칩 레이저 디캡핑 머신 시장 예측(-2030년) : 유형별, 용도별, 지역별 세계 분석

According to Stratistics MRC, the Global Chip Laser Decapping Machine Market is accounted for $304.8 million in 2023 and is expected to reach $492.7 million by 2030 growing at a CAGR of 7.1% during the forecast period. A complex tool used in the semiconductor industry is known as chip laser decapping machine, which is used to precisely remove protective coatings from integrated circuit (IC) chips like epoxy molding compounds or ceramic packaging. The device uses a concentrated laser beam to remove encapsulating materials on demand while protecting the underlying IC, and it gives engineers and scientists access to the interior workings of the chip for quality assurance, design analysis, and defect finding.

Market Dynamics:

Driver:

Rising demand in Non-destructive Decapping

It enables the opening and analysis of semiconductor components, such as integrated circuits (ICs), without affecting their structural integrity. Additionally, this is crucial for failure analysis, quality control, and reverse engineering, as it enables the recovery of valuable, expensive, or rare ICs. Moreover, in order to preserve evidence in forensic investigations or for ICs that need to be deconstructed and put back together again, this non-destructive capacity is highly sought because it eliminates the need for new samples and enables more thorough investigations. Furthermore, by reducing the need to replace priceless ICs, it also saves money. Thus, this strategy improves semiconductor analysis and research's effectiveness and adaptability, thereby drive the market growth.

Restraint:

High cost

There are a number of difficulties caused by the significant initial investment needed in the market for chip laser decapping machines. Initially, both small and major semiconductor companies may be discouraged from implementing this technology by the substantial financial burden it can cause. Furthermore, the significant beginning costs also prevent new and emerging enterprises from entering the market. Moreover, slower adoption rates might be caused by high capital needs, hence which also hinder market competition and innovation.

Opportunity:

Technological advancements

The requirements for downsizing, improved performance, and expanded usefulness are driving a rapid evolution in semiconductor packaging technology. Additionally, when it comes to decapping different chip packages, such as flip-chip, ball grid array (BGA), and wafer-level packages, chip laser decapping machines offer a cutting-edge solution that supports the design and testing of sophisticated semiconductor devices. Furthermore, increased consumer demand for electronic products, automotive electronics, and Internet of Things (IoT) applications is fueling the growth of the worldwide electronics manufacturing sector.

Threat:

Lack of technical expertise and awareness

Machines for chip laser decapping are a relatively new and specialized technology. These machines may not be widely adopted because of the market's inadequate knowledge of their capabilities and advantages. Additionally, chip laser decapping machines are sophisticated machines that demand technical expertise to operate and maintain, so to operate the machinery, resolve problems, and improve machine performance, skilled individuals are required. Hence, these factors hindering market expansion.

COVID-19 Impact

The chip laser decapping machine market was adversely affected by the COVID-19 epidemic in a number of ways. Additionally, production delays, limited access to essential components, and difficulties with machine repair and maintenance were caused by the global disruption of supply chains and manufacturing, as well as lockdowns and travel restrictions. Moreover, other technological fields, such as semiconductor analysis tools like chip laser decapping machines, had to deal with a reduction in funding and attention as resources were shifted to COVID-19-related research and diagnosis. Therefore, as a result of budget constraints brought on by the pandemic's economic uncertainty, many businesses were unable to purchase and use such advanced machinery, which restrained the market's expansion.

The semi-automatic segment is expected to be the largest during the forecast period

The semi-automatic segment is estimated to hold the largest share, due to a form of decapping equipment that combines manual and automated features is represented by the semi-automatic segment. Although the decapping procedure on these devices is automated, some operator involvement is necessary for setup or sample preparation. Furthermore, semi-automatic machines are the best option for certain semiconductor analysis and reverse engineering applications when a high level of control is required because they offer versatility, efficiency, and the ability to create customized solutions. Therefore, these aspects significantly boost the market expansion.

The integrated circuits (IC) trays segment is expected to have the highest CAGR during the forecast period

The integrated circuits (IC) trays segment is anticipated to have highest CAGR during the forecast period, due to specialized equipment made for decapping ICs contained in trays. Additionally, these trays are frequently used in semiconductor testing and manufacturing for handling and storing IC chips. The chapter on IC Trays deals with the requirement for precise, non-destructive decapsulation of chips inside of their trays, enabling quality control, failure analysis, and reverse engineering. Moreover, while maintaining the integrity of the ICs, these machines use laser technology to remove the encapsulating materials. Therefore, they are essential for ensuring semiconductor quality and the efficient and regulated development of cutting-edge chip technology.

Region with largest share:

North America commanded the largest market share during the extrapolated period owing to wider government measures and assistance, like tax incentives, subsidies, and funding programs for R&D, has aided the semiconductor industry in North America. Additionally, these initiatives seek to promote creativity, advance semiconductor technologies, and strengthen industry competition. Moreover, funding for semiconductor technology research has occasionally been provided by government organizations like the National Science Foundation (NSF) and the Department of Defense (DoD), which has a subsequent impact on the creation and application of specialized tools like chip laser decapping machines. Therefore, these are some of the factors which help in driving the market size.

Region with highest CAGR:

Europe is expected to witness highest CAGR over the projection period, owing to innovative decapping equipment that focus on accuracy, automation, and efficiency. The decapping procedure has been made easier by these innovations, which also include better laser technology for more selective and precise decapping. Additionally, the development of eco-friendly decapping techniques that are in line with international environmental goals has also been impacted by Europe's emphasis on sustainability. Furthermore, capabilities for failure assessment and reverse engineering have been significantly improved through collaboration between academic institutions and regional leaders in industry. Therefore, Europe's position in the market for chip laser decapping machines is strengthened by its technological leadership in these fields.

Key players in the market

Some of the key players in the Chip Laser Decapping Machine Market include: Nisene Technology Group, Inc, Kaimeiwo Laser, Plasma-Therm LLC, Han's Laser, Rudolph Technologies, Wuhan Keyi Laser, Huacong Technology, Hamamatsu Photonics, Xcerra Corporation and Accurex Measurement.

Key Developments:

In June 2019, Nanometrics Signs Agreement for Merger of Equals Combination With Rudolph Technologies.

In November 2018, Rudolph Technologies, Inc. announced the availability of its NovusEdge™ system for edge, notch and backside inspection of un-patterned wafers.

Types Covered:

• Semi-Automatic
• Full-Automatic
• Other Types

Applications Covered:

• Integrated Circuits (IC) Trays
• Plastic Packaged Devices
• Printed Circuit Board (PCB) Boards
• Power Devices
• Other Applications

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Application Analysis
• 3.7 Emerging Markets
• 3.8 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Chip Laser Decapping Machine Market, By Type

• 5.1 Introduction
• 5.2 Semi-Automatic
• 5.3 Full-Automatic
• 5.4 Other Types

6 Global Chip Laser Decapping Machine Market, By Application

• 6.1 Introduction
• 6.2 Integrated Circuits (IC) Trays
• 6.3 Plastic Packaged Devices
• 6.4 Printed Circuit Board (PCB) Boards
• 6.5 Power Devices
• 6.6 Other Applications

7 Global Chip Laser Decapping Machine Market, By Geography

• 7.1 Introduction
• 7.2 North America
  • 7.2.1 US
  • 7.2.2 Canada
  • 7.2.3 Mexico
• 7.3 Europe
  • 7.3.1 Germany
  • 7.3.2 UK
  • 7.3.3 Italy
  • 7.3.4 France
  • 7.3.5 Spain
  • 7.3.6 Rest of Europe
• 7.4 Asia Pacific
  • 7.4.1 Japan
  • 7.4.2 China
  • 7.4.3 India
  • 7.4.4 Australia
  • 7.4.5 New Zealand
  • 7.4.6 South Korea
  • 7.4.7 Rest of Asia Pacific
• 7.5 South America
  • 7.5.1 Argentina
  • 7.5.2 Brazil
  • 7.5.3 Chile
  • 7.5.4 Rest of South America
• 7.6 Middle East & Africa
  • 7.6.1 Saudi Arabia
  • 7.6.2 UAE
  • 7.6.3 Qatar
  • 7.6.4 South Africa
  • 7.6.5 Rest of Middle East & Africa

8 Key Developments

• 8.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 8.2 Acquisitions & Mergers
• 8.3 New Product Launch
• 8.4 Expansions
• 8.5 Other Key Strategies

9 Company Profiling

• 9.1 Nisene Technology Group, Inc
• 9.2 Kaimeiwo Laser
• 9.3 Plasma-Therm LLC
• 9.4 Han's Laser
• 9.5 Rudolph Technologies
• 9.6 Wuhan Keyi Laser
• 9.7 Huacong Technology
• 9.8 Hamamatsu Photonics
• 9.9 Xcerra Corporation
• 9.10 Accurex Measurement