세계의 유리 관통 비아(TGV) 웨이퍼 : 시장 점유율과 순위, 전체 판매 및 수요 예측(2025-2031년)

The global market for Through Glass Via (TGV) Wafer was estimated to be worth US$ 370 million in 2024 and is forecast to a readjusted size of US$ 1425 million by 2031 with a CAGR of 20.2% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Through Glass Via (TGV) Wafer cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

In 2024, global Through Glass Via (TGV) Wafer production reached approximately 4.05 million Pcs, with an average global market price of around US$ 90 per pcs. A Through Glass Via (TGV) wafer refers to a glass substrate in which vertical through-holes are formed and metallized, enabling high-density interconnections for miniaturized electronic devices and serving as vertical pathways for signals, power, or heat.

The primary upstream suppliers for TGV wafers include high-purity glass substrate manufacturers, copper and conductive material suppliers, and specialized micro-processing equipment manufacturers. Downstream, the chain involves wafer-level packaging houses, packaging and testing (OSAT) companies, and end-product electronics manufacturers. Within this industrial chain, raw material and equipment suppliers significantly impact cost and delivery times, while packaging houses are ultimately responsible for realizing the final product value.

Driven by the rapid development of smartphones, wearable devices, RF modules, and high-frequency/high-speed electronic components, TGV technology is gaining attention due to its advantages in miniaturization, high-density interconnects, and excellent thermal performance. Particularly in application scenarios such as 5G, millimeter-wave, and automotive electronics, TGV wafers provide critical support for enhancing electronic device performance.

Industry development trends are primarily focused on reducing production costs, improving yield rates, optimizing through-hole design, and enhancing packaging compatibility. Concurrently, TGV wafers are evolving towards larger sizes, thinner profiles, and higher reliability to meet the demands of high-performance electronic packaging.

Globally, TGV wafer production remains dominated by a limited number of technologically advanced manufacturers. Production capacity is constrained by factors such as high-precision laser drilling equipment, uniformity control in copper plating, and cleaning processes. Single production line capacity is typically limited, ranging from thousands to tens of thousands of wafers per month.

As a high-value-added intermediate material, TGV wafers generally command relatively high gross margins, but these are significantly affected by fluctuations in raw material prices and equipment depreciation. The typical gross margin range is 30% to 35%, with margins potentially higher for high-end applications or customized products.

Costs are primarily driven by glass substrate materials, through-hole processing, copper plating, and packaging/testing, accounting for approximately 70% to 80% of the total cost. Equipment depreciation and labor costs constitute the remaining portion.

TGV wafers are ultimately consumed mainly in high-end electronic packaging segments, such as Wafer-Level Packaging (WLP/FOWLP), RF front-end modules, micro-sensors, and automotive electronic components. With the growth in 5G and millimeter-wave communication applications, downstream demand continues to expand, driving rapid development in the industry.

This report aims to provide a comprehensive presentation of the global market for Through Glass Via (TGV) Wafer, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Through Glass Via (TGV) Wafer by region & country, by Type, and by Application.

The Through Glass Via (TGV) Wafer market size, estimations, and forecasts are provided in terms of sales volume (K Pcs) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through Glass Via (TGV) Wafer.

Market Segmentation

By Company

• Corning
• LPKF
• Samtec
• SCHOTT
• Xiamen Sky Semiconductor Technology
• Tecnisco
• PLANOPTIK
• NSG Group
• AGC
• JNTC

Segment by Type

• 300 mm
• 200 mm
• Below150 mm

Segment by Application

• Consumer Electronics
• Automotive Electronics
• High-performance Computing and Data Centers
• Others

By Region

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Australia
  • Rest of Asia-Pacific
• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Netherlands
  • Nordic Countries
  • Rest of Europe
• Latin America
  • Mexico
  • Brazil
  • Rest of Latin America
• Middle East & Africa
  • Turkey
  • Saudi Arabia
  • UAE
  • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Through Glass Via (TGV) Wafer manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Through Glass Via (TGV) Wafer in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Through Glass Via (TGV) Wafer in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

• 1.1 Through Glass Via (TGV) Wafer Product Introduction
• 1.2 Global Through Glass Via (TGV) Wafer Market Size Forecast
  • 1.2.1 Global Through Glass Via (TGV) Wafer Sales Value (2020-2031)
  • 1.2.2 Global Through Glass Via (TGV) Wafer Sales Volume (2020-2031)
  • 1.2.3 Global Through Glass Via (TGV) Wafer Sales Price (2020-2031)
• 1.3 Through Glass Via (TGV) Wafer Market Trends & Drivers
  • 1.3.1 Through Glass Via (TGV) Wafer Industry Trends
  • 1.3.2 Through Glass Via (TGV) Wafer Market Drivers & Opportunity
  • 1.3.3 Through Glass Via (TGV) Wafer Market Challenges
  • 1.3.4 Through Glass Via (TGV) Wafer Market Restraints
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Competitive Analysis by Company

• 2.1 Global Through Glass Via (TGV) Wafer Players Revenue Ranking (2024)
• 2.2 Global Through Glass Via (TGV) Wafer Revenue by Company (2020-2025)
• 2.3 Global Through Glass Via (TGV) Wafer Players Sales Volume Ranking (2024)
• 2.4 Global Through Glass Via (TGV) Wafer Sales Volume by Company Players (2020-2025)
• 2.5 Global Through Glass Via (TGV) Wafer Average Price by Company (2020-2025)
• 2.6 Key Manufacturers Through Glass Via (TGV) Wafer Manufacturing Base and Headquarters
• 2.7 Key Manufacturers Through Glass Via (TGV) Wafer Product Offered
• 2.8 Key Manufacturers Time to Begin Mass Production of Through Glass Via (TGV) Wafer
• 2.9 Through Glass Via (TGV) Wafer Market Competitive Analysis
  • 2.9.1 Through Glass Via (TGV) Wafer Market Concentration Rate (2020-2025)
  • 2.9.2 Global 5 and 10 Largest Manufacturers by Through Glass Via (TGV) Wafer Revenue in 2024
  • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Through Glass Via (TGV) Wafer as of 2024)
• 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

• 3.1 Introduction by Type
  • 3.1.1 300 mm
  • 3.1.2 200 mm
  • 3.1.3 Below150 mm
• 3.2 Global Through Glass Via (TGV) Wafer Sales Value by Type
  • 3.2.1 Global Through Glass Via (TGV) Wafer Sales Value by Type (2020 VS 2024 VS 2031)
  • 3.2.2 Global Through Glass Via (TGV) Wafer Sales Value, by Type (2020-2031)
  • 3.2.3 Global Through Glass Via (TGV) Wafer Sales Value, by Type (%) (2020-2031)
• 3.3 Global Through Glass Via (TGV) Wafer Sales Volume by Type
  • 3.3.1 Global Through Glass Via (TGV) Wafer Sales Volume by Type (2020 VS 2024 VS 2031)
  • 3.3.2 Global Through Glass Via (TGV) Wafer Sales Volume, by Type (2020-2031)
  • 3.3.3 Global Through Glass Via (TGV) Wafer Sales Volume, by Type (%) (2020-2031)
• 3.4 Global Through Glass Via (TGV) Wafer Average Price by Type (2020-2031)

4 Segmentation by Application

• 4.1 Introduction by Application
  • 4.1.1 Consumer Electronics
  • 4.1.2 Automotive Electronics
  • 4.1.3 High-performance Computing and Data Centers
  • 4.1.4 Others
• 4.2 Global Through Glass Via (TGV) Wafer Sales Value by Application
  • 4.2.1 Global Through Glass Via (TGV) Wafer Sales Value by Application (2020 VS 2024 VS 2031)
  • 4.2.2 Global Through Glass Via (TGV) Wafer Sales Value, by Application (2020-2031)
  • 4.2.3 Global Through Glass Via (TGV) Wafer Sales Value, by Application (%) (2020-2031)
• 4.3 Global Through Glass Via (TGV) Wafer Sales Volume by Application
  • 4.3.1 Global Through Glass Via (TGV) Wafer Sales Volume by Application (2020 VS 2024 VS 2031)
  • 4.3.2 Global Through Glass Via (TGV) Wafer Sales Volume, by Application (2020-2031)
  • 4.3.3 Global Through Glass Via (TGV) Wafer Sales Volume, by Application (%) (2020-2031)
• 4.4 Global Through Glass Via (TGV) Wafer Average Price by Application (2020-2031)

5 Segmentation by Region

• 5.1 Global Through Glass Via (TGV) Wafer Sales Value by Region
  • 5.1.1 Global Through Glass Via (TGV) Wafer Sales Value by Region: 2020 VS 2024 VS 2031
  • 5.1.2 Global Through Glass Via (TGV) Wafer Sales Value by Region (2020-2025)
  • 5.1.3 Global Through Glass Via (TGV) Wafer Sales Value by Region (2026-2031)
  • 5.1.4 Global Through Glass Via (TGV) Wafer Sales Value by Region (%), (2020-2031)
• 5.2 Global Through Glass Via (TGV) Wafer Sales Volume by Region
  • 5.2.1 Global Through Glass Via (TGV) Wafer Sales Volume by Region: 2020 VS 2024 VS 2031
  • 5.2.2 Global Through Glass Via (TGV) Wafer Sales Volume by Region (2020-2025)
  • 5.2.3 Global Through Glass Via (TGV) Wafer Sales Volume by Region (2026-2031)
  • 5.2.4 Global Through Glass Via (TGV) Wafer Sales Volume by Region (%), (2020-2031)
• 5.3 Global Through Glass Via (TGV) Wafer Average Price by Region (2020-2031)
• 5.4 North America
  • 5.4.1 North America Through Glass Via (TGV) Wafer Sales Value, 2020-2031
  • 5.4.2 North America Through Glass Via (TGV) Wafer Sales Value by Country (%), 2024 VS 2031
• 5.5 Europe
  • 5.5.1 Europe Through Glass Via (TGV) Wafer Sales Value, 2020-2031
  • 5.5.2 Europe Through Glass Via (TGV) Wafer Sales Value by Country (%), 2024 VS 2031
• 5.6 Asia Pacific
  • 5.6.1 Asia Pacific Through Glass Via (TGV) Wafer Sales Value, 2020-2031
  • 5.6.2 Asia Pacific Through Glass Via (TGV) Wafer Sales Value by Region (%), 2024 VS 2031
• 5.7 South America
  • 5.7.1 South America Through Glass Via (TGV) Wafer Sales Value, 2020-2031
  • 5.7.2 South America Through Glass Via (TGV) Wafer Sales Value by Country (%), 2024 VS 2031
• 5.8 Middle East & Africa
  • 5.8.1 Middle East & Africa Through Glass Via (TGV) Wafer Sales Value, 2020-2031
  • 5.8.2 Middle East & Africa Through Glass Via (TGV) Wafer Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

• 6.1 Key Countries/Regions Through Glass Via (TGV) Wafer Sales Value Growth Trends, 2020 VS 2024 VS 2031
• 6.2 Key Countries/Regions Through Glass Via (TGV) Wafer Sales Value and Sales Volume
  • 6.2.1 Key Countries/Regions Through Glass Via (TGV) Wafer Sales Value, 2020-2031
  • 6.2.2 Key Countries/Regions Through Glass Via (TGV) Wafer Sales Volume, 2020-2031
• 6.3 United States
  • 6.3.1 United States Through Glass Via (TGV) Wafer Sales Value, 2020-2031
  • 6.3.2 United States Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • 6.3.3 United States Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031
• 6.4 Europe
  • 6.4.1 Europe Through Glass Via (TGV) Wafer Sales Value, 2020-2031
  • 6.4.2 Europe Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • 6.4.3 Europe Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031
• 6.5 China
  • 6.5.1 China Through Glass Via (TGV) Wafer Sales Value, 2020-2031
  • 6.5.2 China Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • 6.5.3 China Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031
• 6.6 Japan
  • 6.6.1 Japan Through Glass Via (TGV) Wafer Sales Value, 2020-2031
  • 6.6.2 Japan Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • 6.6.3 Japan Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031
• 6.7 South Korea
  • 6.7.1 South Korea Through Glass Via (TGV) Wafer Sales Value, 2020-2031
  • 6.7.2 South Korea Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • 6.7.3 South Korea Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031
• 6.8 Southeast Asia
  • 6.8.1 Southeast Asia Through Glass Via (TGV) Wafer Sales Value, 2020-2031
  • 6.8.2 Southeast Asia Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • 6.8.3 Southeast Asia Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031
• 6.9 India
  • 6.9.1 India Through Glass Via (TGV) Wafer Sales Value, 2020-2031
  • 6.9.2 India Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • 6.9.3 India Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031

7 Company Profiles

• 7.1 Corning
  • 7.1.1 Corning Company Information
  • 7.1.2 Corning Introduction and Business Overview
  • 7.1.3 Corning Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.1.4 Corning Through Glass Via (TGV) Wafer Product Offerings
  • 7.1.5 Corning Recent Development
• 7.2 LPKF
  • 7.2.1 LPKF Company Information
  • 7.2.2 LPKF Introduction and Business Overview
  • 7.2.3 LPKF Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.2.4 LPKF Through Glass Via (TGV) Wafer Product Offerings
  • 7.2.5 LPKF Recent Development
• 7.3 Samtec
  • 7.3.1 Samtec Company Information
  • 7.3.2 Samtec Introduction and Business Overview
  • 7.3.3 Samtec Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.3.4 Samtec Through Glass Via (TGV) Wafer Product Offerings
  • 7.3.5 Samtec Recent Development
• 7.4 SCHOTT
  • 7.4.1 SCHOTT Company Information
  • 7.4.2 SCHOTT Introduction and Business Overview
  • 7.4.3 SCHOTT Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.4.4 SCHOTT Through Glass Via (TGV) Wafer Product Offerings
  • 7.4.5 SCHOTT Recent Development
• 7.5 Xiamen Sky Semiconductor Technology
  • 7.5.1 Xiamen Sky Semiconductor Technology Company Information
  • 7.5.2 Xiamen Sky Semiconductor Technology Introduction and Business Overview
  • 7.5.3 Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.5.4 Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Wafer Product Offerings
  • 7.5.5 Xiamen Sky Semiconductor Technology Recent Development
• 7.6 Tecnisco
  • 7.6.1 Tecnisco Company Information
  • 7.6.2 Tecnisco Introduction and Business Overview
  • 7.6.3 Tecnisco Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.6.4 Tecnisco Through Glass Via (TGV) Wafer Product Offerings
  • 7.6.5 Tecnisco Recent Development
• 7.7 PLANOPTIK
  • 7.7.1 PLANOPTIK Company Information
  • 7.7.2 PLANOPTIK Introduction and Business Overview
  • 7.7.3 PLANOPTIK Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.7.4 PLANOPTIK Through Glass Via (TGV) Wafer Product Offerings
  • 7.7.5 PLANOPTIK Recent Development
• 7.8 NSG Group
  • 7.8.1 NSG Group Company Information
  • 7.8.2 NSG Group Introduction and Business Overview
  • 7.8.3 NSG Group Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.8.4 NSG Group Through Glass Via (TGV) Wafer Product Offerings
  • 7.8.5 NSG Group Recent Development
• 7.9 AGC
  • 7.9.1 AGC Company Information
  • 7.9.2 AGC Introduction and Business Overview
  • 7.9.3 AGC Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.9.4 AGC Through Glass Via (TGV) Wafer Product Offerings
  • 7.9.5 AGC Recent Development
• 7.10 JNTC
  • 7.10.1 JNTC Company Information
  • 7.10.2 JNTC Introduction and Business Overview
  • 7.10.3 JNTC Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.10.4 JNTC Through Glass Via (TGV) Wafer Product Offerings
  • 7.10.5 JNTC Recent Development

8 Industry Chain Analysis

• 8.1 Through Glass Via (TGV) Wafer Industrial Chain
• 8.2 Through Glass Via (TGV) Wafer Upstream Analysis
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers
  • 8.2.3 Manufacturing Cost Structure
• 8.3 Midstream Analysis
• 8.4 Downstream Analysis (Customers Analysis)
• 8.5 Sales Model and Sales Channels
  • 8.5.1 Through Glass Via (TGV) Wafer Sales Model
  • 8.5.2 Sales Channel
  • 8.5.3 Through Glass Via (TGV) Wafer Distributors

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
    • 10.1.1.1 Research Programs/Design
    • 10.1.1.2 Market Size Estimation
    • 10.1.1.3 Market Breakdown and Data Triangulation
  • 10.1.2 Data Source
    • 10.1.2.1 Secondary Sources
    • 10.1.2.2 Primary Sources
• 10.2 Author Details
• 10.3 Disclaimer