시장보고서
상품코드
1868027

세계의 웨이퍼용 건식 에칭 장비 - 시장 점유율과 순위, 전체 판매량 및 수요 예측(2025-2031년)

Wafer Used Dry Etching Equipment - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

발행일: | 리서치사: QYResearch | 페이지 정보: 영문 | 배송안내 : 2-3일 (영업일 기준)

    
    
    




■ 보고서에 따라 최신 정보로 업데이트하여 보내드립니다. 배송일정은 문의해 주시기 바랍니다.

세계의 웨이퍼용 건식 에칭 장비 시장 규모는 2024년에 206억 2,800만 달러로 평가되었고, 2025-2031년의 예측 기간에 CAGR 7.3%로 성장하여 2031년까지 336억 1,500만 달러에 이를 것으로 예측됩니다.

본 보고서는 웨이퍼용 건식 에칭 장비에 대한 최근 관세 조정과 국제적인 전략적 대응 조치에 대해 국경 간 산업 발자국, 자본 배분 패턴, 지역 경제의 상호의존성, 공급망 재편 등의 관점에서 종합적인 평가를 제공합니다.

건식 에칭 하드웨어의 설계는 기본적으로 진공 챔버, 특수 가스 공급 시스템, 플라즈마에 전력을 공급하는 고주파(RF) 파형 발생 장치, 웨이퍼를 고정하는 가열 척, 배기 시스템으로 구성됩니다.

세계 웨이퍼용 건식 에칭 장비 시장에서 상위 5개 업체는 램리서치, 도쿄일렉트론, 어플라이드 머티리얼즈, 히타치 하이테크, SEMES이며, 이들 5개 업체가 시장 점유율의 약 95%를 차지하고 있어 업계는 비교적 집중화되어 있습니다. 생산기지는 주로 북미와 일본에 위치하고 있으며, 북미가 시장 점유율의 약 60%를 차지하여 가장 중요한 생산기지이며, 그 다음으로 일본이 그 뒤를 잇고 있습니다. 제품 유형별로는 실리콘 에칭, 유전체 에칭, 도체 에칭으로 분류되며, 실리콘 에칭과 유전체 에칭이 각각 약 50% 시장 점유율을 차지하고 있습니다. 용도별로는 IDM(수직통합형 반도체 제조업체)과 파운드리(위탁생산) 두 가지로 구분되며, IDM이 약 75% 시장 점유율을 차지하는 주요 분야입니다.

이 보고서는 웨이퍼용 건식 에칭 장비 세계 시장에 대해 총 판매량, 매출액, 가격, 주요 기업의 시장 점유율 및 순위에 초점을 맞추고 지역/국가, 유형 및 용도별 분석을 종합적으로 제시하는 것을 목적으로 합니다.

웨이퍼용 건식 에칭 장비 시장 규모 추정 및 예측은 판매량(대수)과 매출액(백만 달러)으로 제시되며, 2024년을 기준 연도로 2020년에서 2031년까지의 과거 데이터와 예측 데이터를 포함하고 있습니다. 정량적 분석과 정성적 분석을 통해 독자들이 비즈니스/성장 전략을 수립하고, 시장 경쟁 구도를 평가하고, 현재 시장에서의 포지셔닝을 분석하고, 웨이퍼용 건식 에칭 장비에 대한 정보에 입각한 비즈니스 의사결정을 내릴 수 있도록 돕습니다.

시장 세분화

기업별

  • Lam Research
  • Tokyo Electron Limited
  • Applied Materials
  • Hitachi High-Tech
  • SEMES
  • AMEC
  • NAURA
  • SPTS Technologies(KLA)
  • Oxford Instruments
  • ULVAC
  • Plasma-Therm
  • GigaLane
  • VM
  • Jusung Engineering

유형별 부문

  • 실리콘 에칭
  • 유전체 에칭
  • 도체 에칭

용도별 부문

  • IDM
  • 파운드리

지역별

  • 북미
    • 미국
    • 캐나다
  • 아시아태평양
    • 중국
    • 일본
    • 한국
    • 동남아시아
    • 인도
    • 호주
    • 기타 아시아태평양
  • 유럽
    • 독일
    • 프랑스
    • 영국
    • 이탈리아
    • 네덜란드
    • 북유럽 국가
    • 기타 유럽
  • 라틴아메리카
    • 멕시코
    • 브라질
    • 기타 라틴아메리카
  • 중동 및 아프리카
    • 튀르키예
    • 사우디아라비아
    • 아랍에미리트(UAE)
    • 기타 중동 및 아프리카
LSH 25.12.02

자주 묻는 질문

  • 웨이퍼용 건식 에칭 장비 시장 규모는 어떻게 예측되나요?
  • 웨이퍼용 건식 에칭 장비 시장에서 주요 기업은 어디인가요?
  • 웨이퍼용 건식 에칭 장비의 주요 생산 기지는 어디인가요?
  • 웨이퍼용 건식 에칭 장비는 어떤 유형으로 분류되나요?
  • 웨이퍼용 건식 에칭 장비의 주요 용도는 무엇인가요?

The global market for Wafer Used Dry Etching Equipment was estimated to be worth US$ 20628 million in 2024 and is forecast to a readjusted size of US$ 33615 million by 2031 with a CAGR of 7.3% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Wafer Used Dry Etching Equipment cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

The dry etching hardware design basically involves a vacuum chamber, special gas delivery system, radio frequency (RF) waveform generator to supply power to the plasma, heated chuck to seat the wafer, and an exhaust system.

Global Wafer Used Dry Etching Equipment top five companies are Lam Research, Tokyo Electron Limited, Applied Materials, Hitachi High-Tech, SEMES, occupying a total of about 95% of the market share, the industry is relatively concentrated. The production sites are mainly located in North America and Japan, with North America occupying about 60% of the market share and being the most important production site, followed by Japan. In terms of product type, the products can be divided into Silicon Etch, Dielectric Etchg, and Conductor Etch, of which silicon Etch and dielectric Etch both accounting for near 50% of the market share. In terms of its application, the application area can be divided into two types: IDM and foundry, with IDM dominating and occupying about 75% of the market share.

This report aims to provide a comprehensive presentation of the global market for Wafer Used Dry Etching Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Wafer Used Dry Etching Equipment by region & country, by Type, and by Application.

The Wafer Used Dry Etching Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Used Dry Etching Equipment.

Market Segmentation

By Company

  • Lam Research
  • Tokyo Electron Limited
  • Applied Materials
  • Hitachi High-Tech
  • SEMES
  • AMEC
  • NAURA
  • SPTS Technologies (KLA)
  • Oxford Instruments
  • ULVAC
  • Plasma-Therm
  • GigaLane
  • VM
  • Jusung Engineering

Segment by Type

  • Silicon Etch
  • Dielectric Etch
  • Conductor Etch

Segment by Application

  • IDM
  • Foundry

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Wafer Used Dry Etching Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Wafer Used Dry Etching Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Wafer Used Dry Etching Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 Wafer Used Dry Etching Equipment Product Introduction
  • 1.2 Global Wafer Used Dry Etching Equipment Market Size Forecast
    • 1.2.1 Global Wafer Used Dry Etching Equipment Sales Value (2020-2031)
    • 1.2.2 Global Wafer Used Dry Etching Equipment Sales Volume (2020-2031)
    • 1.2.3 Global Wafer Used Dry Etching Equipment Sales Price (2020-2031)
  • 1.3 Wafer Used Dry Etching Equipment Market Trends & Drivers
    • 1.3.1 Wafer Used Dry Etching Equipment Industry Trends
    • 1.3.2 Wafer Used Dry Etching Equipment Market Drivers & Opportunity
    • 1.3.3 Wafer Used Dry Etching Equipment Market Challenges
    • 1.3.4 Wafer Used Dry Etching Equipment Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global Wafer Used Dry Etching Equipment Players Revenue Ranking (2024)
  • 2.2 Global Wafer Used Dry Etching Equipment Revenue by Company (2020-2025)
  • 2.3 Global Wafer Used Dry Etching Equipment Players Sales Volume Ranking (2024)
  • 2.4 Global Wafer Used Dry Etching Equipment Sales Volume by Company Players (2020-2025)
  • 2.5 Global Wafer Used Dry Etching Equipment Average Price by Company (2020-2025)
  • 2.6 Key Manufacturers Wafer Used Dry Etching Equipment Manufacturing Base and Headquarters
  • 2.7 Key Manufacturers Wafer Used Dry Etching Equipment Product Offered
  • 2.8 Key Manufacturers Time to Begin Mass Production of Wafer Used Dry Etching Equipment
  • 2.9 Wafer Used Dry Etching Equipment Market Competitive Analysis
    • 2.9.1 Wafer Used Dry Etching Equipment Market Concentration Rate (2020-2025)
    • 2.9.2 Global 5 and 10 Largest Manufacturers by Wafer Used Dry Etching Equipment Revenue in 2024
    • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Used Dry Etching Equipment as of 2024)
  • 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 Silicon Etch
    • 3.1.2 Dielectric Etch
    • 3.1.3 Conductor Etch
  • 3.2 Global Wafer Used Dry Etching Equipment Sales Value by Type
    • 3.2.1 Global Wafer Used Dry Etching Equipment Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global Wafer Used Dry Etching Equipment Sales Value, by Type (2020-2031)
    • 3.2.3 Global Wafer Used Dry Etching Equipment Sales Value, by Type (%) (2020-2031)
  • 3.3 Global Wafer Used Dry Etching Equipment Sales Volume by Type
    • 3.3.1 Global Wafer Used Dry Etching Equipment Sales Volume by Type (2020 VS 2024 VS 2031)
    • 3.3.2 Global Wafer Used Dry Etching Equipment Sales Volume, by Type (2020-2031)
    • 3.3.3 Global Wafer Used Dry Etching Equipment Sales Volume, by Type (%) (2020-2031)
  • 3.4 Global Wafer Used Dry Etching Equipment Average Price by Type (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 IDM
    • 4.1.2 Foundry
  • 4.2 Global Wafer Used Dry Etching Equipment Sales Value by Application
    • 4.2.1 Global Wafer Used Dry Etching Equipment Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global Wafer Used Dry Etching Equipment Sales Value, by Application (2020-2031)
    • 4.2.3 Global Wafer Used Dry Etching Equipment Sales Value, by Application (%) (2020-2031)
  • 4.3 Global Wafer Used Dry Etching Equipment Sales Volume by Application
    • 4.3.1 Global Wafer Used Dry Etching Equipment Sales Volume by Application (2020 VS 2024 VS 2031)
    • 4.3.2 Global Wafer Used Dry Etching Equipment Sales Volume, by Application (2020-2031)
    • 4.3.3 Global Wafer Used Dry Etching Equipment Sales Volume, by Application (%) (2020-2031)
  • 4.4 Global Wafer Used Dry Etching Equipment Average Price by Application (2020-2031)

5 Segmentation by Region

  • 5.1 Global Wafer Used Dry Etching Equipment Sales Value by Region
    • 5.1.1 Global Wafer Used Dry Etching Equipment Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global Wafer Used Dry Etching Equipment Sales Value by Region (2020-2025)
    • 5.1.3 Global Wafer Used Dry Etching Equipment Sales Value by Region (2026-2031)
    • 5.1.4 Global Wafer Used Dry Etching Equipment Sales Value by Region (%), (2020-2031)
  • 5.2 Global Wafer Used Dry Etching Equipment Sales Volume by Region
    • 5.2.1 Global Wafer Used Dry Etching Equipment Sales Volume by Region: 2020 VS 2024 VS 2031
    • 5.2.2 Global Wafer Used Dry Etching Equipment Sales Volume by Region (2020-2025)
    • 5.2.3 Global Wafer Used Dry Etching Equipment Sales Volume by Region (2026-2031)
    • 5.2.4 Global Wafer Used Dry Etching Equipment Sales Volume by Region (%), (2020-2031)
  • 5.3 Global Wafer Used Dry Etching Equipment Average Price by Region (2020-2031)
  • 5.4 North America
    • 5.4.1 North America Wafer Used Dry Etching Equipment Sales Value, 2020-2031
    • 5.4.2 North America Wafer Used Dry Etching Equipment Sales Value by Country (%), 2024 VS 2031
  • 5.5 Europe
    • 5.5.1 Europe Wafer Used Dry Etching Equipment Sales Value, 2020-2031
    • 5.5.2 Europe Wafer Used Dry Etching Equipment Sales Value by Country (%), 2024 VS 2031
  • 5.6 Asia Pacific
    • 5.6.1 Asia Pacific Wafer Used Dry Etching Equipment Sales Value, 2020-2031
    • 5.6.2 Asia Pacific Wafer Used Dry Etching Equipment Sales Value by Region (%), 2024 VS 2031
  • 5.7 South America
    • 5.7.1 South America Wafer Used Dry Etching Equipment Sales Value, 2020-2031
    • 5.7.2 South America Wafer Used Dry Etching Equipment Sales Value by Country (%), 2024 VS 2031
  • 5.8 Middle East & Africa
    • 5.8.1 Middle East & Africa Wafer Used Dry Etching Equipment Sales Value, 2020-2031
    • 5.8.2 Middle East & Africa Wafer Used Dry Etching Equipment Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions Wafer Used Dry Etching Equipment Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions Wafer Used Dry Etching Equipment Sales Value and Sales Volume
    • 6.2.1 Key Countries/Regions Wafer Used Dry Etching Equipment Sales Value, 2020-2031
    • 6.2.2 Key Countries/Regions Wafer Used Dry Etching Equipment Sales Volume, 2020-2031
  • 6.3 United States
    • 6.3.1 United States Wafer Used Dry Etching Equipment Sales Value, 2020-2031
    • 6.3.2 United States Wafer Used Dry Etching Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.3.3 United States Wafer Used Dry Etching Equipment Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe Wafer Used Dry Etching Equipment Sales Value, 2020-2031
    • 6.4.2 Europe Wafer Used Dry Etching Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.4.3 Europe Wafer Used Dry Etching Equipment Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China Wafer Used Dry Etching Equipment Sales Value, 2020-2031
    • 6.5.2 China Wafer Used Dry Etching Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.5.3 China Wafer Used Dry Etching Equipment Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan Wafer Used Dry Etching Equipment Sales Value, 2020-2031
    • 6.6.2 Japan Wafer Used Dry Etching Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.6.3 Japan Wafer Used Dry Etching Equipment Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea Wafer Used Dry Etching Equipment Sales Value, 2020-2031
    • 6.7.2 South Korea Wafer Used Dry Etching Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.7.3 South Korea Wafer Used Dry Etching Equipment Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia Wafer Used Dry Etching Equipment Sales Value, 2020-2031
    • 6.8.2 Southeast Asia Wafer Used Dry Etching Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.8.3 Southeast Asia Wafer Used Dry Etching Equipment Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India Wafer Used Dry Etching Equipment Sales Value, 2020-2031
    • 6.9.2 India Wafer Used Dry Etching Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.9.3 India Wafer Used Dry Etching Equipment Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 Lam Research
    • 7.1.1 Lam Research Company Information
    • 7.1.2 Lam Research Introduction and Business Overview
    • 7.1.3 Lam Research Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.1.4 Lam Research Wafer Used Dry Etching Equipment Product Offerings
    • 7.1.5 Lam Research Recent Development
  • 7.2 Tokyo Electron Limited
    • 7.2.1 Tokyo Electron Limited Company Information
    • 7.2.2 Tokyo Electron Limited Introduction and Business Overview
    • 7.2.3 Tokyo Electron Limited Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.2.4 Tokyo Electron Limited Wafer Used Dry Etching Equipment Product Offerings
    • 7.2.5 Tokyo Electron Limited Recent Development
  • 7.3 Applied Materials
    • 7.3.1 Applied Materials Company Information
    • 7.3.2 Applied Materials Introduction and Business Overview
    • 7.3.3 Applied Materials Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.3.4 Applied Materials Wafer Used Dry Etching Equipment Product Offerings
    • 7.3.5 Applied Materials Recent Development
  • 7.4 Hitachi High-Tech
    • 7.4.1 Hitachi High-Tech Company Information
    • 7.4.2 Hitachi High-Tech Introduction and Business Overview
    • 7.4.3 Hitachi High-Tech Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.4.4 Hitachi High-Tech Wafer Used Dry Etching Equipment Product Offerings
    • 7.4.5 Hitachi High-Tech Recent Development
  • 7.5 SEMES
    • 7.5.1 SEMES Company Information
    • 7.5.2 SEMES Introduction and Business Overview
    • 7.5.3 SEMES Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.5.4 SEMES Wafer Used Dry Etching Equipment Product Offerings
    • 7.5.5 SEMES Recent Development
  • 7.6 AMEC
    • 7.6.1 AMEC Company Information
    • 7.6.2 AMEC Introduction and Business Overview
    • 7.6.3 AMEC Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.6.4 AMEC Wafer Used Dry Etching Equipment Product Offerings
    • 7.6.5 AMEC Recent Development
  • 7.7 NAURA
    • 7.7.1 NAURA Company Information
    • 7.7.2 NAURA Introduction and Business Overview
    • 7.7.3 NAURA Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.7.4 NAURA Wafer Used Dry Etching Equipment Product Offerings
    • 7.7.5 NAURA Recent Development
  • 7.8 SPTS Technologies (KLA)
    • 7.8.1 SPTS Technologies (KLA) Company Information
    • 7.8.2 SPTS Technologies (KLA) Introduction and Business Overview
    • 7.8.3 SPTS Technologies (KLA) Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.8.4 SPTS Technologies (KLA) Wafer Used Dry Etching Equipment Product Offerings
    • 7.8.5 SPTS Technologies (KLA) Recent Development
  • 7.9 Oxford Instruments
    • 7.9.1 Oxford Instruments Company Information
    • 7.9.2 Oxford Instruments Introduction and Business Overview
    • 7.9.3 Oxford Instruments Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.9.4 Oxford Instruments Wafer Used Dry Etching Equipment Product Offerings
    • 7.9.5 Oxford Instruments Recent Development
  • 7.10 ULVAC
    • 7.10.1 ULVAC Company Information
    • 7.10.2 ULVAC Introduction and Business Overview
    • 7.10.3 ULVAC Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.10.4 ULVAC Wafer Used Dry Etching Equipment Product Offerings
    • 7.10.5 ULVAC Recent Development
  • 7.11 Plasma-Therm
    • 7.11.1 Plasma-Therm Company Information
    • 7.11.2 Plasma-Therm Introduction and Business Overview
    • 7.11.3 Plasma-Therm Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.11.4 Plasma-Therm Wafer Used Dry Etching Equipment Product Offerings
    • 7.11.5 Plasma-Therm Recent Development
  • 7.12 GigaLane
    • 7.12.1 GigaLane Company Information
    • 7.12.2 GigaLane Introduction and Business Overview
    • 7.12.3 GigaLane Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.12.4 GigaLane Wafer Used Dry Etching Equipment Product Offerings
    • 7.12.5 GigaLane Recent Development
  • 7.13 VM
    • 7.13.1 VM Company Information
    • 7.13.2 VM Introduction and Business Overview
    • 7.13.3 VM Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.13.4 VM Wafer Used Dry Etching Equipment Product Offerings
    • 7.13.5 VM Recent Development
  • 7.14 Jusung Engineering
    • 7.14.1 Jusung Engineering Company Information
    • 7.14.2 Jusung Engineering Introduction and Business Overview
    • 7.14.3 Jusung Engineering Wafer Used Dry Etching Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.14.4 Jusung Engineering Wafer Used Dry Etching Equipment Product Offerings
    • 7.14.5 Jusung Engineering Recent Development

8 Industry Chain Analysis

  • 8.1 Wafer Used Dry Etching Equipment Industrial Chain
  • 8.2 Wafer Used Dry Etching Equipment Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 Wafer Used Dry Etching Equipment Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 Wafer Used Dry Etching Equipment Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer
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