세계의 반도체 패키징용 도금 용액 : 시장 점유율과 순위, 전체 판매량 및 수요 예측(2025-2031년)

The global market for Semiconductor Packaging Electroplating Solution was estimated to be worth US$ 352 million in 2024 and is forecast to a readjusted size of US$ 586 million by 2031 with a CAGR of 8.6% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Semiconductor Packaging Electroplating Solution cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

Semiconductor packaging plating fluid is a key material used in the semiconductor packaging process. Its core function is to form a high-precision metal coating (such as copper, nickel, or gold) on the chip surface through electrochemical deposition, enabling electrical interconnection between the chip and the packaging carrier. Conductor electroplating refers to the process of applying metal ions from the plating fluid to the wafer surface during chip manufacturing to form metal interconnects. In 2024, global sales of semiconductor packaging plating fluid reached 5,000 tons, with an average selling price of approximately $70,000 per ton.

Market drivers primarily include the following:

Technology upgrades and industrial transformations: Exploding demand for AI/HPC:

Technology links: AI chips require high-bandwidth interconnects through 2.5D/3D packaging, driving the upgrade of electroplating solutions toward high purity and low stress.

Advances in 5G/6G communication technologies:

Application scenarios: 5G base station chips must support high-frequency signal transmission, requiring the plating layer to have a low surface roughness (Ra < 0.1μm) to reduce signal loss.

Market growth: The number of global 5G base stations is expected to continue to increase by 2025, driving demand for high-frequency electroplating solutions.

Dual drivers of policy and capital:

Policy support: China's 14th Five-Year Plan explicitly lists integrated circuits as a strategic industry, and local subsidies cover electroplating solution R&D and production line construction.

Accelerating domestic substitution:

Technology breakthroughs: Domestic companies (such as Shanghai Xinyang and Suzhou Jingrui) have achieved technological breakthroughs in sub-5nm copper electroplating materials, gradually replacing imported products such as Atotech. Cost Advantage: Domestic electroplating solutions are 30%-50% cheaper than imported products, and their penetration rate continues to increase among leading packaging and testing companies (such as Changdian Technology and Tongfu Microelectronics).

Stricter Environmental Regulations:

Compliance Costs: The EU's Electronic Waste Regulation requires hexavalent chromium content in electronic products to be less than 0.1wt% by 2025, prompting electroplating solution companies to accelerate the development of chromium-free/low-chromium formulas.

Market Opportunities: Environmentally friendly electroplating solutions are experiencing rapid growth in the EU and North American markets, far outpacing traditional products.

This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging Electroplating Solution, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Semiconductor Packaging Electroplating Solution by region & country, by Type, and by Application.

The Semiconductor Packaging Electroplating Solution market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging Electroplating Solution.

Market Segmentation

By Company

• TANAKA
• Japan Pure Chemical
• MacDermid
• Technic
• DuPont
• BASF
• Shanghai Xinyang Semiconductor Materials Co., Ltd.
• Merck Group
• ADEKA
• Shanghai Feikai Materials Technology Co., Ltd.
• Lishen Technology

Segment by Type

• Copper Electroplating Solution
• Tin Electroplating Solution
• Silver Electroplating Solution
• Gold Electroplating Solution
• Nickel Electroplating Solution
• Others

Segment by Application

• Copper Pillar Bump
• Redistribution Layer
• Through Silicon Via
• Other

By Region

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Australia
  • Rest of Asia-Pacific
• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Netherlands
  • Nordic Countries
  • Rest of Europe
• Latin America
  • Mexico
  • Brazil
  • Rest of Latin America
• Middle East & Africa
  • Turkey
  • Saudi Arabia
  • UAE
  • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Semiconductor Packaging Electroplating Solution manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Semiconductor Packaging Electroplating Solution in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Semiconductor Packaging Electroplating Solution in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

• 1.1 Semiconductor Packaging Electroplating Solution Product Introduction
• 1.2 Global Semiconductor Packaging Electroplating Solution Market Size Forecast
  • 1.2.1 Global Semiconductor Packaging Electroplating Solution Sales Value (2020-2031)
  • 1.2.2 Global Semiconductor Packaging Electroplating Solution Sales Volume (2020-2031)
  • 1.2.3 Global Semiconductor Packaging Electroplating Solution Sales Price (2020-2031)
• 1.3 Semiconductor Packaging Electroplating Solution Market Trends & Drivers
  • 1.3.1 Semiconductor Packaging Electroplating Solution Industry Trends
  • 1.3.2 Semiconductor Packaging Electroplating Solution Market Drivers & Opportunity
  • 1.3.3 Semiconductor Packaging Electroplating Solution Market Challenges
  • 1.3.4 Semiconductor Packaging Electroplating Solution Market Restraints
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Competitive Analysis by Company

• 2.1 Global Semiconductor Packaging Electroplating Solution Players Revenue Ranking (2024)
• 2.2 Global Semiconductor Packaging Electroplating Solution Revenue by Company (2020-2025)
• 2.3 Global Semiconductor Packaging Electroplating Solution Players Sales Volume Ranking (2024)
• 2.4 Global Semiconductor Packaging Electroplating Solution Sales Volume by Company Players (2020-2025)
• 2.5 Global Semiconductor Packaging Electroplating Solution Average Price by Company (2020-2025)
• 2.6 Key Manufacturers Semiconductor Packaging Electroplating Solution Manufacturing Base and Headquarters
• 2.7 Key Manufacturers Semiconductor Packaging Electroplating Solution Product Offered
• 2.8 Key Manufacturers Time to Begin Mass Production of Semiconductor Packaging Electroplating Solution
• 2.9 Semiconductor Packaging Electroplating Solution Market Competitive Analysis
  • 2.9.1 Semiconductor Packaging Electroplating Solution Market Concentration Rate (2020-2025)
  • 2.9.2 Global 5 and 10 Largest Manufacturers by Semiconductor Packaging Electroplating Solution Revenue in 2024
  • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Packaging Electroplating Solution as of 2024)
• 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

• 3.1 Introduction by Type
  • 3.1.1 Copper Electroplating Solution
  • 3.1.2 Tin Electroplating Solution
  • 3.1.3 Silver Electroplating Solution
  • 3.1.4 Gold Electroplating Solution
  • 3.1.5 Nickel Electroplating Solution
  • 3.1.6 Others
• 3.2 Global Semiconductor Packaging Electroplating Solution Sales Value by Type
  • 3.2.1 Global Semiconductor Packaging Electroplating Solution Sales Value by Type (2020 VS 2024 VS 2031)
  • 3.2.2 Global Semiconductor Packaging Electroplating Solution Sales Value, by Type (2020-2031)
  • 3.2.3 Global Semiconductor Packaging Electroplating Solution Sales Value, by Type (%) (2020-2031)
• 3.3 Global Semiconductor Packaging Electroplating Solution Sales Volume by Type
  • 3.3.1 Global Semiconductor Packaging Electroplating Solution Sales Volume by Type (2020 VS 2024 VS 2031)
  • 3.3.2 Global Semiconductor Packaging Electroplating Solution Sales Volume, by Type (2020-2031)
  • 3.3.3 Global Semiconductor Packaging Electroplating Solution Sales Volume, by Type (%) (2020-2031)
• 3.4 Global Semiconductor Packaging Electroplating Solution Average Price by Type (2020-2031)

4 Segmentation by Application

• 4.1 Introduction by Application
  • 4.1.1 Copper Pillar Bump
  • 4.1.2 Redistribution Layer
  • 4.1.3 Through Silicon Via
  • 4.1.4 Other
• 4.2 Global Semiconductor Packaging Electroplating Solution Sales Value by Application
  • 4.2.1 Global Semiconductor Packaging Electroplating Solution Sales Value by Application (2020 VS 2024 VS 2031)
  • 4.2.2 Global Semiconductor Packaging Electroplating Solution Sales Value, by Application (2020-2031)
  • 4.2.3 Global Semiconductor Packaging Electroplating Solution Sales Value, by Application (%) (2020-2031)
• 4.3 Global Semiconductor Packaging Electroplating Solution Sales Volume by Application
  • 4.3.1 Global Semiconductor Packaging Electroplating Solution Sales Volume by Application (2020 VS 2024 VS 2031)
  • 4.3.2 Global Semiconductor Packaging Electroplating Solution Sales Volume, by Application (2020-2031)
  • 4.3.3 Global Semiconductor Packaging Electroplating Solution Sales Volume, by Application (%) (2020-2031)
• 4.4 Global Semiconductor Packaging Electroplating Solution Average Price by Application (2020-2031)

5 Segmentation by Region

• 5.1 Global Semiconductor Packaging Electroplating Solution Sales Value by Region
  • 5.1.1 Global Semiconductor Packaging Electroplating Solution Sales Value by Region: 2020 VS 2024 VS 2031
  • 5.1.2 Global Semiconductor Packaging Electroplating Solution Sales Value by Region (2020-2025)
  • 5.1.3 Global Semiconductor Packaging Electroplating Solution Sales Value by Region (2026-2031)
  • 5.1.4 Global Semiconductor Packaging Electroplating Solution Sales Value by Region (%), (2020-2031)
• 5.2 Global Semiconductor Packaging Electroplating Solution Sales Volume by Region
  • 5.2.1 Global Semiconductor Packaging Electroplating Solution Sales Volume by Region: 2020 VS 2024 VS 2031
  • 5.2.2 Global Semiconductor Packaging Electroplating Solution Sales Volume by Region (2020-2025)
  • 5.2.3 Global Semiconductor Packaging Electroplating Solution Sales Volume by Region (2026-2031)
  • 5.2.4 Global Semiconductor Packaging Electroplating Solution Sales Volume by Region (%), (2020-2031)
• 5.3 Global Semiconductor Packaging Electroplating Solution Average Price by Region (2020-2031)
• 5.4 North America
  • 5.4.1 North America Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
  • 5.4.2 North America Semiconductor Packaging Electroplating Solution Sales Value by Country (%), 2024 VS 2031
• 5.5 Europe
  • 5.5.1 Europe Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
  • 5.5.2 Europe Semiconductor Packaging Electroplating Solution Sales Value by Country (%), 2024 VS 2031
• 5.6 Asia Pacific
  • 5.6.1 Asia Pacific Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
  • 5.6.2 Asia Pacific Semiconductor Packaging Electroplating Solution Sales Value by Region (%), 2024 VS 2031
• 5.7 South America
  • 5.7.1 South America Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
  • 5.7.2 South America Semiconductor Packaging Electroplating Solution Sales Value by Country (%), 2024 VS 2031
• 5.8 Middle East & Africa
  • 5.8.1 Middle East & Africa Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
  • 5.8.2 Middle East & Africa Semiconductor Packaging Electroplating Solution Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

• 6.1 Key Countries/Regions Semiconductor Packaging Electroplating Solution Sales Value Growth Trends, 2020 VS 2024 VS 2031
• 6.2 Key Countries/Regions Semiconductor Packaging Electroplating Solution Sales Value and Sales Volume
  • 6.2.1 Key Countries/Regions Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
  • 6.2.2 Key Countries/Regions Semiconductor Packaging Electroplating Solution Sales Volume, 2020-2031
• 6.3 United States
  • 6.3.1 United States Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
  • 6.3.2 United States Semiconductor Packaging Electroplating Solution Sales Value by Type (%), 2024 VS 2031
  • 6.3.3 United States Semiconductor Packaging Electroplating Solution Sales Value by Application, 2024 VS 2031
• 6.4 Europe
  • 6.4.1 Europe Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
  • 6.4.2 Europe Semiconductor Packaging Electroplating Solution Sales Value by Type (%), 2024 VS 2031
  • 6.4.3 Europe Semiconductor Packaging Electroplating Solution Sales Value by Application, 2024 VS 2031
• 6.5 China
  • 6.5.1 China Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
  • 6.5.2 China Semiconductor Packaging Electroplating Solution Sales Value by Type (%), 2024 VS 2031
  • 6.5.3 China Semiconductor Packaging Electroplating Solution Sales Value by Application, 2024 VS 2031
• 6.6 Japan
  • 6.6.1 Japan Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
  • 6.6.2 Japan Semiconductor Packaging Electroplating Solution Sales Value by Type (%), 2024 VS 2031
  • 6.6.3 Japan Semiconductor Packaging Electroplating Solution Sales Value by Application, 2024 VS 2031
• 6.7 South Korea
  • 6.7.1 South Korea Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
  • 6.7.2 South Korea Semiconductor Packaging Electroplating Solution Sales Value by Type (%), 2024 VS 2031
  • 6.7.3 South Korea Semiconductor Packaging Electroplating Solution Sales Value by Application, 2024 VS 2031
• 6.8 Southeast Asia
  • 6.8.1 Southeast Asia Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
  • 6.8.2 Southeast Asia Semiconductor Packaging Electroplating Solution Sales Value by Type (%), 2024 VS 2031
  • 6.8.3 Southeast Asia Semiconductor Packaging Electroplating Solution Sales Value by Application, 2024 VS 2031
• 6.9 India
  • 6.9.1 India Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
  • 6.9.2 India Semiconductor Packaging Electroplating Solution Sales Value by Type (%), 2024 VS 2031
  • 6.9.3 India Semiconductor Packaging Electroplating Solution Sales Value by Application, 2024 VS 2031

7 Company Profiles

• 7.1 TANAKA
  • 7.1.1 TANAKA Company Information
  • 7.1.2 TANAKA Introduction and Business Overview
  • 7.1.3 TANAKA Semiconductor Packaging Electroplating Solution Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.1.4 TANAKA Semiconductor Packaging Electroplating Solution Product Offerings
  • 7.1.5 TANAKA Recent Development
• 7.2 Japan Pure Chemical
  • 7.2.1 Japan Pure Chemical Company Information
  • 7.2.2 Japan Pure Chemical Introduction and Business Overview
  • 7.2.3 Japan Pure Chemical Semiconductor Packaging Electroplating Solution Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.2.4 Japan Pure Chemical Semiconductor Packaging Electroplating Solution Product Offerings
  • 7.2.5 Japan Pure Chemical Recent Development
• 7.3 MacDermid
  • 7.3.1 MacDermid Company Information
  • 7.3.2 MacDermid Introduction and Business Overview
  • 7.3.3 MacDermid Semiconductor Packaging Electroplating Solution Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.3.4 MacDermid Semiconductor Packaging Electroplating Solution Product Offerings
  • 7.3.5 MacDermid Recent Development
• 7.4 Technic
  • 7.4.1 Technic Company Information
  • 7.4.2 Technic Introduction and Business Overview
  • 7.4.3 Technic Semiconductor Packaging Electroplating Solution Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.4.4 Technic Semiconductor Packaging Electroplating Solution Product Offerings
  • 7.4.5 Technic Recent Development
• 7.5 DuPont
  • 7.5.1 DuPont Company Information
  • 7.5.2 DuPont Introduction and Business Overview
  • 7.5.3 DuPont Semiconductor Packaging Electroplating Solution Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.5.4 DuPont Semiconductor Packaging Electroplating Solution Product Offerings
  • 7.5.5 DuPont Recent Development
• 7.6 BASF
  • 7.6.1 BASF Company Information
  • 7.6.2 BASF Introduction and Business Overview
  • 7.6.3 BASF Semiconductor Packaging Electroplating Solution Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.6.4 BASF Semiconductor Packaging Electroplating Solution Product Offerings
  • 7.6.5 BASF Recent Development
• 7.7 Shanghai Xinyang Semiconductor Materials Co., Ltd.
  • 7.7.1 Shanghai Xinyang Semiconductor Materials Co., Ltd. Company Information
  • 7.7.2 Shanghai Xinyang Semiconductor Materials Co., Ltd. Introduction and Business Overview
  • 7.7.3 Shanghai Xinyang Semiconductor Materials Co., Ltd. Semiconductor Packaging Electroplating Solution Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.7.4 Shanghai Xinyang Semiconductor Materials Co., Ltd. Semiconductor Packaging Electroplating Solution Product Offerings
  • 7.7.5 Shanghai Xinyang Semiconductor Materials Co., Ltd. Recent Development
• 7.8 Merck Group
  • 7.8.1 Merck Group Company Information
  • 7.8.2 Merck Group Introduction and Business Overview
  • 7.8.3 Merck Group Semiconductor Packaging Electroplating Solution Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.8.4 Merck Group Semiconductor Packaging Electroplating Solution Product Offerings
  • 7.8.5 Merck Group Recent Development
• 7.9 ADEKA
  • 7.9.1 ADEKA Company Information
  • 7.9.2 ADEKA Introduction and Business Overview
  • 7.9.3 ADEKA Semiconductor Packaging Electroplating Solution Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.9.4 ADEKA Semiconductor Packaging Electroplating Solution Product Offerings
  • 7.9.5 ADEKA Recent Development
• 7.10 Shanghai Feikai Materials Technology Co., Ltd.
  • 7.10.1 Shanghai Feikai Materials Technology Co., Ltd. Company Information
  • 7.10.2 Shanghai Feikai Materials Technology Co., Ltd. Introduction and Business Overview
  • 7.10.3 Shanghai Feikai Materials Technology Co., Ltd. Semiconductor Packaging Electroplating Solution Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.10.4 Shanghai Feikai Materials Technology Co., Ltd. Semiconductor Packaging Electroplating Solution Product Offerings
  • 7.10.5 Shanghai Feikai Materials Technology Co., Ltd. Recent Development
• 7.11 Lishen Technology
  • 7.11.1 Lishen Technology Company Information
  • 7.11.2 Lishen Technology Introduction and Business Overview
  • 7.11.3 Lishen Technology Semiconductor Packaging Electroplating Solution Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.11.4 Lishen Technology Semiconductor Packaging Electroplating Solution Product Offerings
  • 7.11.5 Lishen Technology Recent Development

8 Industry Chain Analysis

• 8.1 Semiconductor Packaging Electroplating Solution Industrial Chain
• 8.2 Semiconductor Packaging Electroplating Solution Upstream Analysis
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers
  • 8.2.3 Manufacturing Cost Structure
• 8.3 Midstream Analysis
• 8.4 Downstream Analysis (Customers Analysis)
• 8.5 Sales Model and Sales Channels
  • 8.5.1 Semiconductor Packaging Electroplating Solution Sales Model
  • 8.5.2 Sales Channel
  • 8.5.3 Semiconductor Packaging Electroplating Solution Distributors

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
    • 10.1.1.1 Research Programs/Design
    • 10.1.1.2 Market Size Estimation
    • 10.1.1.3 Market Breakdown and Data Triangulation
  • 10.1.2 Data Source
    • 10.1.2.1 Secondary Sources
    • 10.1.2.2 Primary Sources
• 10.2 Author Details
• 10.3 Disclaimer