시장보고서
상품코드
1859925

세계의 DBA 기판(알루미늄 직접 접합 기판) : 시장 점유율과 순위, 전체 판매 및 수요 예측(2025-2031년)

DBA (Direct Bonded Aluminum) Substrate - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

발행일: | 리서치사: QYResearch | 페이지 정보: 영문 | 배송안내 : 2-3일 (영업일 기준)

    
    
    




■ 보고서에 따라 최신 정보로 업데이트하여 보내드립니다. 배송일정은 문의해 주시기 바랍니다.

DBA 기판(알루미늄 직접 접합 기판) 시장 규모는 2024년에 1,614만 달러로 평가되었고, 2025-2031년의 예측 기간에 CAGR 12.0%로 확대되어 2031년까지 3,657만 달러로 재조정될 전망입니다.

본 보고서는 DBA 기판(알루미늄 직접 접합 기판)에 대한 최근 관세 조정과 국제적인 전략적 대응 조치에 대해 국경 간 산업 발자국, 자본 배분 패턴, 지역 경제의 상호 의존성, 공급망 재구축 등의 관점에서 종합적인 평가를 제공합니다.

DBA 기판(알루미늄 직접 접합 기판)은 질화알루미늄(AlN), 알루미나(Al2O3) 등의 세라믹 기판에 알루미늄을 직접 접합하여 알루미늄 회로를 형성하는 전자부품입니다. 내열 충격성과 전기적 특성이 우수하여 고전압, 고전류 파워 디바이스에 이상적인 소재입니다. 신재생에너지, 기차, 전기자동차(EV) 등에의 적용이 기대되고 있습니다.

북미의 DBA 기판(알루미늄 직접 접합 기판) 시장은 2024년에 131만 달러로 평가되었고, 2025-2031년의 예측 기간 동안 연평균 8.6%의 연평균 복합 성장률(CAGR)로 성장하여 2031년에는 233만 달러에 달할 것으로 예측됩니다.

유럽의 DBA 기판(알루미늄 직접 접합 기판) 시장은 2024년에 387만 달러로 평가되었고, 2025-2031년의 예측 기간 동안 연평균 9.27%의 연평균 복합 성장률(CAGR)로 2031년에는 708만 달러에 달할 것으로 예측됩니다.

일본의 DBA 기판(알루미늄 직접 접합 기판) 시장은 2024년에 894만 달러로 평가되었고, 2025-2031년의 예측 기간 동안 연평균 10.58%의 연평균 복합 성장률(CAGR)로 성장하여 2031년에는 1,781만 달러에 달할 것으로 예측됩니다.

중국의 DBA 기판(알루미늄 직접 접합 기판) 시장은 2024년에 175만 달러로 평가되었고, 2025-2031년의 예측 기간 동안 연평균 20.58%의 연평균 복합 성장률(CAGR)로 2031년에는 882만 달러에 달할 것으로 예측됩니다.

DBA 기판(알루미늄 직접 접합 기판)의 세계 주요 기업으로는 Mitsubishi Materials, DENKA, DOWA METALTECH, Littelfuse IXYS, Ferrotec(Jiangsu Fulehua Semiconductor Technology) 등이 있습니다. 2024년 기준, 세계 상위 3개사가 매출액 기준으로 약 85.7%의 점유율을 차지하고 있습니다.

세계 DBA 기판(알루미늄 직접 접합 기판) 산업은 현재 꾸준한 발전 단계에 있으며, 그 용도는 하이브리드 자동차 및 전기자동차, 재생 에너지 시스템, 철도 운송용 파워 일렉트로닉스에 집중되어 있습니다. Mitsubishi Materials, DOWA Metaltech, Denka 등 일본 업체들이 세계 리더로 자리매김하고 있는 가운데, 강소복락화반도체기술 등 중국 업체들이 부상하면서 현지 공급망을 강화하고 수입 의존도를 낮추기 위해 노력하고 있습니다. DBA 기판은 비용 효율성과 성능의 균형이 뛰어나 중출력 용도에서 높은 평가를 받고 있습니다. 향후 교통수단의 전동화, 재생에너지 도입 확대, 산업 자동화의 진전에 따라 산업은 더욱 확대될 것으로 예측됩니다. 향후 동향으로는 세라믹과 금속의 접합 기술 향상, 맞춤형 기판 설계, 공급망 내결함성 강화를 위한 지역별 생산의 현지화 등을 들 수 있습니다.

주요 성장 요인으로는 DBA 기판이 파워 모듈과 인버터에서 중요한 역할을 하는 자동차 산업의 전동화 가속화, 컨버터와 인버터에 신뢰성과 열효율이 우수한 기판을 필요로 하는 재생에너지 인프라의 확대, 내열 사이클성과 내구성이 필수적인 철도, 운송 및 산업용 전력 시스템의 성장 등을 들 수 있습니다. 운송 및 산업용 전력 시스템의 성장을 들 수 있습니다. 또한, AMB 기판 대비 비용 우위로 인해 DBA 기판은 비용 중심 용도에서 경쟁력 있는 대체품으로 자리매김하고 있습니다. 그러나 업계는 몇 가지 제약 요인에 직면해 있습니다. 고출력 용도에서 AMB 기판에 대한 성능 제한, 결함 없는 접합을 달성하기 위한 기술적 과제, 원자재 공급의 제약, 긴 인증 주기, 고성능 AMB 기판과 저비용 DBC 기판의 경쟁 압력 등이 있습니다.

이 보고서는 DBA 기판(알루미늄 직접 접합 기판) 세계 시장에 대해 총 판매량, 매출액, 가격, 주요 기업의 시장 점유율 및 순위에 초점을 맞추어 지역/국가별, 기판 두께별, 용도별 분석을 종합적으로 제시하는 것을 목적으로 합니다.

DBA 기판(알루미늄 직접 접합 기판) 시장 규모, 추정 및 예측은 판매량(평방미터) 및 매출액(백만 달러)으로 제시되며, 2024년을 기준 연도, 2020년에서 2031년까지의 과거 데이터와 예측 데이터를 포함합니다. 정량적 분석과 정성적 분석을 통해 독자들이 DBA 기판(알루미늄 직접 접합 기판)에 대한 비즈니스/성장 전략을 수립하고, 시장 경쟁을 평가하고, 현재 시장에서의 포지셔닝을 분석하고, 정보에 입각한 비즈니스 의사결정을 내릴 수 있도록 도와드립니다.

시장 세분화

목차

기업별

  • Mitsubishi Materials
  • DENKA
  • DOWA METALTECH
  • Littelfuse IXYS
  • Jiangsu Fulehua Semiconductor Technology

기판 두께별 부문

  • 0.635mm DBA 기판
  • 0.38mm DBA 기판
  • 기타 두께

용도별 구분

  • 하이브리드 전기자동차(HEV)
  • 전력망, 철도 운송, 산업기계

지역별

  • 북미
    • 미국
    • 캐나다
  • 아시아태평양
    • 중국
    • 일본
    • 한국
    • 동남아시아
    • 인도
    • 호주
    • 기타 아시아태평양
  • 유럽
    • 독일
    • 프랑스
    • 영국
    • 이탈리아
    • 네덜란드
    • 북유럽 국가
    • 기타 유럽
  • 라틴아메리카
    • 멕시코
    • 브라질
    • 기타 라틴아메리카
  • 중동 및 아프리카
    • 튀르키예
    • 사우디아라비아
    • 아랍에미리트(UAE)
    • 기타 중동 및 아프리카
LSH

The global market for DBA (Direct Bonded Aluminum) Substrate was estimated to be worth US$ 16.14 million in 2024 and is forecast to a readjusted size of US$ 36.57 million by 2031 with a CAGR of 12.0% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on DBA (Direct Bonded Aluminum) Substrate cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

DBA (Direct Bonded Aluminum) substrates are electronic components in which aluminum is directly bonded to a ceramic substrate such as aluminum nitride (AlN) or alumina (Al2O3), and then forming an aluminum circuit. With excellent thermal shock resistance and electrical characteristics, it is an ideal material for high-voltage, large-current power devices.Applications include Renewable energy, Electric trains, EVs, and more.

North American market for DBA (Direct Bonded Aluminum) Substrate was valued at $ 1.31 million in 2024 and will reach $ 2.33 million by 2031, at a CAGR of 8.6 % during the forecast period of 2025 through 2031.

Europe market for DBA (Direct Bonded Aluminum) Substrate was valued at $ 3.87 million in 2024 and will reach $ 7.08 million by 2031, at a CAGR of 9.27% during the forecast period of 2025 through 2031.

Japan market for DBA (Direct Bonded Aluminum) Substrate was valued at $ 8.94 million in 2024 and will reach $ 17.81 million by 2031, at a CAGR of 10.58% during the forecast period of 2025 through 2031.

China market for DBA (Direct Bonded Aluminum) Substrate was valued at $ 1.75 million in 2024 and will reach $ 8.82 million by 2031, at a CAGR of 20.58% during the forecast period of 2025 through 2031.

The global key companies of DBA (Direct Bonded Aluminum) Substrate include Mitsubishi Materials, DENKA, DOWA METALTECH, Littelfuse IXYS, Ferrotec (Jiangsu Fulehua Semiconductor Technology), etc. In 2024, the global three largest players hold a share approximately 85.7% in terms of revenue.

The global DBA (Direct Bonded Aluminum) substrate industry is currently in a stage of steady development, with applications concentrated in hybrid and electric vehicles, renewable energy systems, and rail transit power electronics. Japanese manufacturers such as Mitsubishi Materials, DOWA Metaltech, and Denka remain global leaders, while Chinese companies like Jiangsu Fulehua Semiconductor Technology are emerging to strengthen local supply chains and reduce dependency on imports. DBA substrates are valued for their balance between cost-effectiveness and performance, making them attractive for medium-power applications. Looking ahead, the industry will expand alongside the electrification of transportation, renewable energy deployment, and industrial automation. Future trends include improved ceramic-to-metal bonding technologies, customized substrate designs, and regional localization of production to enhance supply chain resilience.

Key growth drivers include the accelerating electrification of the automotive industry, where DBA substrates are critical in power modules and inverters; the expansion of renewable energy infrastructure, which demands reliable and thermally efficient substrates for converters and inverters; and the growth of rail transit and industrial power systems, where thermal cycling resistance and durability are essential. In addition, cost advantages compared to AMB substrates position DBA substrates as a competitive alternative in cost-sensitive applications. However, the industry faces several restraining factors: performance limitations relative to AMB substrates in high-power applications, technical challenges in achieving defect-free bonding, raw material supply constraints, long certification cycles, and competitive pressure from both higher-performance AMB and lower-cost DBC substrates.

This report aims to provide a comprehensive presentation of the global market for DBA (Direct Bonded Aluminum) Substrate, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of DBA (Direct Bonded Aluminum) Substrate by region & country, by Substrate Thickness, and by Application.

The DBA (Direct Bonded Aluminum) Substrate market size, estimations, and forecasts are provided in terms of sales volume (Square Meter) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding DBA (Direct Bonded Aluminum) Substrate.

Market Segmentation

By Company

  • Mitsubishi Materials
  • DENKA
  • DOWA METALTECH
  • Littelfuse IXYS
  • Jiangsu Fulehua Semiconductor Technology

Segment by Substrate Thickness

  • 0.635mm DBA Substrate
  • 0.38mm DBA Substrate
  • Other Thickness

Segment by Application

  • Hybrid Electric Vehicle (HEV)
  • Power Grid, Rail Transit, and Industrial Machinery

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of DBA (Direct Bonded Aluminum) Substrate manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Substrate Thickness, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of DBA (Direct Bonded Aluminum) Substrate in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of DBA (Direct Bonded Aluminum) Substrate in country level. It provides sigmate data by Substrate Thickness, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 DBA (Direct Bonded Aluminum) Substrate Product Introduction
  • 1.2 Global DBA (Direct Bonded Aluminum) Substrate Market Size Forecast
    • 1.2.1 Global DBA (Direct Bonded Aluminum) Substrate Sales Value (2020-2031)
    • 1.2.2 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume (2020-2031)
    • 1.2.3 Global DBA (Direct Bonded Aluminum) Substrate Sales Price (2020-2031)
  • 1.3 DBA (Direct Bonded Aluminum) Substrate Market Trends & Drivers
    • 1.3.1 DBA (Direct Bonded Aluminum) Substrate Industry Trends
    • 1.3.2 DBA (Direct Bonded Aluminum) Substrate Market Drivers & Opportunity
    • 1.3.3 DBA (Direct Bonded Aluminum) Substrate Market Challenges
    • 1.3.4 DBA (Direct Bonded Aluminum) Substrate Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global DBA (Direct Bonded Aluminum) Substrate Players Revenue Ranking (2024)
  • 2.2 Global DBA (Direct Bonded Aluminum) Substrate Revenue by Company (2020-2025)
  • 2.3 Global DBA (Direct Bonded Aluminum) Substrate Players Sales Volume Ranking (2024)
  • 2.4 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume by Company Players (2020-2025)
  • 2.5 Global DBA (Direct Bonded Aluminum) Substrate Average Price by Company (2020-2025)
  • 2.6 Key Manufacturers DBA (Direct Bonded Aluminum) Substrate Manufacturing Base and Headquarters
  • 2.7 Key Manufacturers DBA (Direct Bonded Aluminum) Substrate Product Offered
  • 2.8 Key Manufacturers Time to Begin Mass Production of DBA (Direct Bonded Aluminum) Substrate
  • 2.9 DBA (Direct Bonded Aluminum) Substrate Market Competitive Analysis
    • 2.9.1 DBA (Direct Bonded Aluminum) Substrate Market Concentration Rate (2020-2025)
    • 2.9.2 Global 5 and 10 Largest Manufacturers by DBA (Direct Bonded Aluminum) Substrate Revenue in 2024
    • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in DBA (Direct Bonded Aluminum) Substrate as of 2024)
  • 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Substrate Thickness

  • 3.1 Introduction by Substrate Thickness
    • 3.1.1 0.635mm DBA Substrate
    • 3.1.2 0.38mm DBA Substrate
    • 3.1.3 Other Thickness
  • 3.2 Global DBA (Direct Bonded Aluminum) Substrate Sales Value by Substrate Thickness
    • 3.2.1 Global DBA (Direct Bonded Aluminum) Substrate Sales Value by Substrate Thickness (2020 VS 2024 VS 2031)
    • 3.2.2 Global DBA (Direct Bonded Aluminum) Substrate Sales Value, by Substrate Thickness (2020-2031)
    • 3.2.3 Global DBA (Direct Bonded Aluminum) Substrate Sales Value, by Substrate Thickness (%) (2020-2031)
  • 3.3 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume by Substrate Thickness
    • 3.3.1 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume by Substrate Thickness (2020 VS 2024 VS 2031)
    • 3.3.2 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume, by Substrate Thickness (2020-2031)
    • 3.3.3 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume, by Substrate Thickness (%) (2020-2031)
  • 3.4 Global DBA (Direct Bonded Aluminum) Substrate Average Price by Substrate Thickness (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 Hybrid Electric Vehicle (HEV)
    • 4.1.2 Power Grid, Rail Transit, and Industrial Machinery
  • 4.2 Global DBA (Direct Bonded Aluminum) Substrate Sales Value by Application
    • 4.2.1 Global DBA (Direct Bonded Aluminum) Substrate Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global DBA (Direct Bonded Aluminum) Substrate Sales Value, by Application (2020-2031)
    • 4.2.3 Global DBA (Direct Bonded Aluminum) Substrate Sales Value, by Application (%) (2020-2031)
  • 4.3 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume by Application
    • 4.3.1 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume by Application (2020 VS 2024 VS 2031)
    • 4.3.2 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume, by Application (2020-2031)
    • 4.3.3 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume, by Application (%) (2020-2031)
  • 4.4 Global DBA (Direct Bonded Aluminum) Substrate Average Price by Application (2020-2031)

5 Segmentation by Region

  • 5.1 Global DBA (Direct Bonded Aluminum) Substrate Sales Value by Region
    • 5.1.1 Global DBA (Direct Bonded Aluminum) Substrate Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global DBA (Direct Bonded Aluminum) Substrate Sales Value by Region (2020-2025)
    • 5.1.3 Global DBA (Direct Bonded Aluminum) Substrate Sales Value by Region (2026-2031)
    • 5.1.4 Global DBA (Direct Bonded Aluminum) Substrate Sales Value by Region (%), (2020-2031)
  • 5.2 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume by Region
    • 5.2.1 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume by Region: 2020 VS 2024 VS 2031
    • 5.2.2 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume by Region (2020-2025)
    • 5.2.3 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume by Region (2026-2031)
    • 5.2.4 Global DBA (Direct Bonded Aluminum) Substrate Sales Volume by Region (%), (2020-2031)
  • 5.3 Global DBA (Direct Bonded Aluminum) Substrate Average Price by Region (2020-2031)
  • 5.4 North America
    • 5.4.1 North America DBA (Direct Bonded Aluminum) Substrate Sales Value, 2020-2031
    • 5.4.2 North America DBA (Direct Bonded Aluminum) Substrate Sales Value by Country (%), 2024 VS 2031
  • 5.5 Europe
    • 5.5.1 Europe DBA (Direct Bonded Aluminum) Substrate Sales Value, 2020-2031
    • 5.5.2 Europe DBA (Direct Bonded Aluminum) Substrate Sales Value by Country (%), 2024 VS 2031
  • 5.6 Asia Pacific
    • 5.6.1 Asia Pacific DBA (Direct Bonded Aluminum) Substrate Sales Value, 2020-2031
    • 5.6.2 Asia Pacific DBA (Direct Bonded Aluminum) Substrate Sales Value by Region (%), 2024 VS 2031
  • 5.7 South America
    • 5.7.1 South America DBA (Direct Bonded Aluminum) Substrate Sales Value, 2020-2031
    • 5.7.2 South America DBA (Direct Bonded Aluminum) Substrate Sales Value by Country (%), 2024 VS 2031
  • 5.8 Middle East & Africa
    • 5.8.1 Middle East & Africa DBA (Direct Bonded Aluminum) Substrate Sales Value, 2020-2031
    • 5.8.2 Middle East & Africa DBA (Direct Bonded Aluminum) Substrate Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions DBA (Direct Bonded Aluminum) Substrate Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions DBA (Direct Bonded Aluminum) Substrate Sales Value and Sales Volume
    • 6.2.1 Key Countries/Regions DBA (Direct Bonded Aluminum) Substrate Sales Value, 2020-2031
    • 6.2.2 Key Countries/Regions DBA (Direct Bonded Aluminum) Substrate Sales Volume, 2020-2031
  • 6.3 United States
    • 6.3.1 United States DBA (Direct Bonded Aluminum) Substrate Sales Value, 2020-2031
    • 6.3.2 United States DBA (Direct Bonded Aluminum) Substrate Sales Value by Substrate Thickness (%), 2024 VS 2031
    • 6.3.3 United States DBA (Direct Bonded Aluminum) Substrate Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe DBA (Direct Bonded Aluminum) Substrate Sales Value, 2020-2031
    • 6.4.2 Europe DBA (Direct Bonded Aluminum) Substrate Sales Value by Substrate Thickness (%), 2024 VS 2031
    • 6.4.3 Europe DBA (Direct Bonded Aluminum) Substrate Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China DBA (Direct Bonded Aluminum) Substrate Sales Value, 2020-2031
    • 6.5.2 China DBA (Direct Bonded Aluminum) Substrate Sales Value by Substrate Thickness (%), 2024 VS 2031
    • 6.5.3 China DBA (Direct Bonded Aluminum) Substrate Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan DBA (Direct Bonded Aluminum) Substrate Sales Value, 2020-2031
    • 6.6.2 Japan DBA (Direct Bonded Aluminum) Substrate Sales Value by Substrate Thickness (%), 2024 VS 2031
    • 6.6.3 Japan DBA (Direct Bonded Aluminum) Substrate Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea DBA (Direct Bonded Aluminum) Substrate Sales Value, 2020-2031
    • 6.7.2 South Korea DBA (Direct Bonded Aluminum) Substrate Sales Value by Substrate Thickness (%), 2024 VS 2031
    • 6.7.3 South Korea DBA (Direct Bonded Aluminum) Substrate Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia DBA (Direct Bonded Aluminum) Substrate Sales Value, 2020-2031
    • 6.8.2 Southeast Asia DBA (Direct Bonded Aluminum) Substrate Sales Value by Substrate Thickness (%), 2024 VS 2031
    • 6.8.3 Southeast Asia DBA (Direct Bonded Aluminum) Substrate Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India DBA (Direct Bonded Aluminum) Substrate Sales Value, 2020-2031
    • 6.9.2 India DBA (Direct Bonded Aluminum) Substrate Sales Value by Substrate Thickness (%), 2024 VS 2031
    • 6.9.3 India DBA (Direct Bonded Aluminum) Substrate Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 Mitsubishi Materials
    • 7.1.1 Mitsubishi Materials Company Information
    • 7.1.2 Mitsubishi Materials Introduction and Business Overview
    • 7.1.3 Mitsubishi Materials DBA (Direct Bonded Aluminum) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.1.4 Mitsubishi Materials DBA (Direct Bonded Aluminum) Substrate Product Offerings
    • 7.1.5 Mitsubishi Materials Recent Development
  • 7.2 DENKA
    • 7.2.1 DENKA Company Information
    • 7.2.2 DENKA Introduction and Business Overview
    • 7.2.3 DENKA DBA (Direct Bonded Aluminum) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.2.4 DENKA DBA (Direct Bonded Aluminum) Substrate Product Offerings
    • 7.2.5 DENKA Recent Development
  • 7.3 DOWA METALTECH
    • 7.3.1 DOWA METALTECH Company Information
    • 7.3.2 DOWA METALTECH Introduction and Business Overview
    • 7.3.3 DOWA METALTECH DBA (Direct Bonded Aluminum) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.3.4 DOWA METALTECH DBA (Direct Bonded Aluminum) Substrate Product Offerings
    • 7.3.5 DOWA METALTECH Recent Development
  • 7.4 Littelfuse IXYS
    • 7.4.1 Littelfuse IXYS Company Information
    • 7.4.2 Littelfuse IXYS Introduction and Business Overview
    • 7.4.3 Littelfuse IXYS DBA (Direct Bonded Aluminum) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.4.4 Littelfuse IXYS DBA (Direct Bonded Aluminum) Substrate Product Offerings
    • 7.4.5 Littelfuse IXYS Recent Development
  • 7.5 Jiangsu Fulehua Semiconductor Technology
    • 7.5.1 Jiangsu Fulehua Semiconductor Technology Company Information
    • 7.5.2 Jiangsu Fulehua Semiconductor Technology Introduction and Business Overview
    • 7.5.3 Jiangsu Fulehua Semiconductor Technology DBA (Direct Bonded Aluminum) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.5.4 Jiangsu Fulehua Semiconductor Technology DBA (Direct Bonded Aluminum) Substrate Product Offerings
    • 7.5.5 Jiangsu Fulehua Semiconductor Technology Recent Development

8 Industry Chain Analysis

  • 8.1 DBA (Direct Bonded Aluminum) Substrate Industrial Chain
  • 8.2 DBA (Direct Bonded Aluminum) Substrate Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 DBA (Direct Bonded Aluminum) Substrate Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 DBA (Direct Bonded Aluminum) Substrate Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer
샘플 요청 목록
0 건의 상품을 선택 중
목록 보기
전체삭제