시장보고서
상품코드
1874467

세계의 무전해도금 용액 : 시장 점유율과 순위, 전체 판매량 및 수요 예측(2025-2031년)

Electroless Plating Solutions - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

발행일: | 리서치사: QYResearch | 페이지 정보: 영문 | 배송안내 : 2-3일 (영업일 기준)

    
    
    




■ 보고서에 따라 최신 정보로 업데이트하여 보내드립니다. 배송일정은 문의해 주시기 바랍니다.

세계의 무전해도금 용액 시장 규모는 2024년에 45억 1,500만 달러로 평가되었고, 2025-2031년의 예측 기간에 CAGR 4.9%로 성장을 지속하여, 2031년까지 63억 1,700만 달러에 이를 것으로 예측됩니다.

이 보고서는 무전해 도금 솔루션의 국경 간 산업적 발자취, 자본 배분 패턴, 지역 경제의 상호 의존성, 공급망 재구축, 최근 관세 조정 및 국제적인 전략적 대응 조치에 대한 종합적인 평가를 제공합니다.

무전해 도금 용액은 자기 촉매 화학 환원 반응을 통해 재료 표면에 금속 또는 합금 피막을 증착시키는 표면 처리 기술입니다. 화학도금과 전기도금의 가장 큰 차이점은 피막의 증착을 구동하는 방식에 있습니다.

본고에서는 ENEPIG, ENIG, 무전해 니켈, 무전해 금, 무전해 구리, 무전해 주석, 무전해 은을 포함한 모든 유형의 무전해 도금 용액에 초점을 맞출 것입니다.

다른 공정 용액 시스템의 관점에서 볼 때, 주류 무전해 도금 용액에는 ENIG, ENEPIG, 무전해 구리 도금, 무전해 니켈 도금, 무전해 주석 도금, 무전해 금도금, 무전해 은도금 등이 있습니다. 각기 다른 솔루션 시스템은 각각 다른 적용 시나리오를 가지고 있습니다. 예를 들어, 무전해 니켈 도금은 가장 널리 사용되고 있으며, 인쇄 회로 기판(PCB), 반도체, 자동차, 산업기계, 석유 화학 등의 분야에서 채택되고 있습니다. 한편, ENIG와 ENEPIG는 주로 PCB와 반도체 분야에서 사용되고 있습니다. 현재 무전해 구리 도금 용액은 전체 용도 중 가장 높은 비율을 차지하고 있습니다. 반도체 첨단 패키징 기판 시장 침투율이 높아지는 가운데, ENIG와 ENEPIG는 각각의 장점으로 인해 2031년까지 ENIG와 ENEPIG 솔루션 시장 점유율이 27%를 넘어설 것으로 예측됩니다.

현재 세계 무전해 도금 솔루션의 주요 제조업체로는 C. Uyemura &Co, Atotech(MKS), Dupont, MacDermid Enthone Industrial Solutions, JCU Corporation, YMT, MK Chem &Tech Co. Ltd, GHTECH, OKUNO Chemical Industries 등을 들 수 있습니다. 향후 몇 년 동안 업계의 경쟁은 더욱 치열해지고 시장은 세분화될 것으로 예상되지만, 하이엔드 응용 시장은 여전히 주요 기업이 주도할 것입니다. 세계 하이엔드 PCB 분야의 무전해 도금 솔루션의 주류 기업으로는 Atotech(MKS), 맥더미드 엔톤 인더스트리얼 솔루션즈(MKS) 등을 들 수 있습니다. 이들 기업은 브랜드 인지도, 제품 기술 등 측면에서 중국 현지 기업보다 여전히 우위를 점하고 있습니다. 최근 몇 년 동안 하류 시장 수요 증가와 산업 기술 수준의 지속적인 향상으로 PCB, 전자 반도체, 신에너지 자동차 등 산업은 좋은 발전 기회를 맞이하고 있습니다. 중국 내수 시장에서도 기술 혁신과 현지화 서비스를 기반으로 중국 현지 제조업체(GHTech, 광저우삼복신소재과학기술유한공사, 광동천과과학기술 등)가 점차 부상하며 시장 점유율을 확대하고 있습니다.

무전해 도금 용액의 향후 동향은 주로 다음과 같은 점으로 나타납니다.

1. 고성능화 및 맞춤화: 고급 PCB, 첨단 반도체 패키징, 자동차 전자기기, 광센서, 항공우주 등 분야의 발전에 따라 무전해 도금 솔루션은 높은 균일성, 고순도, 초박막 코팅, 환경 친화적인 무시안화 공정 등 더 높은 요구사항이 요구되고 있습니다. 무전해 도금 솔루션은 점차 고성능화 및 맞춤화 방향으로 발전할 것입니다. 특히 높은 균일성은 주로 용액 배합의 정확도에 반영됩니다. IC 기판 및 웨이퍼 레벨 패키징의 응용 분야에서는 미세 배선 피치가 서브마이크론 수준으로 축소되어 화학 도금층이 기판 표면 전체에 걸쳐 매우 높은 균일성을 유지해야 하며, 과도금과 같은 문제를 피해야 합니다.

2. 환경 보호 : 세계 환경 보호 규정(RoHS, REACH, 중국 녹색 제조 시스템 등)이 강화됨에 따라 무전해 도금 솔루션은 다음과 같은 세 가지 업계 동향을 추진하고 있습니다 : 1, 무 시안화 금염 기술의 빠른 진화, 2, 저독성 환원제 침투 촉진, 3, 환경 친화적 인 무전해 도금 솔루션 시장 규모 확대.

3. 저인/무인 공정: 기존의 무전해 니켈 도금은 주로 인산나트륨을 환원제로 사용하기 때문에 Ni-P 합금 도금층의 인 함량은 일반적으로 10% 내외로 높습니다. 기술 혁신과 발전에 따라 하류 산업에서 도금액의 신뢰성과 환경 보호에 대한 요구가 높아지고 있습니다. 예를 들어, 고주파 및 고속 통신 및 데이터 전송에서 고인 니켈-인 합금은 신호 손실이 발생하기 쉽고, 저인/무인 무전해 니켈 도금은 전송 효율을 크게 향상시킬 수 있습니다.

이 보고서는 무전해 도금 솔루션 세계 시장에 대해 총 판매량, 매출, 가격, 주요 기업의 시장 점유율 및 순위에 초점을 맞추고 지역/국가, 유형 및 용도별 분석을 종합적으로 제시하는 것을 목적으로 합니다.

무전해 도금 솔루션 시장 규모와 추정 및 예측은 판매량(톤)과 매출액(백만 달러)으로 제시되며, 2024년을 기준 연도로 하여, 2020년에서 2031년까지의 과거 데이터와 예측 데이터를 포함하는 2024년부터 2031년까지 시장 규모를 조사했습니다. 정량적, 정성적 분석을 통해 독자들이 무전해 도금 솔루션에 대한 사업 전략 및 성장 전략 수립, 시장 경쟁 평가, 현재 시장에서의 자사 포지셔닝 분석, 정보에 입각한 비즈니스 의사결정을 할 수 있도록 지원합니다.

시장 세분화

기업별

  • C. Uyemura & Co
  • Atotech(MKS)
  • Dupont
  • MacDermid Enthone Industrial Solutions
  • OKUNO Chemical Industries
  • JCU Corporation
  • GHTECH
  • Guangdong Skychem Technology
  • Shenzhen Baikal Electronic Materials Co., Ltd
  • Jetchem
  • Guangzhou Sanfu New Materials Technology Co., Ltd
  • Shenzhen Chuangzhi Success Technology
  • HLHC
  • Shenhzen Yicheng
  • Shenzhen Hotchain
  • Shenzhen ZhengTianWei Science&Technology
  • Shenzhen Songbai
  • TANAKA
  • Shenzhen Xingjingwei
  • Kanigen
  • Guangdong Shuo Cheng Technology
  • Hubei Harvar
  • YMT
  • MK Chem & Tech Co., Ltd
  • JX Advanced Metals Corp
  • PacTech
  • KPM Tech Vina
  • Japan Pure Chemical
  • Micron Coatings Group
  • Argos
  • KC Jones Plating Company

유형별 부문

  • ENEPIG
  • ENIG
  • 무전해니켈 용액
  • 무전해동용액
  • 무전해금 용액
  • 무전해주석 용액
  • 무전해은 및 기타

용도별 부문

  • 반도체
  • 인쇄회로기판
  • 자동차
  • 장식
  • 광학 디바이스
  • 항공우주
  • 전기 기기
  • 산업기계
  • 석유화학
  • 기타

지역별

  • 북미
    • 미국
    • 캐나다
  • 아시아태평양
    • 중국
    • 일본
    • 한국
    • 동남아시아
    • 인도
    • 호주
    • 기타 아시아태평양
  • 유럽
    • 독일
    • 프랑스
    • 영국
    • 이탈리아
    • 네덜란드
    • 북유럽 국가
    • 기타 유럽
  • 라틴아메리카
    • 멕시코
    • 브라질
    • 기타 라틴아메리카
  • 중동 및 아프리카
    • 튀르키예
    • 사우디아라비아
    • 아랍에미리트(UAE)
    • 기타 중동 및 아프리카
LSH 25.12.23

자주 묻는 질문

  • 무전해 도금 용액 시장 규모는 어떻게 예측되나요?
  • 무전해 도금 솔루션의 주요 제조업체는 어디인가요?
  • 무전해 도금 솔루션의 향후 동향은 무엇인가요?
  • 무전해 도금 용액의 주요 유형은 무엇인가요?
  • 무전해 도금 솔루션의 주요 용도는 무엇인가요?

The global market for Electroless Plating Solutions was estimated to be worth US$ 4515 million in 2024 and is forecast to a readjusted size of US$ 6317 million by 2031 with a CAGR of 4.9% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Electroless Plating Solutions cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

Electroless Plating Solution is a surface treatment solution that deposits a metal or alloy film on the surface of a material through an autocatalytic chemical reduction reaction. The biggest difference between chemical plating and electroplating is the way to drive the deposition of the coating.

This article focuses on all types of Electroless Plating Solutions, including ENEPIG, ENIG, Electroless Nickel, Electroless Gold, Electroless Copper, Electroless Tin, and Electroless Silver.

From the perspective of different process solution systems, the mainstream Electroless Plating Solutions include ENIG, ENEPIG, Electroless Plating copper, Electroless Plating nickel, Electroless Plating tin, Electroless Plating gold, Electroless Plating silver, etc. Different solution systems have different application scenarios. For example, Electroless Plating nickel is the most widely used, such as PCB, semiconductors, automobiles, industrial machinery, petrochemicals and other scenarios, while ENIG and ENEPIG are mainly used in PCB and semiconductors. At present, Electroless Plating copper solution accounts for the highest proportion in the entire application. With the increase in the market penetration rate of semiconductor advanced packaging substrates, ENIG and ENEPIG are expected to exceed 27% of the market share of ENIG and ENEPIG solutions by 2031 due to their own advantages.

At present, the core manufacturers of Electroless Plating Solutions in the world mainly include C. Uyemura & Co, Atotech (MKS), Dupont, MacDermid Enthone Industrial Solutions, JCU Corporation, YMT, MK Chem & Tech Co., Ltd, GHTECH, OKUNO Chemical Industries, etc. It is expected that the industry competition will be more significant in the next few years, and the market will be fragmented, but the high-end application market will still be dominated by leading companies. In the global high-end PCB field, the mainstream companies of Electroless Plating Solutions include Atotech (MKS), MacDermid Enthone Industrial Solutions, etc. These companies still have obvious advantages over Chinese local companies in terms of brand awareness, product technology, etc. In recent years, with the expansion of downstream market demand and the continuous improvement of industry technology level, industries such as PCB, electronic semiconductors, and new energy vehicles are facing good development opportunities. Chinese local manufacturers (GHTECH, Guangzhou Sanfu New Materials Technology Co., Ltd, Guangdong Skychem Technology, etc.) are also gradually emerging in the domestic market in China, relying on their technological innovation and localized services to gradually expand their market share.

The future trends of Electroless Plating Solutions are mainly reflected in the following aspects:

1. High performance and customization: With the development of high-end PCB, advanced semiconductor packaging, automotive electronics, optical sensors, aerospace and other fields, higher requirements are put forward for Electroless Plating Solutions, such as high uniformity, high purity, ultra-thin coating, environmentally friendly cyanide-free process, etc. Electroless Plating Solutions will gradually develop in the direction of high performance and customization. Among them, high uniformity is mainly reflected in the precision of the potion formula. In IC substrates and wafer-level packaging applications, the spacing of fine lines is getting smaller and smaller, reaching the sub-micron level, which requires the chemical plating layer to maintain extremely high uniformity on the entire substrate surface to avoid problems such as overplating.

2. Environmental protection: Global environmental protection regulations are becoming stricter (such as RoHS, REACH, and China's green manufacturing system), which promotes Electroless Plating Solutions to present three major industry trends: 1) Accelerated iteration of cyanide-free gold salt technology; 2) Improved penetration of low-toxic reducing agents; 3) Expansion of the market scale of environmentally friendly Electroless Plating Solutions.

3. Low-phosphorus/phosphorus-free process: Traditional Electroless Plating nickel mainly uses sodium hypophosphite as a reducing agent, resulting in a high phosphorus content in the Ni-P alloy coating, generally around 10%. With technological innovation and development, downstream industries have higher requirements for the reliability and environmental protection of the solution. For example, in high-frequency, high-speed communications and data transmission, high-phosphorus Ni-P is prone to signal loss, and low-phosphorus/phosphorus-free Electroless Plating nickel can significantly improve transmission efficiency.

This report aims to provide a comprehensive presentation of the global market for Electroless Plating Solutions, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Electroless Plating Solutions by region & country, by Type, and by Application.

The Electroless Plating Solutions market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electroless Plating Solutions.

Market Segmentation

By Company

  • C. Uyemura & Co
  • Atotech (MKS)
  • Dupont
  • MacDermid Enthone Industrial Solutions
  • OKUNO Chemical Industries
  • JCU Corporation
  • GHTECH
  • Guangdong Skychem Technology
  • Shenzhen Baikal Electronic Materials Co., Ltd
  • Jetchem
  • Guangzhou Sanfu New Materials Technology Co., Ltd
  • Shenzhen Chuangzhi Success Technology
  • HLHC
  • Shenhzen Yicheng
  • Shenzhen Hotchain
  • Shenzhen ZhengTianWei Science&Technology
  • Shenzhen Songbai
  • TANAKA
  • Shenzhen Xingjingwei
  • Kanigen
  • Guangdong Shuo Cheng Technology
  • Hubei Harvar
  • YMT
  • MK Chem & Tech Co., Ltd
  • JX Advanced Metals Corp
  • PacTech
  • KPM Tech Vina
  • Japan Pure Chemical
  • Micron Coatings Group
  • Argos
  • KC Jones Plating Company

Segment by Type

  • ENEPIG
  • ENIG
  • Electroless Nickel Solution
  • Electroless Copper Solution
  • Electroless Gold Solution
  • Electroless Tin Solution
  • Electroless Silver and Others

Segment by Application

  • Semiconductor
  • PCB
  • Automotive
  • Decoration
  • Optical Devices
  • Aerospace
  • Electrical Appliances
  • Industrial Machinery
  • Petrochemical
  • Others

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Electroless Plating Solutions manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Electroless Plating Solutions in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Electroless Plating Solutions in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 Electroless Plating Solutions Product Introduction
  • 1.2 Global Electroless Plating Solutions Market Size Forecast
    • 1.2.1 Global Electroless Plating Solutions Sales Value (2020-2031)
    • 1.2.2 Global Electroless Plating Solutions Sales Volume (2020-2031)
    • 1.2.3 Global Electroless Plating Solutions Sales Price (2020-2031)
  • 1.3 Electroless Plating Solutions Market Trends & Drivers
    • 1.3.1 Electroless Plating Solutions Industry Trends
    • 1.3.2 Electroless Plating Solutions Market Drivers & Opportunity
    • 1.3.3 Electroless Plating Solutions Market Challenges
    • 1.3.4 Electroless Plating Solutions Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global Electroless Plating Solutions Players Revenue Ranking (2024)
  • 2.2 Global Electroless Plating Solutions Revenue by Company (2020-2025)
  • 2.3 Global Electroless Plating Solutions Players Sales Volume Ranking (2024)
  • 2.4 Global Electroless Plating Solutions Sales Volume by Company Players (2020-2025)
  • 2.5 Global Electroless Plating Solutions Average Price by Company (2020-2025)
  • 2.6 Key Manufacturers Electroless Plating Solutions Manufacturing Base and Headquarters
  • 2.7 Key Manufacturers Electroless Plating Solutions Product Offered
  • 2.8 Key Manufacturers Time to Begin Mass Production of Electroless Plating Solutions
  • 2.9 Electroless Plating Solutions Market Competitive Analysis
    • 2.9.1 Electroless Plating Solutions Market Concentration Rate (2020-2025)
    • 2.9.2 Global 5 and 10 Largest Manufacturers by Electroless Plating Solutions Revenue in 2024
    • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Electroless Plating Solutions as of 2024)
  • 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 ENEPIG
    • 3.1.2 ENIG
    • 3.1.3 Electroless Nickel Solution
    • 3.1.4 Electroless Copper Solution
    • 3.1.5 Electroless Gold Solution
    • 3.1.6 Electroless Tin Solution
    • 3.1.7 Electroless Silver and Others
  • 3.2 Global Electroless Plating Solutions Sales Value by Type
    • 3.2.1 Global Electroless Plating Solutions Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global Electroless Plating Solutions Sales Value, by Type (2020-2031)
    • 3.2.3 Global Electroless Plating Solutions Sales Value, by Type (%) (2020-2031)
  • 3.3 Global Electroless Plating Solutions Sales Volume by Type
    • 3.3.1 Global Electroless Plating Solutions Sales Volume by Type (2020 VS 2024 VS 2031)
    • 3.3.2 Global Electroless Plating Solutions Sales Volume, by Type (2020-2031)
    • 3.3.3 Global Electroless Plating Solutions Sales Volume, by Type (%) (2020-2031)
  • 3.4 Global Electroless Plating Solutions Average Price by Type (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 Semiconductor
    • 4.1.2 PCB
    • 4.1.3 Automotive
    • 4.1.4 Decoration
    • 4.1.5 Optical Devices
    • 4.1.6 Aerospace
    • 4.1.7 Electrical Appliances
    • 4.1.8 Industrial Machinery
    • 4.1.9 Petrochemical
  • 4.2 Global Electroless Plating Solutions Sales Value by Application
    • 4.2.1 Global Electroless Plating Solutions Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global Electroless Plating Solutions Sales Value, by Application (2020-2031)
    • 4.2.3 Global Electroless Plating Solutions Sales Value, by Application (%) (2020-2031)
  • 4.3 Global Electroless Plating Solutions Sales Volume by Application
    • 4.3.1 Global Electroless Plating Solutions Sales Volume by Application (2020 VS 2024 VS 2031)
    • 4.3.2 Global Electroless Plating Solutions Sales Volume, by Application (2020-2031)
    • 4.3.3 Global Electroless Plating Solutions Sales Volume, by Application (%) (2020-2031)
  • 4.4 Global Electroless Plating Solutions Average Price by Application (2020-2031)

5 Segmentation by Region

  • 5.1 Global Electroless Plating Solutions Sales Value by Region
    • 5.1.1 Global Electroless Plating Solutions Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global Electroless Plating Solutions Sales Value by Region (2020-2025)
    • 5.1.3 Global Electroless Plating Solutions Sales Value by Region (2026-2031)
    • 5.1.4 Global Electroless Plating Solutions Sales Value by Region (%), (2020-2031)
  • 5.2 Global Electroless Plating Solutions Sales Volume by Region
    • 5.2.1 Global Electroless Plating Solutions Sales Volume by Region: 2020 VS 2024 VS 2031
    • 5.2.2 Global Electroless Plating Solutions Sales Volume by Region (2020-2025)
    • 5.2.3 Global Electroless Plating Solutions Sales Volume by Region (2026-2031)
    • 5.2.4 Global Electroless Plating Solutions Sales Volume by Region (%), (2020-2031)
  • 5.3 Global Electroless Plating Solutions Average Price by Region (2020-2031)
  • 5.4 North America
    • 5.4.1 North America Electroless Plating Solutions Sales Value, 2020-2031
    • 5.4.2 North America Electroless Plating Solutions Sales Value by Country (%), 2024 VS 2031
  • 5.5 Europe
    • 5.5.1 Europe Electroless Plating Solutions Sales Value, 2020-2031
    • 5.5.2 Europe Electroless Plating Solutions Sales Value by Country (%), 2024 VS 2031
  • 5.6 Asia Pacific
    • 5.6.1 Asia Pacific Electroless Plating Solutions Sales Value, 2020-2031
    • 5.6.2 Asia Pacific Electroless Plating Solutions Sales Value by Region (%), 2024 VS 2031
  • 5.7 South America
    • 5.7.1 South America Electroless Plating Solutions Sales Value, 2020-2031
    • 5.7.2 South America Electroless Plating Solutions Sales Value by Country (%), 2024 VS 2031
  • 5.8 Middle East & Africa
    • 5.8.1 Middle East & Africa Electroless Plating Solutions Sales Value, 2020-2031
    • 5.8.2 Middle East & Africa Electroless Plating Solutions Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions Electroless Plating Solutions Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions Electroless Plating Solutions Sales Value and Sales Volume
    • 6.2.1 Key Countries/Regions Electroless Plating Solutions Sales Value, 2020-2031
    • 6.2.2 Key Countries/Regions Electroless Plating Solutions Sales Volume, 2020-2031
  • 6.3 United States
    • 6.3.1 United States Electroless Plating Solutions Sales Value, 2020-2031
    • 6.3.2 United States Electroless Plating Solutions Sales Value by Type (%), 2024 VS 2031
    • 6.3.3 United States Electroless Plating Solutions Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe Electroless Plating Solutions Sales Value, 2020-2031
    • 6.4.2 Europe Electroless Plating Solutions Sales Value by Type (%), 2024 VS 2031
    • 6.4.3 Europe Electroless Plating Solutions Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China Electroless Plating Solutions Sales Value, 2020-2031
    • 6.5.2 China Electroless Plating Solutions Sales Value by Type (%), 2024 VS 2031
    • 6.5.3 China Electroless Plating Solutions Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan Electroless Plating Solutions Sales Value, 2020-2031
    • 6.6.2 Japan Electroless Plating Solutions Sales Value by Type (%), 2024 VS 2031
    • 6.6.3 Japan Electroless Plating Solutions Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea Electroless Plating Solutions Sales Value, 2020-2031
    • 6.7.2 South Korea Electroless Plating Solutions Sales Value by Type (%), 2024 VS 2031
    • 6.7.3 South Korea Electroless Plating Solutions Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia Electroless Plating Solutions Sales Value, 2020-2031
    • 6.8.2 Southeast Asia Electroless Plating Solutions Sales Value by Type (%), 2024 VS 2031
    • 6.8.3 Southeast Asia Electroless Plating Solutions Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India Electroless Plating Solutions Sales Value, 2020-2031
    • 6.9.2 India Electroless Plating Solutions Sales Value by Type (%), 2024 VS 2031
    • 6.9.3 India Electroless Plating Solutions Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 C. Uyemura & Co
    • 7.1.1 C. Uyemura & Co Company Information
    • 7.1.2 C. Uyemura & Co Introduction and Business Overview
    • 7.1.3 C. Uyemura & Co Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.1.4 C. Uyemura & Co Electroless Plating Solutions Product Offerings
    • 7.1.5 C. Uyemura & Co Recent Development
  • 7.2 Atotech (MKS)
    • 7.2.1 Atotech (MKS) Company Information
    • 7.2.2 Atotech (MKS) Introduction and Business Overview
    • 7.2.3 Atotech (MKS) Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.2.4 Atotech (MKS) Electroless Plating Solutions Product Offerings
    • 7.2.5 Atotech (MKS) Recent Development
  • 7.3 Dupont
    • 7.3.1 Dupont Company Information
    • 7.3.2 Dupont Introduction and Business Overview
    • 7.3.3 Dupont Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.3.4 Dupont Electroless Plating Solutions Product Offerings
    • 7.3.5 Dupont Recent Development
  • 7.4 MacDermid Enthone Industrial Solutions
    • 7.4.1 MacDermid Enthone Industrial Solutions Company Information
    • 7.4.2 MacDermid Enthone Industrial Solutions Introduction and Business Overview
    • 7.4.3 MacDermid Enthone Industrial Solutions Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.4.4 MacDermid Enthone Industrial Solutions Electroless Plating Solutions Product Offerings
    • 7.4.5 MacDermid Enthone Industrial Solutions Recent Development
  • 7.5 OKUNO Chemical Industries
    • 7.5.1 OKUNO Chemical Industries Company Information
    • 7.5.2 OKUNO Chemical Industries Introduction and Business Overview
    • 7.5.3 OKUNO Chemical Industries Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.5.4 OKUNO Chemical Industries Electroless Plating Solutions Product Offerings
    • 7.5.5 OKUNO Chemical Industries Recent Development
  • 7.6 JCU Corporation
    • 7.6.1 JCU Corporation Company Information
    • 7.6.2 JCU Corporation Introduction and Business Overview
    • 7.6.3 JCU Corporation Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.6.4 JCU Corporation Electroless Plating Solutions Product Offerings
    • 7.6.5 JCU Corporation Recent Development
  • 7.7 GHTECH
    • 7.7.1 GHTECH Company Information
    • 7.7.2 GHTECH Introduction and Business Overview
    • 7.7.3 GHTECH Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.7.4 GHTECH Electroless Plating Solutions Product Offerings
    • 7.7.5 GHTECH Recent Development
  • 7.8 Guangdong Skychem Technology
    • 7.8.1 Guangdong Skychem Technology Company Information
    • 7.8.2 Guangdong Skychem Technology Introduction and Business Overview
    • 7.8.3 Guangdong Skychem Technology Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.8.4 Guangdong Skychem Technology Electroless Plating Solutions Product Offerings
    • 7.8.5 Guangdong Skychem Technology Recent Development
  • 7.9 Shenzhen Baikal Electronic Materials Co., Ltd
    • 7.9.1 Shenzhen Baikal Electronic Materials Co., Ltd Company Information
    • 7.9.2 Shenzhen Baikal Electronic Materials Co., Ltd Introduction and Business Overview
    • 7.9.3 Shenzhen Baikal Electronic Materials Co., Ltd Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.9.4 Shenzhen Baikal Electronic Materials Co., Ltd Electroless Plating Solutions Product Offerings
    • 7.9.5 Shenzhen Baikal Electronic Materials Co., Ltd Recent Development
  • 7.10 Jetchem
    • 7.10.1 Jetchem Company Information
    • 7.10.2 Jetchem Introduction and Business Overview
    • 7.10.3 Jetchem Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.10.4 Jetchem Electroless Plating Solutions Product Offerings
    • 7.10.5 Jetchem Recent Development
  • 7.11 Guangzhou Sanfu New Materials Technology Co., Ltd
    • 7.11.1 Guangzhou Sanfu New Materials Technology Co., Ltd Company Information
    • 7.11.2 Guangzhou Sanfu New Materials Technology Co., Ltd Introduction and Business Overview
    • 7.11.3 Guangzhou Sanfu New Materials Technology Co., Ltd Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.11.4 Guangzhou Sanfu New Materials Technology Co., Ltd Electroless Plating Solutions Product Offerings
    • 7.11.5 Guangzhou Sanfu New Materials Technology Co., Ltd Recent Development
  • 7.12 Shenzhen Chuangzhi Success Technology
    • 7.12.1 Shenzhen Chuangzhi Success Technology Company Information
    • 7.12.2 Shenzhen Chuangzhi Success Technology Introduction and Business Overview
    • 7.12.3 Shenzhen Chuangzhi Success Technology Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.12.4 Shenzhen Chuangzhi Success Technology Electroless Plating Solutions Product Offerings
    • 7.12.5 Shenzhen Chuangzhi Success Technology Recent Development
  • 7.13 HLHC
    • 7.13.1 HLHC Company Information
    • 7.13.2 HLHC Introduction and Business Overview
    • 7.13.3 HLHC Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.13.4 HLHC Electroless Plating Solutions Product Offerings
    • 7.13.5 HLHC Recent Development
  • 7.14 Shenhzen Yicheng
    • 7.14.1 Shenhzen Yicheng Company Information
    • 7.14.2 Shenhzen Yicheng Introduction and Business Overview
    • 7.14.3 Shenhzen Yicheng Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.14.4 Shenhzen Yicheng Electroless Plating Solutions Product Offerings
    • 7.14.5 Shenhzen Yicheng Recent Development
  • 7.15 Shenzhen Hotchain
    • 7.15.1 Shenzhen Hotchain Company Information
    • 7.15.2 Shenzhen Hotchain Introduction and Business Overview
    • 7.15.3 Shenzhen Hotchain Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.15.4 Shenzhen Hotchain Electroless Plating Solutions Product Offerings
    • 7.15.5 Shenzhen Hotchain Recent Development
  • 7.16 Shenzhen ZhengTianWei Science&Technology
    • 7.16.1 Shenzhen ZhengTianWei Science&Technology Company Information
    • 7.16.2 Shenzhen ZhengTianWei Science&Technology Introduction and Business Overview
    • 7.16.3 Shenzhen ZhengTianWei Science&Technology Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.16.4 Shenzhen ZhengTianWei Science&Technology Electroless Plating Solutions Product Offerings
    • 7.16.5 Shenzhen ZhengTianWei Science&Technology Recent Development
  • 7.17 Shenzhen Songbai
    • 7.17.1 Shenzhen Songbai Company Information
    • 7.17.2 Shenzhen Songbai Introduction and Business Overview
    • 7.17.3 Shenzhen Songbai Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.17.4 Shenzhen Songbai Electroless Plating Solutions Product Offerings
    • 7.17.5 Shenzhen Songbai Recent Development
  • 7.18 TANAKA
    • 7.18.1 TANAKA Company Information
    • 7.18.2 TANAKA Introduction and Business Overview
    • 7.18.3 TANAKA Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.18.4 TANAKA Electroless Plating Solutions Product Offerings
    • 7.18.5 TANAKA Recent Development
  • 7.19 Shenzhen Xingjingwei
    • 7.19.1 Shenzhen Xingjingwei Company Information
    • 7.19.2 Shenzhen Xingjingwei Introduction and Business Overview
    • 7.19.3 Shenzhen Xingjingwei Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.19.4 Shenzhen Xingjingwei Electroless Plating Solutions Product Offerings
    • 7.19.5 Shenzhen Xingjingwei Recent Development
  • 7.20 Kanigen
    • 7.20.1 Kanigen Company Information
    • 7.20.2 Kanigen Introduction and Business Overview
    • 7.20.3 Kanigen Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.20.4 Kanigen Electroless Plating Solutions Product Offerings
    • 7.20.5 Kanigen Recent Development
  • 7.21 Guangdong Shuo Cheng Technology
    • 7.21.1 Guangdong Shuo Cheng Technology Company Information
    • 7.21.2 Guangdong Shuo Cheng Technology Introduction and Business Overview
    • 7.21.3 Guangdong Shuo Cheng Technology Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.21.4 Guangdong Shuo Cheng Technology Electroless Plating Solutions Product Offerings
    • 7.21.5 Guangdong Shuo Cheng Technology Recent Development
  • 7.22 Hubei Harvar
    • 7.22.1 Hubei Harvar Company Information
    • 7.22.2 Hubei Harvar Introduction and Business Overview
    • 7.22.3 Hubei Harvar Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.22.4 Hubei Harvar Electroless Plating Solutions Product Offerings
    • 7.22.5 Hubei Harvar Recent Development
  • 7.23 YMT
    • 7.23.1 YMT Company Information
    • 7.23.2 YMT Introduction and Business Overview
    • 7.23.3 YMT Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.23.4 YMT Electroless Plating Solutions Product Offerings
    • 7.23.5 YMT Recent Development
  • 7.24 MK Chem & Tech Co., Ltd
    • 7.24.1 MK Chem & Tech Co., Ltd Company Information
    • 7.24.2 MK Chem & Tech Co., Ltd Introduction and Business Overview
    • 7.24.3 MK Chem & Tech Co., Ltd Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.24.4 MK Chem & Tech Co., Ltd Electroless Plating Solutions Product Offerings
    • 7.24.5 MK Chem & Tech Co., Ltd Recent Development
  • 7.25 JX Advanced Metals Corp
    • 7.25.1 JX Advanced Metals Corp Company Information
    • 7.25.2 JX Advanced Metals Corp Introduction and Business Overview
    • 7.25.3 JX Advanced Metals Corp Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.25.4 JX Advanced Metals Corp Electroless Plating Solutions Product Offerings
    • 7.25.5 JX Advanced Metals Corp Recent Development
  • 7.26 PacTech
    • 7.26.1 PacTech Company Information
    • 7.26.2 PacTech Introduction and Business Overview
    • 7.26.3 PacTech Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.26.4 PacTech Electroless Plating Solutions Product Offerings
    • 7.26.5 PacTech Recent Development
  • 7.27 KPM Tech Vina
    • 7.27.1 KPM Tech Vina Company Information
    • 7.27.2 KPM Tech Vina Introduction and Business Overview
    • 7.27.3 KPM Tech Vina Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.27.4 KPM Tech Vina Electroless Plating Solutions Product Offerings
    • 7.27.5 KPM Tech Vina Recent Development
  • 7.28 Japan Pure Chemical
    • 7.28.1 Japan Pure Chemical Company Information
    • 7.28.2 Japan Pure Chemical Introduction and Business Overview
    • 7.28.3 Japan Pure Chemical Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.28.4 Japan Pure Chemical Electroless Plating Solutions Product Offerings
    • 7.28.5 Japan Pure Chemical Recent Development
  • 7.29 Micron Coatings Group
    • 7.29.1 Micron Coatings Group Company Information
    • 7.29.2 Micron Coatings Group Introduction and Business Overview
    • 7.29.3 Micron Coatings Group Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.29.4 Micron Coatings Group Electroless Plating Solutions Product Offerings
    • 7.29.5 Micron Coatings Group Recent Development
  • 7.30 Argos
    • 7.30.1 Argos Company Information
    • 7.30.2 Argos Introduction and Business Overview
    • 7.30.3 Argos Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.30.4 Argos Electroless Plating Solutions Product Offerings
    • 7.30.5 Argos Recent Development
  • 7.31 KC Jones Plating Company
    • 7.31.1 KC Jones Plating Company Company Information
    • 7.31.2 KC Jones Plating Company Introduction and Business Overview
    • 7.31.3 KC Jones Plating Company Electroless Plating Solutions Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.31.4 KC Jones Plating Company Electroless Plating Solutions Product Offerings
    • 7.31.5 KC Jones Plating Company Recent Development

8 Industry Chain Analysis

  • 8.1 Electroless Plating Solutions Industrial Chain
  • 8.2 Electroless Plating Solutions Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 Electroless Plating Solutions Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 Electroless Plating Solutions Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer
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