지능형 차량 ZCU(Zone Control Unit) 시장(2026년)

ZCU Research: Cross-domain integrated ZCUs are becoming the edge computing nodes of the next-generation zonal architecture

Currently, the mainstream zonal architecture is mainly the quasi-central + zonal architecture with multiple central computing platforms and 2~4 ZCUs. At this stage, the so-called body-oriented ZCU is predominantly tasked with body-related functions, while functions associated with the powertrain domain and chassis domain are not decoupled, and are implemented via dedicated separate functional domain controllers.

By the integration level of the central computing platform, two main EEA paths will emerge in the next stage:

Path 1 - Zonal architecture with cross-domain integration: Cockpit-driving integrated computer integration will be further improved to form a zonal architecture with cross-domain integration. In this architecture, the related functions of the body, powertrain and chassis are all disassembled and scattered, and integrated into their nearby ZCUs. ZCUs at this stage are dominated by cross-domain integrated ZCUs, which will be mainly deployed for L3+ scenarios. Featuring lightweight edge pre-processing capabilities, they require high performance multi-core MCUs with high computing power, high-capacity storage, robust communication capability and virtualization support.

Path 2 - Zonal architecture with highly integrated central computing: Central computing is further integrated and the architecture continues to be streamlined. ZCUs completely weaken the local computing power and develop in the direction of central cerebrum + intelligent control cerebellum + I/O zone control, further reducing costs and improving integration. ZCUs at this stage are positioned as pure edge I/O nodes. I/O oriented ZCUs no longer execute application logic, and only retain power distribution, protocol forwarding and driver functions. Their differentiation is reduced, imposing lower requirements on MCU computing power and storage, with emphasis placed on the richness of I/O interfaces.

Cross-domain integrated ZCU: the vehicle control strategy of the motion domain is moved up to HPC, while I/O execution is moved down to ZCUs

High-level intelligent driving functions require the intelligent driving domain to simultaneously invoke torque, brake, steering and suspension vertical control. They impose stringent requirements on the coordinated control of powertrain and chassis, and demand extremely low deterministic latency. In traditional motion domain control solutions, the powertrain domain controller and chassis domain controller perform control functions separately. They are concurrently responsible for vehicle control algorithms, mass I/O acquisition, solenoid valve driving, power distribution, gateway forwarding and other functions. The intelligent driving domain needs to connect two domain controllers across domains. There are many links, longer communication delays, and complex interfaces, which are not conducive to software-hardware decoupling and vehicle control function updates. Therefore, in high-end autonomous vehicles of L3 and above, the integration of the powertrain domain and the chassis domain is highly necessary.

The integration of the powertrain domain and the chassis domain into a ZCU essentially decouples the two core responsibilities of domain controllers: control strategies are uplifted, and I/O execution is offloaded downwards. The cross-domain integrated ZCU does not stuff all powertrain and chassis functions, but offloads the real-time I/O, local execution, sub-closed loop, power distribution, and gateway capabilities of the powertrain domain and the chassis domain to their nearby ZCUs. Sub-functions such as EPS, EPB, CDC, etc. are migrated to the ZCU software stack, canceling the separate chassis ECU, and moving the VMC logic up to the central HPC.

Actuators of the powertrain domain and the chassis domain are well?suited for integration into ZCUs. Motion?domain?related sensors and actuators such as wheel?speed sensors, brake motors and steering motors are mostly located close to wheels and chassis, featuring the shortest physical distance to ZCUs. The actuator of the motion domain is connected to its nearby ZCU, so that the extremely short communication link can ensure the high real-time performance required by high-level intelligent driving functions.

Therefore, the cross-domain integrated ZCU places relatively high requirements on MCUs in terms of processing capabilities, peripheral interfaces, virtualization mechanisms, and functional security.

At present, the cross-domain integrated ZCU integrating the motion domain is the main solution for EEAs in the next stage. Most of the domestic mainstream OEMs have planned the next-generation ZCU solutions integrating powertrain and chassis domain functions, and major Tier 1 suppliers have also launched cross-domain integrated ZCU system solutions.

For example, Jingwei Hirain exhibited its Re-ZCU at the Beijing International Automotive Exhibition in 2026. This is a "chassis domain + body domain" integrated ZCU that uses a single MCU. On the basis of retaining chassis control functions such as single-channel EPB, dual-chamber air springs, and dual-valve CDC shock absorbers, it also integrates common body control functions like rear tailgate switch, rear seat adjustment, rear air conditioning adjustment, rear light adjustment, etc.

Re-ZCU integrates chassis functions and some body functions in the rear compartment, breaking the functional boundaries of traditional separate ECUs. This design eliminates the need for separate chassis domain controllers and body controllers in the rear compartment, helping to simplify the vehicle's circuit layout and reduce vehicle weight and cost.

ZCUs support distributed audio architectures and transmit audio streams based on AVB+TSN Ethernet

In addition to integrating the motion domain, ZCUs in the next stage will also integrate audio power amplifiers to achieve separate audio partition management. Traditional audio solutions centrally deploy power amplifier modules in a separate power amplifier ECU or cockpit domain controller. All speaker and microphone signals are aggregated to a dedicated power amplifier or cockpit domain controller for DAC conversion, power amplification and audio?effect processing. The A2B dedicated audio bus is adopted for daisy-chained cross-zone wiring, which brings challenges such as excessively long wire harnesses, complicated routing and signal attenuation.

With the development of the zonal architecture and higher user requirements for cockpit audio experience, the distributed audio architecture decentralizes power amplifier functions into ZCUs and eliminates separate power amplifier ECUs, with speakers connected to nearby ZCUs. It has become a direction for the industry to explore collectively. In the distributed audio architecture, power amplifier circuits are embedded within ZCUs. The cockpit SoC undertakes audio algorithm decoding, and digital audio is transmitted to ZCUs in each zone via AVB?TSN Ethernet. Speakers are driven in proximity to realize flexible management, synchronous transmission and personalized experience of multi-zone audio.

Hardware integration: ZCUs integrate multi-channel audio codecs, AVB/TSN Ethernet audio bridging, local storage (for pre-loading audio effect algorithms) and DSP?based power amplifiers. They directly sample and process audio?node signals from local microphones, speakers and power amplifiers, and exchange data with the central domain controller via the backbone network.

Software decoupling: Through a SOA, audio functions are abstracted into separate services (such as "volume adjustment service" and "sound effect mode service"). Each ZCU is invoked on demand, while the central domain controller is only responsible for strategy orchestration.

Wiring harness simplification: ZCUs connect local zone audio nodes via local power supply and audio buses, which effectively shortens speaker harness length and greatly reduces in-vehicle harness weight and routing complexity. While guaranteeing system functions, it cuts hardware BOM cost and lowers vehicle manufacturing cost as well as curb weight. At the same time, they enable software-defined audio and realize flexible platform iteration of different vehicle models.

Infineon's ZCU-based AVB distributed audio solution as an example: through the design of "central computing + distributed ZCUs", combined with the high bandwidth and low latency of Ethernet as well as automotive zone audio requirements, flexible management and control, synchronous transmission and personalized experience of multi-zone audio are achieved.

Central computing unit and Ethernet switch: they are responsible for audio data processing, network management and traffic scheduling. They connect each zone audio controller through Ethernet to build a "backbone network" for automotive audio and video transmission. At the same time, the time synchronization (gPTP) and quality of service (QoS) mechanisms based on the AVB protocol ensure low-latency, lag-free synchronous transmission of multi-zone audio streams;

Distributed ZCU:

Zone audio function: Each physical ZCU receives AVTP audio data through Ethernet and independently controls audio output to achieve zone-based personalized audio experience.

Audio Codec: It is the "local processing center" of zone audio, responsible for the encoding (analog -> digital), decoding (digital -> analog), mixing, amplification and other operations of audio signals. Wherein, I2S is an automotive-grade serial audio bus, suitable for short-distance, high-reliability audio transmission; TDM supports multi-channel audio transmission on the same link, improving bandwidth utilization.

MCU: Infineon AURIXTM TC4x is used. This chip is designed with specialized hardware peripheral support for AVB. It can support AVB protocols such as IEE802.1AS, IEEE802.1Qav, and TSN protocols like IEEE802.1 Qbu, IEEE802.1 Qbv, and IEE802.1 CB.

Cross-domain integrated ZCU reconstructs business model: hardware standardization, OEM-led software differentiation

In the SDV era, automotive electronic architectures achieve rapid multiplexing across vehicle models and classes through modular design and software configuration. ZCUs serve as the core carrier for "standardized hardware + software differentiation".

The cross-domain integrated ZCU is no longer a simple unit for body I/O, power distribution and gateway functions. Instead, it is a local edge-computing unit integrating body, gateway, power distribution, partial chassis/powertrain actuation, audio power amplifiers and multiple other functions. It should comply with both ASIL-B and ASIL-D, with safety isolation implemented via Hypervisor. Therefore, the traditional Tier1 black box model will gradually phase out, while the new model will move towards in-depth multi-party research, software-hardware decoupling and hierarchical collaboration, platform-based pre-research, and OEMs' mastery of upper-layer SOA and vehicle architecture definition.

Currently, all parties in the ZCU industry chain are exploring more flexible cooperation modes. Chip vendors extend upward to the underlying software and reference platforms, basic software vendors improve their status, OEMs upwardly master the vehicle architecture/SOA/application layer, and Tier1 suppliers or EMS providers undertake system integration and hardware implementation. For example, Flex, Infineon, and Vector collaborated to launch a scalable ZCU development kit; ST and AutoCore jointly released an Ethernet-based ZCU distributed audio solution, and UAES launched a "building block"-style platform solution, allowing OEMs to flexibly choose different supply levels from hardware to complete solutions.

For example, Flex, Infineon, and Vector collaborated to launch a scalable ZCU development kit at CES 2026. The core of this solution lies in its modular design and scalable architecture. It consists of about 30 modules internally. Developers can flexibly combine configurations according to specific vehicle models and functional requirements. It provides a clear path for subsequent mass production, quickly adapting to various vehicle models from entry-level to luxury segments, from traditional fuel models to high-end autonomous models. The solution is a one-stop turnkey model of "chip + software + EMS". Infineon provides core semiconductor solutions covering MCUs, power semiconductors and security chips, Vector provides high-performance embedded software and development tools, and Flex is responsible for the hardware design, manufacturing and mass production of ZCUs.

The highest configuration version of the development kit adopts a dual-MCU redundant architecture to ensure fail-safe operation. It uses Infineon's TC4x MCU with a real-time performance of 2 X 6,810 DMIPS. It is also equipped with 2 X 10MB memory and 2 X 21MB non-volatile memory, leaving sufficient margin for L4 autonomous driving and high-security-level applications. This design guarantees functional safety and provides a solid hardware foundation for "software-defined vehicles". OEMs can continuously unlock new features or optimize existing performance through software updates and configurations on standardized hardware, greatly shortening the development cycle of new vehicle models.

A single-MCU version is also available. Developers can flexibly choose the solution according to the actual projects and costs, fully embodying the core concept of "scalability and multiplexing".

In terms of communication interfaces, this ZCU solution covers almost all mainstream protocols of the current automotive network. Ethernet interfaces include two 1000BASE-T1 ports (one upgradable to 2500BASE-T1), two 100BASE-T1 ports and two 10BASE-T1S ports. For CAN, two 5 Mbit/s CAN-FD ports supporting partial networking are provided, together with eighteen 5Mbit/s CAN-FD ports without partial networking support for general body and chassis communication. In addition, it integrates 16 LIN interfaces, one 10 Mbit/s FlexRay interface, two 125 kbit/s bi-directional PSI5 interfaces, four DSI3 interfaces (supporting up to 12 ultrasonic sensors), two SENT interfaces (upgradable to master triggered SPC protocol), and four 3-wire WSS (wheel-speed-sensor) interfaces (upgradable to a 2-wire solution).

At the signal and power supply control level, this ZCU solution provides four pull-down digital inputs, 10 pull-up digital inputs, 24 pull-up analog inputs and two 5V analog-output interfaces, enabling direct connection to various automotive sensors and actuators.

For power control, it incorporates eight electronic fuses with hardware-based i2t protection, 42 high-side switches, four low-side switches, eight motor half-bridges and one brushed motor full-bridge. It can supply power to up to 63 ECUs or actuators, with a continuous current conversion capability of 85A and a total distributed current up to 688A.

Table of Contents

1 Overview and Market of ZCU

• 1.1 Product Form Development Path of ZCU
• Two Paths for Zonal Architecture in the Next Stage
• Development Direction of ZCU in the Next Stage
• Comparison of Three ZCU Product Forms
• Application Logic of I/O?oriented ZCU under Central Integrated Architecture
• 1.2 Statistics on ZCU Installation in Vehicle Models of OEMs
• Statistics on ZCU Installation in Vehicle Models of OEMs (1)
• Statistics on ZCU Installation in Vehicle Models of OEMs (9)
• 1.3 ZCU Market Pattern and Market Size Forecast
• Passenger Car ZCU Installations and Market Size in China, 2023-2030E (1)
• Passenger Car ZCU Installations and Market Size in China, 2023-2030E (2)
• OEM Market Share of Passenger Car ZCU Suppliers in China, Jan-May 2026
• OEM Market Share of Passenger Car ZCU Suppliers in China, 2025
• OEM Market Share of Passenger Car BCM (including ZCU) Suppliers of Independent Auto Brands in China, 2024-2025

2 ZCU System Solution Construction

• 2.1 ZCU System Integration Solutions
• ZCU System Solution 1:
• ZCU System Solution 2:
• 2.2 ZCU Hardware Construction
  • 2.2.1 ZCU Hardware Platform Solutions
• ZCU: Hardware Composition
• ZCU: The Underlying Hardware Should Be Incorporated into a Software-Manageable System
• ZCU Hardware Platform Solution 1:
• ZCU Hardware Platform Solution 4:
• 2.2.2 PMICs and Solutions
• ZCU Power Supply Module Design (1):
• ZCU Power Supply Module Design (2):
• ZCU PMIC/SBC Selection and Summary (1)
• ZCU PMIC/SBC Selection and Summary (2)
• ZCU PMIC/SBC Selection and Summary (3)
• ZCU PMIC 1:
• ZCU PMIC 2:
• ZCU PMIC 3:
• ZCU Power Supply Management Solutions:
• 2.2.3 MCUs and Solutions
• ZCU MCU Innovation Requirements (1)
• ZCU MCU Innovation Requirements (2)
• ZCU MCU Innovation Requirements (3)
• Future ZCU MCU Competition
• ZCU MCU Summary and Selection (1)
• ZCU MCU Summary and Selection (5)
• ZCU MCU 1:
• ZCU MCU 6:
• ZCU MCU Application Solution 1:
• ZCU MCU Application Solution 2:
• ZCU MCU Application Solution 3:
• ZCU MCU Technology Trend: MCU Less Design
• 2.2.4 Communication Interface Chips and Solutions
• ZCU Communication Network Construction (1)
• ZCU Communication Network Construction (2)
• Communication between ZCU and External Nodes (Backbone Network): Summary of Mainstream 100M/1000M Ethernet Chips
• 100 BASE-T1 Application Case: ONVO L60 Communication Architecture
• 1000 BASE-T1 Application Case: XPeng XEEA3.5 Vehicle Communication Architecture (1)
• 1000 BASE-T1 Application Case: XPeng XEEA3.5 Vehicle Communication Architecture (2)
• Communication between ZCU and Intra?Zone Nodes (Local Low?Speed Use?Cases): Summary of 10BASE?T1S Chips
• 10BASE-T1S Chips (1):
• 10BASE-T1S Chips (3)
• ZCU 10M Ethernet Application Solutions
• Communication between ZCU and Intra?Zone Nodes (Sensor Connectivity): Summary of 10G+ SerDes Chips
• 2.2.5 Driver ICs/Power Devices and Solutions
• ZCU Driver Module Design (1): Zone Load Types and Driver IC Selection
• ZCU Driver Module Design (2): Semiconductor-Based Power Distribution
• ZCU Driver Module Design (3)
• ZCU Driver Module Design (4)
• Power Supply Solutions for Off-board Capacitive Loads in ZCU (1)
• Power Supply Solutions for Off-board Capacitive Loads in ZCU (2)
• Power Supply Solutions for Off-board Capacitive Loads in ZCU (3)
• Summary of ZCU HSD IC Vendors and Products (1)
• Summary of ZCU HSD IC Vendors and Products (2)
• Summary of ZCU HSD IC Vendors and Products (3)
• ZCU HSD ICs (1)
• ZCU HSD ICs (2)
• Summary of ZCU LSD IC Vendors and Products (1)
• Summary of ZCU LSD IC Vendors and Products (2)
• ZCU LSD ICs (1)
• ZCU LSD ICs (2)
• Summary of Half-Bridge Driver IC Vendors and Products (1)
• Summary of Half-Bridge Driver IC Vendors and Products (2)
• ZCU Half-Bridge Driver ICs (1)
• ZCU Half-Bridge Driver ICs (2)
• Summary of H-Bridge Driver IC Vendors and Products (1)
• Summary of H-Bridge Driver IC Vendors and Products (2)
• ZCU H-Bridge Driver ICs (1)
• ZCU H-Bridge Driver ICs (2)
• Summary of ZCU e-Fuse IC Vendors and Products (1)
• Summary of ZCU e-Fuse IC Vendors and Products (2)
• Summary of ZCU e-Fuse IC Vendors and Products (3)
• ZCU e-Fuse ICs (1)
• ZCU e-Fuse ICs (2)
• 2.3 ZCU Software Construction
• Software Layered Architecture of ZCU
• ZCU SOA Design
• ZCU SOA Development Process
• Zone SOA Solutions of OEMs (1)
• Zone SOA Solutions of OEMs (3): Features of Cloud-link-edge Integrated SOA Software Platform of Z-One "Galaxy" Full-stack 3.0
• 2.4 ZCU Development & Cooperation Models
• Mainstream ZCU Development & Cooperation Models
• ZCU Development & Cooperation Models: Comparison of Five Models
• ZCU Development & Cooperation Models: Key Risks in ZCU Cooperation
• ZCU Development & Cooperation Models: Business Model Reconstructed by Cross-Domain Integrated ZCU

3 Cutting-Edge ZCU Technology Trends

• 3.1 ZCU Cross?Domain Integration with Motion Domain
• Cross-Domain Integrated EEA Forms
• New Requirements of Cross-domain integrated ZCU for MCU
• Cross-Domain Integrated ZCU: Core Challenges at the Architectural Level
• Cross-Domain Integrated ZCU - Challenges
• Cross-Domain Integrated ZCU: Software Architecture Solutions (1)
• Cross-Domain Integrated ZCU: Software Architecture Solutions (5)
• Cross-Domain Integrated ZCU: Based on SOA Framework
• Summary of Cross-Domain Integrated ZCU Solutions
• Cross-Domain Integrated ZCU Application Solution 1
• Cross-Domain Integrated ZCU Application Solution 2
• Cross-Domain Integrated ZCU Application Solution 3
• 3.2 48V ZCU
• Background of 48V Zone Architecture Technology Development (1)
• Background of 48V Zone Architecture Technology Development (2)
• Background of 48V Zone Architecture Technology Development (3)
• Evolution of 48V Power Distribution Architecture (1)
• Evolution of 48V Power Distribution Architecture (2)
• 48V ZCU Design - Power Supply Architecture Selection: Distributed and Centralized Power Supply
• 48V ZCU Design - Power Network Topology and Functional Safety Design (1)
• 48V ZCU Design - Power Network Topology and Functional Safety Design (2)
• 48V ZCU Design - 48V Semiconductor Device Selection
• 48V ZCU Design - 48-12V Bidirectional DCDC Topology Selection
• 48V ZCU Design - Grid Isolation Switch Design
• 48V ZCU Design - Smart e-Fuse
• Summary of ZCU Vendors and Solutions (1)
• Summary of ZCU Vendors and Solutions (2)
• 48V ZCU Solution 1:
• 48V ZCU Solution 7:
• 3.3 ZCU Distributed Audio
• Distributed Audio Architecture: Power Amplifiers Are Integrated into ZCU To Achieve Partitioned Audio Management
• Distributed Audio Architecture: Audio Stream Transmission Based on AVB+TSN Ethernet
• Summary of ZCU Distributed Audio Solutions
• ZCU Distributed Audio Solution 1:
• ZCU Distributed Audio Solution 2:
• ZCU Distributed Audio Solution 3:
• 3.4 Fiber Optic ZCU
• Demand for Fiber Optic Communication in In-vehicle Backbone Networks
• Automotive Optical Fiber Backbone Network: Architecture Composition
• Automotive Optical Fiber Backbone Network: Comparison with Copper Cable Ethernet Backbone Network
• Fiber Optic ZCU: Backbone Network Based on Fiber Optic Ethernet
• Fiber Optic ZCU: Backbone Network Based on PON
• Fiber Optic ZCU: Mainstream Adoption of Photoelectric Hybrid Network Architecture (1)
• Fiber Optic ZCU: Mainstream Adoption of Photoelectric Hybrid Network Architecture (2)
• ZCU Fiber Optic Communication Network Architecture: Summary of Manufacturers and Solutions
• ZCU Fiber Optic Communication Solutions (1)
• ZCU Fiber Optic Communication Solutions (7)

4 ZCU Deployment Solutions of OEMs

• 4.1 Xiaomi Auto
• ZCU Evolution Roadmap (1)
• ZCU Evolution Roadmap (2)
• EEA 2.0 ZCU Platform: Three ZCUs (Front/Left/Right) Improve Integration
• EEA 2.0 ZCU Platform: ZCU Function Integration Strategy
• EEA 1.0 ZCU Platform: EEA Has Three ZCUs
• EEA 1.0 ZCU Platform: ZCU Locations
• EEA 1.0 ZCU Platform: ZCU Functional Block Diagram
• EEA 1.0 ZCU Platform: ZCU Breakdown of Xiaomi SU7
• EEA 1.0 ZCU Platform: Summary of ZCUs
• 4.2 Geely
• ZCU Evolution Roadmap
• GEEA 3.0 ZCU Platform: Left/Right ZCU Solution
• GEEA 3.0 ZCU Platform:
• 4.3 ZEEKR
• ZCU Evolution Roadmap
• ZEEA 3.0 ZCU Platform: Intelligent Power Distribution Design (1)
• ZEEA 3.0 ZCU Platform: Intelligent Power Distribution Design (2)
• ZEEA 3.0 ZCU Platform: ZCU Anti-Pinch Software
• ZEEA 3.0 ZCU Platform: ZCU Cooperative Development Model
• ZEEA 3.0: Driving ZCU PCMU (1)
• ZEEA 3.0: Driving ZCU PCMU (2) - Functional Levels and Classification
• ZEEA 3.0: Driving ZCU PCMU (3) - Future Evolution Route
• ZEEA 3.0: Driving ZCU PCMU (4) - Common Development Issues and Key Technologies
• ZEEA 3.0 - Driving ZCU R&D Strategy 1
• ZEEA 3.0 - Driving ZCU R&D Strategy 12
• 4.4 NIO
• ZCU Evolution Roadmap
• ZCU Evolution Roadmap
• NT3.0 ZCU Platform (High Performance) 1: 1*Central Supercomputing Platform + 2*ZCU
• NT3.0 ZCU Platform (High Performance) 2:
• NT3.0 ZCU Platform (High Performance) 3:
• NT3.0 ZCU Platform (High Performance) - ES8: Front ZCU Function Integration Strategy
• NT3.0 ZCU Platform (High Performance) - ES8: Rear ZCU Function Integration Strategy
• NT3.0 ZCU Platform (ONVO): 1*Central Computing Platform + 3~4*ZCU
• NT3.0 ZCU Platform (ONVO): ZCU Function Integration Strategy of ONVO L60
• NT3.0 ZCU Platform - Software:
• NT3.0 ZCU Platform - Software: SkyOS-based Intelligent Vehicle Control Software Platform (1)
• NT3.0 ZCU Platform - Software: SkyOS-based Intelligent Vehicle Control Software Platform (4)
• NT3.0 ZCU Platform - Software:
• 4.5 Harmony Intelligent Mobility Alliance (HIMA)
• ZCU Evolution Roadmap
• VIU (Integration of Body Domain + Motion Domain):
• ZCU Platform (STELATO S9):
• ZCU Platform (STELATO S9):
• ZCU Platform (AITO M7):
• ZCU Platform (AITO M7):
• ZCU Platform (AITO M9):
• ZCU Platform (AITO M9): Left ZCU (VIU 1) - Body Functional Block Diagram and Network Architecture
• ZCU Platform (AITO M9): Right ZCU (VIU 2) - Body Functional Block Diagram and Network Architecture
• ZCU Platform (AITO M9): Rear ZCU (VIU 3) - Body Functional Block Diagram and Network Architecture
• ZCU Platform (AITO M9): Right Domain Controller Disassembly (1)
• ZCU Platform (AITO M9): Right Domain Controller Disassembly (4)
• 4.6 XPeng
• ZCU Evolution Roadmap
• XEEA 4.0 ZCU Platform (G7)
• XEEA 3.5 ZCU Platform: Functional Integration
• XEEA 3.5 ZCU Platform: Network Topology
• XEEA 3.5 ZCU Platform: System Development Capability Building
• XEEA 3.5 ZCU Platform: Zone Control Hardware Development
• XEEA 3.5 ZCU Platform: Zone Control Software Development
• XEEA 3.5 ZCU Platform: Vehicle Cross-Domain Communication Middleware
• XEEA 3.5 ZCU Platform: G9 - Right ZCU Disassembly (1)
• XEEA 3.5 ZCU Platform: G9 - Right ZCU Disassembly (4)
• XEEA 3.5 ZCU Platform Development Trends: Zone Control Hardware
• XEEA 3.5 ZCU Platform Development Trends: Zone Control Software
• 4.7 Leapmotor
• ZCU Evolution Roadmap
• LEAP 3.5 ZCU Platform:
• LEAP 3.0 ZCU Platform:
• ZCU Platform Design:
• 4.8 Voyah
• ZCU Evolution Roadmap
• Tianyuan Intelligent Architecture ZCU 2.0 Platform:
• Tianyuan Intelligent Architecture ZCU 2.0 Platform: Cross-Domain Function Integration (1)
• Tianyuan Intelligent Architecture ZCU 2.0 Platform: Cross-Domain Function Integration (5)
• Tianyuan Intelligent Architecture ZCU 2.0 Platform: Vehicle OTA Update Solution
• Tianyuan Architecture ZCU 1.0 Platform: Based on SOA
• Tianyuan Architecture ZCU 1.0 Platform: Hardware
• Tianyuan Architecture ZCU 1.0 Platform: Function Allocation Logic
• Tianyuan Architecture ZCU 1.0 Platform: VIU Integration
• Tianyuan Architecture ZCU 1.0 Platform: 300+ SOA Open Interfaces Support Scenario Customization
• 4.9 FAW Hongqi
• ZCU Evolution Roadmap
• FEEA3.0 ZCU Platform: EH7 Uses Three ZCUs (Front, Middle and Rear)
• FEEA3.0 ZCU Platform: Body Function Breakdown of Hongqi EH7 (1)
• FEEA3.0 ZCU Platform: Body Function Breakdown of Hongqi EH7 (4)
• FEEA3.0 ZCU Platform: FAW.OS
• FEEA3.0 ZCU Platform: Intelligent HIS Vehicle-Cloud Integrated Architecture
• 4.10 Li Auto
• ZCU Evolution Roadmap
• Next-Generation Fiber Optic Communication ZCU Platform:
• LEEA3.0 ZCU Platform (1):
• LEEA3.0 ZCU Platform (7):
• LEEA2.5 BCM Platform:
• 4.11 BYD
• ZCU Evolution Roadmap
• Xuanji Architecture ZCU Platform (1):
• Xuanji Architecture ZCU Platform (2):
• e3.0 Evo Body Controller Platform (1):
• e3.0 Evo Body Controller Platform (2):
• 4.12 Chery Automobile
• ZCU Evolution Roadmap
• EEA5.0 ZCU Platform (1):
• EEA5.0 ZCU Platform (2):
• EEA5.0 ZCU Platform: Left ZCU Disassembly of STERRA ES/ET (1)
• EEA5.0 ZCU Platform: Left ZCU Disassembly of STERRA ES/ET (5)
• 4.13 Changan Automobile
• ZCU Evolution Roadmap
• SDA2.0 ZCU Platform (1):
• SDA2.0 ZCU Platform (2):
• 4.14 GAC
• ZCU Evolution Roadmap
• X-Soul4.0 ZCU Platform:
• X-Soul3.0 ZCU Platform:
• X-Soul3.0 ZCU Platform: ZCU Function Integration Strategy of Hyptec GT (1)
• X-Soul3.0 ZCU Platform: ZCU Function Integration Strategy of Hyptec GT (2)
• X-Soul3.0 ZCU Platform: ZCU Function Integration Strategy of Hyptec GT (3)
• 4.15 SAIC
• ZCU Evolution Roadmap
• Galaxy Full Stack 4.0 ZCU Platform (1):
• Galaxy Full Stack 4.0 ZCU Platform (2):
• Galaxy Full Stack 4.0 ZCU Platform (3):
• Galaxy Full Stack 3.0 ZCU Platform:
• Galaxy Full Stack 3.0 ZCU Platform: ZCU Function Integration Strategy
• Galaxy Full Stack 3.0 ZCU Platform: SOA (1)
• Galaxy Full Stack 3.0 ZCU Platform: SOA (2)
• Galaxy Full Stack 3.0 ZCU Platform: Right ZCU Disassembly (1)
• Galaxy Full Stack 3.0 ZCU Platform: Right ZCU Disassembly (6)
• 4.16 Great Wall Motor (GWM)
• ZCU Evolution Roadmap
• GEEA4.0 ZCU Platform:
• GEEA4.0 ZCU Platform: Hardware Platform
• GEEA4.0 ZCU Platform: SOA
• 4.17 Tesla
• ZCU Evolution Roadmap (1)
• ZCU Evolution Roadmap (2)
• Cybertruck ZCU Platform (1):
• Cybertruck ZCU Platform (4): ZCU Function Distribution
• Cybertruck ZCU Platform (5): EPB Integration
• Model3/Y ZCU Platform (1):
• Model3/Y ZCU Platform (2): Communication Architecture
• Model3/Y ZCU Platform (3): Power Distribution Architecture
• Model3/Y ZCU Platform (4): Function Integration Strategy - Front Body Zone
• Model3/Y ZCU Platform (5): Function Integration Strategy - Left/Right Body Zone
• Model3/Y ZCU Platform (6): Summary of body ZCU Technical Features
• Model3/Y ZCU Platform (7): Front ZCU Disassembly
• Model3/Y ZCU Platform (8): Left ZCU Disassembly
• Model3/Y ZCU Platform (9): Right ZCU Disassembly
• 4.18 Volkswagen
• ZCU Evolution Roadmap
• CEA ZCU Platform (1):
• CEA ZCU Platform (2):
• 4.19 BMW
• ZCU Evolution Roadmap
• Neue Klasse ZCU Platform:
• Neue Klasse ZCU Platform: Next-Generation Software Platform (1)
• Neue Klasse ZCU Platform: Next-Generation Software Platform (2)
• Neue Klasse Architecture ZCU Platform: Functional Integration Strategy
• Neue Klasse Architecture ZCU Platform: Cybersecurity
• Neue Klasse ZCU Platform: ZCU Integrates Ambient Lighting (1)
• Neue Klasse ZCU Platform: ZCU Integrates Ambient Lighting (4)

5 ZCU Solutions of Tier1 Suppliers

• 5.1 Jingwei Hirain
• ZCU Product Evolution Roadmap
• ZCU: Diversified Cooperation Models
• ZCU Product Solution 1:
• ZCU Product Solution 2:
• ZCU System Solution Design 1:
• ZCU System Solution Design 6:
• 5.2 Joynext
• ZCU Product Evolution Roadmap
• ZCU Product Solution:
• ZCU System Solution Design 1:
• ZCU System Solution Design 4:
• 5.3 Desay SV
• ZCU Product Evolution Roadmap
• ZCU Product Solution:
• Cross-Domain Integrated ZCU System Solution Design 1:
• Cross-Domain Integrated ZCU System Solution Design 6:
• 5.4 Huawei
• ZCU Product Evolution Roadmap
• ZCU Product Solution 1:
• ZCU Product Solution 2:
• ZCU Platform Software: Development & Cooperation Model
• 5.5 Steelmate
• ZCU Product Evolution Roadmap
• ZCU Product Solution:
• 5.6 ATECH
• ZCU Product Evolution Roadmap
• ZCU Product Solution:
• Next-generation ZCU Research Project:
• 5.7 G-Pulse
• ZCU Product Evolution Roadmap
• ZCU Product Solution 1:
• ZCU Product Solution 2:
• ZCU System Solution Design 1:
• ZCU System Solution Design 2:
• ZCU System Solution Design 3:
• 5.8 Autolink
• ZCU Product Evolution Roadmap
• ZCU Product Solution 1:
• ZCU Product Solution 2:
• 5.9 UAES
• ZCU Product Evolution Roadmap
• ZCU Product Supply Model
• ZCU Product Solution 1:
• ZCU Product Solution 2:
• ZCU System Software Platform:
• 5.10 AUMOVIO
• ZCU Product Evolution Roadmap
• ZCU: Scalable And Modular Product Development Model
• ZCU Product Solution:
• Cross-Domain Integrated ZCU System Solution Design 1:
• Cross-Domain Integrated ZCU System Solution Design 2:
• 5.11 Marelli
• ZCU Product Evolution Roadmap
• ZCU Product Solution 1:
• ZCU Product Solution 2:
• ZCU Product Solution 3:
• 5.12 Aptiv
• ZCU Product Evolution Roadmap
• ZCU Product Solution 1:
• ZCU Product Solution 2:
• ZCU System Solution Design:
• 5.13 Huaqin Technology
• ZCU Product Evolution Roadmap
• ZCU Product Solution:
• ZCU:
• 5.14 Neusoft Reach
• ZCU Product Evolution Roadmap
• ZCU Product Solution 1:
• ZCU Product Solution 2:
• 5.15 Flex
• ZCU Product Evolution Roadmap
• ZCU Product Solution:
• ZCU product business model:
• 5.16 H&T
• ZCU Product Evolution Roadmap
• ZCU Product Solution: