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1028568

메모리 패키징 : 플랫폼별(와이어 본드, 플립칩, 기타), 애플리케이션별(TSV 패키징, DRAM 패키징, 기타), 최종사용자별(자동차, 의료기기, 기타), 지역별 세계 시장 규모 예측(-2028년)

Memory Packaging Market Forecasts to 2028 - Global Analysis By Platform (Wire-Bond, Flip Chip and Others), Application (TSV Packaging, DRAM Packaging and Others), End User (Automotive, Medical Devices and Others) and By Geography

발행일: | 리서치사: Stratistics Market Research Consulting | 페이지 정보: 영문 150+ Pages | 배송안내 : 2-3일 (영업일 기준)

※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

세계의 메모리 패키징 시장 규모는 2020년에 324억 3,000만 달러를 기록했으며, 예측 기간 중 7.5%의 CAGR로 성장하고 2028년까지 578억 4,000만 달러에 달할 것으로 예측되고 있습니다.

패키징 및 어셈블리 인프라의 성장, 스마트폰의 수요 증가, 자율주행의 보급 등이 시장의 성장으로 연결되고 있습니다. 그러나 메모리의 미세화에 수반하는 열문제가 시장의 성장을 방해하고 있습니다.

세계의 메모리 패키징 시장을 조사했으며, 시장의 개요, 시장 성장요인 및 저해요인 분석, 시장 기회, Covid-19의 영향, 플랫폼·애플리케이션·최종사용자·지역별 시장 규모의 추이와 예측, 경쟁 구도, 주요 기업의 개요 등의 정보를 정리하여 전해드립니다.

목차

제1장 개요

제2장 서문

제3장 시장 동향 분석

  • 촉진요인
  • 억제요인
  • 시장 기회
  • 위협
  • 애플리케이션 분석
  • 최종사용자 분석
  • 신흥 시장
  • Covid-19의 영향

제4장 Porter의 산업 분석

제5장 플랫폼별

  • 웨이퍼 레벨 칩스케일 패키징(WLCSP)
  • 와이어 본드
  • 플립칩
  • 리드 프레임
  • 실리콘 관통 전극(TSV)

제6장 애플리케이션별

  • 3D Through-Silicon Via(TSV) 패키지
  • 다이나믹 RAM(DRAM) 패키지
  • Not AND(NAND) 플래시 패키지
  • Not OR(NOR) 플래시 패키지

제7장 최종사용자별

  • 자동차
  • 가전
  • 임베디드 시스템
  • 정보기술(IT)과 통신
  • 의료기기
  • 군 및 항공우주

제8장 지역별

  • 북미
    • 미국
    • 캐나다
    • 멕시코
  • 유럽
    • 독일
    • 영국
    • 이탈리아
    • 프랑스
    • 스페인
    • 기타 유럽
  • 아시아태평양
    • 일본
    • 중국
    • 인도
    • 호주
    • 뉴질랜드
    • 한국
    • 기타 아시아태평양
  • 남미
    • 아르헨티나
    • 브라질
    • 칠레
    • 기타 남미
  • 중동과 아프리카
    • 사우디아라비아
    • 아랍에미리트
    • 카타르
    • 남아프리카공화국
    • 기타 중동 및 아프리카

제9장 주요 발전

  • 계약, 파트너십, 협업, 조인트 벤처
  • 인수합병
  • 신제품 발매
  • 확장
  • 기타 주요 전략

제10장 기업 개요

  • Apple Inc.
  • ASE Group
  • Cisco Systems Inc.
  • Dell EMC
  • Fujitsu Semiconductor Limited
  • Hana Micron Inc.
  • IBM Corporation
  • Intel Corporation
  • Micron Technology Inc.
  • Nanya Technology Corporation
  • Qualcomm Technologies Inc.
  • Samsung Electronics Co. Ltd
  • SK Hynix Inc.
  • STMicroelectronics
  • Toshiba Electronic Devices & Storage Corporation
KSA 21.10.06

According to Stratistics MRC, the Global Memory Packaging Market is accounted for $32.43 billion in 2020 and is expected to reach $57.84 billion by 2028 growing at a CAGR of 7.5% during the forecast period. Growth in packaging and assembly infrastructure, rising demand for smartphones and growing popularity of autonomous driving are driving the market growth. However, thermal issues due to the miniaturization of memory are hampering the growth of the market.

Memory is made of small semiconductor chips similar to processors and should be packaged into less fragile and tiny chips to be integrated with the rest of the system. There are many different memory device packaging options available, used in a wide range of packaging technologies, depending on product requirements, like performance, density, and cost.

Based on the end user, the automotive segment is going to have lucrative growth during the forecast period owing to increase in acceptance of DRAM memory. Furthermore, the growth is led by the trend of autonomous driving and in vehicle infotainment. By geography, Asia Pacific is going to have high growth during the forecast period which can be attributed to a wide range of applications in several consumer electronics, especially in tablets and smartphones.

Some of the key players profiled in the Memory Packaging Market include Apple Inc., ASE Group, Cisco Systems Inc., Dell EMC, Fujitsu Semiconductor Limited, Hana Micron Inc., IBM Corporation, Intel Corporation, Micron Technology Inc., Nanya Technology Corporation, Qualcomm Technologies Inc., Samsung Electronics Co. Ltd, SK Hynix Inc., STMicroelectronics and Toshiba Electronic Devices & Storage Corporation.

Platforms Covered:

  • Wafer-Level Chip-Scale Packaging(WLCSP)
  • Wire-Bond
  • Flip-Chip
  • Lead-Frame
  • Through-Silicon Via (TSV)

Applications Covered:

  • 3D Through-Silicon Via (TSV) Packaging
  • Dynamic Random Access Memory (DRAM) Packaging
  • Not AND (NAND) Flash Packaging
  • Not OR (NOR) Flash Packaging

End Users Covered:

  • Automotive
  • Consumer Electronics
  • Embedded Systems
  • Information Technology (IT) & Telecom
  • Medical Devices
  • Military and Aerospace

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2018, 2019, 2020, 2024 and 2027
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Memory Packaging Market, By Platform

  • 5.1 Introduction
  • 5.2 Wafer-Level Chip-Scale Packaging(WLCSP)
  • 5.3 Wire-Bond
  • 5.4 Flip-Chip
  • 5.5 Lead-Frame
  • 5.6 Through-Silicon Via (TSV)

6 Global Memory Packaging Market, By Application

  • 6.1 Introduction
  • 6.2 3D Through-Silicon Via (TSV) Packaging
  • 6.3 Dynamic Random Access Memory (DRAM) Packaging
  • 6.4 Not AND (NAND) Flash Packaging
  • 6.5 Not OR (NOR) Flash Packaging

7 Global Memory Packaging Market, By End User

  • 7.1 Introduction
  • 7.2 Automotive
  • 7.3 Consumer Electronics
  • 7.4 Embedded Systems
  • 7.5 Information Technology (IT) & Telecom
  • 7.6 Medical Devices
  • 7.7 Military and Aerospace

8 Global Memory Packaging Market, By Geography

  • 8.1 Introduction
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 Italy
    • 8.3.4 France
    • 8.3.5 Spain
    • 8.3.6 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 Japan
    • 8.4.2 China
    • 8.4.3 India
    • 8.4.4 Australia
    • 8.4.5 New Zealand
    • 8.4.6 South Korea
    • 8.4.7 Rest of Asia Pacific
  • 8.5 South America
    • 8.5.1 Argentina
    • 8.5.2 Brazil
    • 8.5.3 Chile
    • 8.5.4 Rest of South America
  • 8.6 Middle East & Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 UAE
    • 8.6.3 Qatar
    • 8.6.4 South Africa
    • 8.6.5 Rest of Middle East & Africa

9 Key Developments

  • 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 9.2 Acquisitions & Mergers
  • 9.3 New Product Launch
  • 9.4 Expansions
  • 9.5 Other Key Strategies

10 Company Profiling

  • 10.1 Apple Inc.
  • 10.2 ASE Group
  • 10.3 Cisco Systems Inc.
  • 10.4 Dell EMC
  • 10.5 Fujitsu Semiconductor Limited
  • 10.6 Hana Micron Inc.
  • 10.7 IBM Corporation
  • 10.8 Intel Corporation
  • 10.9 Micron Technology Inc.
  • 10.10 Nanya Technology Corporation
  • 10.11 Qualcomm Technologies Inc.
  • 10.12 Samsung Electronics Co. Ltd
  • 10.13 SK Hynix Inc.
  • 10.14 STMicroelectronics
  • 10.15 Toshiba Electronic Devices & Storage Corporation
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