전자제품용 PUR 접착제 시장 : 세계 산업 분석, 규모, 점유율, 성장, 동향, 예측(2025-2032년)

Persistence Market Research has recently published an extensive report on the global PUR Adhesives in Electronics Market. This report offers a comprehensive analysis of the key market dynamics, including drivers, trends, opportunities, and challenges, providing deep insights into the market structure.

Key Insights:

• PUR Adhesives in Electronics Market Size (2025E): USD 4360.6 Mn
• Projected Market Value (2032F): USD 6568.9 Mn
• Global Market Growth Rate (CAGR 2025 to 2032): 6.0%

PUR Adhesives in Electronics Market - Report Scope:

The PUR Adhesives in Electronics Market encompasses a range of reactive polyurethane adhesives used for bonding, encapsulation, and sealing applications in electronic components. These adhesives offer excellent mechanical strength, moisture resistance, and thermal stability, making them suitable for applications in consumer electronics, automotive electronics, and industrial electronics. The market serves diverse segments such as circuit boards, sensors, semiconductors, and display panels. Growth is driven by the increasing demand for miniaturized and high-performance electronic devices, advancements in adhesive formulations, and the expanding application of PUR adhesives in critical electronic assembly processes.

Market Growth Drivers:

Several key factors are driving the global PUR Adhesives in Electronics Market. The rising demand for durable and flexible adhesives in electronic device manufacturing is significantly contributing to market growth. The shift toward lightweight and compact electronic components has increased the use of PUR adhesives due to their superior bonding capabilities and resistance to environmental factors. Technological advancements in smart electronics, 5G infrastructure, and electric vehicles (EVs) have further expanded the scope of PUR adhesives in high-performance applications. Additionally, the growing emphasis on sustainability and eco-friendly adhesives has led to the development of solvent-free and low-VOC PUR adhesives, enhancing their adoption in various industries.

Market Restraints:

Despite promising growth prospects, the PUR Adhesives in Electronics Market faces challenges related to high material costs and processing complexities. The requirement for specialized curing conditions and precise application techniques can increase production costs. Additionally, competition from alternative adhesive technologies, such as epoxy and silicone-based adhesives, may limit market penetration. Concerns regarding the long-term stability of PUR adhesives in high-temperature applications and regulatory compliance with environmental standards further add to the challenges. Addressing these issues requires continuous investment in research and technological advancements to enhance adhesive performance and cost-effectiveness.

Market Opportunities:

The market presents significant opportunities driven by the increasing demand for high-reliability adhesives in advanced electronic applications. The development of next-generation PUR adhesives with enhanced thermal conductivity and electrical insulation properties caters to the need for high-performance electronic assemblies. The expansion of the Internet of Things (IoT), wearable technology, and flexible electronics provides new growth avenues for PUR adhesives, particularly in high-density circuit boards and smart devices. Strategic collaborations, investments in automation, and the introduction of bio-based PUR adhesives are essential for capitalizing on emerging opportunities and maintaining market leadership.

Key Questions Answered in the Report:

• What are the primary factors driving the growth of the PUR Adhesives in Electronics Market globally?
• Which adhesive formulations and technologies are leading the adoption in various applications?
• How are technological advancements influencing the competitive landscape of the PUR Adhesives in Electronics Market?
• Who are the key players in the PUR Adhesives in Electronics Market, and what strategies are they employing to stay competitive?
• What are the emerging trends and future prospects in the global PUR Adhesives in Electronics Market?

Competitive Intelligence and Business Strategy:

Leading players in the global PUR Adhesives in Electronics Market, including Henkel AG & Co. KGaA, 3M Company, H.B. Fuller Company, and Sika AG, focus on innovation, product differentiation, and strategic collaborations to gain a competitive edge. These companies invest in R&D to develop advanced adhesive solutions with improved thermal stability, electrical insulation, and sustainability attributes. Collaborations with electronics manufacturers, material scientists, and research institutions facilitate market access and promote new technology adoption. Emphasis on automation, sustainable manufacturing practices, and advanced adhesive application techniques fosters market growth and enhances brand reputation in the evolving PUR Adhesives in Electronics Market landscape.

Key Companies Profiled:

• Henkel AG & Co. KGaA
• 3M
• H.B Fuller
• Dow Chemical Company
• Sika AG
• Avery Dennison
• Master Bond Inc.
• Lord Corporation
• Huntsman Corporation
• Permabond
• DELO Industries Adhesives
• Panacol
• ITW Polymers Adhesives

PUR Adhesives in Electronics Market Research Segmentation

By Component Type:

• Thermal Conductive
• Electrically Conductive
• UV Curing
• Others

By Application:

• Surface-mount devices
• Potting & Encapsulation
• Conformal Coatings
• Others

By Region:

• North America
• Europe
• East Asia
• South Asia & Oceania
• Latin America
• Middle East & Africa

Table of Contents

1. Executive Summary

• 1.1. Global PUR Adhesives in Electronics Market Snapshot, 2025 - 2032
• 1.2. Market Opportunity Assessment, 2025 - 2032, US$ Mn
• 1.3. Key Market Trends
• 1.4. Future Market Projections
• 1.5. Premium Market Insights
• 1.6. Industry Developments and Key Market Events
• 1.7. PMR Analysis and Recommendations

2. Market Overview

• 2.1. Market Scope and Definition
• 2.2. Market Dynamics
  • 2.2.1. Drivers
  • 2.2.2. Restraints
  • 2.2.3. Opportunity
  • 2.2.4. Challenges
  • 2.2.5. Key Trends
• 2.3. Component Type Lifecycle Analysis
• 2.4. PUR Adhesives in Electronics Market: Value Chain
  • 2.4.1. List of Raw Material Supplier
  • 2.4.2. List of Manufacturers
  • 2.4.3. List of Distributors
  • 2.4.4. List of Applications
  • 2.4.5. Profitability Analysis
• 2.5. Porter Five Force's Analysis
• 2.6. Geopolitical Tensions: Market Impact
• 2.7. Macro-Economic Factors
  • 2.7.1. Global Sectorial Outlook
  • 2.7.2. Global GDP Growth Outlook
  • 2.7.3. Global Parent Market Overview
• 2.8. Forecast Factors - Relevance and Impact
• 2.9. Regulatory and Technology Landscape

3. Global PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

• 3.1. Key Highlights
  • 3.1.1. Market Volume (Units) Projections
  • 3.1.2. Market Size and Y-o-Y Growth
  • 3.1.3. Absolute $ Opportunity
• 3.2. Market Size (US$ Mn) Analysis and Forecast
  • 3.2.1. Historical Market Size Analysis, 2019 - 2023
  • 3.2.2. Current Market Size Forecast, 2025 - 2032
• 3.3. Global PUR Adhesives in Electronics Market Outlook: Component Type
  • 3.3.1. Introduction / Key Findings
  • 3.3.2. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Component Type, 2019 - 2023
  • 3.3.3. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
    • 3.3.3.1. Thermal Conductive
    • 3.3.3.2. Electrically Conductive
    • 3.3.3.3. UV Curing
    • 3.3.3.4. Others
• 3.4. Market Attractiveness Analysis: Component Type
• 3.5. Global PUR Adhesives in Electronics Market Outlook: Application
  • 3.5.1. Introduction / Key Findings
  • 3.5.2. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Application, 2019 - 2023
  • 3.5.3. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
    • 3.5.3.1. Surface-mount devices
    • 3.5.3.2. Potting & Encapsulation
    • 3.5.3.3. Conformal Coatings
    • 3.5.3.4. Others
• 3.6. Market Attractiveness Analysis: Application

4. Global PUR Adhesives in Electronics Market Outlook: Region

• 4.1. Key Highlights
• 4.2. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Region, 2019 - 2023
• 4.3. Current Market Size (US$ Mn) and Volume (Units) Forecast By Region, 2025 - 2032
  • 4.3.1. North America
  • 4.3.2. Europe
  • 4.3.3. East Asia
  • 4.3.4. South Asia and Oceania
  • 4.3.5. Latin America
  • 4.3.6. Middle East & Africa (MEA)
• 4.4. Market Attractiveness Analysis: Region

5. North America PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

• 5.1. Key Highlights
• 5.2. Pricing Analysis
• 5.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
  • 5.3.1. By Country
  • 5.3.2. By Component Type
  • 5.3.3. By Application
• 5.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
  • 5.4.1. U.S.
  • 5.4.2. Canada
• 5.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
  • 5.5.1. Thermal Conductive
  • 5.5.2. Electrically Conductive
  • 5.5.3. UV Curing
  • 5.5.4. Others
• 5.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
  • 5.6.1. Surface-mount devices
  • 5.6.2. Potting & Encapsulation
  • 5.6.3. Conformal Coatings
  • 5.6.4. Others
• 5.7. Market Attractiveness Analysis

6. Europe PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

• 6.1. Key Highlights
• 6.2. Pricing Analysis
• 6.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
  • 6.3.1. By Country
  • 6.3.2. By Component Type
  • 6.3.3. By Application
• 6.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
  • 6.4.1. Germany
  • 6.4.2. France
  • 6.4.3. U.K.
  • 6.4.4. Italy
  • 6.4.5. Spain
  • 6.4.6. Russia
  • 6.4.7. Turkey
  • 6.4.8. Rest of Europe
• 6.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
  • 6.5.1. Thermal Conductive
  • 6.5.2. Electrically Conductive
  • 6.5.3. UV Curing
  • 6.5.4. Others
• 6.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
  • 6.6.1. Surface-mount devices
  • 6.6.2. Potting & Encapsulation
  • 6.6.3. Conformal Coatings
  • 6.6.4. Others
• 6.7. Market Attractiveness Analysis

7. East Asia PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

• 7.1. Key Highlights
• 7.2. Pricing Analysis
• 7.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
  • 7.3.1. By Country
  • 7.3.2. By Component Type
  • 7.3.3. By Application
• 7.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
  • 7.4.1. China
  • 7.4.2. Japan
  • 7.4.3. South Korea
• 7.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
  • 7.5.1. Thermal Conductive
  • 7.5.2. Electrically Conductive
  • 7.5.3. UV Curing
  • 7.5.4. Others
• 7.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
  • 7.6.1. Surface-mount devices
  • 7.6.2. Potting & Encapsulation
  • 7.6.3. Conformal Coatings
  • 7.6.4. Others
• 7.7. Market Attractiveness Analysis

8. South Asia & Oceania PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

• 8.1. Key Highlights
• 8.2. Pricing Analysis
• 8.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
  • 8.3.1. By Country
  • 8.3.2. By Component Type
  • 8.3.3. By Application
• 8.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
  • 8.4.1. India
  • 8.4.2. Southeast Asia
  • 8.4.3. ANZ
  • 8.4.4. Rest of South Asia & Oceania
• 8.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
  • 8.5.1. Thermal Conductive
  • 8.5.2. Electrically Conductive
  • 8.5.3. UV Curing
  • 8.5.4. Others
• 8.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
  • 8.6.1. Surface-mount devices
  • 8.6.2. Potting & Encapsulation
  • 8.6.3. Conformal Coatings
  • 8.6.4. Others
• 8.7. Market Attractiveness Analysis

9. Latin America PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

• 9.1. Key Highlights
• 9.2. Pricing Analysis
• 9.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
  • 9.3.1. By Country
  • 9.3.2. By Component Type
  • 9.3.3. By Application
• 9.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
  • 9.4.1. Brazil
  • 9.4.2. Mexico
  • 9.4.3. Rest of Latin America
• 9.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
  • 9.5.1. Thermal Conductive
  • 9.5.2. Electrically Conductive
  • 9.5.3. UV Curing
  • 9.5.4. Others
• 9.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
  • 9.6.1. Surface-mount devices
  • 9.6.2. Potting & Encapsulation
  • 9.6.3. Conformal Coatings
  • 9.6.4. Others
• 9.7. Market Attractiveness Analysis

10. Middle East & Africa PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

• 10.1. Key Highlights
• 10.2. Pricing Analysis
• 10.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
  • 10.3.1. By Country
  • 10.3.2. By Component Type
  • 10.3.3. By Application
• 10.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
  • 10.4.1. GCC
  • 10.4.2. Egypt
  • 10.4.3. South Africa
  • 10.4.4. Northern Africa
  • 10.4.5. Rest of Middle East & Africa
• 10.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
  • 10.5.1. Thermal Conductive
  • 10.5.2. Electrically Conductive
  • 10.5.3. UV Curing
  • 10.5.4. Others
• 10.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
  • 10.6.1. Surface-mount devices
  • 10.6.2. Potting & Encapsulation
  • 10.6.3. Conformal Coatings
  • 10.6.4. Others
• 10.7. Market Attractiveness Analysis

11. Competition Landscape

• 11.1. Market Share Analysis, 2024
• 11.2. Market Structure
  • 11.2.1. Competition Intensity Mapping By Market
  • 11.2.2. Competition Dashboard
  • 11.2.3. Apparent Product Capacity
• 11.3. Company Profiles (Details - Overview, Financials, Strategy, Recent Developments)
  • 11.3.1. Henkel AG & Co. KGaA
    • 11.3.1.1. Overview
    • 11.3.1.2. Segments and Product
    • 11.3.1.3. Key Financials
    • 11.3.1.4. Market Developments
    • 11.3.1.5. Market Strategy
  • 11.3.2. 3M
    • 11.3.2.1. Overview
    • 11.3.2.2. Segments and Product
    • 11.3.2.3. Key Financials
    • 11.3.2.4. Market Developments
    • 11.3.2.5. Market Strategy
  • 11.3.3. H.B Fuller
    • 11.3.3.1. Overview
    • 11.3.3.2. Segments and Product
    • 11.3.3.3. Key Financials
    • 11.3.3.4. Market Developments
    • 11.3.3.5. Market Strategy
  • 11.3.4. Dow Chemical Company
    • 11.3.4.1. Overview
    • 11.3.4.2. Segments and Product
    • 11.3.4.3. Key Financials
    • 11.3.4.4. Market Developments
    • 11.3.4.5. Market Strategy
  • 11.3.5. Sika AG
    • 11.3.5.1. Overview
    • 11.3.5.2. Segments and Product
    • 11.3.5.3. Key Financials
    • 11.3.5.4. Market Developments
    • 11.3.5.5. Market Strategy
  • 11.3.6. Avery Dennison
    • 11.3.6.1. Overview
    • 11.3.6.2. Segments and Product
    • 11.3.6.3. Key Financials
    • 11.3.6.4. Market Developments
    • 11.3.6.5. Market Strategy
  • 11.3.7. Master Bond Inc.
    • 11.3.7.1. Overview
    • 11.3.7.2. Segments and Product
    • 11.3.7.3. Key Financials
    • 11.3.7.4. Market Developments
    • 11.3.7.5. Market Strategy
  • 11.3.8. Lord Corporation
    • 11.3.8.1. Overview
    • 11.3.8.2. Segments and Product
    • 11.3.8.3. Key Financials
    • 11.3.8.4. Market Developments
    • 11.3.8.5. Market Strategy
  • 11.3.9. Huntsman Corporation
    • 11.3.9.1. Overview
    • 11.3.9.2. Segments and Product
    • 11.3.9.3. Key Financials
    • 11.3.9.4. Market Developments
    • 11.3.9.5. Market Strategy
  • 11.3.10. Permabond
    • 11.3.10.1. Overview
    • 11.3.10.2. Segments and Product
    • 11.3.10.3. Key Financials
    • 11.3.10.4. Market Developments
    • 11.3.10.5. Market Strategy
  • 11.3.11. DELO Industries Adhesives
    • 11.3.11.1. Overview
    • 11.3.11.2. Segments and Product
    • 11.3.11.3. Key Financials
    • 11.3.11.4. Market Developments
    • 11.3.11.5. Market Strategy
  • 11.3.12. Panacol
    • 11.3.12.1. Overview
    • 11.3.12.2. Segments and Product
    • 11.3.12.3. Key Financials
    • 11.3.12.4. Market Developments
    • 11.3.12.5. Market Strategy
  • 11.3.13. ITW Polymers Adhesives
    • 11.3.13.1. Overview
    • 11.3.13.2. Segments and Product
    • 11.3.13.3. Key Financials
    • 11.3.13.4. Market Developments
    • 11.3.13.5. Market Strategy

12. Appendix

H12.1. Research Methodology

H12.2. Research Assumptions

H12.3. Acronyms and Abbreviations