세계의 본딩 와이어 : 시장 점유율과 순위, 전체 판매 및 수요 예측(2025-2031년)

The global market for Bonding Wires was estimated to be worth US$ 2679 million in 2024 and is forecast to a readjusted size of US$ 3957 million by 2031 with a CAGR of 5.6% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Bonding Wires cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

Bond wires are fine wires used to establish electrical connections between different components in electronic devices. Typically made of materials such as gold, aluminum, or copper, they measure only a few micrometers in diameter. They are usually attached to the device using a specialized bonding process involving heat and pressure.

In 2024, global bonding wire production capacity reached 6.01 billion square meters, with worldwide sales volume hitting 4.929 billion square meters. The average selling price stood at $543 per kilometer, yielding an average gross profit margin of 17.75%.

Development Trends

Thinner Diameters: As semiconductor packaging evolves toward miniaturization and higher power density, demands for finer bonding wire diameters intensify. Companies must continuously advance thin-diameter fabrication technologies, such as developing ultra-fine single-crystal copper bonding wires below 8μm.

High Performance: Developing bonding wires with high-reliability coating technologies, such as silver nanocoating, to enhance oxidation resistance and joint reliability, meeting demands in harsh environments like high temperatures and humidity.

Material Innovation: Researching and developing novel bonding wire materials, such as copper-carbon nanotube composite bonding wires, to further improve strength and thermal dissipation performance.

Upstream and Downstream Impacts

Upstream Impact: Bonding wire's primary raw materials include metals such as gold, aluminum, and copper. The stability of upstream material supply and price fluctuations directly affect production costs. For instance, 4N-grade high-purity copper-the main raw material for single-crystal copper bonding wire-poses cost control challenges for manufacturers due to price volatility.

Downstream Impact: The development of downstream industries such as semiconductors, LED lighting, and power devices plays a decisive role in determining bonding wire demand. For instance, the rising domestic production rate in the semiconductor packaging and testing industry, the increasing penetration of flip-chip packaging for LED chips, and the explosive demand for power devices in new energy vehicles will all drive rapid growth in the bonding wire market.

This report aims to provide a comprehensive presentation of the global market for Bonding Wires, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Bonding Wires by region & country, by Type, and by Application.

The Bonding Wires market size, estimations, and forecasts are provided in terms of sales volume (K Meter) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Bonding Wires.

Market Segmentation

By Company

• MK Electron
• Tanaka
• Heraeus
• LT Metals
• Nippon Micrometal Corporation
• Doublink Solders
• Microblue Electronic &Technology
• Kangqiang Electronics
• Kanfort
• Tatsuta
• Ametek Coining
• Yantai YesNo Electronic Materials
• Gpilot Technology
• Niche-Tech
• CCC Bonding Wire
• World Star Electronic Material

Segment by Type

• Gold Bonding Wire
• Copper Bonding Wire
• Silver Bonding Wire
• Aluminum Bonding Wire
• Others

Segment by Application

• Semiconductor Packaging
• Optoelectronic Devices
• Sensors and Microelectromechanical Systems (MEMS)
• Others

By Region

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Australia
  • Rest of Asia-Pacific
• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Netherlands
  • Nordic Countries
  • Rest of Europe
• Latin America
  • Mexico
  • Brazil
  • Rest of Latin America
• Middle East & Africa
  • Turkey
  • Saudi Arabia
  • UAE
  • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Bonding Wires manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Bonding Wires in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Bonding Wires in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

• 1.1 Bonding Wires Product Introduction
• 1.2 Global Bonding Wires Market Size Forecast
  • 1.2.1 Global Bonding Wires Sales Value (2020-2031)
  • 1.2.2 Global Bonding Wires Sales Volume (2020-2031)
  • 1.2.3 Global Bonding Wires Sales Price (2020-2031)
• 1.3 Bonding Wires Market Trends & Drivers
  • 1.3.1 Bonding Wires Industry Trends
  • 1.3.2 Bonding Wires Market Drivers & Opportunity
  • 1.3.3 Bonding Wires Market Challenges
  • 1.3.4 Bonding Wires Market Restraints
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Competitive Analysis by Company

• 2.1 Global Bonding Wires Players Revenue Ranking (2024)
• 2.2 Global Bonding Wires Revenue by Company (2020-2025)
• 2.3 Global Bonding Wires Players Sales Volume Ranking (2024)
• 2.4 Global Bonding Wires Sales Volume by Company Players (2020-2025)
• 2.5 Global Bonding Wires Average Price by Company (2020-2025)
• 2.6 Key Manufacturers Bonding Wires Manufacturing Base and Headquarters
• 2.7 Key Manufacturers Bonding Wires Product Offered
• 2.8 Key Manufacturers Time to Begin Mass Production of Bonding Wires
• 2.9 Bonding Wires Market Competitive Analysis
  • 2.9.1 Bonding Wires Market Concentration Rate (2020-2025)
  • 2.9.2 Global 5 and 10 Largest Manufacturers by Bonding Wires Revenue in 2024
  • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Bonding Wires as of 2024)
• 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

• 3.1 Introduction by Type
  • 3.1.1 Gold Bonding Wire
  • 3.1.2 Copper Bonding Wire
  • 3.1.3 Silver Bonding Wire
  • 3.1.4 Aluminum Bonding Wire
  • 3.1.5 Others
• 3.2 Global Bonding Wires Sales Value by Type
  • 3.2.1 Global Bonding Wires Sales Value by Type (2020 VS 2024 VS 2031)
  • 3.2.2 Global Bonding Wires Sales Value, by Type (2020-2031)
  • 3.2.3 Global Bonding Wires Sales Value, by Type (%) (2020-2031)
• 3.3 Global Bonding Wires Sales Volume by Type
  • 3.3.1 Global Bonding Wires Sales Volume by Type (2020 VS 2024 VS 2031)
  • 3.3.2 Global Bonding Wires Sales Volume, by Type (2020-2031)
  • 3.3.3 Global Bonding Wires Sales Volume, by Type (%) (2020-2031)
• 3.4 Global Bonding Wires Average Price by Type (2020-2031)

4 Segmentation by Application

• 4.1 Introduction by Application
  • 4.1.1 Semiconductor Packaging
  • 4.1.2 Optoelectronic Devices
  • 4.1.3 Sensors and Microelectromechanical Systems (MEMS)
  • 4.1.4 Others
• 4.2 Global Bonding Wires Sales Value by Application
  • 4.2.1 Global Bonding Wires Sales Value by Application (2020 VS 2024 VS 2031)
  • 4.2.2 Global Bonding Wires Sales Value, by Application (2020-2031)
  • 4.2.3 Global Bonding Wires Sales Value, by Application (%) (2020-2031)
• 4.3 Global Bonding Wires Sales Volume by Application
  • 4.3.1 Global Bonding Wires Sales Volume by Application (2020 VS 2024 VS 2031)
  • 4.3.2 Global Bonding Wires Sales Volume, by Application (2020-2031)
  • 4.3.3 Global Bonding Wires Sales Volume, by Application (%) (2020-2031)
• 4.4 Global Bonding Wires Average Price by Application (2020-2031)

5 Segmentation by Region

• 5.1 Global Bonding Wires Sales Value by Region
  • 5.1.1 Global Bonding Wires Sales Value by Region: 2020 VS 2024 VS 2031
  • 5.1.2 Global Bonding Wires Sales Value by Region (2020-2025)
  • 5.1.3 Global Bonding Wires Sales Value by Region (2026-2031)
  • 5.1.4 Global Bonding Wires Sales Value by Region (%), (2020-2031)
• 5.2 Global Bonding Wires Sales Volume by Region
  • 5.2.1 Global Bonding Wires Sales Volume by Region: 2020 VS 2024 VS 2031
  • 5.2.2 Global Bonding Wires Sales Volume by Region (2020-2025)
  • 5.2.3 Global Bonding Wires Sales Volume by Region (2026-2031)
  • 5.2.4 Global Bonding Wires Sales Volume by Region (%), (2020-2031)
• 5.3 Global Bonding Wires Average Price by Region (2020-2031)
• 5.4 North America
  • 5.4.1 North America Bonding Wires Sales Value, 2020-2031
  • 5.4.2 North America Bonding Wires Sales Value by Country (%), 2024 VS 2031
• 5.5 Europe
  • 5.5.1 Europe Bonding Wires Sales Value, 2020-2031
  • 5.5.2 Europe Bonding Wires Sales Value by Country (%), 2024 VS 2031
• 5.6 Asia Pacific
  • 5.6.1 Asia Pacific Bonding Wires Sales Value, 2020-2031
  • 5.6.2 Asia Pacific Bonding Wires Sales Value by Region (%), 2024 VS 2031
• 5.7 South America
  • 5.7.1 South America Bonding Wires Sales Value, 2020-2031
  • 5.7.2 South America Bonding Wires Sales Value by Country (%), 2024 VS 2031
• 5.8 Middle East & Africa
  • 5.8.1 Middle East & Africa Bonding Wires Sales Value, 2020-2031
  • 5.8.2 Middle East & Africa Bonding Wires Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

• 6.1 Key Countries/Regions Bonding Wires Sales Value Growth Trends, 2020 VS 2024 VS 2031
• 6.2 Key Countries/Regions Bonding Wires Sales Value and Sales Volume
  • 6.2.1 Key Countries/Regions Bonding Wires Sales Value, 2020-2031
  • 6.2.2 Key Countries/Regions Bonding Wires Sales Volume, 2020-2031
• 6.3 United States
  • 6.3.1 United States Bonding Wires Sales Value, 2020-2031
  • 6.3.2 United States Bonding Wires Sales Value by Type (%), 2024 VS 2031
  • 6.3.3 United States Bonding Wires Sales Value by Application, 2024 VS 2031
• 6.4 Europe
  • 6.4.1 Europe Bonding Wires Sales Value, 2020-2031
  • 6.4.2 Europe Bonding Wires Sales Value by Type (%), 2024 VS 2031
  • 6.4.3 Europe Bonding Wires Sales Value by Application, 2024 VS 2031
• 6.5 China
  • 6.5.1 China Bonding Wires Sales Value, 2020-2031
  • 6.5.2 China Bonding Wires Sales Value by Type (%), 2024 VS 2031
  • 6.5.3 China Bonding Wires Sales Value by Application, 2024 VS 2031
• 6.6 Japan
  • 6.6.1 Japan Bonding Wires Sales Value, 2020-2031
  • 6.6.2 Japan Bonding Wires Sales Value by Type (%), 2024 VS 2031
  • 6.6.3 Japan Bonding Wires Sales Value by Application, 2024 VS 2031
• 6.7 South Korea
  • 6.7.1 South Korea Bonding Wires Sales Value, 2020-2031
  • 6.7.2 South Korea Bonding Wires Sales Value by Type (%), 2024 VS 2031
  • 6.7.3 South Korea Bonding Wires Sales Value by Application, 2024 VS 2031
• 6.8 Southeast Asia
  • 6.8.1 Southeast Asia Bonding Wires Sales Value, 2020-2031
  • 6.8.2 Southeast Asia Bonding Wires Sales Value by Type (%), 2024 VS 2031
  • 6.8.3 Southeast Asia Bonding Wires Sales Value by Application, 2024 VS 2031
• 6.9 India
  • 6.9.1 India Bonding Wires Sales Value, 2020-2031
  • 6.9.2 India Bonding Wires Sales Value by Type (%), 2024 VS 2031
  • 6.9.3 India Bonding Wires Sales Value by Application, 2024 VS 2031

7 Company Profiles

• 7.1 MK Electron
  • 7.1.1 MK Electron Company Information
  • 7.1.2 MK Electron Introduction and Business Overview
  • 7.1.3 MK Electron Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.1.4 MK Electron Bonding Wires Product Offerings
  • 7.1.5 MK Electron Recent Development
• 7.2 Tanaka
  • 7.2.1 Tanaka Company Information
  • 7.2.2 Tanaka Introduction and Business Overview
  • 7.2.3 Tanaka Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.2.4 Tanaka Bonding Wires Product Offerings
  • 7.2.5 Tanaka Recent Development
• 7.3 Heraeus
  • 7.3.1 Heraeus Company Information
  • 7.3.2 Heraeus Introduction and Business Overview
  • 7.3.3 Heraeus Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.3.4 Heraeus Bonding Wires Product Offerings
  • 7.3.5 Heraeus Recent Development
• 7.4 LT Metals
  • 7.4.1 LT Metals Company Information
  • 7.4.2 LT Metals Introduction and Business Overview
  • 7.4.3 LT Metals Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.4.4 LT Metals Bonding Wires Product Offerings
  • 7.4.5 LT Metals Recent Development
• 7.5 Nippon Micrometal Corporation
  • 7.5.1 Nippon Micrometal Corporation Company Information
  • 7.5.2 Nippon Micrometal Corporation Introduction and Business Overview
  • 7.5.3 Nippon Micrometal Corporation Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.5.4 Nippon Micrometal Corporation Bonding Wires Product Offerings
  • 7.5.5 Nippon Micrometal Corporation Recent Development
• 7.6 Doublink Solders
  • 7.6.1 Doublink Solders Company Information
  • 7.6.2 Doublink Solders Introduction and Business Overview
  • 7.6.3 Doublink Solders Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.6.4 Doublink Solders Bonding Wires Product Offerings
  • 7.6.5 Doublink Solders Recent Development
• 7.7 Microblue Electronic &Technology
  • 7.7.1 Microblue Electronic &Technology Company Information
  • 7.7.2 Microblue Electronic &Technology Introduction and Business Overview
  • 7.7.3 Microblue Electronic &Technology Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.7.4 Microblue Electronic &Technology Bonding Wires Product Offerings
  • 7.7.5 Microblue Electronic &Technology Recent Development
• 7.8 Kangqiang Electronics
  • 7.8.1 Kangqiang Electronics Company Information
  • 7.8.2 Kangqiang Electronics Introduction and Business Overview
  • 7.8.3 Kangqiang Electronics Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.8.4 Kangqiang Electronics Bonding Wires Product Offerings
  • 7.8.5 Kangqiang Electronics Recent Development
• 7.9 Kanfort
  • 7.9.1 Kanfort Company Information
  • 7.9.2 Kanfort Introduction and Business Overview
  • 7.9.3 Kanfort Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.9.4 Kanfort Bonding Wires Product Offerings
  • 7.9.5 Kanfort Recent Development
• 7.10 Tatsuta
  • 7.10.1 Tatsuta Company Information
  • 7.10.2 Tatsuta Introduction and Business Overview
  • 7.10.3 Tatsuta Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.10.4 Tatsuta Bonding Wires Product Offerings
  • 7.10.5 Tatsuta Recent Development
• 7.11 Ametek Coining
  • 7.11.1 Ametek Coining Company Information
  • 7.11.2 Ametek Coining Introduction and Business Overview
  • 7.11.3 Ametek Coining Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.11.4 Ametek Coining Bonding Wires Product Offerings
  • 7.11.5 Ametek Coining Recent Development
• 7.12 Yantai YesNo Electronic Materials
  • 7.12.1 Yantai YesNo Electronic Materials Company Information
  • 7.12.2 Yantai YesNo Electronic Materials Introduction and Business Overview
  • 7.12.3 Yantai YesNo Electronic Materials Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.12.4 Yantai YesNo Electronic Materials Bonding Wires Product Offerings
  • 7.12.5 Yantai YesNo Electronic Materials Recent Development
• 7.13 Gpilot Technology
  • 7.13.1 Gpilot Technology Company Information
  • 7.13.2 Gpilot Technology Introduction and Business Overview
  • 7.13.3 Gpilot Technology Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.13.4 Gpilot Technology Bonding Wires Product Offerings
  • 7.13.5 Gpilot Technology Recent Development
• 7.14 Niche-Tech
  • 7.14.1 Niche-Tech Company Information
  • 7.14.2 Niche-Tech Introduction and Business Overview
  • 7.14.3 Niche-Tech Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.14.4 Niche-Tech Bonding Wires Product Offerings
  • 7.14.5 Niche-Tech Recent Development
• 7.15 CCC Bonding Wire
  • 7.15.1 CCC Bonding Wire Company Information
  • 7.15.2 CCC Bonding Wire Introduction and Business Overview
  • 7.15.3 CCC Bonding Wire Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.15.4 CCC Bonding Wire Bonding Wires Product Offerings
  • 7.15.5 CCC Bonding Wire Recent Development
• 7.16 World Star Electronic Material
  • 7.16.1 World Star Electronic Material Company Information
  • 7.16.2 World Star Electronic Material Introduction and Business Overview
  • 7.16.3 World Star Electronic Material Bonding Wires Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.16.4 World Star Electronic Material Bonding Wires Product Offerings
  • 7.16.5 World Star Electronic Material Recent Development

8 Industry Chain Analysis

• 8.1 Bonding Wires Industrial Chain
• 8.2 Bonding Wires Upstream Analysis
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers
  • 8.2.3 Manufacturing Cost Structure
• 8.3 Midstream Analysis
• 8.4 Downstream Analysis (Customers Analysis)
• 8.5 Sales Model and Sales Channels
  • 8.5.1 Bonding Wires Sales Model
  • 8.5.2 Sales Channel
  • 8.5.3 Bonding Wires Distributors

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
    • 10.1.1.1 Research Programs/Design
    • 10.1.1.2 Market Size Estimation
    • 10.1.1.3 Market Breakdown and Data Triangulation
  • 10.1.2 Data Source
    • 10.1.2.1 Secondary Sources
    • 10.1.2.2 Primary Sources
• 10.2 Author Details
• 10.3 Disclaimer