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시장보고서
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1871983

인터포저 및 팬아웃 WLP : 세계 시장 점유율과 순위, 총판매량 및 수요 예측(2025-2031년)

Interposer and Fan-Out WLP - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
발행일: | 리서치사: QYResearch | 페이지 정보: 영문 | 배송안내 : 2-3일 (영업일 기준)

    
    
    




■ 보고서에 따라 최신 정보로 업데이트하여 보내드립니다. 배송일정은 문의해 주시기 바랍니다.

세계의 인터포저 및 팬아웃 WLP 시장 규모는 2024년에 87억 4,200만 달러로 추정되며, 2025-2031년의 예측 기간에 CAGR 10.8%로 성장하며, 2031년까지 176억 3,100만 달러로 확대할 것으로 예측되고 있습니다.

첨단 포장 기술의 지속적인 발전 속에서 인터포저 기반 포장과 팬아웃 웨이퍼 레벨 포장(FOWLP)은 고성능 칩 시스템의 이기종 통합 및 소형화 요구를 지원하는 두 가지 핵심 포장 기술 경로가 되었습니다.

인터포저 포장은 고밀도 상호 연결 '인터포저'(일반적으로 실리콘, 유리 또는 유기 물질로 구성)를 패키지 구조에 도입하여 여러 칩(로직 칩, 메모리 등)을 동일한 플랫폼에 통합하는 것입니다. 이 기술은 2.5D 또는 3D 패키징으로 분류되며, 고속 신호 전송, 대역폭 확대, 높은 패키지 밀도 등의 이점을 제공합니다. 특히 고성능 컴퓨팅(HPC), AI 서버, HBM 통합, GPU 등 매우 높은 연산 능력과 전송 효율이 요구되는 용도에 적합합니다.

팬아웃 웨이퍼 레벨 포장(FOWLP)은 베어칩을 재구성된 웨이퍼에 내장하고, 재배선층(RDL) 기술을 사용하여 기존 기판을 사용하지 않고 I/O 신호를 배선하여 패키지 통합을 실현합니다. 이 포장 방식은 구조가 얇고, 크기가 작고, I/O 밀도가 높고, 포장 비용이 낮다는 특징이 있습니다. 모바일 단말기용 칩, RF 모듈, 엣지 AI 프로세서 등 크기 제약과 성능이 중요한 분야에서 널리 채택되고 있습니다.

고성능 컴퓨팅, 모바일 기기, AI 이종 통합 칩에 대한 수요가 증가함에 따라 인터포저 포장과 팬아웃 웨이퍼 레벨 포장은 첨단 포장 시스템에서 중요한 기술적 지주가 되고 있으며, 전 세계 포장 및 테스트 세계 포장 및 테스트 기업의 기술 환경과 경쟁 장벽을 재구축하고 있습니다. 이 분야에서는 ASE, Amkor Technology, Samsung, TSMC 등 국제적인 주요 기업이 공정 개선을 주도하고 있으며, 플랫폼 기반 포장 기술(CoWoS, INFO, FOCoS, SWIFT 등)을 통해 모바일 프로세서, GPU, AI 가속기, RF 모듈 등 하이엔드 시장에서 폭넓은 입지를 구축하고 있습니다. AI 가속기, RF 모듈 등 하이엔드 시장에서 폭넓은 입지를 구축하고 있습니다.

한편, 중국 본토와 아시아태평양에서도 포장 테스트 능력이 빠르게 부상하고 있습니다. 장전과학기술, 동푸미전자, 파워텍 테크놀러지, 화천과학기술, 중국 웨이퍼 레벨 CSP 주식회사 등 기업은 인터포저 및 팬아웃 포장 분야에서 핵심적인 기술력과 산업 기반을 구축했습니다. 일부 기업은 독자적인 플랫폼 구축으로 추격형에서 병행형으로 전환하고 있습니다.

현재 AI 엣지 컴퓨팅, 칩렛 인터커넥트, HBM 고대역폭 스토리지와 같은 신흥 용도에서 인터포저와 팬아웃 포장의 기술 융합이 두드러지게 나타나고 있습니다. 포장은 '후공정 제조'의 역할에서 전략적 '전공정 시스템 아키텍처 설계'의 역할로 진화하고 있습니다. 시스템 제조업체와 IC 설계 고객에게는 안정적인 공정 능력, 시스템 포장의 협업 체계, 첨단 플랫폼 기술을 보유한 파트너를 선정하는 것이 제품 성능과 시장 출시 시기를 결정하는 데 매우 중요합니다. 이러한 변화의 물결 속에서 세대를 초월한 공정 능력과 세계 서비스 경험을 가진 핵심 포장 및 테스트 기업은 첨단 포장 기술의 상용화를 지속적으로 가속화하여 세계 포장 산업을 고성능, 저전력, 시스템 통합의 방향으로 이끌어 갈 것입니다.

이 보고서는 인터포저 및 FOWLP(Fan-Out WLP) 세계 시장에 대해 총매출액, 주요 기업의 시장 점유율 및 순위에 초점을 맞추고 지역/국가, 유형 및 용도별 분석을 종합적으로 제시하는 것을 목표로 합니다.

인터포저 및 FOWLP(Fan-Out WLP) 시장 규모 추정 및 예측은 2024년을 기준 연도로 하여 2020-2031년의 과거 데이터와 예측 데이터를 포함하는 매출액으로 제시되었습니다. 정량적 분석과 정성적 분석을 통해 독자들이 비즈니스/성장 전략을 수립하고, 시장 경쟁 구도를 평가하고, 현재 시장에서의 포지셔닝을 분석하고, 인터포저 및 FOWLP(Fan-Out WLP)에 대한 정보에 입각한 비즈니스 의사결정을 내릴 수 있도록 돕습니다. 할 수 있도록 지원합니다.

시장 세분화

기업별

  • ASE
  • Amkor
  • Samsung
  • TSMC
  • JCET
  • Tongfu
  • Powertech
  • Tianshui Huatian
  • UTAC
  • King Yuan
  • Hana Micro
  • Chipbond
  • ChipMOS
  • Nepes
  • Macronix
  • China Wafer Level CSP Co., Ltd
  • SJ Semiconductor

유형별 부문

  • 인터포저
  • 팬아웃 WLP

용도별 부문

  • CMOS 이미지 센서
  • 무선 접속
  • 로직 및 메모리 집적회로
  • MEMS 및 센서
  • 아날로그 및 하이브리드 집적회로
  • 기타

지역별

  • 북미
    • 미국
    • 캐나다
  • 아시아태평양
    • 중국
    • 일본
    • 한국
    • 동남아시아
    • 인도
    • 호주
    • 기타 아시아태평양
  • 유럽
    • 독일
    • 프랑스
    • 영국
    • 이탈리아
    • 네덜란드
    • 북유럽 국가
    • 기타 유럽
  • 라틴아메리카
    • 멕시코
    • 브라질
    • 기타 라틴아메리카
  • 중동 및 아프리카
    • 튀르키예
    • 사우디아라비아
    • 아랍에미리트
    • 기타 중동 및 아프리카
KSA 25.12.03

자주 묻는 질문

  • 인터포저 및 팬아웃 WLP 시장 규모는 어떻게 예측되나요?
  • 인터포저 포장의 주요 특징은 무엇인가요?
  • 팬아웃 웨이퍼 레벨 포장(FOWLP)의 장점은 무엇인가요?
  • 인터포저 및 팬아웃 포장 기술의 수요가 증가하는 이유는 무엇인가요?
  • 주요 기업들은 어떤 기술을 통해 시장에서 경쟁하고 있나요?
  • 중국 본토와 아시아태평양 지역의 포장 테스트 능력은 어떻게 발전하고 있나요?

The global market for Interposer and Fan-Out WLP was estimated to be worth US$ 8742 million in 2024 and is forecast to a readjusted size of US$ 17631 million by 2031 with a CAGR of 10.8% during the forecast period 2025-2031.

Amid the continuous evolution of advanced packaging technology, interposer-based packaging and fan-out wafer-level packaging (FOWLP) have become two core packaging technology paths to support the heterogeneous integration and miniaturization needs of high-performance chip systems.

Interposer packaging integrates multiple chips (such as logic chips and memory) onto the same platform by introducing a high-density interconnect "interposer" (typically made of silicon, glass, or organic materials) into the packaging structure. This technology, which falls under the 2.5D or 3D packaging category, offers advantages such as high-speed signal transmission, increased bandwidth, and high packaging density. It is particularly suitable for applications such as high-performance computing (HPC), AI servers, HBM integration, and GPUs, which require extremely high computing power and transmission efficiency.

Fan-out wafer-level packaging (FOWLP) achieves package integration by embedding bare chips within a reconstructed wafer and utilizing redistribution layer (RDL) technology to route I/O signals without using a traditional substrate. This packaging method has a thinner structure, smaller size, higher I/O density and lower packaging cost. It is widely used in size-constrained and performance-sensitive fields such as mobile terminal chips, RF modules, and edge AI processors.

With the growing demand for high-performance computing, mobile devices, and AI heterogeneous integrated chips, interposer packaging and fan-out wafer-level packaging are becoming key technological pillars in advanced packaging systems, reshaping the technological landscape and competitive barriers for global packaging and testing companies. In this field, leading international companies such as ASE, Amkor Technology, Samsung, and TSMC continue to lead process iterations and have established a broad presence in high-end markets such as mobile processors, GPUs, AI accelerators, and RF modules through platform-based packaging technologies (such as CoWoS, InFO, FOCoS, and SWIFT).

At the same time, packaging and testing capabilities are rapidly emerging in mainland China and the Asia-Pacific region. Companies such as Changdian Technology, Tongfu Microelectronics, Powertech Technology, Huatian Technology, and China Wafer Level CSP Co., Ltd. have established core technical capabilities and industrial foundations in interposer and fan-out packaging. Some companies have transitioned from following to running alongside by building independent platforms.

Currently, the technological convergence of interposers and fan-out packaging is becoming increasingly prominent for emerging applications such as AI edge computing, chiplet interconnection, and HBM high-bandwidth storage. Packaging is evolving from a "back-end manufacturing" role to a strategic "front-end system architecture design" role. For system manufacturers and IC design clients, selecting partners with stable process capabilities, system packaging collaboration, and advanced platform technologies is becoming crucial for determining product performance and time to market. In this wave of change, core packaging and testing companies with cross-generational process capabilities and global service experience will continue to accelerate the commercialization of advanced packaging technologies, leading the global packaging industry towards high performance, low power consumption, and system integration.

This report aims to provide a comprehensive presentation of the global market for Interposer and Fan-Out WLP, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Interposer and Fan-Out WLP by region & country, by Type, and by Application.

The Interposer and Fan-Out WLP market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Interposer and Fan-Out WLP.

Market Segmentation

By Company

  • ASE
  • Amkor
  • Samsung
  • TSMC
  • JCET
  • Tongfu
  • Powertech
  • Tianshui Huatian
  • UTAC
  • King Yuan
  • Hana Micro
  • Chipbond
  • ChipMOS
  • Nepes
  • Macronix
  • China Wafer Level CSP Co., Ltd
  • SJ Semiconductor

Segment by Type

  • Interposer
  • Fan-Out WLP

Segment by Application

  • CMOS Image Sensor
  • Wireless Connections
  • Logic and Memory Integrated Circuits
  • MEMS and Sensors
  • Analog and Hybrid Integrated Circuits
  • Others

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Interposer and Fan-Out WLP company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Revenue of Interposer and Fan-Out WLP in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Revenue of Interposer and Fan-Out WLP in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 Interposer and Fan-Out WLP Product Introduction
  • 1.2 Global Interposer and Fan-Out WLP Market Size Forecast (2020-2031)
  • 1.3 Interposer and Fan-Out WLP Market Trends & Drivers
    • 1.3.1 Interposer and Fan-Out WLP Industry Trends
    • 1.3.2 Interposer and Fan-Out WLP Market Drivers & Opportunity
    • 1.3.3 Interposer and Fan-Out WLP Market Challenges
    • 1.3.4 Interposer and Fan-Out WLP Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global Interposer and Fan-Out WLP Players Revenue Ranking (2024)
  • 2.2 Global Interposer and Fan-Out WLP Revenue by Company (2020-2025)
  • 2.3 Key Companies Interposer and Fan-Out WLP Manufacturing Base Distribution and Headquarters
  • 2.4 Key Companies Interposer and Fan-Out WLP Product Offered
  • 2.5 Key Companies Time to Begin Mass Production of Interposer and Fan-Out WLP
  • 2.6 Interposer and Fan-Out WLP Market Competitive Analysis
    • 2.6.1 Interposer and Fan-Out WLP Market Concentration Rate (2020-2025)
    • 2.6.2 Global 5 and 10 Largest Companies by Interposer and Fan-Out WLP Revenue in 2024
    • 2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Interposer and Fan-Out WLP as of 2024)
  • 2.7 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 Interposer
    • 3.1.2 Fan-Out WLP
  • 3.2 Global Interposer and Fan-Out WLP Sales Value by Type
    • 3.2.1 Global Interposer and Fan-Out WLP Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global Interposer and Fan-Out WLP Sales Value, by Type (2020-2031)
    • 3.2.3 Global Interposer and Fan-Out WLP Sales Value, by Type (%) (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 CMOS Image Sensor
    • 4.1.2 Wireless Connections
    • 4.1.3 Logic and Memory Integrated Circuits
    • 4.1.4 MEMS and Sensors
    • 4.1.5 Analog and Hybrid Integrated Circuits
    • 4.1.6 Others
  • 4.2 Global Interposer and Fan-Out WLP Sales Value by Application
    • 4.2.1 Global Interposer and Fan-Out WLP Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global Interposer and Fan-Out WLP Sales Value, by Application (2020-2031)
    • 4.2.3 Global Interposer and Fan-Out WLP Sales Value, by Application (%) (2020-2031)

5 Segmentation by Region

  • 5.1 Global Interposer and Fan-Out WLP Sales Value by Region
    • 5.1.1 Global Interposer and Fan-Out WLP Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global Interposer and Fan-Out WLP Sales Value by Region (2020-2025)
    • 5.1.3 Global Interposer and Fan-Out WLP Sales Value by Region (2026-2031)
    • 5.1.4 Global Interposer and Fan-Out WLP Sales Value by Region (%), (2020-2031)
  • 5.2 North America
    • 5.2.1 North America Interposer and Fan-Out WLP Sales Value, 2020-2031
    • 5.2.2 North America Interposer and Fan-Out WLP Sales Value by Country (%), 2024 VS 2031
  • 5.3 Europe
    • 5.3.1 Europe Interposer and Fan-Out WLP Sales Value, 2020-2031
    • 5.3.2 Europe Interposer and Fan-Out WLP Sales Value by Country (%), 2024 VS 2031
  • 5.4 Asia Pacific
    • 5.4.1 Asia Pacific Interposer and Fan-Out WLP Sales Value, 2020-2031
    • 5.4.2 Asia Pacific Interposer and Fan-Out WLP Sales Value by Region (%), 2024 VS 2031
  • 5.5 South America
    • 5.5.1 South America Interposer and Fan-Out WLP Sales Value, 2020-2031
    • 5.5.2 South America Interposer and Fan-Out WLP Sales Value by Country (%), 2024 VS 2031
  • 5.6 Middle East & Africa
    • 5.6.1 Middle East & Africa Interposer and Fan-Out WLP Sales Value, 2020-2031
    • 5.6.2 Middle East & Africa Interposer and Fan-Out WLP Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions Interposer and Fan-Out WLP Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions Interposer and Fan-Out WLP Sales Value, 2020-2031
  • 6.3 United States
    • 6.3.1 United States Interposer and Fan-Out WLP Sales Value, 2020-2031
    • 6.3.2 United States Interposer and Fan-Out WLP Sales Value by Type (%), 2024 VS 2031
    • 6.3.3 United States Interposer and Fan-Out WLP Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe Interposer and Fan-Out WLP Sales Value, 2020-2031
    • 6.4.2 Europe Interposer and Fan-Out WLP Sales Value by Type (%), 2024 VS 2031
    • 6.4.3 Europe Interposer and Fan-Out WLP Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China Interposer and Fan-Out WLP Sales Value, 2020-2031
    • 6.5.2 China Interposer and Fan-Out WLP Sales Value by Type (%), 2024 VS 2031
    • 6.5.3 China Interposer and Fan-Out WLP Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan Interposer and Fan-Out WLP Sales Value, 2020-2031
    • 6.6.2 Japan Interposer and Fan-Out WLP Sales Value by Type (%), 2024 VS 2031
    • 6.6.3 Japan Interposer and Fan-Out WLP Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea Interposer and Fan-Out WLP Sales Value, 2020-2031
    • 6.7.2 South Korea Interposer and Fan-Out WLP Sales Value by Type (%), 2024 VS 2031
    • 6.7.3 South Korea Interposer and Fan-Out WLP Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia Interposer and Fan-Out WLP Sales Value, 2020-2031
    • 6.8.2 Southeast Asia Interposer and Fan-Out WLP Sales Value by Type (%), 2024 VS 2031
    • 6.8.3 Southeast Asia Interposer and Fan-Out WLP Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India Interposer and Fan-Out WLP Sales Value, 2020-2031
    • 6.9.2 India Interposer and Fan-Out WLP Sales Value by Type (%), 2024 VS 2031
    • 6.9.3 India Interposer and Fan-Out WLP Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 ASE
    • 7.1.1 ASE Profile
    • 7.1.2 ASE Main Business
    • 7.1.3 ASE Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.1.4 ASE Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.1.5 ASE Recent Developments
  • 7.2 Amkor
    • 7.2.1 Amkor Profile
    • 7.2.2 Amkor Main Business
    • 7.2.3 Amkor Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.2.4 Amkor Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.2.5 Amkor Recent Developments
  • 7.3 Samsung
    • 7.3.1 Samsung Profile
    • 7.3.2 Samsung Main Business
    • 7.3.3 Samsung Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.3.4 Samsung Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.3.5 Samsung Recent Developments
  • 7.4 TSMC
    • 7.4.1 TSMC Profile
    • 7.4.2 TSMC Main Business
    • 7.4.3 TSMC Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.4.4 TSMC Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.4.5 TSMC Recent Developments
  • 7.5 JCET
    • 7.5.1 JCET Profile
    • 7.5.2 JCET Main Business
    • 7.5.3 JCET Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.5.4 JCET Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.5.5 JCET Recent Developments
  • 7.6 Tongfu
    • 7.6.1 Tongfu Profile
    • 7.6.2 Tongfu Main Business
    • 7.6.3 Tongfu Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.6.4 Tongfu Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.6.5 Tongfu Recent Developments
  • 7.7 Powertech
    • 7.7.1 Powertech Profile
    • 7.7.2 Powertech Main Business
    • 7.7.3 Powertech Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.7.4 Powertech Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.7.5 Powertech Recent Developments
  • 7.8 Tianshui Huatian
    • 7.8.1 Tianshui Huatian Profile
    • 7.8.2 Tianshui Huatian Main Business
    • 7.8.3 Tianshui Huatian Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.8.4 Tianshui Huatian Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.8.5 Tianshui Huatian Recent Developments
  • 7.9 UTAC
    • 7.9.1 UTAC Profile
    • 7.9.2 UTAC Main Business
    • 7.9.3 UTAC Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.9.4 UTAC Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.9.5 UTAC Recent Developments
  • 7.10 King Yuan
    • 7.10.1 King Yuan Profile
    • 7.10.2 King Yuan Main Business
    • 7.10.3 King Yuan Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.10.4 King Yuan Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.10.5 King Yuan Recent Developments
  • 7.11 Hana Micro
    • 7.11.1 Hana Micro Profile
    • 7.11.2 Hana Micro Main Business
    • 7.11.3 Hana Micro Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.11.4 Hana Micro Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.11.5 Hana Micro Recent Developments
  • 7.12 Chipbond
    • 7.12.1 Chipbond Profile
    • 7.12.2 Chipbond Main Business
    • 7.12.3 Chipbond Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.12.4 Chipbond Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.12.5 Chipbond Recent Developments
  • 7.13 ChipMOS
    • 7.13.1 ChipMOS Profile
    • 7.13.2 ChipMOS Main Business
    • 7.13.3 ChipMOS Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.13.4 ChipMOS Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.13.5 ChipMOS Recent Developments
  • 7.14 Nepes
    • 7.14.1 Nepes Profile
    • 7.14.2 Nepes Main Business
    • 7.14.3 Nepes Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.14.4 Nepes Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.14.5 Nepes Recent Developments
  • 7.15 Macronix
    • 7.15.1 Macronix Profile
    • 7.15.2 Macronix Main Business
    • 7.15.3 Macronix Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.15.4 Macronix Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.15.5 Macronix Recent Developments
  • 7.16 China Wafer Level CSP Co., Ltd
    • 7.16.1 China Wafer Level CSP Co., Ltd Profile
    • 7.16.2 China Wafer Level CSP Co., Ltd Main Business
    • 7.16.3 China Wafer Level CSP Co., Ltd Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.16.4 China Wafer Level CSP Co., Ltd Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.16.5 China Wafer Level CSP Co., Ltd Recent Developments
  • 7.17 SJ Semiconductor
    • 7.17.1 SJ Semiconductor Profile
    • 7.17.2 SJ Semiconductor Main Business
    • 7.17.3 SJ Semiconductor Interposer and Fan-Out WLP Products, Services and Solutions
    • 7.17.4 SJ Semiconductor Interposer and Fan-Out WLP Revenue (US$ Million) & (2020-2025)
    • 7.17.5 SJ Semiconductor Recent Developments

8 Industry Chain Analysis

  • 8.1 Interposer and Fan-Out WLP Industrial Chain
  • 8.2 Interposer and Fan-Out WLP Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 Interposer and Fan-Out WLP Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 Interposer and Fan-Out WLP Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer
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