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시장보고서
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2109334
자율주행용 센서 칩 시장(2026년)Autonomous Driving Sensor Chip Research Report, 2026 |
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자율주행용 센서 칩에 관한 조사 - 물리적 세계를 깊이 인식하며, 센서 칩이 지능화에서 '주도적인 역할'을 수행하고 있습니다.
2026년, 자율주행용 센서 칩 업계는 중요한 전환점을 맞이합니다. 레벨 3(L3) 자율주행 도입 방침이 공식적으로 시행되며, 고도화된 지능형 주행이 대규모 상용화 단계에 접어듭니다. 이 보고서에서는 센서 칩의 기술적 진화 동향을 중심으로, 규제에 따른 지각 기능의 고도화, 실증 실험을 통한 레벨 3(L3)의 대규모 전개, 하드웨어 시장의 재평가 주기라는 3가지 핵심적인 변혁 아래에서 자율주행용 센서 칩의 기술적 방향성에 대해 상세히 해설합니다. 이 보고서에서는 자동차용 카메라, LiDAR, 레이더, 초음파 레이더, UWB 근거리 센싱을 포함한 5대 카테고리의 센서 칩에 대해 기술 진화, 시장 경쟁, 산업 구조를 체계적으로 정리하고, 주요 공급업체의 제품 업데이트 및 각 OEM사의 도입 현황에 대해서도 포괄적으로 다루고 있습니다.
이 5대 카테고리 센서 칩의 기술적 진화에서 다음과 같은 점이 특히 주목할 만합니다. :
카메라용 CIS 칩 - ‘단순한 영상 촬영’에서 ‘센싱과 컴퓨팅의 통합’을 실현하는 지능형 지각 단말기로 진화하고 있습니다.
라이더(LiDAR) 칩 - ‘수천 채널’ 및 6D 풀컬러 지각이라는 새로운 시대로 진입하고 있습니다;
레이더 칩 - ‘엣지 처리’에서 위성 아키텍처 및 고채널 수 설계로 전환되고 있습니다.
초음파 및 UWB 칩 - ‘보조적 지각’에서 모든 시나리오에 대응하는 협업형 노드로 진화하고 있습니다.
카메라용 센서 칩 - 해상도 향상 및 지능형 통합
2026년, 자동차용 카메라 칩 시장에서는 다음과 같은 3가지 주요 동향이 나타납니다.
1. 후면 조사형(BSI) 및 적층 구조의 보급
CIS는 구조 기술에 따라 전면 조사형(FSI), 후면 조사형(BSI), 적층 구조로 분류되며, 적층 아키텍처가 향후 주류가 될 전망입니다. 차량용 CIS에는 화질, 다이나믹 레인지, 저조도 촬영 능력, 멀티 카메라 협업 처리 능력에 대해 더 높은 요구 사항이 부과되며, 자동차 등급 인증 및 기능 안전 기준을 충족해야 합니다. 2025년에는 BSI+3D 적층 구조가 전 세계 양산 CIS의 75% 이상을 차지하며, 단일 픽셀 크기는 0.6 마이크로미터를 돌파했습니다.
SmartSens SC860AT를 예로 들어보겠습니다. SmartSens의 최신 CARSens(R)-XR Gen 2 기술 플랫폼을 기반으로 하는 SC860AT는 싱글 픽셀 아키텍처를 채택하여 Lofic HDR(R) 2.0 및 SFCPixel(R) 등의 첨단 기술을 통합함과 동시에 AB-Exposure(TM) 듀얼 프레임 노출 제어를 지원합니다. 높은 프레임 레이트, 높은 감도, 넓은 다이나믹 레인지와 같은 성능상의 장점을 갖추고 있으며, 자동차의 전면 뷰, 측면 뷰, 후면 뷰 카메라, 차량내 탑승자 모니터링 시스템(OMS)용 카메라, 그리고 E-Mirror 전자 백미러에 적용되는 완전히 새로운 화질 향상 요건을 충족합니다.
2. 고해상도: 8MP가 표준이 되었으며, 12MP가 세를 넓히고 있습니다.
2026년, ADAS의 보급에 따라 8메가픽셀 센서는 고도화된 자율주행의 표준 사양이 되었으며, 12메가픽셀 제품도 등장하고 있습니다.
OmniVision의 OX08D20을 예로 들어보겠습니다. 이 8메가픽셀 CMOS 센서는 첨단 운전자 보조 시스템(ADAS) 및 자율주행(AD)용 차량 외부 카메라를 위해 특별히 설계되었습니다. Mobileye사와 공동 개발한 혁신적인 촬영 솔루션을 통해 프레임 속도를 최대 60fps까지 향상시켰으며, a-CSP를 채택함으로써 동급 외부 센서와 비교하여 크기를 50% 줄였습니다.
3. HDR 및 LFM 기술 통합 - 140dB 이상이 필수 기준
첨단 운전자 보조 시스템(ADAS)에서 140dB를 초과하는 하이 다이내믹 레인지(HDR) 및 LED 플리커 저감(LFM)은 자동차용 CMOS 이미지 센서(CIS)에 있으며, 엄격한 기술적 기준이 되고 있습니다. 이 통합 기술은 극한의 조명 조건에서 발생하는 촬영 문제를 해결하여, 차량이 교통 신호를 정확하게 식별하고 시각적 오판을 방지하도록 보장합니다.
SmartSens SC126AT를 예로 들어보겠습니다. CARSens(R)-XR Plus 기술 플랫폼을 기반으로 개발된 SC126AT는 SFCPixel(R), PixGain HDR(R) 및 기타 우수한 기술을 통합한 싱글 픽셀 아키텍처 설계를 채택하고 있습니다. 고감도, 넓은 다이내믹 레인지, 저노이즈와 같은 뛰어난 성능 지표를 자랑하며, 온칩 ISP 기능도 지원합니다.
LiDAR 센서 칩 - 수천 채널과 6D 풀컬러 인식의 시대
2026년, 자동차용 카메라 칩 시장에서는 다음과 같은 3가지 주요 동향이 나타납니다. :
1. 채널 수가 수백 개에서 수천 개로 기하급수적으로 급증
2026년 4월, RoboSense는 세계 최초로 네이티브 2160채널을 지원하는 자동차 등급 SPAD-SoC 'Phoenix'를 출시했습니다. 또한 Hesai는 최대 4,320채널을 갖춘 6D 풀컬러 칩 'Picasso'를 출시했고, 화웨이는 896채널의 듀얼 광로 이미지 레벨 LiDAR를 발표했습니다. 자동차용 LiDAR의 지각 능력은 공식적으로 '점군 레벨'에서 '이미지 레벨'로 전환되었습니다.
RoboSense의 두 가지 플래그십 칩을 예로 들면:
'Phoenix' 칩은 세계 최초의 모노리식 집적형 네이티브 2160채널 자동차 등급 SPAD-SoC입니다. 4메가픽셀을 넘는 초고해상도와 600미터의 초장거리 감지 범위를 실현하여, LiDAR의 인식 정밀도와 커버 범위를 전례 없는 수준으로 끌어올렸습니다. 이 칩은 이미 자동차 등급 인증을 획득했으며, 2026년 중 양산 및 차량 탑재가 예정되어 있습니다. 이를 통해 레벨 3 이상의 고도 자율주행에서 초고해상도 인지 기반으로서 기능합니다.
'Peacock Chip'은 해상도 640×480을 자랑하는 업계 최초의 양산 대응 올 솔리드 스테이트 대면적 SPAD-SoC입니다. 180°×135°의 초광시야각과 밀리미터 수준의 정밀도를 갖추고 있으며, 단거리이자 사각지대가 없는 지점을 포착하며 초고밀도 포인트 클라우드 커버리지를 실현함으로써, 지금까지 없던 비용 대비 성능을 제공합니다. 2026년 3분기에 양산을 시작할 예정이며, 주로 자동차용 사이드 및 사각지대 감지용 LiDAR, 로봇 공학, 공간 인텔리전스 시장을 타깃으로 하여 고성능 지각 기술의 대규모 보급을 추진합니다.
2. 디지털 아키텍처가 아날로그 아키텍처를 완전히 대체
2024-2025년에 자동차용 라이다(LiDAR) 업계에서는 핵심 아키텍처의 세대 교체가 일어났습니다. SPAD-SoC(단일 광자 애벌랜치 다이오드 시스템 온 칩)로 대표되는 디지털 아키텍처가 기존의 아날로그 아키텍처를 완전히 대체하며, 고성능 자동차용 라이다의 표준 솔루션으로 자리 잡았습니다.
SPAD-SoC는 센싱과 연산을 통합한 아키텍처 설계를 채택하여, SPAD 어레이와 완전한 디지털 신호 처리 시스템을 단일 칩 위에 통합하고 있습니다. SPAD-SoC는 광자 감지, 시간 측정, 신호 처리, 데이터 출력을 포함한 전체 워크플로를 동시에 완료할 수 있으며, 광자가 입사하면 즉시 깊이/이미지 데이터를 출력합니다.
기존의 디스크리트 솔루션과 비교하여 SPAD-SoC는 고집적화, 저전력 소비, 소형화, 고속 응답을 특징으로 합니다. 이는 장거리·다채널 LiDAR 및 단거리 플래시 LiDAR의 핵심 구성 요소로 기능하며, LiDAR 성능에 가장 큰 영향을 미치기 때문에 모든 LiDAR 공급업체가 경쟁하는 중요한 기술적 요충지로 발전하고 있습니다.
3. 칩 기반 6D 풀컬러 지각
2026년, 칩 기반 6D 풀컬러 지각을 통해 LiDAR는 ‘색맹 측정기’에서 ‘풀컬러 관찰자’로 진화할 것입니다. 이는 단순히 3차원 공간 좌표(XYZ)만을 출력하는 것에서 공간 좌표와 색상 정보(RGB)를 동기화하여 출력하는 6차원 지각 능력으로 업그레이드됨을 의미합니다.
칩 수준에서 컬러 광 센싱(RGB)과 TOF 거리 측정(XYZ)이 네이티브 픽셀 수준의 융합을 실현하여 컬러 포인트 클라우드를 직접 생성합니다. 이는 생성된 모든 데이터 포인트가 본질적으로 정확한 공간 위치와 실제 색상 정보를 갖추고 있음을 의미하며, 스티칭, 보정 또는 보충적인 추론이 필요하지 않습니다.
Hesai사의 ‘Picasso 6D 풀컬러 LiDAR 칩’을 예로 들어보겠습니다. Hesai사는 RGB 컬러 광 센싱 기능을 LiDAR 수신 칩에 직접 통합했습니다. 'Picasso SPAD-SoC'는 하나의 칩으로 근적외선 레이저 거리 측정과 가시광선 센싱을 모두 처리하는 '올 퓨전(All-Fusion)' 설계를 채택하고 있습니다. 각 픽셀 유닛은 거리를 측정하기 위한 레이저 조사와 색상을 식별하기 위한 빛 포착을 모두 수행할 수 있습니다. 즉, 레이저 광선이 물체에서 반사될 때 칩은 각 지점의 공간적 위치와 색상을 모두 순간적으로 포착합니다.
레이더 센서 칩 - 위성 아키텍처와 고채널 설계
1. 위성 아키텍처의 적용 동향
2026년, 위성 아키텍처는 자동차용 레이더 센서 칩의 핵심 기술 혁신 방향으로 부상하고 있습니다. 이 아키텍처는 기존의 ‘엣지 인텔리전스’라는 설계 철학을 뒤집고, 레이더를 독립된 블랙박스에서 개방형 지각 프론트엔드로 진화시키고 있습니다.
위성 아키텍처의 본질은 자율주행 지각 시스템 내의 ‘분업 모델’에 있습니다. 레이더는 프런트엔드 지각(RF 송수신 및 원시 데이터 수집)에 특화된 ‘위성’으로 기능하는 반면, 복잡한 신호 처리, 표적 탐지 및 추적 알고리즘은 모두 중앙 도메인 컨트롤러로 이관됩니다.
위성 레이더 솔루션에는 주로 다음 두 가지 유형이 있습니다. :
전용 RSP IC 솔루션 - 레이더 모듈 공급업체가 주도하는 높은 에너지 효율과 유연성을 갖춘 전용 레이더 브리지 칩을 채택하고 있습니다.
RSP IP 통합형 ADAS SoC 솔루션 - 각 OEM 업체가 주도하며, 레이더 신호 프로세서 IP를 ADAS SoC에 통합함으로써 최대 집적화를 실현하는 방식입니다.
2. 8T8R 이미징 레이더의 보급 가속화
2026년은 8T8R 이미징 레이더 칩의 양산이 시작되는 첫 해가 될 것입니다. NXP의 TEF8388과 인피니온의 CTRX8188F를 비롯한 싱글 칩 8T8R 솔루션이 잇달아 등장함에 따라 4D 레이더는 하이엔드 옵션 사양에서 대규모 보급으로 전환되고 있습니다. 저비용, 고집적화, 뛰어난 전력 효율을 자랑하는 8T8R 아키텍처는 미드엔드 6T8R 솔루션과 하이엔드 16T16R/24T24R 솔루션을 연결하는 중요한 가교 역할을 하고 있습니다. 싱글 칩 8T8R 솔루션은 CMOS 기술을 채택하여 RF 프런트엔드와 신호 처리를 고도로 집적함으로써 성능, 비용, 양산성 사이에서 최적의 균형을 실현하고 있습니다. 향후 3년 동안 15만 위안 대의 주류 차종에 급속히 보급되어, 고도화된 자율주행용 지각 시스템의 ‘필수 요건’이 될 것으로 전망됩니다.
인피니온(Infineon)사의 RASIC(TM) CTRX8188F를 예로 들어보겠습니다. 이 8T8R 자동차용 레이더 트랜시버는 이미징 레이더 및 고수준 ADAS 애플리케이션을 대상으로 합니다. 이러한 고채널 레이더 칩은 기존의 레이더 모듈뿐만 아니라 중앙 처리 아키텍처에도 적용되어, 풍부한 원시 레이더 데이터를 백엔드 컴퓨팅 플랫폼으로 전송합니다.
CTRX8188F는 업계를 선도하는 여러 RF 성능 지표를 실현하고 있습니다. 14.5dBm의 송신 전력으로 장거리 레이더 감지를 보장하며, -100 dBc/Hz의 낮은 위상 잡음으로 뛰어난 신호 대 잡음비를 실현하고, 10.2dB의 잡음 지수로 업계 최고 수준의 수신 감도를 실현하고 있습니다. 센티미터 수준의 거리 분해능을 실현하는 4GHz 초광대역; 고속 이동 표적의 탐지 요건을 충족하는 최대 200MHz/µs의 변조 속도.
초음파 및 UWB 근거리 감지 칩 - 보조 기능에서 핵심 감지 기능으로의 진화
1. 초음파 레이더 센서 칩의 핵심 기술 동향: 통합 아키텍처
엣지 AI 추론 기능의 통합: 2026년에는 주류 초음파 레이더 모듈에 신경망 처리 장치(NPU)를 탑재한 마이크로컨트롤러가 통합되어, 경량 딥러닝 모델의 실시간 추론을 충분히 지원할 수 있게 될 것입니다.
센서 간 모달리티의 정합 및 융합 - 초음파 레이더 칩의 협업 기능은 센서 간 연동에서 멀티모달 융합으로 진화합니다. 2026년의 하이엔드 자율주행 아키텍처에서는 초음파 레이더의 단거리·고정밀 거리 데이터, 카메라의 풍부한 텍스처 정보, 레이더의 속도 벡터 데이터가 크로스 모달 어텐션 메커니즘을 갖춘 트랜스포머 아키텍처를 통해 융합될 것입니다.
2. 자동차용 UWB 근거리 인식 칩의 주요 기술 동향: 다기능 통합
밀리파 기술과 UWB 기술의 융합을 통해 UWB 기술은 차량 사용시 ‘모든 시나리오에서의 안전 보호’ 실현을 목표로 하고 있습니다. 그 범위는 ADAS(첨단 운전자 지원 시스템) 운영시 차량 검색, 잠금 해제, 장애물 회피부터 주차, 도어 개폐 및 잠금에 이르기까지 다양합니다. 이는 단순한 기능의 중첩이 아니라, 시스템의 효율성과 비용 구조의 재구성을 의미합니다. UWB는 단순한 ‘스마트 키’에서 차량 내부와 외부의 인지 네트워크를 연결하는 ‘지능형 신경망’으로 진화하고 있습니다.
‘통신 칩’에서 통신·인지 통합형 SoC로의 진화
칩 아키텍처의 ‘3-in-1’ 통합을 통해 주류 UWB 칩은 단순히 거리 측정만 지원하는 통신 칩에서 ‘위치 측정 + 레이더 + 통신’이라는 3가지 기능을 겸비한 SoC 솔루션으로 진화했습니다.
'단일 지점 지각'에서 협업 지각으로의 진화
기존 UWB 레이더의 앵커 포인트는 독립적으로 작동하므로 기반리에서 사각지대가 발생했습니다. Calterah는 IEEE 802.15.4ab 규격에서 정의된 센싱 기술을 채택하여 멀티스태틱 레이더 모드를 구현하고 있습니다. 후방의 앵커 R1이 송신하는 동안 R2는 수신하며, 그 반대의 경우도 마찬가지로 진행됩니다. 이를 통해 고립된 UWB 레이더를 협업하여 작동하는 네트워크화된 레이더로 변혁시키고 있습니다.
Calterah의 UWB 제품 시리즈를 예로 들면, 이 회사는 완성도 높은 두 가지 개발 키트를 출시했습니다. 하나는 차량내 ‘아동 존재 감지(CPD)’용이고, 다른 하나는 4ab 센싱 기술을 기반으로 한 주차 지원 시스템용입니다. 이 키트들은 Tier 1 공급업체 및 OEM을 대상으로 하드웨어 레퍼런스 디자인, 소프트웨어 SDK, AI 모델, 툴체인 등 완벽한 세트를 제공합니다.
이 개발 키트에는 디지털 키, 킥 투 오픈(Kick-to-Open) 방식의 테일게이트, 차량내 아동 감지, 외부 주차 지원, 센트리 모드 등 다기능 융합 솔루션이 통합되어 있으며, 신속한 도입이 가능한 엔지니어링 솔루션을 구성하고 있습니다. 차체상의 UWB 앵커 포인트 세트를 재사용함으로써, 여러 가지 지능형 인식 및 연결 시나리오를 구현할 수 있습니다.
목차
제1장 자동차 자율주행 센서 칩 시장의 개요
제2장 자동차용 카메라 센서 칩
제3장 자동차용 LiDAR 센서 칩
제4장 자동차용 레이더 센서 칩
제5장 기타 센서 칩
제6장 OEM의 센서 칩 응용과 향후 동향
제7장 공급업체 각사의 센서 칩 생산 상황과 향후 동향
KSA 26.08.20Research on Autonomous Driving Sensor Chips: Deeply Perceiving the Physical World, Sensor Chips Are Playing A "Leading Role" in Intelligence
In 2026, the autonomous driving sensor chip industry hits a critical turning point. The access policy for L3 autonomous driving is officially implemented, and high-level intelligent driving enters the large-scale application phase. Centered on the technological evolution trend of sensor chips, this report elaborates on the technological direction of autonomous driving sensor chips under three core transformations: perception upgrading driven by regulations, large-scale rollout of L3 from pilot trials, and revaluation cycle of hardware market. It systematically sorts out the technological evolution, market competition and industrial pattern of five major categories of sensor chips including automotive camera, LiDAR, radar, ultrasonic radar and UWB near-field sensing, covering product updates of major suppliers and application status of OEMs.
The technological evolution of the five major categories of sensor chips highlights the following:
Camera CIS chips: Evolving from "merely imaging" to "sensing-computing integration" intelligent perception terminals;
LiDAR chips: Entering a new era of "thousands of channels" and 6D full-color perception;
Radar chips: Moving from "edge processing" towards satellite architecture and high-channel count design;
Ultrasonic and UWB chips: Upgrading from "auxiliary perception" to full-scenario collaborative nodes.
Camera Sensor Chips: Resolution Improvement and Intelligent Integration
In 2026, the automotive camera chip market presents three major trends:
1. Mass Popularization of Back-side-illuminated (BSI) and Stacked Structures
CIS is categorized by structural technology into Front-Side Illuminated (FSI), Back-Side Illuminated (BSI) and Stacked structures, and the stacked architecture represents the mainstream direction for the future. Automotive CIS imposes higher requirements on image resolution, dynamic range, low-light imaging capability and multi-camera collaborative processing capability, and needs to meet automotive-grade certification and functional safety standards. In 2025, BSI + 3D stacked structures accounted for over 75% of mass-produced CIS worldwide, with single-pixel size breaking through 0.6 micrometers.
Take SmartSens SC860AT as an example: Built on SmartSens' brand-new CARSens(R)-XR Gen 2 technology platform, SC860AT adopts a single-pixel architecture, integrated with advanced technologies including Lofic HDR(R)2.0 and SFCPixel(R), and supports AB-Exposure(TM) dual-frame exposure control. It has performance advantages such as high frame rate, high sensitivity and wide dynamic range, catering to brand-new image upgrade requirements of automotive front-view, side-view, rear-view cameras, in-cabin occupancy monitoring system (OMS) cameras and E-Mirror electronic rearview mirrors.
2.High Resolution: 8MP Becomes Standard, and 12MP Gathers Pace
In 2026, with the popularization of ADAS, 8-megapixel sensors have become standard configuration for high-level intelligent driving, and 12-megapixel products make a debut.
Take OmniVision OX08D20 as an example: This 8-megapixel CMOS sensor is specially designed for exterior automotive cameras in Advanced Driver Assistance Systems (ADAS) and Autonomous Driving (AD). Via an innovative shooting solution co-developed with Mobileye, it boosts frame rate up to 60 fps, and adopts a-CSP that reduces its size by 50% compared with peer exterior sensors.
3.Integration of HDR and LFM Technologies - 140dB+ Becomes A Mandatory Threshold
For Advanced Driver Assistance Systems (ADAS), high dynamic range (HDR) exceeding 140dB and LED Flicker Mitigation (LFM) have become rigid technical thresholds for automotive CMOS image sensors (CIS). This integrated technology addresses imaging challenges under extreme lighting conditions, ensuring vehicles accurately identify traffic signals and avoid visual misjudgments.
Take SmartSens SC126AT as an example: Developed on the CARSens(R)-XR Plus technology platform, SC126AT features a single-pixel architecture design integrated with SFCPixel(R), PixGain HDR(R) and other advantageous technologies. It boasts high sensitivity, wide dynamic range, low noise and other superior performance metrics, and supports on-chip ISP functions.
LiDAR Sensor Chips: Era of Thousands of Channels and 6D Full-Color Perception
In 2026, the automotive camera chip market witnesses three major trends:
1.Exponential Surge in Channel Count from Hundreds to Thousands
In April 2026, RoboSense launched Phoenix, the world's first native 2160-channel automotive-grade SPAD-SoC; Hesai released Picasso, a 6D full-color chip with up to 4320 channels; Huawei rolled out an 896-channel dual optical path image-level LiDAR. The perception capability of automotive LiDAR has formally transitioned from "point cloud level" to "image level".
Take RoboSense's dual flagship chips as examples:
The Phoenix Chip is the world's first monolithically integrated native 2160-channel automotive-grade SPAD-SoC. It delivers ultra-high resolution of over 4 megapixels and an ultra-long detection range of 600 meters, elevating the perception precision and coverage of LiDAR to an unprecedented level. The chip now has obtained automotive-grade certification and is scheduled for mass production and vehicle integration within 2026, serving as the ultra-high-definition perception foundation for L3 and above high-level intelligent driving.
The Peacock Chip is the industry's first production-ready all-solid-state large-area SPAD-SoC with a resolution of 640X480. With an ultra-wide field of view of 180°X135° and millimeter-level accuracy, it enables short-range, blind-spot-free point, ultra high-density point cloud coverage, offering unprecedented cost-effectiveness. Scheduled for mass production in Q3 2026, it will be mainly oriented to automotive side and blind-spot detection LiDAR, robotics and spatial intelligence markets to drive large-scale adoption of high-performance perception.
2.Digital Architecture Fully Replaces Analog Architecture
From 2024 to 2025, the automotive LiDAR industry underwent a generational transformation of core architectures. Digital architectures represented by SPAD-SoC (Single-Photon Avalanche Diode - System-on-Chip) have fully replaced traditional analog architectures and become the standard solution for high-performance automotive LiDAR.
SPAD-SoC adopts a sensing-computing integrated architectural design, integrating SPAD arrays and a complete digital signal processing system on a single chip. SPAD-SoC can complete the full workflow including photon detection, time measurement, signal processing and data output simultaneously, directly outputting depth/image data upon photon incidence.
Compared with traditional discrete solutions, SPAD-SoC features high integration, low power consumption, compact size and fast response speed. It acts as the core component for long-range high-channel LiDAR and short-range Flash LiDAR, exerting the most significant impact on LiDAR performance, thus evolving into a critical technological highland contested by all LiDAR suppliers.
3.Chip-Based 6D Full-Color Perception
In 2026, chip-based 6D full-color perception marks LiDAR evolves from a "color-blind measuring instrument" to a "full-color observer". It upgrades from merely outputting three-dimensional spatial coordinates (XYZ) to six-dimensional perception capability that synchronously outputs spatial coordinates and color information (RGB).
At the chip level, color light sensing (RGB) and TOF ranging (XYZ) achieve native pixel-level fusion, directly generating colored point clouds. This means every data point inherently carries precise spatial position and authentic color information upon generation - no stitching, calibration or supplementary deduction required.
Take Hesai's Picasso 6D full-color LiDAR chip as an example: Hesai embeds RGB color light sensing functionality directly into the receiving chip of LiDAR. The Picasso SPAD-SoC adopts an all-fusion design where a single chip handles both near-infrared laser ranging and visible light sensing. Each pixel unit can both emit lasers to measure distance and capture light to identify colors. This means that when laser beams reflect off objects, the chip instantly captures both the spatial position and color of each point.
Radar Sensor Chips: Satellite Architecture and High-Channel Design
1. Adaptation Trend of Satellite Architecture
In 2026, Satellite Architecture emerges as the core technological transformation direction for automotive radar sensor chips. This architecture subverts the traditional "edge intelligence" design philosophy, driving radars to evolve from independent black box to open perception frontend.
The essence of satellite architecture is a "division of labor model" for intelligent driving perception systems. Radars act as "satellites" dedicated to frontend perception (RF transceiving and raw data collection), while complex signal processing, target detection and tracking algorithms are entirely migrated upward to the central domain controller.
There are two primary satellite radar solutions:
Dedicated RSP IC Solution: Adopts dedicated Radar Bridge chips featuring high energy efficiency and flexibility, led by radar module suppliers;
RSP IP Integrated ADAS SoC Solution: Integrates radar signal processor IP into ADAS SoC for maximum integration, led by OEMs.
2. Popularization of 8T8R Imaging Radar Accelerates
2026 marks the inaugural year for the mass production of 8T8R imaging radar chips. The successive launch of single-chip 8T8R solutions including NXP TEF8388 and Infineon CTRX8188F is driving 4D radar from high-end optional configuration to large-scale popularization. Boasting lower cost, higher integration and superior power efficiency, the 8T8R architecture serves as a critical bridge between mid-end 6T8R and high-end 16T16R/24T24R solutions. Single-chip 8T8R solutions adopt CMOS technology to highly integrate RF frontends and signal processing, striking an optimal balance among performance, cost and mass producibility. It is projected to rapidly penetrate mainstream RMB150,000 vehicle models over the next three years and become a "rigid demand" for high-level intelligent driving perception systems.
Take Infineon RASIC(TM) CTRX8188F as an example: This 8T8R automotive radar transceiver targets imaging radar and high-level ADAS applications. Such high-channel radar chips apply not only to conventional radar modules but also central computing architectures, transmitting rich raw radar data to backend computing platforms.
The CTRX8188F delivers multiple industry-leading RF performance metrics: transmitting power of 14.5dBm ensuring long-distance radar detection; phase noise as low as -100 dBc/Hz for superior signal-to-noise ratio; noise figure of 10.2dB delivering industry-leading receiving sensitivity; 4GHz ultra wideband enabling centimeter-level distance resolution; modulation speed up to 200 MHz/µs meeting detection requirements for high-speed moving targets.
Ultrasonic and UWB Near Field Perception Chips: Upgraded from Auxiliary to Core Perception
1. Core Technological Trend of Ultrasonic Radar Sensor Chips: Integrated Architecture
Integration of Edge AI Inference Capability: In 2026, mainstream ultrasonic radar modules integrate microcontrollers equipped with Neural Processing Units (NPU), enough to support real-time inference of lightweight deep learning models.
Cross-Sensor Modal Alignment and Fusion: The collaborative capability of ultrasonic radar chips evolves from inter-sensor coordination to multi-modal fusion. In high-end intelligent driving architectures in 2026, short-range high-precision distance data from ultrasonic radars, rich texture information from cameras and velocity vector data from radars are fused via Transformer architecture with cross-modal attention mechanisms.
2. Core Technological Trend of Automotive UWB Near Field Perception Chips: Multi-Functional Integration
With the combination of millimeter-wave and UWB technologies, UWB technology is striving to deliver "full-scenario safety protection" for vehicle usage, covering from car search, unlocking, and obstacle avoidance in ADAS operation to parking, door opening and locking. This represents not merely superposition of functions, but a reconstruction of system efficiency and cost structure. UWB is evolving from a single "smart key" to an "intelligent neural network" connecting internal and external perception networks.
Evolution from "Communication Chips" to Communication-perception Integrated SoC
The "three-in-one" integration of chip architecture means that mainstream UWB chips have evolved from communication chips only supporting ranging to a "positioning + radar + communication" trinity SoC solution.
Evolution from "Single-Point Perception" to Collaborative Perception
Traditional UWB radar anchor points operate independently, creating near-field blind spots. By adopting the Sensing technology defined under IEEE 802.15.4ab standard, Calterah realizes multi-static radar mode - rear anchor R1 transmits while R2 receives and vice versa, transforming isolated UWB radars into networked radars operating in coordination.
Take Calterah's UWB product series as an example: Calterah launched two mature development kits: one for in-cabin Child Presence Detection (CPD), and the other for parking assist systems based on 4ab Sensing technology. These kits deliver a complete set of hardware reference design, software SDK, AI model and toolchain to Tier 1 suppliers and OEMs.
The development kits integrate multi-functional fusion solutions including digital key, kick-to-open tailgate, in-vehicle child detection, external parking assist and sentry mode to form an engineering solution ready for rapid deployment. By reusing a set of vehicle-body UWB anchor points, multiple intelligent perception and connectivity scenarios can be enabled.
Table of Contents
1 Overview of Automotive Autonomous Driving Sensor Chip Market
- 1.1 Overview of Automotive Autonomous Driving Sensor Chips
- 1.1.1 Types of Autonomous Driving Sensor Chips
- Overview and Classification of Autonomous Driving Sensor Chips
- Functional Principles, Signal Processing Links and Core Technical Indicators of Camera Perception Chips
- Functional Principles, Signal Processing Links and Core Technical Indicators of LiDAR Chips
- Functional Principles, Signal Processing Links and Core Technical Indicators of Radar Chips
- Functional Principles, Signal Processing Links and Core Technical Indicators of Ultrasonic Radar Chips
- Comparison of Advantages, Disadvantages and Complementary Perception Logic of Various Autonomous Driving Sensor Chips
- Fusion Strategy and Function Mapping of Autonomous Driving Sensors
- 1.1.2 Sensor Configuration for Different Levels of Autonomous Driving
- China's Taxonomy of Driving Automation for Vehicles
- Installation Rate of L1-L3 Intelligent Driving Systems (Including Hardware Pre-Embedded) in Passenger Cars in China, 2022-2030E
- Sensor Configuration of Autonomous Driving by Level
- Intelligent Driving Solutions, Sensor Configurations and Suppliers of OEMs (1)
- Intelligent Driving Solutions, Sensor Configurations and Suppliers of OEMs (2)
- Intelligent Driving Solutions, Sensor Configurations and Suppliers of OEMs (3)
- Intelligent Driving Solutions, Sensor Configurations and Suppliers of OEMs (8)
- Intelligent Driving Solutions, Sensor Configurations and Suppliers of OEMs (9)
- Sensor Configurations for Current Mainstream Intelligent Driving Solutions of OEMs and Their Next-Generation Deployment Plans (1)
- Sensor Configurations for Current Mainstream Intelligent Driving Solutions of OEMs and Their Next-Generation Deployment Plans (2)
- Sensor Configurations for Current Mainstream Intelligent Driving Solutions of OEMs and Their Next-Generation Deployment Plans (3)
- Sensor Configurations for Current Mainstream Intelligent Driving Solutions of OEMs and Their Next-Generation Deployment Plans (4)
- Sensor Configurations for Current Mainstream Intelligent Driving Solutions of OEMs and Their Next-Generation Deployment Plans (5)
- Sensor Configurations for Current Mainstream Intelligent Driving Solutions of OEMs and Their Next-Generation Deployment Plans (6)
- 1.2 Industrial Policies and Standards
- 1.2.1 Dynamics in Autonomous Driving Sensor Standards
- Dynamics in Chinese Regulations and Standards for Autonomous Driving Sensors
2 Automotive Camera Sensor Chips
- 2.1 Summary of New Automotive Camera Sensor Chip Products and Trends
- Summary of New Automotive Camera Sensor Chip Products (1)
- Summary of New Automotive Camera Sensor Chip Products (2)
- Summary of New Automotive Camera Sensor Chip Products (3)
- Summary of Development Trends of Automotive Camera Sensor Chips
- New Automotive Camera Sensor Chip Products
- Technical Trend 1 of Automotive Camera Sensor Chips
- Technical Trend 2 of Automotive Camera Sensor Chips
- Technical Trend 3 of Automotive Camera Sensor Chips
- 2.2 Classification and Market Size Forecast for Automotive Camera Sensor Chip Products
- Classification of Core Chip Products for Automotive Camera Sensors - CMOS Image Sensor (CIS)
- Performance Specification Indicators of CMOS Image Sensor (CIS)
- Structural Composition of CMOS Image Sensor (CIS) (1)
- Structural Composition of CMOS Image Sensor (CIS) (2)
- Classification of Core Chip Products for Automotive Camera Sensors
- Performance Specification Indicators of Image Signal Processors (ISP)
- Image Signal Processor (ISP) IP
- Image Signal Processor (ISP) IP: Automotive-Grade Products and Certifications of Overseas and China's Local Suppliers (1)
- Image Signal Processor (ISP) IP: Automotive-Grade Products and Certifications of Overseas and China's Local Suppliers (2)
- Shipments of Camera Chips (1-3MP, 5MP, 8MP and Above) for Chinese Passenger Cars, 2022-2030E
- Shipments of Camera Chips (1-3MP, 5MP, 8MP and Above) for China's Local Passenger Cars, 2022-2030E (1)
- Shipments of Camera Chips (1-3MP, 5MP, 8MP and Above) for China's Local Passenger Cars, 2022-2030E (2)
- Shipments of Camera Chips (1-3MP, 5MP, 8MP and Above) for China's Local Passenger Cars, 2022-2030E (2)
3 Automotive LiDAR Sensor Chips
- 3.1 Summary of New Automotive LiDAR Sensor Chip Products and Trends
- Summary of New Automotive LiDAR Sensor Chip Products (1)
- Summary of New Automotive LiDAR Sensor Chip Products (2)
- Summary of New Automotive LiDAR Sensor Chip Products (3)
- New Automotive LiDAR Sensor Chip Products
- Technical Trend 1 of Automotive LiDAR Sensor Chips
- Technical Trend 2 of Automotive LiDAR Sensor Chips
- Technical Trend 3 of Automotive LiDAR Sensor Chips
- Technical Trend 4 of Automotive LiDAR Sensor Chips
- 3.2 Classification and Market Size Forecast for Automotive LiDAR Sensor Chip Products
- Classification of Automotive LiDAR Sensor Chip Products (1)
- Classification of Automotive LiDAR Sensor Chip Products (2)
- Operating Mechanism of Automotive LiDAR Sensor Chips
- Installations and Market Size of LiDAR for China's Local Passenger Cars, 2022-2030E
- Market Size of LiDAR for China's Local Passenger Cars, 2022-2030E, Attached with Calculation Tables
4 Automotive Radar Sensor Chips
- 4.1 Summary of New Automotive Radar Sensor Chip Products and Trends
- Summary of New Automotive Radar Sensor Chip Products (1)
- Summary of New Automotive Radar Sensor Chip Products (2)
- New Automotive Radar Sensor Chip Products
- Technical Trend 1 of Automotive Radar Sensor Chips
- Technical Trend 2 of Automotive Radar Sensor Chips (1)
- Technical Trend 2 of Automotive Radar Sensor Chips (2)
- Technical Trend 2 of Automotive Radar Sensor Chips (3)
- Technical Trend 3 of Automotive Radar Sensor Chips (1)
- Technical Trend 3 of Automotive Radar Sensor Chips (2)
- 4.2 Classification and Market Size Forecast for Automotive Radar Sensor Chip Products
- Classification of Automotive Radar Sensor Chip Products
- Industry Chain of Automotive Radar Chips
- Installations of Radars (Traditional, 4D Imaging, Distributed Radars) for China's Local Passenger Cars, 2022-2030E, Attached with Calculation Tables
5 Other Sensor Chips
- 5.1 Trends and Market Size Forecast for New Automotive Ultrasonic Radar Sensor Chip Products
- Summary of New Automotive Ultrasonic Radar Sensor Chip Products
- New Automotive Ultrasonic Radar Sensor Chip Products
- Technical Trend 1 of Automotive Ultrasonic Radar Sensor Chips
- Technical Trend 2 of Automotive Ultrasonic Radar Sensor Chips
- Technical Trend 3 of Automotive Ultrasonic Radar Sensor Chips
- 5.2 Trends and Market Size Forecast for New Automotive UWB Near-Field Sensing Chip Products
- Summary of New Automotive UWB Near-Field Sensing Chip Products
- Automotive Application Scenarios of UWB
- UWB Function Expansion (1)
- UWB Function Expansion (2)
- New Automotive UWB Near-Field Sensing Chip Products
- Technical Trend 1 of Automotive UWB Near-Field Sensing Chips
- Technical Trend 2 of Automotive UWB Near-Field Sensing Chips
6 OEMs' Application and Future Trends of Sensor Chips
- 6.1 Geely
- Summary of Intelligent Driving Platforms and Sensor Applications
- Summary of Core Camera Sensor Chip Suppliers and Applications (Partial)
- Summary of Core LiDAR Chip Suppliers and Applications (Partial)
- Summary of Core Radar Chip Suppliers and Applications (Partial)
- Intelligent Driving Solution Layout
- LiDAR Chip Cooperation - RoboSense Eocene Digital Architecture and Dual Flagship Chips
- Phoenix Chip Empowers Robotaxi Prototype Eva Cab (1)
- Phoenix Chip Empowers Robotaxi Prototype Eva Cab (2)
- LiDAR Chip Cooperation - Hesai FM C500 Main Control Chip Based on RISC-V Architecture
- High-End Chips Empowers Intelligent Driving AI - G-ASD 4.0 (1)
- High-End Chips Empowers Intelligent Driving AI - G-ASD 4.0 (2)
- High-End Chips Empowers Intelligent Driving AI - G-ASD 4.0 (3)
- 6.2 Changan
- Summary of Intelligent Driving Platforms and Sensor Applications
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
- Image Signal Processor (ISP) Cooperation - Fullhan FH8330E
- LiDAR Chip Cooperation - Hesai FTX LiDAR
- Ultrasonic Radar Chip Cooperation - Tinychip TCAU33 Automotive-Grade High-Voltage Direct-Drive Ultrasonic Sensor Chip
- Radar Chip Cooperation - Calterah Andes-Pro and Andes Premium 8T8R Imaging Radar Solutions
- Intelligent Driving AI - Tops AD
- 6.3 Great Wall Motor
- Summary of Intelligent Driving Platforms and Sensor Applications
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
- Intelligent Driving Solution Layout
- LiDAR Chip Cooperation - RoboSense Obtains OEM Designation Orders for New Vehicle Models
- Image Signal Processor (ISP) Cooperation - Raytron Infrared Thermal Imaging System
- LiDAR Chip Cooperation - Hesai Becomes Exclusive LiDAR Supplier for New-generation ORA Vehicle Models
- Intelligent Sensor R&D Layout - RaboSensor
- IC and Hardware Design
- 6.4 Chery
- Summary of Intelligent Driving Platforms and Sensor Applications
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
- Intelligent Driving Solution Layout
- CMOS Image Sensor (CIS) Chip Cooperation - SmartSens Automotive CIS
- LiDAR Chip Cooperation - Hesai LiDAR
- Multiple Sensors Empower Falcon Pilot System (1)
- Multiple Sensors Empower Falcon Pilot System (2)
- Multiple Sensors Empower Falcon Pilot System (3)
- Multiple Sensors Empower Falcon Pilot System (4)
- Multiple Sensors Empower Falcon Pilot System (5)
- 6.5 Volkswagen
- Summary of Intelligent Driving Platforms and Sensor Applications (1)
- Summary of Intelligent Driving Platforms and Sensor Applications (2)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (3)
- Relying on System-on-Chips Independently Designed and Developed by CARIZON
- Cooperation Update - Xheart X7 Chip
- CARIZON C7H Intelligent Driving Chip (1)
- CARIZON C7H Intelligent Driving Chip (2)
- 6.6 BYD
- Summary of Intelligent Driving Platforms and Sensor Applications
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
- Intelligent Driving Solution Layout (1)
- Intelligent Driving Solution Layout (2)
- DiPilot High-Level Intelligent Driving System
- Self-Developed Intelligent Driving Chip - Xuanji A3
- Cooperation Update - RoboSense LiDAR Equipped with Phoenix Chip
- 6.7 Li Auto
- Summary of Intelligent Driving Platforms and Sensor Applications
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
- Intelligent Driving Solution Layout
- Self-Developed Chip - Mach M100 (1)
- Self-Developed Chip - Mach M100 (2)
- Self-Developed Chip - Mach M100 (3)
- Self-Developed Automotive Chips - Autonomous Driving SoC, Intelligent Driving AI Inference Chip and SiC Power Chip for Motor Controllers
- Cooperation Update - Hesai Technology Obtains LiDAR Designation Order for the Full Ragne of Li Auto's Vehicle Models with New-Generation Driving Assistance Platform
- 6.8 Xpeng
- Summary of Intelligent Driving Platforms and Sensor Applications
- Summary of Core Sensor Chip Suppliers and Applications (Partial)
- Intelligent Driving Functions and Chip Application Trends (1)
- Intelligent Driving Functions and Chip Application Trends (2)
- Turing AI Chip (1)
- Turing AI Chip (2)
- Turing AI Chip (3)
- Turing AI Chip (4)
- 6.9 NIO
- Summary of Intelligent Driving Platforms and Sensor Applications
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
- Intelligent Driving Solution Layout
- Strategic Cooperation with GigaDevice
- Self-Developed LiDAR Chip - Yangjian Has Achieved Mass Production
- Intelligent Driving SoC - Shenji NX9031
- Intelligent Driving SoC - Performance Parameters of Shenji NX9031
- 6.10 Leapmotor
- Summary of Intelligent Driving Platforms and Sensor Applications
- Summary of Core Sensor Chip Suppliers and Applications (Partial)
- LiDAR Chip Cooperation - Deepened Strategic Partnership with Hesai Technology
- Cross-Domain Fusion Solution of Snapdragon(R) Cockpit Elite and Snapdragon Ride(TM) Elite
- Intelligent Driving AI - Over 40 VLA Driving Assistance Functions
- 6.11 Xiaomi Auto
- Summary of Intelligent Driving Platforms, and Core Sensor Chip Suppliers and Applications
- Intelligent Driving Solution Layout
- Hardware of Driving Assistance Sensors for New-Generation Xiaomi SU7 (Top-Spec for Full Range of the Model) (1)
- Hardware of Driving Assistance Sensors for New-Generation Xiaomi SU7 (Top-Spec for Full Range of the Model) (2)
- Hardware of Driving Assistance Sensors for New-Generation Xiaomi SU7 (Top-Spec for Full Range of the Model) (3)
- Intelligent Driving Sensor Configuration Under EEA2.0 (Xiaomi YU7)
- 6.12 SAIC Motor
- Summary of Intelligent Driving Platforms and Sensor Applications
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
- Intelligent Driving Solution Layout
- IM AD 3.0 Intelligent Driving System
- Innovative Cross-Domain Fusion Functions and Scenario Cases for Intelligent Driving - Peripheral Vision Perception Interaction (Intelligent Driving + Cockpit)
- Innovative Cross-Domain Fusion Functions and Scenario Cases for Intelligent Driving - Falcon Smart Lighting System 2.0 (Lighting + Intelligent Driving + Cockpit + Chassis)
- 6.13 GAC
- Summary of Intelligent Driving Platforms and Sensor Applications (1)
- Summary of Intelligent Driving Platforms and Sensor Applications (2)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
- Ultrasonic Radar Chip Cooperation - Geehy and GAC Jointly Develop China's First Mass-Produced Automotive-Grade Chip
- LiDAR Chip Cooperation - Seyond Obtains LiDAR Designation Order for GAC Platform Vehicle Models
- World Premiere and Mass Production of Horizon Journey(R) 6B Chip for Bz 3X
- Hyptec GT Climb Edition - Hanyu M1 Chip
- GAC Launches 12 Automotive-Grade Chips Together with Partners
- 6.14 FAW Hongqi
- Summary of Intelligent Driving Platforms and Sensor Applications
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
- Feiren 1.X Architecture - Central Computing Platform - Self-Developed Five-Domain Fusion AI Chip "Hongqi No.1"
- China's First Automotive-Grade Advanced Process Multi-Domain Fusion Chip - "Hongqi No.1"
- Feiren 1.X Architecture Empowers Hongqi Sinan Intelligent Driving
- 6.15 Dongfeng Motor
- Summary of Intelligent Driving Platforms and Sensor Applications
- Summary of Core Sensor Chip Suppliers and Applications (Partial)
- Chip Cooperation Update - Strategic Partnership with National New Energy Vehicle Technology Innovation Center
- Intelligent Driving Solution Cooperation Update - SenseAuto and Dongfeng Motor Jointly Launches the Industry's First Generative Intelligent Driving Mass Production Solution
- Multi-Sensor Fusion Empowers Tianyuan Intelligent Driving Technology Architecture R-AiD (1)
- Multi-Sensor Fusion Empowers Tianyuan Intelligent Driving Technology Architecture R-AiD (2)
- Multi-Sensor Fusion Empowers Tianyuan Intelligent Driving Technology Architecture R-AiD (3)
- 6.16 Huawei
- Summary of Intelligent Driving Platforms, and Core Sensor Chip Suppliers and Applications
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
- Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
- Iteration History and Continuous Evolution of Huawei ADS
- MAEXTRO V800 Supporting 40 Sensors + Eightfold Redundancy
- 896-Chnnel LiDAR (1)
- 896-Chnnel LiDAR (2)
- 896-Chnnel LiDAR (3)
- Partial Parameters of LiDAR/Radar Sensors for Qiankun Intelligent Driving
- C-C Ring Network Architecture: Qiankun ADS 4.0
- E/E Architecture: From Star Networking to Ethernet Ring Network
- Luxeed - Luxeed S7 E/E Architecture Design: Intelligent Driving Domain Sensor Configuration (1)
- Luxeed - Luxeed S7 E/E Architecture Design: Intelligent Driving Domain Sensor Configuration (2)
- AITO - AITO M9 E/E Architecture Topology Diagram: MDC Autonomous Driving Domain Controller and Sensor Configuration
- 6.17 Tesla
- Summary of Intelligent Driving Platform and Sensor Applications
- Summary of Core Sensor Chip Suppliers and Applications (Partial)
- Evolution of FSD Hardware Platform and Sensor Configuration
- Implementation Stages of Autopilot/FSD Functions
- Historical Iteration of Edge/Cloud Software and Hardware
- Central Computing Module - Next-Generation HW5.0/AI 5.0 for Intelligent Driving
- ISP IP of Automotive Chips for FSD Vision-only Solution
- R&D Progress of AI5
7 Production Status and Future Trends of Sensor Chips of Suppliers
- 7.1 OmniVision
- Profile
- Summary of Camera Sensor Chip Products
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.2 onsemi
- Profile
- Automotive Analog Chip Product Layout
- Summary of Camera Sensor Chip Products (1)
- Summary of Camera Sensor Chip Products (2)
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.3 Sony
- Profile
- Summary of Camera Sensor Chip Products
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends (1)
- Future Technological Trends (2)
- 7.4 SmartSens
- Profile
- Summary of Camera Sensor Chip Products
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.5 Samsung
- Profile
- Summary of Camera Sensor Chip Products
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.6 GalaxyCore
- Profile
- Summary of Camera Sensor Chip Products
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.7 Hesai Technology
- Profile
- Summary of LiDAR Chip Products
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.8 RoboSense
- Profile
- Summary of LiDAR Chip Products
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.9 Huawei
- Profile
- Summary of LiDAR Products
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.10 Seyond
- Profile
- Summary of LiDAR Chip Products
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.11 Calterah
- Profile
- Summary of Radar Chip Products
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.12 TI
- Profile o
- Automotive Analog Chip Product Layout (1)
- Automotive Analog Chip Product Layout (2)
- Summary of Radar Chip Products
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.13 STMicroelectronics
- Profile o
- Automotive Analog Chip Product Layout
- Summary of Radar Chip Products
- Automotive Sensor Chip Products
- One-Stop ADAS Domain Control Solution (1)
- One-Stop ADAS Domain Control Solution (2)
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.14 Desay SV
- Profile
- Summary of Complete Radar Solutions
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.15 NXP
- Profile
- Automotive Analog Chip Product Layout
- Summary of Radar Chip Products
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
- 7.16 Infineon
- Profile
- Automotive Analog Chip Product Layout
- Summary of Radar Chip Products
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends (1)
- Future Technological Trends (2)
- 7.17 Novosense
- Profile
- Automotive Analog Chip Product Layout
- Automotive Sensor Chip Products
- Development Roadmap of Automotive Sensor Chips
- Future Technological Trends
