세계의 팹리스 IC 설계 시장 인사이트 및 예측(-2030년)

The global Fabless IC Design market is projected to grow from US$ 258.6 billion in 2024 to US$ 546.9 billion by 2030, at a Compound Annual Growth Rate (CAGR) of 13.29% during the forecast period.

Based on the location of company headquarters, American companies hold a share about 71% of global Fabless IC market in 2023, key American IC design houses are NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), Marvell Technology Group, Monolithic Power Systems, Inc. (MPS), Cirrus Logic, Inc., Synaptics, Allegro MicroSystems, and Semtech, etc. China Taiwan IC design houses have a share about 14.5% in 2023, key enterprises include MediaTek, Novatek Microelectronics Corp., Realtek Semiconductor Corporation, Himax Technologies, Global Unichip Corporation (GUC), Silicon Motion, Raydium, Silergy, Alchip Technologies, FocalTech, and Elite Semiconductor Microelectronics Technology, etc. Chinese Fabless IC design houses also play important roles, in 2023, companies headquartered in China hold about 7% of global.

The global key companies of Fabless IC Design include NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, Marvell Technology Group, Novatek Microelectronics Corp., Tsinghua Unigroup, and Realtek Semiconductor Corporation, etc. In 2023, the global top 35 Fabless IC Design houses had a share approximately 90% in terms of revenue.

Report Includes

This report presents an overview of global market for Fabless IC Design market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.

This report researches the key producers of Fabless IC Design, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for Fabless IC Design, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East & Africa, and Other Countries.

This report focuses on the Fabless IC Design revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global Fabless IC Design market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.

This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Fabless IC Design revenue, projected growth trends, production technology, application and end-user industry.

Descriptive company profiles of the major global players, including NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, Marvell Technology Group, Novatek Microelectronics Corp., Tsinghua Unigroup, and Realtek Semiconductor Corporation, etc.

Market Segmentation

By Company

NVIDIA

Qualcomm

Broadcom

Advanced Micro Devices. (AMD)

MediaTek

Marvell Technology Group

Novatek Microelectronics Corp.

Tsinghua Unigroup

Realtek Semiconductor Corporation

OmniVision Technology, Inc

Monolithic Power Systems. (MPS)

Cirrus Logic, Inc.

Socionext Inc.

LX Semicon

HiSilicon Technologies

Synaptics

Allegro MicroSystems

Himax Technologies

Semtech

Global Unichip Corporation (GUC)

Hygon Information Technology

GigaDevice

Silicon Motion

Ingenic Semiconductor

Raydium

Goodix Limited

Sitronix

Nordic Semiconductor

Silergy

Shanghai Fudan Microelectronics

Alchip Technologies

FocalTech

MegaChips Corporation

Elite Semiconductor

SGMICRO

Segment by Type

Analog ICs

Logic ICs

Microcontroller and Microprocessor ICs

Memory ICs

Segment by Application

Mobile Devices

PCs

Automotive

Industrial & Medical

Servers

Network Infrastructure

Appliances/Consumer Goods

Others

By Region

North America

United States

Canada

Asia-Pacific

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

Europe

Germany

France

U.K.

Italy

Nordic Countries

Rest of Europe

Latin America

Mexico

Brazil

Middle East & Africa

Turkey

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Revenue of Fabless IC Design in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.

Chapter 3: Detailed analysis of Fabless IC Design companies' competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.

Chapter 7: Europe by Type, by Application and by country, revenue for each segment.

Chapter 8: China by Type, and by Application, revenue for each segment.

Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.

Chapter 10: Middle East & Africa by Type, by Application and by country, revenue for each segment.

Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Fabless IC Design revenue, gross margin, and recent development, etc.

Chapter 12: Analyst's Viewpoints/Conclusions

Table of Contents

• Table of Contents

1 Report Overview

• 1.1 Study Scope
• 1.2 Market Analysis by Type
  • 1.2.1 Global Fabless IC Design Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
  • 1.2.2 Analog ICs
  • 1.2.3 Logic ICs
  • 1.2.4 Microcontroller and Microprocessor ICs
  • 1.2.5 Memory ICs
• 1.3 Market by Application
  • 1.3.1 Global Fabless IC Design Market Share by Application: 2019 VS 2023 VS 2030
  • 1.3.2 Mobile Devices
  • 1.3.3 PCs
  • 1.3.4 Automotive
  • 1.3.5 Industrial & Medical
  • 1.3.6 Servers
  • 1.3.7 Network Infrastructure
  • 1.3.8 Appliances/Consumer Goods
  • 1.3.9 Others
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Global Growth Trends

• 2.1 Global Fabless IC Design Market Perspective (2019-2030)
• 2.2 Global Fabless IC Design Growth Trends by Region
  • 2.2.1 Global Fabless IC Design Market Size by Region: 2019 VS 2023 VS 2030
  • 2.2.2 Fabless IC Design Historic Market Size by Region (2019-2024)
  • 2.2.3 Fabless IC Design Forecasted Market Size by Region (2025-2030)
• 2.3 Global Fabless IC Design Revenue by Region (by Location of Company Headquarters)
  • 2.3.1 Global Fabless IC Design Market Size by Region: 2019 VS 2023 VS 2030 (by Location of Company Headquarters)
  • 2.3.2 Fabless IC Design Historic Market Size by Region (by Location of Company Headquarters) & (2019-2024)
  • 2.3.3 Fabless IC Design Forecasted Market Size by Region (2025-2030) & (by Location of Company Headquarters)
• 2.4 Fabless IC Design Market Dynamics
  • 2.4.1 Fabless IC Design Industry Trends
  • 2.4.2 Fabless IC Design Market Drivers
  • 2.4.3 Fabless IC Design Market Challenges
  • 2.4.4 Fabless IC Design Market Restraints

3 Competition Landscape by Key Players

• 3.1 Global Revenue Fabless IC Design by Players
  • 3.1.1 Global Fabless IC Design Revenue by Players (2019-2024)
  • 3.1.2 Global Fabless IC Design Revenue Market Share by Players (2019-2024)
• 3.2 Global Fabless IC Design Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
• 3.3 Global Fabless IC Design Market Concentration Ratio
  • 3.3.1 Global Fabless IC Design Market Concentration Ratio (CR5 and HHI)
  • 3.3.2 Global Top 10 and Top 5 Companies by Fabless IC Design Revenue in 2023
• 3.4 Global Key Players of Fabless IC Design Head office and Area Served
• 3.5 Global Key Players of Fabless IC Design, Product and Application
• 3.6 Global Key Players of Fabless IC Design, Establish Year
• 3.7 Mergers & Acquisitions, Expansion Plans

4 Fabless IC Design Breakdown Data by Type

• 4.1 Global Fabless IC Design Historic Market Size by Type (2019-2024)
• 4.2 Global Fabless IC Design Forecasted Market Size by Type (2025-2030)

5 Fabless IC Design Breakdown Data by Application

• 5.1 Global Fabless IC Design Historic Market Size by Application (2019-2024)
• 5.2 Global Fabless IC Design Forecasted Market Size by Application (2025-2030)

6 North America

• 6.1 North America Fabless IC Design Market Size (2019-2030)
• 6.2 North America Fabless IC Design Market Size by Type
  • 6.2.1 North America Fabless IC Design Market Size by Type (2019-2024)
  • 6.2.2 North America Fabless IC Design Market Size by Type (2025-2030)
  • 6.2.3 North America Fabless IC Design Market Share by Type (2019-2030)
• 6.3 North America Fabless IC Design Market Size by Application
  • 6.3.1 North America Fabless IC Design Market Size by Application (2019-2024)
  • 6.3.2 North America Fabless IC Design Market Size by Application (2025-2030)
  • 6.3.3 North America Fabless IC Design Market Share by Application (2019-2030)
• 6.4 North America Fabless IC Design Market Size by Country
  • 6.4.1 North America Fabless IC Design Market Size by Country: 2019 VS 2023 VS 2030
  • 6.4.2 North America Fabless IC Design Market Size by Country (2019-2024)
  • 6.4.3 North America Fabless IC Design Market Share by Country (2025-2030)
  • 6.4.4 United States
  • 6.4.5 Canada

7 Europe

• 7.1 Europe Fabless IC Design Market Size (2019-2030)
• 7.2 Europe Fabless IC Design Market Size by Type
  • 7.2.1 Europe Fabless IC Design Market Size by Type (2019-2024)
  • 7.2.2 Europe Fabless IC Design Market Size by Type (2025-2030)
  • 7.2.3 Europe Fabless IC Design Market Share by Type (2019-2030)
• 7.3 Europe Fabless IC Design Market Size by Application
  • 7.3.1 Europe Fabless IC Design Market Size by Application (2019-2024)
  • 7.3.2 Europe Fabless IC Design Market Size by Application (2025-2030)
  • 7.3.3 Europe Fabless IC Design Market Share by Application (2019-2030)
• 7.4 Europe Fabless IC Design Market Size by Country
  • 7.4.1 Europe Fabless IC Design Market Size by Country: 2019 VS 2023 VS 2030
  • 7.4.2 Europe Fabless IC Design Market Size by Country (2019-2024)
  • 7.4.3 Europe Fabless IC Design Market Size by Country (2025-2030)
  • 7.4.4 Germany
  • 7.4.5 France
  • 7.4.6 U.K.
  • 7.4.7 Italy
  • 7.4.8 Netherlands and Switzerland
  • 7.4.9 Nordic Countries

8 Asia Pacific

• 8.1 Asia Pacific Fabless IC Design Market Size (2019-2030)
• 8.2 Asia Pacific Fabless IC Design Market Size by Type
  • 8.2.1 Asia Pacific Fabless IC Design Market Size by Type (2019-2024)
  • 8.2.2 Asia Pacific Fabless IC Design Market Size by Type (2025-2030)
  • 8.2.3 Asia Pacific Fabless IC Design Market Share by Type (2019-2030)
• 8.3 Asia Pacific Fabless IC Design Market Size by Application
  • 8.3.1 Asia Pacific Fabless IC Design Market Size by Application (2019-2024)
  • 8.3.2 Asia Pacific Fabless IC Design Market Size by Application (2025-2030)
  • 8.3.3 Asia Pacific Fabless IC Design Market Share by Application (2019-2030)
• 8.4 Asia Pacific Fabless IC Design Market Size by Region
  • 8.4.1 Asia Pacific Fabless IC Design Market Size by Region: 2019 VS 2023 VS 2030
  • 8.4.2 Asia Pacific Fabless IC Design Market Size by Region (2019-2024)
  • 8.4.3 Asia Pacific Fabless IC Design Market Size by Region (2025-2030)
  • 8.4.4 China
  • 8.4.5 Japan
  • 8.4.6 South Korea
  • 8.4.7 China Taiwan
  • 8.4.8 Southeast Asia
  • 8.4.9 India

9 South America

• 9.1 South America Fabless IC Design Market Size (2019-2030)
• 9.2 South America Fabless IC Design Market Size by Type
  • 9.2.1 South America Fabless IC Design Market Size by Type (2019-2024)
  • 9.2.2 South America Fabless IC Design Market Size by Type (2025-2030)
  • 9.2.3 South America Fabless IC Design Market Share by Type (2019-2030)
• 9.3 South America Fabless IC Design Market Size by Application
  • 9.3.1 South America Fabless IC Design Market Size by Application (2019-2024)
  • 9.3.2 South America Fabless IC Design Market Size by Application (2025-2030)
  • 9.3.3 South America Fabless IC Design Market Share by Application (2019-2030)
• 9.4 South America Fabless IC Design Market Size by Country
  • 9.4.1 South America Fabless IC Design Market Size by Country: 2019 VS 2023 VS 2030
  • 9.4.2 South America Fabless IC Design Market Size by Country (2019-2024)
  • 9.4.3 South America Fabless IC Design Market Size by Country (2025-2030)
  • 9.4.4 Brazil

10 Middle East & Africa

• 10.1 Middle East & Africa Fabless IC Design Market Size (2019-2030)
• 10.2 Middle East & Africa Fabless IC Design Market Size by Type
  • 10.2.1 Middle East & Africa Fabless IC Design Market Size by Type (2019-2024)
  • 10.2.2 Middle East & Africa Fabless IC Design Market Size by Type (2025-2030)
  • 10.2.3 Middle East & Africa Fabless IC Design Market Share by Type (2019-2030)
• 10.3 Middle East & Africa Fabless IC Design Market Size by Application
  • 10.3.1 Middle East & Africa Fabless IC Design Market Size by Application (2019-2024)
  • 10.3.2 Middle East & Africa Fabless IC Design Market Size by Application (2025-2030)
  • 10.3.3 Middle East & Africa Fabless IC Design Market Share by Application (2019-2030)
• 10.4 Middle East & Africa Fabless IC Design Market Size by Country
  • 10.4.1 Middle East & Africa Fabless IC Design Market Size by Country: 2019 VS 2023 VS 2030
  • 10.4.2 Middle East & Africa Fabless IC Design Market Size by Country (2019-2024)
  • 10.4.3 Middle East & Africa Fabless IC Design Market Size by Country (2025-2030)
  • 10.4.4 Turkey
  • 10.4.5 Israel

11 Key Players Profiles

• 11.1 NVIDIA
  • 11.1.1 NVIDIA Company Details
  • 11.1.2 NVIDIA Business Overview
  • 11.1.3 NVIDIA Fabless IC Design Introduction
  • 11.1.4 NVIDIA Revenue in Fabless IC Design Business (2019-2024)
• 11.2 Qualcomm
  • 11.2.1 Qualcomm Company Details
  • 11.2.2 Qualcomm Business Overview
  • 11.2.3 Qualcomm Fabless IC Design Introduction
  • 11.2.4 Qualcomm Revenue in Fabless IC Design Business (2019-2024)
• 11.3 Broadcom
  • 11.3.1 Broadcom Company Details
  • 11.3.2 Broadcom Business Overview
  • 11.3.3 Broadcom Fabless IC Design Introduction
  • 11.3.4 Broadcom Revenue in Fabless IC Design Business (2019-2024)
  • 11.3.5 Broadcom Recent Development
• 11.4 Advanced Micro Device (AMD)
  • 11.4.1 Advanced Micro Device (AMD) Company Details
  • 11.4.2 Advanced Micro Device (AMD) Business Overview
  • 11.4.3 Advanced Micro Device (AMD) Fabless IC Design Introduction
  • 11.4.4 Advanced Micro Device (AMD) Revenue in Fabless IC Design Business (2019-2024)
  • 11.4.5 Advanced Micro Device (AMD) Recent Development
• 11.5 MediaTek
  • 11.5.1 MediaTek Company Details
  • 11.5.2 MediaTek Business Overview
  • 11.5.3 MediaTek Fabless IC Design Introduction
  • 11.5.4 MediaTek Revenue in Fabless IC Design Business (2019-2024)
• 11.6 Marvell Technology Group
  • 11.6.1 Marvell Company Details
  • 11.6.2 Marvell Business Overview
  • 11.6.3 Marvell Fabless IC Design Introduction
  • 11.6.4 Marvell Revenue in Fabless IC Design Business (2019-2024)
  • 11.6.5 Marvell Recent Development
• 11.7 Novatek Microelectronics Corp.
  • 11.7.1 Novatek Microelectronics Company Details
  • 11.7.2 Novatek Microelectronics Business Overview
  • 11.7.3 Novatek Microelectronics Fabless IC Design Introduction
  • 11.7.4 Novatek Microelectronics Revenue in Fabless IC Design Business (2019-2024)
• 11.8 Tsinghua Unigroup (Unisoc, Guoxin Micro)
  • 11.8.1 Tsinghua Unigroup Company Details
  • 11.8.2 Tsinghua Unigroup Business Overview
  • 11.8.3 Tsinghua Unigroup Semiconductor Manufacturing Introduction
  • 11.8.4 Tsinghua Unigroup Revenue in Semiconductor Manufacturing Business (2019-2024)
• 11.9 Realtek Semiconductor
  • 11.9.1 Realtek Semiconductor Company Details
  • 11.9.2 Realtek Semiconductor Business Overview
  • 11.9.3 Realtek Semiconductor Fabless IC Design Introduction
  • 11.9.4 Realtek Semiconductor Revenue in Fabless IC Design Business (2019-2024)
• 11.10 OmniVision Technology, Inc (Will Semiconductor Co., Ltd. Shanghai)
  • 11.10.1 OmniVision Technology, Inc Company Details
  • 11.10.2 OmniVision Technology, Inc Business Overview
  • 11.10.3 OmniVision Technology, Inc Fabless IC Design Introduction
  • 11.10.4 OmniVision Technology, Inc Revenue in Fabless IC Design Business (2019-2024)
• 11.11 Monolithic Power Systems, Inc. (MPS)
  • 11.11.1 MPS Company Details
  • 11.11.2 MPS Business Overview
  • 11.11.3 MPS Semiconductor Manufacturing Introduction
  • 11.11.4 MPS Revenue in Semiconductor Manufacturing Business (2019-2024)
  • 11.11.5 MPS Recent Development
• 11.12 Cirrus Logic, Inc.
  • 11.12.1 Cirrus Logic, Inc. Company Details
  • 11.12.2 Cirrus Logic, Inc. Business Overview
  • 11.12.3 Cirrus Logic, Inc. Semiconductor Manufacturing Introduction
  • 11.12.4 Cirrus Logic, Inc. Revenue in Semiconductor Manufacturing Business (2019-2024)
  • 11.12.5 Cirrus Logic, Inc. Recent Development
• 11.13 Socionext
  • 11.13.1 Socionext Company Details
  • 11.13.2 Socionext Business Overview
  • 11.13.3 Socionext Fabless IC Design Introduction
  • 11.13.4 Socionext Revenue in Fabless IC Design Business (2019-2024)
• 11.14 LX Semicon
  • 11.14.1 LX Semicon Company Details
  • 11.14.2 LX Semicon Business Overview
  • 11.14.3 LX Semicon Fabless IC Design Introduction
  • 11.14.4 LX Semicon Revenue in Fabless IC Design Business (2019-2024)
• 11.15 HiSilicon Technologies (HUAWEI)
  • 11.15.1 HiSilicon Technologies (HUAWEI) Company Details
  • 11.15.2 HiSilicon Technologies (HUAWEI) Business Overview
  • 11.15.3 HiSilicon Technologies (HUAWEI) Fabless IC Design Introduction
  • 11.15.4 HiSilicon Technologies (HUAWEI) Revenue in Fabless IC Design Business (2019-2024)
• 11.16 Synaptics
  • 11.16.1 Synaptics Company Details
  • 11.16.2 Synaptics Business Overview
  • 11.16.3 Synaptics Fabless IC Design Introduction
  • 11.16.4 Synaptics Revenue in Fabless IC Design Business (2019-2024)
  • 11.16.5 Synaptics Recent Development
• 11.17 Allegro MicroSystems
  • 11.17.1 Allegro MicroSystems Company Details
  • 11.17.2 Allegro MicroSystems Business Overview
  • 11.17.3 Allegro MicroSystems Fabless IC Design Introduction
  • 11.17.4 Allegro MicroSystems Revenue in Fabless IC Design Business (2019-2024)
  • 11.17.5 Allegro MicroSystems Recent Development
• 11.18 Himax
  • 11.18.1 Himax Company Details
  • 11.18.2 Himax Business Overview
  • 11.18.3 Himax Fabless IC Design Introduction
  • 11.18.4 Himax Revenue in Fabless IC Design Business (2019-2024)
• 11.19 Semtech
  • 11.19.1 Semtech Company Details
  • 11.19.2 Semtech Business Overview
  • 11.19.3 Semtech Fabless IC Design Introduction
  • 11.19.4 Semtech Revenue in Fabless IC Design Business (2019-2024)
• 11.20 Global Unichip Corporation (GUC)
  • 11.20.1 Global Unichip Corporation (GUC) Company Details
  • 11.20.2 Global Unichip Corporation (GUC) Business Overview
  • 11.20.3 Global Unichip Corporation (GUC) Fabless IC Design Introduction
  • 11.20.4 Global Unichip Corporation (GUC) Revenue in Fabless IC Design Business (2019-2024)
• 11.21 Hygon Information Technology
  • 11.21.1 Hygon Information Technology Company Details
  • 11.21.2 Hygon Information Technology Business Overview
  • 11.21.3 Hygon Information Technology Fabless IC Design Introduction
  • 11.21.4 Hygon Information Technology Revenue in Fabless IC Design Business (2019-2024)
• 11.22 GigaDevice
  • 11.22.1 GigaDevice Company Details
  • 11.22.2 GigaDevice Business Overview
  • 11.22.3 GigaDevice Fabless IC Design Introduction
  • 11.22.4 GigaDevice Revenue in Fabless IC Design Business (2019-2024)
• 11.23 Silicon Motion
  • 11.23.1 Silicon Motion Company Details
  • 11.23.2 Silicon Motion Business Overview
  • 11.23.3 Silicon Motion Fabless IC Design Introduction
  • 11.23.4 Silicon Motion Revenue in Fabless IC Design Business (2019-2024)
• 11.24 Ingenic
  • 11.24.1 Ingenic Company Details
  • 11.24.2 Ingenic Business Overview
  • 11.24.3 Ingenic Fabless IC Design Introduction
  • 11.24.4 Ingenic Revenue in Fabless IC Design Business (2019-2024)
• 11.25 Raydium
  • 11.25.1 Raydium Company Details
  • 11.25.2 Raydium Business Overview
  • 11.25.3 Raydium Fabless IC Design Introduction
  • 11.25.4 Raydium Revenue in Fabless IC Design Business (2019-2024)
• 11.26 Goodix
  • 11.26.1 Goodix Company Details
  • 11.26.2 Goodix Business Overview
  • 11.26.3 Goodix Fabless IC Design Introduction
  • 11.26.4 Goodix Revenue in Fabless IC Design Business (2019-2024)
• 11.27 Sitronix
  • 11.27.1 Sitronix Company Details
  • 11.27.2 Sitronix Business Overview
  • 11.27.3 Sitronix Fabless IC Design Introduction
  • 11.27.4 Sitronix Revenue in Fabless IC Design Business (2019-2024)
• 11.28 Nordic Semiconductor
  • 11.28.1 Nordic Semiconductor Company Details
  • 11.28.2 Nordic Semiconductor Business Overview
  • 11.28.3 Nordic Semiconductor Fabless IC Design Introduction
  • 11.28.4 Nordic Semiconductor Revenue in Fabless IC Design Business (2019-2024)
  • 11.28.5 Nordic Semiconductor Recent Development
• 11.29 Silergy
  • 11.29.1 Silergy Company Details
  • 11.29.2 Silergy Business Overview
  • 11.29.3 Silergy Fabless IC Design Introduction
  • 11.29.4 Silergy Revenue in Fabless IC Design Business (2019-2024)
• 11.30 Shanghai Fudan Microelectronics Group
  • 11.30.1 Shanghai Fudan Microelectronics Group Company Details
  • 11.30.2 Shanghai Fudan Microelectronics Group Business Overview
  • 11.30.3 Shanghai Fudan Microelectronics Group Fabless IC Design Introduction
  • 11.30.4 Shanghai Fudan Microelectronics Group Revenue in Fabless IC Design Business (2019-2024)
• 11.31 Alchip Technologies
  • 11.31.1 Alchip Technologies Company Details
  • 11.31.2 Alchip Technologies Business Overview
  • 11.31.3 Alchip Technologies Fabless IC Design Introduction
  • 11.31.4 Alchip Technologies Revenue in Fabless IC Design Business (2019-2024)
• 11.32 FocalTech
  • 11.32.1 FocalTech Company Details
  • 11.32.2 FocalTech Business Overview
  • 11.32.3 FocalTech Fabless IC Design Introduction
  • 11.32.4 FocalTech Revenue in Fabless IC Design Business (2019-2024)
• 11.33 MegaChips
  • 11.33.1 MegaChips Company Details
  • 11.33.2 MegaChips Business Overview
  • 11.33.3 MegaChips Fabless IC Design Introduction
  • 11.33.4 MegaChips Revenue in Fabless IC Design Business (2019-2024)
  • 11.33.5 MegaChips Recent Development
• 11.34 Elite Semiconductor Memory Technology
  • 11.34.1 Elite Semiconductor Memory Technology Company Details
  • 11.34.2 Elite Semiconductor Memory Technology Business Overview
  • 11.34.3 Elite Semiconductor Memory Technology Fabless IC Design Introduction
  • 11.34.4 Elite Semiconductor Memory Technology Revenue in Fabless IC Design Business (2019-2024)
• 11.35 SGMICRO
  • 11.35.1 SGMICRO Company Details
  • 11.35.2 SGMICRO Business Overview
  • 11.35.3 SGMICRO Fabless IC Design Introduction
  • 11.35.4 SGMICRO Revenue in Fabless IC Design Business (2019-2024)

12 Analyst's Viewpoints/Conclusions

13 Appendix

• 13.1 Research Methodology
  • 13.1.1 Methodology/Research Approach
  • 13.1.2 Data Source
• 13.2 Author Details
• 13.3 Disclaimer