequately prepare wafers for later processes such as photolithography and etching. It usually comprises precision grinding wheels, advanced cooling systems, and can accommodate many sizes of wafers, and is used for surface planarization, reducing roughness, relieving stresses, and adhesion enhancement.

Regional Outlook

The global wafer grinder market is further segmented based on geography including North America (the US, and Canada), Europe (the UK, Germany, France, Italy, Spain, Germany, France, Russia, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, Australia and New Zealand, ASEAN Countries, and the Rest of Asia-Pacific), and the Rest of the World (the Middle East & Africa, and Latin America).

5G Technology Proliferation in the North America Region

The rapid growth of 5G technology is fostering an increase in demand for advanced semiconductors, especially precision wafer grinding for optimal device performance and energy efficiency. According to the 5G Americans, Org., in July 2024, the global adoption of 5G technology reached nearly two billion connections in Q1 2024, with 185 million new additions. North America emerges as the leader in 5G adoption with 32% of all wireless cellular connections. The region is additionally the growth driver, adding 22 million new connections to the operators' networks. Latin America showed growth in 4G LTE and 5G connections, with eight million new LTE connections and nine million new 5G connections, totaling 48 million 5G connections.

Asia-Pacific Holds Major Market Share

Asia-Pacific holds a significant share owing to the expansion of manufacturing capacity in Asia, particularly in China, Taiwan, and South Korea. According to the India Brand Equity Foundation (IBEF) by 2025, the Indian electronics manufacturing industry is anticipated to reach $520 billion, with a projected increase in demand for electronic products to $400 billion by FY25, up from $33 billion in FY20. The electronics system market is expected to grow 2.3 times from its FY19 size, reaching $160 billion by FY25. Electronic goods exports were $29.1 billion in FY24, up from $23.6 billion in FY23. The electronics design segment, growing at 20.1%, accounted for 22% of the ESDM market in FY19 and is expected to make 27% by FY25. As a major consumer electronics market in the Asia Pacific Region, India has significant expertise in electronic chip design and embedded software, aiming for $300 billion in electronics manufacturing and $120 billion in exports by 2025-26.

Market Players Outlook

The major companies serving the wafer grinder market include DISCO Corp., Ebara Corp., G&N GmbH, Infineon Technologies, Applied Material, Inc., Tokyo Electron Ltd., and others. The market players are increasingly focusing on business expansion and product development by applying strategies such as collaborations, mergers, and acquisitions to stay competitive in the market.

Recent Developments

• In July 2023, DISCO Corp. developed an optimized process using laser processing's ingot slicing method, KABRA, for the production of GaN wafers, which has increased wafer production and reduced production time.

The Report Covers:

• Market value data analysis of 2024 and forecast to 2035.
• Annualized market revenues ($ million) for each market segment.
• Country-wise analysis of major geographical regions.
• Key companies operating in the global wafer grinder market. Based on the availability of data, information related to new products, and relevant news is also available in the report.
• Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
• Analysis of market-entry and market expansion strategies.
• Competitive strategies by identifying 'who-stands-where' in the market.

Table of Contents

1. Report Summary

• Current Industry Analysis and Growth Potential Outlook
• Global Wafer Grinder Market Sales Analysis - Product Type| Offering | Application| End-User ($ Million)
• Wafer Grinder Market Sales Performance of Top Countries
• 1.1. Research Methodology
• Primary Research Approach
• Secondary Research Approach
• 1.2. Market Snapshot

2. Market Overview and Insights

• 2.1. Scope of the Study
• 2.2. Analyst Insight & Current Market Trends
  • 2.2.1. Key Wafer Grinder Industry Trends
  • 2.2.2. Market Recommendations
• 2.3. Porter's Five Forces Analysis for the Wafer Grinder Market
  • 2.3.1. Competitive Rivalry
  • 2.3.2. Threat of New Entrants
  • 2.3.3. Bargaining Power of Suppliers
  • 2.3.4. Bargaining Power of Buyers
  • 2.3.5. Threat of Substitutes

3. Market Determinants

• 3.1. Market Drivers
  • 3.1.1. Drivers For Global Wafer Grinder Market: Impact Analysis
• 3.2. Market Pain Points and Challenges
  • 3.2.1. Restraints For Global Wafer Grinder Market: Impact Analysis
• 3.3. Market Opportunities

4. Competitive Landscape

• 4.1. Competitive Dashboard - Wafer Grinder Market Revenue and Share by Manufacturers
• Wafer Grinder Product Comparison Analysis
• Top Market Player Ranking Matrix
• 4.2. Key Company Analysis
  • 4.2.1. DISCO Corp.
    • 4.2.1.1. Overview
    • 4.2.1.2. Product Portfolio
    • 4.2.1.3. Financial Analysis (Subject to Data Availability)
    • 4.2.1.4. SWOT Analysis
    • 4.2.1.5. Business Strategy
  • 4.2.2. Applied Materials, Inc.
    • 4.2.2.1. Overview
    • 4.2.2.2. Product Portfolio
    • 4.2.2.3. Financial Analysis (Subject to Data Availability)
    • 4.2.2.4. SWOT Analysis
    • 4.2.2.5. Business Strategy
    • 4.2.2.6.
  • 4.2.3. Ebara Corp.
    • 4.2.3.1. Overview
    • 4.2.3.2. Product Portfolio
    • 4.2.3.3. Financial Analysis (Subject to Data Availability)
    • 4.2.3.4. SWOT Analysis
    • 4.2.3.5. Business Strategy
  • 4.2.4. Tokyo Electron Ltd.
    • 4.2.4.1. Overview
    • 4.2.4.2. Product Portfolio
    • 4.2.4.3. Financial Analysis (Subject to Data Availability)
    • 4.2.4.4. SWOT Analysis
    • 4.2.4.5. Business Strategy
• 4.3. Top Winning Strategies by Market Players
  • 4.3.1. Merger and Acquisition
  • 4.3.2. Product Launch
  • 4.3.3. Partnership And Collaboration

5. Global Wafer Grinder Market by Type ($ Million)

• 5.1. Wafer Surface Grinder
• 5.2. Wafer Edge Grinder

6. Global Wafer Grinder Market by Application ($ Million)

• 6.1. Silicon Wafer
• 6.2. SiC Wafer
• 6.3. Sapphire Wafer
• 6.4. Compound Semiconductors

7. Regional Analysis

• 7.1. North American Wafer Grinder Market Sales Analysis -Type| Application | Country ($ Million)
• Macroeconomic Factors for North America
  • 7.1.1. United States
  • 7.1.2. Canada
• 7.2. European Wafer Grinder Market Sales Analysis -Type| Application | Country ($ Million)
• Macroeconomic Factors for European
  • 7.2.1. UK
  • 7.2.2. Germany
  • 7.2.3. Italy
  • 7.2.4. Spain
  • 7.2.5. France
  • 7.2.6. Russia
  • 7.2.7. Rest of Europe
• 7.3. Asia-Pacific Wafer Grinder Market Sales Analysis -Type| Application | Country ($ Million)
• Macroeconomic Factors for Asia-Pacific
  • 7.3.1. China
  • 7.3.2. Japan
  • 7.3.3. South Korea
  • 7.3.4. India
  • 7.3.5. Australia & New Zealand
  • 7.3.6. ASEAN Countries (Thailand, Indonesia, Vietnam, Singapore, And Other)
  • 7.3.7. Rest of Asia-Pacific
• 7.4. Rest of the World Wafer Grinder Market Sales Analysis -Type| Application | Country ($ Million)
• Macroeconomic Factors for the Rest of the World
  • 7.4.1. Latin America
  • 7.4.2. Middle East and Africa

8. Company Profiles

• 8.1. Applied Materials, Inc.
  • 8.1.1. Quick Facts
  • 8.1.2. Company Overview
  • 8.1.3. Product Portfolio
  • 8.1.4. Business Strategies
• 8.2. Chevalier Machinery, Inc.
  • 8.2.1. Quick Facts
  • 8.2.2. Company Overview
  • 8.2.3. Product Portfolio
  • 8.2.4. Business Strategies
• 8.3. Daitron Inc.
  • 8.3.1. Quick Facts
  • 8.3.2. Company Overview
  • 8.3.3. Product Portfolio
  • 8.3.4. Business Strategies
• 8.4. Datensicherheit Nord GmbH
  • 8.4.1. Quick Facts
  • 8.4.2. Company Overview
  • 8.4.3. Product Portfolio
  • 8.4.4. Business Strategies
• 8.5. Ebara Corp.
  • 8.5.1. Quick Facts
  • 8.5.2. Company Overview
  • 8.5.3. Product Portfolio
  • 8.5.4. Business Strategies
• 8.6. Engis Corp.
  • 8.6.1. Quick Facts
  • 8.6.2. Company Overview
  • 8.6.3. Product Portfolio
  • 8.6.4. Business Strategies
• 8.7. G&N GmbH
  • 8.7.1. Quick Facts
  • 8.7.2. Company Overview
  • 8.7.3. Product Portfolio
  • 8.7.4. Business Strategies
• 8.8. JTEKT Corp.
  • 8.8.1. Quick Facts
  • 8.8.2. Company Overview
  • 8.8.3. Product Portfolio
  • 8.8.4. Business Strategies
• 8.9. JOEN LIH MACHINERY CO., LTD.
  • 8.9.1. Quick Facts
  • 8.9.2. Company Overview
  • 8.9.3. Product Portfolio
  • 8.9.4. Business Strategies
• 8.10. KINIK Co.
  • 8.10.1. Quick Facts
  • 8.10.2. Company Overview
  • 8.10.3. Product Portfolio
  • 8.10.4. Business Strategies
• 8.11. Koyo Machinery
  • 8.11.1. Quick Facts
  • 8.11.2. Company Overview
  • 8.11.3. Product Portfolio
  • 8.11.4. Business Strategies
• 8.12. Kulicke and Soffa Industries, Inc.
  • 8.12.1. Quick Facts
  • 8.12.2. Company Overview
  • 8.12.3. Product Portfolio
  • 8.12.4. Business Strategies
• 8.13. Logitech Ltd.
  • 8.13.1. Quick Facts
  • 8.13.2. Company Overview
  • 8.13.3. Product Portfolio
  • 8.13.4. Business Strategies
• 8.14. Okamoto Machine Tool Works, Ltd.
  • 8.14.1. Quick Facts
  • 8.14.2. Company Overview
  • 8.14.3. Product Portfolio
  • 8.14.4. Business Strategies
• 8.15. Qingdao Gaoce Technology Co., Ltd.
  • 8.15.1. Quick Facts
  • 8.15.2. Company Overview
  • 8.15.3. Product Portfolio
  • 8.15.4. Business Strategies
• 8.16. Revasum
  • 8.16.1. Quick Facts
  • 8.16.2. Company Overview
  • 8.16.3. Product Portfolio
  • 8.16.4. Business Strategies
• 8.17. S3-Alliance
  • 8.17.1. Quick Facts
  • 8.17.2. Company Overview
  • 8.17.3. Product Portfolio
  • 8.17.4. Business Strategies
• 8.18. SpeedFam Co. Ltd.
  • 8.18.1. Quick Facts
  • 8.18.2. Company Overview
  • 8.18.3. Product Portfolio
  • 8.18.4. Business Strategies
• 8.19. Tokyo Electron Ltd.
  • 8.19.1. Quick Facts
  • 8.19.2. Company Overview
  • 8.19.3. Product Portfolio
  • 8.19.4. Business Strategies
• 8.20. Tokyo Seimitsu Co., Ltd.
  • 8.20.1. Quick Facts
  • 8.20.2. Company Overview
  • 8.20.3. Product Portfolio
  • 8.20.4. Business Strategies
• 8.21. WAIDA MFG. Co., Ltd.
  • 8.21.1. Quick Facts
  • 8.21.2. Company Overview
  • 8.21.3. Product Portfolio
  • 8.21.4. Business Strategies