시스템 인 패키지(SIP) 및 3D 패키징 : 세계 시장 점유율과 순위, 총판매량 및 수요 예측(2025-2031년)

The global market for System In a Package (SIP) and 3D Packaging was estimated to be worth US$ 25750 million in 2024 and is forecast to a readjusted size of US$ 42986 million by 2031 with a CAGR of 7.9% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on System In a Package (SIP) and 3D Packaging cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

A System in a Package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked using package on package. The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together. A SiP is like a system on a chip (SoC) but less tightly integrated and not on a single semiconductor die. SiP dies can be stacked vertically or tiled horizontally, unlike less dense multi-chip modules, which place dies horizontally on a carrier. SiP connects the dies with standard off-chip wire bonds or solder bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies with conductors running through the die. The System in a Package (SIP) and 3D Packaging industry can be broken down into several segments, non 3D Packaging, 3D Packaging, etc.

Market Drivers for System in a Package (SiP)

Miniaturization and Space Efficiency:

Driver: The demand for smaller, more compact electronic devices with increased functionality drives the adoption of SiP technology, allowing manufacturers to integrate multiple components in a smaller footprint.

Performance Optimization:

Driver: SiP enables the integration of diverse components such as processors, memory, RF modules, and sensors in close proximity, optimizing system performance by reducing interconnect lengths and minimizing signal delays.

Time-to-Market Advantage:

Driver: SiP technology offers faster time-to-market for new products by simplifying the design process, reducing development cycles, and streamlining manufacturing processes compared to multi-chip solutions.

Enhanced Functionality and Connectivity:

Driver: SiP allows for the seamless integration of different functionalities, such as wireless communication, sensors, and power management, in a single package, enabling more advanced and feature-rich electronic devices.

Cost Efficiency and Bill of Materials Reduction:

Driver: By integrating multiple components into a single package, SiP technology can reduce the overall bill of materials (BoM), assembly costs, and PCB footprint, leading to cost savings for manufacturers.

Market Challenges for System in a Package (SiP)

Complex Design and Integration Challenges:

Challenge: Designing and integrating multiple components within a single package can be complex, requiring expertise in system-level design, thermal management, signal integrity, and power distribution.

Interconnect and Signal Integrity Issues:

Challenge: Signal integrity issues, such as cross-talk, noise, and impedance mismatches, can arise in SiP designs due to the proximity of components, requiring careful planning and simulation to optimize performance.

Thermal Management and Reliability Concerns:

Challenge: Heat dissipation and thermal management become critical in SiP designs with densely packed components, necessitating efficient cooling solutions and reliability testing to ensure long-term performance.

Testing and Validation Complexity:

Challenge: Testing and validating SiP designs can be challenging due to the integration of multiple functionalities, requiring specialized testing equipment, methodologies, and comprehensive validation processes.

Supply Chain and Manufacturing Coordination:

Challenge: Coordinating the supply chain for diverse components and managing the manufacturing processes for SiP assemblies can be complex, requiring close collaboration between various stakeholders and partners.

This report aims to provide a comprehensive presentation of the global market for System In a Package (SIP) and 3D Packaging, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of System In a Package (SIP) and 3D Packaging by region & country, by Type, and by Application.

The System In a Package (SIP) and 3D Packaging market size, estimations, and forecasts are provided in terms of sales volume (M Pieces) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding System In a Package (SIP) and 3D Packaging.

Market Segmentation

By Company

• Amkor
• SPIL
• JCET
• ASE
• Powertech Technology Inc
• TFME
• ams AG
• UTAC
• Huatian
• Nepes
• Chipmos
• Suzhou Jingfang Semiconductor Technology Co

Segment by Type

• Non 3D Packaging
• 3D Packaging

Segment by Application

• Telecommunications
• Automotive
• Medical Devices
• Consumer Electronics
• Other

By Region

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Australia
  • Rest of Asia-Pacific
• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Netherlands
  • Nordic Countries
  • Rest of Europe
• Latin America
  • Mexico
  • Brazil
  • Rest of Latin America
• Middle East & Africa
  • Turkey
  • Saudi Arabia
  • UAE
  • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of System In a Package (SIP) and 3D Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of System In a Package (SIP) and 3D Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of System In a Package (SIP) and 3D Packaging in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

• 1.1 System In a Package (SIP) and 3D Packaging Product Introduction
• 1.2 Global System In a Package (SIP) and 3D Packaging Market Size Forecast
  • 1.2.1 Global System In a Package (SIP) and 3D Packaging Sales Value (2020-2031)
  • 1.2.2 Global System In a Package (SIP) and 3D Packaging Sales Volume (2020-2031)
  • 1.2.3 Global System In a Package (SIP) and 3D Packaging Sales Price (2020-2031)
• 1.3 System In a Package (SIP) and 3D Packaging Market Trends & Drivers
  • 1.3.1 System In a Package (SIP) and 3D Packaging Industry Trends
  • 1.3.2 System In a Package (SIP) and 3D Packaging Market Drivers & Opportunity
  • 1.3.3 System In a Package (SIP) and 3D Packaging Market Challenges
  • 1.3.4 System In a Package (SIP) and 3D Packaging Market Restraints
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Competitive Analysis by Company

• 2.1 Global System In a Package (SIP) and 3D Packaging Players Revenue Ranking (2024)
• 2.2 Global System In a Package (SIP) and 3D Packaging Revenue by Company (2020-2025)
• 2.3 Global System In a Package (SIP) and 3D Packaging Players Sales Volume Ranking (2024)
• 2.4 Global System In a Package (SIP) and 3D Packaging Sales Volume by Company Players (2020-2025)
• 2.5 Global System In a Package (SIP) and 3D Packaging Average Price by Company (2020-2025)
• 2.6 Key Manufacturers System In a Package (SIP) and 3D Packaging Manufacturing Base and Headquarters
• 2.7 Key Manufacturers System In a Package (SIP) and 3D Packaging Product Offered
• 2.8 Key Manufacturers Time to Begin Mass Production of System In a Package (SIP) and 3D Packaging
• 2.9 System In a Package (SIP) and 3D Packaging Market Competitive Analysis
  • 2.9.1 System In a Package (SIP) and 3D Packaging Market Concentration Rate (2020-2025)
  • 2.9.2 Global 5 and 10 Largest Manufacturers by System In a Package (SIP) and 3D Packaging Revenue in 2024
  • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in System In a Package (SIP) and 3D Packaging as of 2024)
• 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

• 3.1 Introduction by Type
  • 3.1.1 Non 3D Packaging
  • 3.1.2 3D Packaging
• 3.2 Global System In a Package (SIP) and 3D Packaging Sales Value by Type
  • 3.2.1 Global System In a Package (SIP) and 3D Packaging Sales Value by Type (2020 VS 2024 VS 2031)
  • 3.2.2 Global System In a Package (SIP) and 3D Packaging Sales Value, by Type (2020-2031)
  • 3.2.3 Global System In a Package (SIP) and 3D Packaging Sales Value, by Type (%) (2020-2031)
• 3.3 Global System In a Package (SIP) and 3D Packaging Sales Volume by Type
  • 3.3.1 Global System In a Package (SIP) and 3D Packaging Sales Volume by Type (2020 VS 2024 VS 2031)
  • 3.3.2 Global System In a Package (SIP) and 3D Packaging Sales Volume, by Type (2020-2031)
  • 3.3.3 Global System In a Package (SIP) and 3D Packaging Sales Volume, by Type (%) (2020-2031)
• 3.4 Global System In a Package (SIP) and 3D Packaging Average Price by Type (2020-2031)

4 Segmentation by Application

• 4.1 Introduction by Application
  • 4.1.1 Telecommunications
  • 4.1.2 Automotive
  • 4.1.3 Medical Devices
  • 4.1.4 Consumer Electronics
  • 4.1.5 Other
• 4.2 Global System In a Package (SIP) and 3D Packaging Sales Value by Application
  • 4.2.1 Global System In a Package (SIP) and 3D Packaging Sales Value by Application (2020 VS 2024 VS 2031)
  • 4.2.2 Global System In a Package (SIP) and 3D Packaging Sales Value, by Application (2020-2031)
  • 4.2.3 Global System In a Package (SIP) and 3D Packaging Sales Value, by Application (%) (2020-2031)
• 4.3 Global System In a Package (SIP) and 3D Packaging Sales Volume by Application
  • 4.3.1 Global System In a Package (SIP) and 3D Packaging Sales Volume by Application (2020 VS 2024 VS 2031)
  • 4.3.2 Global System In a Package (SIP) and 3D Packaging Sales Volume, by Application (2020-2031)
  • 4.3.3 Global System In a Package (SIP) and 3D Packaging Sales Volume, by Application (%) (2020-2031)
• 4.4 Global System In a Package (SIP) and 3D Packaging Average Price by Application (2020-2031)

5 Segmentation by Region

• 5.1 Global System In a Package (SIP) and 3D Packaging Sales Value by Region
  • 5.1.1 Global System In a Package (SIP) and 3D Packaging Sales Value by Region: 2020 VS 2024 VS 2031
  • 5.1.2 Global System In a Package (SIP) and 3D Packaging Sales Value by Region (2020-2025)
  • 5.1.3 Global System In a Package (SIP) and 3D Packaging Sales Value by Region (2026-2031)
  • 5.1.4 Global System In a Package (SIP) and 3D Packaging Sales Value by Region (%), (2020-2031)
• 5.2 Global System In a Package (SIP) and 3D Packaging Sales Volume by Region
  • 5.2.1 Global System In a Package (SIP) and 3D Packaging Sales Volume by Region: 2020 VS 2024 VS 2031
  • 5.2.2 Global System In a Package (SIP) and 3D Packaging Sales Volume by Region (2020-2025)
  • 5.2.3 Global System In a Package (SIP) and 3D Packaging Sales Volume by Region (2026-2031)
  • 5.2.4 Global System In a Package (SIP) and 3D Packaging Sales Volume by Region (%), (2020-2031)
• 5.3 Global System In a Package (SIP) and 3D Packaging Average Price by Region (2020-2031)
• 5.4 North America
  • 5.4.1 North America System In a Package (SIP) and 3D Packaging Sales Value, 2020-2031
  • 5.4.2 North America System In a Package (SIP) and 3D Packaging Sales Value by Country (%), 2024 VS 2031
• 5.5 Europe
  • 5.5.1 Europe System In a Package (SIP) and 3D Packaging Sales Value, 2020-2031
  • 5.5.2 Europe System In a Package (SIP) and 3D Packaging Sales Value by Country (%), 2024 VS 2031
• 5.6 Asia Pacific
  • 5.6.1 Asia Pacific System In a Package (SIP) and 3D Packaging Sales Value, 2020-2031
  • 5.6.2 Asia Pacific System In a Package (SIP) and 3D Packaging Sales Value by Region (%), 2024 VS 2031
• 5.7 South America
  • 5.7.1 South America System In a Package (SIP) and 3D Packaging Sales Value, 2020-2031
  • 5.7.2 South America System In a Package (SIP) and 3D Packaging Sales Value by Country (%), 2024 VS 2031
• 5.8 Middle East & Africa
  • 5.8.1 Middle East & Africa System In a Package (SIP) and 3D Packaging Sales Value, 2020-2031
  • 5.8.2 Middle East & Africa System In a Package (SIP) and 3D Packaging Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

• 6.1 Key Countries/Regions System In a Package (SIP) and 3D Packaging Sales Value Growth Trends, 2020 VS 2024 VS 2031
• 6.2 Key Countries/Regions System In a Package (SIP) and 3D Packaging Sales Value and Sales Volume
  • 6.2.1 Key Countries/Regions System In a Package (SIP) and 3D Packaging Sales Value, 2020-2031
  • 6.2.2 Key Countries/Regions System In a Package (SIP) and 3D Packaging Sales Volume, 2020-2031
• 6.3 United States
  • 6.3.1 United States System In a Package (SIP) and 3D Packaging Sales Value, 2020-2031
  • 6.3.2 United States System In a Package (SIP) and 3D Packaging Sales Value by Type (%), 2024 VS 2031
  • 6.3.3 United States System In a Package (SIP) and 3D Packaging Sales Value by Application, 2024 VS 2031
• 6.4 Europe
  • 6.4.1 Europe System In a Package (SIP) and 3D Packaging Sales Value, 2020-2031
  • 6.4.2 Europe System In a Package (SIP) and 3D Packaging Sales Value by Type (%), 2024 VS 2031
  • 6.4.3 Europe System In a Package (SIP) and 3D Packaging Sales Value by Application, 2024 VS 2031
• 6.5 China
  • 6.5.1 China System In a Package (SIP) and 3D Packaging Sales Value, 2020-2031
  • 6.5.2 China System In a Package (SIP) and 3D Packaging Sales Value by Type (%), 2024 VS 2031
  • 6.5.3 China System In a Package (SIP) and 3D Packaging Sales Value by Application, 2024 VS 2031
• 6.6 Japan
  • 6.6.1 Japan System In a Package (SIP) and 3D Packaging Sales Value, 2020-2031
  • 6.6.2 Japan System In a Package (SIP) and 3D Packaging Sales Value by Type (%), 2024 VS 2031
  • 6.6.3 Japan System In a Package (SIP) and 3D Packaging Sales Value by Application, 2024 VS 2031
• 6.7 South Korea
  • 6.7.1 South Korea System In a Package (SIP) and 3D Packaging Sales Value, 2020-2031
  • 6.7.2 South Korea System In a Package (SIP) and 3D Packaging Sales Value by Type (%), 2024 VS 2031
  • 6.7.3 South Korea System In a Package (SIP) and 3D Packaging Sales Value by Application, 2024 VS 2031
• 6.8 Southeast Asia
  • 6.8.1 Southeast Asia System In a Package (SIP) and 3D Packaging Sales Value, 2020-2031
  • 6.8.2 Southeast Asia System In a Package (SIP) and 3D Packaging Sales Value by Type (%), 2024 VS 2031
  • 6.8.3 Southeast Asia System In a Package (SIP) and 3D Packaging Sales Value by Application, 2024 VS 2031
• 6.9 India
  • 6.9.1 India System In a Package (SIP) and 3D Packaging Sales Value, 2020-2031
  • 6.9.2 India System In a Package (SIP) and 3D Packaging Sales Value by Type (%), 2024 VS 2031
  • 6.9.3 India System In a Package (SIP) and 3D Packaging Sales Value by Application, 2024 VS 2031

7 Company Profiles

• 7.1 Amkor
  • 7.1.1 Amkor Company Information
  • 7.1.2 Amkor Introduction and Business Overview
  • 7.1.3 Amkor System In a Package (SIP) and 3D Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.1.4 Amkor System In a Package (SIP) and 3D Packaging Product Offerings
  • 7.1.5 Amkor Recent Development
• 7.2 SPIL
  • 7.2.1 SPIL Company Information
  • 7.2.2 SPIL Introduction and Business Overview
  • 7.2.3 SPIL System In a Package (SIP) and 3D Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.2.4 SPIL System In a Package (SIP) and 3D Packaging Product Offerings
  • 7.2.5 SPIL Recent Development
• 7.3 JCET
  • 7.3.1 JCET Company Information
  • 7.3.2 JCET Introduction and Business Overview
  • 7.3.3 JCET System In a Package (SIP) and 3D Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.3.4 JCET System In a Package (SIP) and 3D Packaging Product Offerings
  • 7.3.5 JCET Recent Development
• 7.4 ASE
  • 7.4.1 ASE Company Information
  • 7.4.2 ASE Introduction and Business Overview
  • 7.4.3 ASE System In a Package (SIP) and 3D Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.4.4 ASE System In a Package (SIP) and 3D Packaging Product Offerings
  • 7.4.5 ASE Recent Development
• 7.5 Powertech Technology Inc
  • 7.5.1 Powertech Technology Inc Company Information
  • 7.5.2 Powertech Technology Inc Introduction and Business Overview
  • 7.5.3 Powertech Technology Inc System In a Package (SIP) and 3D Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.5.4 Powertech Technology Inc System In a Package (SIP) and 3D Packaging Product Offerings
  • 7.5.5 Powertech Technology Inc Recent Development
• 7.6 TFME
  • 7.6.1 TFME Company Information
  • 7.6.2 TFME Introduction and Business Overview
  • 7.6.3 TFME System In a Package (SIP) and 3D Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.6.4 TFME System In a Package (SIP) and 3D Packaging Product Offerings
  • 7.6.5 TFME Recent Development
• 7.7 ams AG
  • 7.7.1 ams AG Company Information
  • 7.7.2 ams AG Introduction and Business Overview
  • 7.7.3 ams AG System In a Package (SIP) and 3D Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.7.4 ams AG System In a Package (SIP) and 3D Packaging Product Offerings
  • 7.7.5 ams AG Recent Development
• 7.8 UTAC
  • 7.8.1 UTAC Company Information
  • 7.8.2 UTAC Introduction and Business Overview
  • 7.8.3 UTAC System In a Package (SIP) and 3D Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.8.4 UTAC System In a Package (SIP) and 3D Packaging Product Offerings
  • 7.8.5 UTAC Recent Development
• 7.9 Huatian
  • 7.9.1 Huatian Company Information
  • 7.9.2 Huatian Introduction and Business Overview
  • 7.9.3 Huatian System In a Package (SIP) and 3D Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.9.4 Huatian System In a Package (SIP) and 3D Packaging Product Offerings
  • 7.9.5 Huatian Recent Development
• 7.10 Nepes
  • 7.10.1 Nepes Company Information
  • 7.10.2 Nepes Introduction and Business Overview
  • 7.10.3 Nepes System In a Package (SIP) and 3D Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.10.4 Nepes System In a Package (SIP) and 3D Packaging Product Offerings
  • 7.10.5 Nepes Recent Development
• 7.11 Chipmos
  • 7.11.1 Chipmos Company Information
  • 7.11.2 Chipmos Introduction and Business Overview
  • 7.11.3 Chipmos System In a Package (SIP) and 3D Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.11.4 Chipmos System In a Package (SIP) and 3D Packaging Product Offerings
  • 7.11.5 Chipmos Recent Development
• 7.12 Suzhou Jingfang Semiconductor Technology Co
  • 7.12.1 Suzhou Jingfang Semiconductor Technology Co Company Information
  • 7.12.2 Suzhou Jingfang Semiconductor Technology Co Introduction and Business Overview
  • 7.12.3 Suzhou Jingfang Semiconductor Technology Co System In a Package (SIP) and 3D Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.12.4 Suzhou Jingfang Semiconductor Technology Co System In a Package (SIP) and 3D Packaging Product Offerings
  • 7.12.5 Suzhou Jingfang Semiconductor Technology Co Recent Development

8 Industry Chain Analysis

• 8.1 System In a Package (SIP) and 3D Packaging Industrial Chain
• 8.2 System In a Package (SIP) and 3D Packaging Upstream Analysis
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers
  • 8.2.3 Manufacturing Cost Structure
• 8.3 Midstream Analysis
• 8.4 Downstream Analysis (Customers Analysis)
• 8.5 Sales Model and Sales Channels
  • 8.5.1 System In a Package (SIP) and 3D Packaging Sales Model
  • 8.5.2 Sales Channel
  • 8.5.3 System In a Package (SIP) and 3D Packaging Distributors

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
    • 10.1.1.1 Research Programs/Design
    • 10.1.1.2 Market Size Estimation
    • 10.1.1.3 Market Breakdown and Data Triangulation
  • 10.1.2 Data Source
    • 10.1.2.1 Secondary Sources
    • 10.1.2.2 Primary Sources
• 10.2 Author Details
• 10.3 Disclaimer