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Printed Circuit Board Market Size, Share, Growth Analysis, By Product Type, By End User, By Product, By Laminate Materials, By Raw Materials, By Application, By Region - Industry Forecast 2024-2031

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  • Nippon Mektron Ltd.(Japan)
  • TTM Technologies, Inc.(United States)
  • Unimicron Technology Corporation(Taiwan)
  • Zhen Ding Technology Holding Limited(Hong Kong)
  • Young Poong Electronics Co., Ltd.(South Korea)
  • Samsung Electro-Mechanics Co., Ltd.(South Korea)
  • Ibiden Co., Ltd.(Japan)
  • Compeq Manufacturing Co., Ltd.(Taiwan)
  • Tripod Technology Corporation(Taiwan)
  • Daeduck GDS Co., Ltd.(South Korea)
  • Fujikura Ltd.(Japan)
  • Sumitomo Electric Industries, Ltd.(Japan)
  • CMK Corporation(Taiwan)
  • AT&S Austria Technologie & Systemtechnik AG(Austria)
  • Chin-Poon Industrial Co., Ltd.(Taiwan)
  • Kingboard Laminates Holdings Limited(Hong Kong)
  • Shennan Circuits Co., Ltd.(China)
  • WUS Printed Circuit Co., Ltd.(China)
  • KCE Electronics Public Company Limited(Thailand)
  • Multek Corporation(United States)

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KSA 25.01.02

Global Printed Circuit Board Market size was valued at USD 80 billion in 2022 and is poised to grow from USD 84.4 billion in 2023 to USD 132.1 billion by 2031, growing at a CAGR of 5.7% during the forecast period (2024-2031).

As of October 2023, the printed circuit board (PCB) market remains a cornerstone of the global electronics industry, vital for the functionality of nearly all electronic devices and systems. The rising demand for gadgets like smartphones and laptops is a primary driver of this growth. Additionally, population expansion and the increased adoption of electronics in developing economies are fueling the demand for PCBs. These components are increasingly utilized across diverse sectors, including consumer electronics, automotive, and IT & telecommunications, largely due to advancements in technology such as industrial automation and next-gen medical devices. Notably, the automotive sector is witnessing heightened PCB adoption, enabling seamless integration of mobile devices, enhancing user experience through features like battery monitoring and climate control.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Printed Circuit Board market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Printed Circuit Board Market Segmental Analysis

Global Printed Circuit Board Market is segmented by Product Type, End User, Product, Laminate Materials, Raw Materials, Application and Region. Based on Product Type, the market is segmented into Standard Multiplayer PCBs, Rigid 1-2 Sided PCBs, HDI/Micro-via/Build-Up, Flexible PCBs, Rigid-Flex PCBs, Others. Based on End User, the market is segmented into Industrial Electronics, Healthcare, Aerospace& Defence, Automotive, Consumer Electronics, Others. Based on Product, the market is segmented into Rigid PCBs, Standard Multiplayer, HDI/Build-up/Microtia, Flexible Circuits, IC Substrate, Others. Based on Raw Material, the market is segmented into Glass Fabric, Epoxy Resin, Kraft Paper, Phenolic Resin, Polyimide Film. Based on Application, the market is segmented into Industrial Electronics, Aerospace & Defence, IT and Telecom, Automotive, Consumer Electronics, Others. Based on Region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & and Africa.

Driver of the Global Printed Circuit Board Market

One of the key drivers propelling the Global Printed Circuit Board (PCB) market is the increasing demand from the automotive sector. The integration of micro sensors allows automotive manufacturers to incorporate advanced technologies that enhance safety features and telecommunications capabilities. Modern vehicles are equipped with a wide array of electronic components, including sensors, cameras, various radar systems (such as ARRAD), infotainment systems, and sophisticated driver assistance systems (ADAS) for commercial vehicles. As these technological advancements continue to evolve, the need for high-performance, reliable PCBs is expected to rise significantly, further stimulating market growth in the industry.

Restraints in the Global Printed Circuit Board Market

The global Printed Circuit Board market faces significant restraints primarily due to the volatility in the supply and pricing of raw materials. This fluctuation imposes substantial cost pressures on manufacturers, hampering their growth potential. Additionally, unfavorable bilateral trade agreements, such as ongoing trade wars between major economies, adversely impact the broader electronic components market. Such deteriorating trade relations not only affect the overall demand for electronic products but also create imbalances in the supply-demand dynamics within the industry. Consequently, these factors collectively hinder the market's progress and development, posing challenges for manufacturers and stakeholders.

Market Trends of the Global Printed Circuit Board Market

The Global Printed Circuit Board (PCB) market is witnessing a significant trend towards the miniaturization of electronic components, driven by the rising demand for advanced electronic products that require power-efficient, low-data transfer capabilities. As industries increasingly prioritize compact, high-density circuit designs, the use of High-Density Interconnect (HDI) substrates has surged. These advanced PCBs enable complex interconnections between an array of miniature components, facilitating improved signal transmission and overall performance. Consequently, this trend enhances the functionality of modern devices across various sectors, positioning the PCB market for robust growth as manufacturers adapt to evolving technological demands and consumer preferences.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Driver & Opportunities
    • Restraints & Challenges
  • Porters Analysis & Impact
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2023
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis
  • Technological Advancement
  • Regulatory Landscape
  • Case Studies
  • Patent Analysis
  • Trade Analysis

Printed Circuit Board Market Size by Product Type & CAGR (2024-2031)

  • Market Overview
  • Standard Multilayer PCBs
  • Rigid 1-2 Sided PCBs
  • HDI/Micro-via/Build-up
  • Flexible PCBs
  • Rigid-Flex PCBs
  • Others

Printed Circuit Board Market Size by End User & CAGR (2024-2031)

  • Market Overview
  • Industrial Electronics
  • Healthcare
  • Aerospace & Defence
  • Automotive
  • Consumer Electronics
  • Others

Printed Circuit Board Market Size by Product & CAGR (2024-2031)

  • Market Overview
  • Rigid PCBs
  • Standard Multiplayer
  • HDI/Build-Up/ Microtia
  • Flexible Circuits
  • IC Substrate
  • Others

Printed Circuit Board Market Size by Laminate Materials & CAGR (2024-2031)

  • Market Overview
  • FR-4
  • FR-4 High Tg
  • FR-4 Halogen free
  • Standard and others
  • Flexible
    • PI
    • PET
  • Paper
  • Composites
  • Others

Printed Circuit Board Market Size by Raw Materials & CAGR (2024-2031)

  • Market Overview
  • Glass Fabric
  • Epoxy Resin
  • Kraft Paper
  • Phenolic Resin
  • Polyimide Film

Printed Circuit Board Market Size by Application & CAGR (2024-2031)

  • Market Overview
  • Industrial Electronics
  • Aerospace and Defence
  • IT and Telecom
  • Automotive
  • Consumer Electronics
  • Others

Printed Circuit Board Market Size & CAGR (2024-2031)

  • North America, (Product Type, End User, Product Laminate Materials, Raw Materials, Application)
    • US
    • Canada
  • Europe, (Product Type, End User, Product Laminate Materials, Raw Materials, Application)
    • UK
    • Germany
    • Spain
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific, (Product Type, End User, Product Laminate Materials, Raw Materials, Application
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia Pacific
  • Latin America, (Product Type, End User, Product Laminate Materials, Raw Materials, Application)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa, (Product Type, End User, Product Laminate Materials, Raw Materials, Application)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2023
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2023
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2021-2023)

Key Company Profiles

  • Nippon Mektron Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • TTM Technologies, Inc. (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Unimicron Technology Corporation (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Zhen Ding Technology Holding Limited (Hong Kong)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Young Poong Electronics Co., Ltd. (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Samsung Electro-Mechanics Co., Ltd. (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ibiden Co., Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Compeq Manufacturing Co., Ltd. (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Tripod Technology Corporation (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Daeduck GDS Co., Ltd. (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Fujikura Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Sumitomo Electric Industries, Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • CMK Corporation (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • AT&S Austria Technologie & Systemtechnik AG (Austria)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Chin-Poon Industrial Co., Ltd. (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Kingboard Laminates Holdings Limited (Hong Kong)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Shennan Circuits Co., Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • WUS Printed Circuit Co., Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • KCE Electronics Public Company Limited (Thailand)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Multek Corporation (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendation

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