납땜 재료 시장 예측(-2028년) - 제품별(바, 와이어, 페이스트, 플럭스, 플럭스, 기타 제품), 유형별(납, 무연), 공정별(웨이브/리플로우, 스크린 인쇄, 로봇, 레이저), 최종사용자별, 지역별 세계 분석

According to Stratistics MRC, the Global Solder Materials Market is accounted for $1759.36 million in 2022 and is expected to reach $2495.69 million by 2028 growing at a CAGR of 6.0% during the forecast period. Soldering is known as a process in which two or more metals are joined together by melting, followed by placing a filler metal, called solder, into the joint. When compared to the adjacent metal, the filler metal employed in the process has a lower melting point. Nearly all solders contained lead in previous decades, but lead-free alloys are now more frequently used in electronics and plumbing due to customer worries about the environment and their health. In electronics, plumbing, building, and metalworking for jewellery, medical devices, and musical instruments, solder is employed. Between copper pipes in plumbing systems as well as joints in sheet metal objects like food cans, gutters, roof flashing, and automotive radiators, solder primarily offers somewhat permanent yet reversible connections. Electrical cable is connected to devices with electronic solder, and electronic components are attached to printed circuit boards.

According to the International Tin Association (ITA), tin prices have risen to USD 42,000 per ton in 2022. In recent years, the price of tin was between USD 15,000 and USD 20,000 per ton, but it roughly doubled in 2021.

Market Dynamics:

Driver:

Increasing demand from electronics industry

Electrical lines are joined to devices with electronic solder, and electronic components are attached to printed circuit boards. Flux, a substance found inside the solder core, aids in strengthening the mechanical and electrical connections. Lead-free rosin-core solder is the most popular form of solder for electronics. Tin and copper alloys make up the majority of this type of solder. Computers and servers, communications, and consumer items are all part of the electronics market. Different types and forms of electronic solder are required for various electrical products. PCB and surface-mount devices are driven by the rising need for the miniaturization and automation of mobile devices, touch screens and displays, and medical electronic systems. The use of solder materials has increased as a result of the rising demand for these items. As the need for smart devices rises and more energy-efficient electronics are developed, the market for solder materials is also anticipated to grow.

Restraint:

High cost of lead-free solders

Lead-free solders require the use of more expensive materials compared to traditional lead-based solders. Metals such as silver, copper, and tin are commonly used in lead-free solder alloys, and their higher costs increase the overall price of lead-free solder materials. Furthermore, the manufacturing process for lead-free solders is often more complex and energy-intensive, leading to increased production costs. Manufacturers need to invest in research and development to formulate new solder compositions and ensure compliance with industry regulations. These additional expenses further contribute to the higher cost of lead-free solder materials, which are projected to impede the fog computing market's growth.

Opportunity:

Emergence of nanoparticle- based solder materials

The addition of nanoparticles to conventional solder pastes can improve the properties of the solder alloys and joints. With the characteristics of minor size and high surface activity, nanoparticles are added to the solder matrix to prepare nano-composite solder. It has been noted that adding nanoparticles to solder can greatly improve the solder's matrix, increase its wetting capacity, and improve the mechanical performance of the solder junctions. Metal particles, intermetallic compound particles, metal oxide particles, carbon-based nanoparticles, and others are the most common types of nanoparticles. Electronic components must be able to resist high temperatures for lengthy periods of time in the automobile, aircraft, and oil and gas drilling industries. In these extreme settings, solder joint fatigue failure is a significant issue. The dependability of the junction is increased by adding nanoparticles to the solder to harden it and stabilize the grain structure. Thus, the market has a lot to gain from nanoparticle-based solder materials are driving the growth of the Solder Materials market over the forecast period.

Threat:

Health risks associated with soldering

When rosin-based flux chemicals, which are frequently used to make electrical connections, are burned, solder vapors typically result, posing health risks to workers. When solder wire is heated, numerous chemical-containing vapours are released. These gases can either trigger asthma attacks or exacerbate pre-existing respiratory disorders. The upper respiratory system, the eyes, and the skin can all become irritated by the fumes. Because the worker's head is more likely to come into contact with the fume source when hand soldering, the risk is increased. Additionally, when lead is not handled appropriately during the manufacture of electronic products using lead soldering, employees may be exposed to serious health impacts. Memory and attention issues, digestion issues, reproductive issues, and muscle pain are a few of the health consequences. The soldering process releases fumes and dust, which are hazardous to human health, which will impede the market growth over the forecast period.

COVID-19 Impact:

The COVID-19 outbreak, which started in Wuhan (China) in December 2019, is rapidly spreading around the world. One of the world's largest industries, chemicals and materials, is experiencing significant disruptions as a result of this pandemic, including supply chain breakdowns, the cancellation of technological events, and office closures. China is the center of the world's production and the biggest provider of raw materials for many industries, but it is also one of the nations most severely impacted by the COVID-19 pandemic. Due to factory closures, supply chain challenges, and the general market collapse brought on by COVID-19, the expansion of the solder materials industry is also being hampered.

The Wire segment is expected to be the largest during the forecast period

During the anticipated timeframe, the wire segment's market share will expand significantly. Demand for solder wires has significantly increased for repair and maintenance applications across a variety of industries, particularly in the infrastructure, automotive, and consumer electronics sectors. The demand for solder wire is fueled by the rise in the number of cars and the consequent growth in the need for maintenance and repair services. Widespread use of wires in PCB soldering and higher output is major market drivers. For instance, people should be aware that certain wires should only be used in certain situations, such as acid-core solder wire, which is okay for plumbing but unsuitable for electronics because it contains acid, thereby boosting market growth.

The Robotic segment is expected to have the highest CAGR during the forecast period

The robotic segment is expected to have the highest CAGR during the forecast period in the solder materials market. Robotic soldering can lead to cost savings in the long run. While initial investment costs for robotic systems may be higher, they can provide significant returns by reducing labor costs and minimizing defects or rework. The potential cost savings associated with robotic soldering can make it an attractive option for various industries, leading to market growth, which is fostering the expansion of the global market.

Region with largest share:

North America has the largest share in the regional market due to the rapidly expanding electronics and semiconductor industries. This was linked to the country's expanding refurbishing sector. Over the course of the projection period, an increase in the production of sophisticated semiconductor devices is anticipated to increase market share. Due to an expansion of the electronics industry's production base, the sector is anticipated to have significant growth, particularly in Mexico. Additionally, it is anticipated that the growth of the electronics aftermarket and the rising number of repair shops for electronic gadgets will promote market expansion.

Region with highest CAGR:

The solder materials market in Asia Pacific is anticipated to develop at the greatest CAGR during the forecast period since it has the highest production of electronics globally. The electrical and automotive industries are driving up demand for soldering supplies in these nations. The solder materials are becoming increasingly important in electronic vehicle applications in addition to their uses in the electronic sector. Since the price of gasoline, diesel, and compressed natural gas has grown, there has been a trend among customers toward electronic products. The market in the area has grown as a result of this change, making it the fastest-growing market for this technology over the projection period.

Key players in the market:

Some of the key players in Solder Materials Market include Accurus Scientific, Agni Solders, Aim, Balaji Insulation Co., Belmont Metals Inc., Deoksan Hi Metal, Digi Key Corp., Duksan Himetal Co. Ltd., Element Solutions Inc., Fakri Metals, Fusion Incorporated, Genma Europe Gmbh, Handy And Harman Manufacturing Singapore Pte. Ltd., Harima Chemicals Group Inc., Indium Corp., Inventec Performance Chemical, Kester, Koki Company Ltd, Lucas-Milhaupt, Inc., Nihon Genma, Qualitek International, Inc., R.S. Hughes, Saru Silver Alloy Private Limited, Senju Metal Industry Co. Ltd., Stannol Gmbh And Co. Kg, Superior Flux & Mfg. Co., Tamura Corp., Warton Metals Ltd. And Waytek

Key Developments:

In June 2022, Indium Corporation expanded its portfolio of proven pastes with two new AuSn pastes designed for the higher processing temperatures and assembly needs required in high-power LED module array applications, such as automotive, infrastructure, and horticulture.

In May 2022, Kester launched ALPHA HRL3 Solder Sphere, Lead-free, high reliability, low temperature alloy for ball mount applications. The alloy is designed to exhibit improved drop shock and thermal cycling performance versus existing low temperature alloys in the market.

In January 2022, Tamura Corp. developed compact and highly efficient power modules for use in electric vehicle (EV) chargers and power conversion systems.

Products Covered:

• Bar
• Wire
• Paste
• Flux
• Other Products

Types Covered:

• With Lead
• Lead-Free

Processes Covered:

• Wave/Reflow
• Screen Printing
• Robotic
• Laser

End Users Covered:

• Consumer Electronics
• Automotive
• Industrial

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2020, 2021, 2022, 2025, and 2028
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Product Analysis
• 3.7 End User Analysis
• 3.8 Emerging Markets
• 3.9 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Solder Materials Market, By Product

• 5.1 Introduction
• 5.2 Bar
• 5.3 Wire
• 5.4 Paste
• 5.5 Flux
• 5.6 Other Products

6 Global Solder Materials Market, By Type

• 6.1 Introduction
• 6.2 With Lead
• 6.3 Lead-Free

7 Global Solder Materials Market, By Process

• 7.1 Introduction
• 7.2 Wave/Reflow
• 7.3 Screen Printing
• 7.4 Robotic
• 7.5 Laser

8 Global Solder Materials Market, By End User

• 8.1 Introduction
• 8.2 Consumer Electronics
• 8.3 Automotive
• 8.4 Industrial

9 Global Solder Materials Market, By Geography

• 9.1 Introduction
• 9.2 North America
  • 9.2.1 US
  • 9.2.2 Canada
  • 9.2.3 Mexico
• 9.3 Europe
  • 9.3.1 Germany
  • 9.3.2 UK
  • 9.3.3 Italy
  • 9.3.4 France
  • 9.3.5 Spain
  • 9.3.6 Rest of Europe
• 9.4 Asia Pacific
  • 9.4.1 Japan
  • 9.4.2 China
  • 9.4.3 India
  • 9.4.4 Australia
  • 9.4.5 New Zealand
  • 9.4.6 South Korea
  • 9.4.7 Rest of Asia Pacific
• 9.5 South America
  • 9.5.1 Argentina
  • 9.5.2 Brazil
  • 9.5.3 Chile
  • 9.5.4 Rest of South America
• 9.6 Middle East & Africa
  • 9.6.1 Saudi Arabia
  • 9.6.2 UAE
  • 9.6.3 Qatar
  • 9.6.4 South Africa
  • 9.6.5 Rest of Middle East & Africa

10 Key Developments

• 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 10.2 Acquisitions & Mergers
• 10.3 New Product Launch
• 10.4 Expansions
• 10.5 Other Key Strategies

11 Company Profiling

11.1 Accurus Scientific

• 11.2 Agni Solders
• 11.3 Aim
• 11.4 Balaji Insulation Co.
• 11.5 Belmont Metals Inc.
• 11.6 Deoksan Hi Metal
• 11.7 Digi Key Corp.
• 11.8 Duksan Himetal Co. Ltd.
• 11.9 Element Solutions Inc.
• 11.10 Fakri Metals
• 11.11 Fusion Incorporated
• 11.12 Genma Europe Gmbh
• 11.13 Handy And Harman Manufacturing Pvt. Ltd.
• 11.14 Harima Chemicals Group Inc.
• 11.15 Indium Corp.
• 11.16 Inventec Performance Chemical
• 11.17 Kester
• 11.18 Koki Company Ltd
• 11.19 Lucas-Milhaupt, Inc.
• 11.20 Nihon Genma
• 11.21 Qualitek International, Inc.
• 11.22 R.S. Hughes
• 11.23 Saru Silver Alloy Private Limited
• 11.24 Senju Metal Industry Co. Ltd.
• 11.25 Stannol Gmbh And Co. Kg
• 11.26 Superior Flux & Mfg. Co.
• 11.27 Tamura Corp.
• 11.28 Warton Metals Ltd.
• 11.29 Waytek