세계 첨단 패키징 및 절단 장비 시장 : 유형, 재료, 컴포넌트, 기술, 용도, 지역별 분석(-2030년)

According to Stratistics MRC, the Global Advanced Packaging and Cutting Equipment Market is accounted for $31.7 billion in 2023 and is expected to reach $61.2 billion by 2030 growing at a CAGR of 9.84% during the forecast period. A type of equipment and technology known as "advanced packaging and cutting equipment" is used in a number of different sectors to effectively package, process, and cut materials or products. These cutting-edge solutions are intended to boost quality control, decrease waste, and enhance production processes in manufacturing and packaging operations. Technology advancements continue to spur innovation in this area, resulting in more effective and adaptable machinery.

According to India Electronics and Semiconductor Association, the semiconductor component market in the country is expected to be worth $ 32.35 billion by 2025.

Market Dynamics:

Driver:

Increased efficiency

Modern machinery automates the cutting and packing operations, lowering manual labor requirements and boosting productivity. Quicker output and shorter manufacturing times result from quicker processing rates. Advanced machinery ensures that items are regularly cut to the proper size and form via the use of accurate measurements and cutting methods. This accuracy lowers waste and raises the caliber of the final product. These are the elements driving the market's expansion.

Restraint:

Limited Flexibility

Some cutting and packing technology may not be flexible enough to accommodate a variety of product variants or packaging designs. For companies that need to alter their manufacturing lines often, this constraint might be an issue. It can be challenging to integrate new equipment into current production lines and may call for alterations or improvements to other steps in the manufacturing process. Consequently, this hinders market growth.

Opportunity:

Enhanced safety

Safety elements like sensors, emergency stop mechanisms, and protective barriers are frequently incorporated into advanced technology to lower the chance of accidents and injuries. Automation can reduce the amount of time operators are exposed to potentially dangerous jobs. Improved inventory management and product monitoring across the supply chain are made possible by the integration of cutting-edge packaging equipment with tracking and traceability systems. Therefore, these are the elements driving the market's expansion.

Threat:

High initial cost

The cost of installing and buying cutting-edge packing equipment might be high. For new or small firms, this upfront cost can be a major obstacle. To make sure that they function properly, this equipment frequently needs routine maintenance. Over time, maintenance costs, such as those for replacement components, technician fees, and downtime for repairs, can mount. These are the things that are impeding the market's expansion.

COVID-19 Impact:

The pandemic affected the manufacturing and distribution of sophisticated packaging and cutting machinery by upsetting global supply systems. Many manufacturers experienced issues with the delivery of necessary parts and supplies, which affected their capacity to complete orders. Due to economic uncertainty and lockdown measures, several sectors that significantly rely on sophisticated packaging and cutting technology, such as the automotive and aerospace industry, saw a decline in demand during the epidemic. As a result, fewer equipment orders were placed.

The cutting machine segment is expected to be the largest during the forecast period

The cutting machine segment is expected to be the largest during the forecast period. A cutting machine is a device that grinds, shaves, snips, shears, or otherwise removes material from a work piece using one or more abrasives. Horizontal and vertical machining centers are the two most used types of cutting equipment. Vertical machining centers are used to create 45-degree cuts and other sharp angles, whereas horizontal machining centers are used to produce straight cuts.

The automotive electronics segment is expected to have the highest CAGR during the forecast period

The automotive electronics segment is expected to have the highest CAGR during the forecast period. The need for automotive electronics is rising as more consumers choose high-tech automobiles, which necessitate premium packaging for electrical components. Over the next years, consumer electronics are expected to experience significant growth due to the quickly rising demand for portable devices like smartphones, tablets, and PC accessories like laptops and Netbooks, as well as an increase in consumer disposable income.

Region with largest share:

North America is projected to hold the largest market share during the forecast period due to increase in disposable income among the population has spurred the demand for advanced packaging solutions. The use of more advanced technologies by the energy and power sector has boosted market expansion. During the market's forecast period, it is also anticipated that the increasing use of microcontrollers and microprocessors in consumer electronics and electric cars would fuel demand for advanced packaging solutions.

Region with highest CAGR:

Asia Pacific is projected to hold the highest CAGR over the forecast period. The availability of cutting-edge technology, the soaring demand for smart gadgets, and the ongoing rise of the region's industrial industries are all credited with this astounding increase. A number of non-profit organizations actively engage in the development of improved power infrastructure, further accelerating the expansion of the advanced packaging sector and advancing packaging technology.

Key players in the market:

Some of the key players in Advanced Packaging and Cutting Equipment Market include: Microchip Technology Inc., ASM Pacific, Teradyne, Advantest, COHU Semiconductor Equipment Group, Intel, SUSS Microtec, Tokyo Seimitsu, Samsung Electronics Co. Ltd, Applied Material, Shinkawa, Hitachi, Toray Engineering, DISCO and KulickeandSoffa.

Key Developments:

In August 2023, Samsung announced its collaboration with Intel to deliver cutting-edge vRAN solutions with enhanced performance to meet rising capacity demands.

In July 2023, Microchip Technology Incorporated announced a multi-year initiative to invest approximately $300 million in expanding its operations in India.

In June 2023, Intel announced that it is using its own EMIB packaging technology for its new Xeon Scalable processors. EMIB is a 2.5D packaging technology that can integrate multiple dies on a single substrate.

Types Covered:

• Cutting Machine
• Scribing Machine
• Packaging machines
• Rotary die
• Capping machines
• CNC machine
• Dicing Machine
• Lamination Machine
• Other Types

Materials Covered:

• Metal
• Ceramic
• Plastic
• Hybrid
• Glass
• Other Materials

Components Covered:

• Software
• Hardware
• Services
• Other Components

Technologies Covered:

• Laser-Based
• Mechanical
• Waterjet
• Plasma
• Other Technologies

Applications Covered:

• Consumer Electronics
• Automotive Electronics
• Communication
• Aerospace & Defense
• Industrial
• Healthcare
• Other Applications

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Technology Analysis
• 3.7 Application Analysis
• 3.8 Emerging Markets
• 3.9 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Advanced Packaging and Cutting Equipment Market, By Type

• 5.1 Introduction
• 5.2 Cutting Machine
• 5.3 Scribing Machine
• 5.4 Packaging machines

5.5

Rotary die

• 5.6 Capping machines
• 5.7 CNC machine
• 5.8 Dicing Machine
• 5.9 Lamination Machine
• 5.10 Other Types

6 Global Advanced Packaging and Cutting Equipment Market, By Material

• 6.1 Introduction
• 6.2 Metal
• 6.3 Ceramic
• 6.4 Plastic
• 6.5 Hybrid
• 6.6 Glass
• 6.7 Other Materials

7 Global Advanced Packaging and Cutting Equipment Market, By Component

• 7.1 Introduction
• 7.2 Software
• 7.3 Hardware
• 7.4 Services
• 7.5 Other Components

8 Global Advanced Packaging and Cutting Equipment Market, By Technology

• 8.1 Introduction
• 8.2 Laser-Based
• 8.3 Mechanical
• 8.4 Waterjet
• 8.5 Plasma
• 8.6 Othe Technologies

9 Global Advanced Packaging and Cutting Equipment Market, By Application

• 9.1 Introduction
• 9.2 Consumer Electronics
• 9.3 Automotive Electronics
• 9.4 Communication
• 9.5 Aerospace & Defense
• 9.6 Industrial
• 9.7 Healthcare
• 9.8 Other Applications

10 Global Advanced Packaging and Cutting Equipment Market, By Geography

• 10.1 Introduction
• 10.2 North America
  • 10.2.1 US
  • 10.2.2 Canada
  • 10.2.3 Mexico
• 10.3 Europe
  • 10.3.1 Germany
  • 10.3.2 UK
  • 10.3.3 Italy
  • 10.3.4 France
  • 10.3.5 Spain
  • 10.3.6 Rest of Europe
• 10.4 Asia Pacific
  • 10.4.1 Japan
  • 10.4.2 China
  • 10.4.3 India
  • 10.4.4 Australia
  • 10.4.5 New Zealand
  • 10.4.6 South Korea
  • 10.4.7 Rest of Asia Pacific
• 10.5 South America
  • 10.5.1 Argentina
  • 10.5.2 Brazil
  • 10.5.3 Chile
  • 10.5.4 Rest of South America
• 10.6 Middle East & Africa
  • 10.6.1 Saudi Arabia
  • 10.6.2 UAE
  • 10.6.3 Qatar
  • 10.6.4 South Africa
  • 10.6.5 Rest of Middle East & Africa

11 Key Developments

• 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 11.2 Acquisitions & Mergers
• 11.3 New Product Launch
• 11.4 Expansions
• 11.5 Other Key Strategies

12 Company Profiling

• 12.1 Microchip Technology Inc.
• 12.2 ASM Pacific
• 12.3 Teradyne
• 12.4 Advantest
• 12.5 COHU Semiconductor Equipment Group
• 12.6 Intel
• 12.7 SUSS Microtec
• 12.8 Tokyo Seimitsu
• 12.9 Samsung Electronics Co. Ltd
• 12.10 Applied Material
• 12.11 Shinkawa
• 12.12 Hitachi
• 12.13 Toray Engineering
• 12.14 DISCO
• 12.15 KulickeandSoffa