![]() |
½ÃÀ庸°í¼
»óǰÄÚµå
1462693
¹«¼± ÃæÀü¿ë IC ½ÃÀå Àü¸Á(-2030³â) : À¯Çüº°, ºÎǰº°, Á¤°Ý Àü·Âº°, Ä¿Çøµ ±â¼úº°, ¿ëµµº°, Áö¿ªº° ¼¼°è ºÐ¼®Wireless Charging ICs Market Forecasts to 2030 - Global Analysis By Type, By Component, Power Rating, Coupling Technology, Application and By Geography |
Stratistics MRC¿¡ µû¸£¸é, ¹«¼± ÃæÀü¿ë IC ¼¼°è ½ÃÀåÀº 2023³â 69¾ï ´Þ·¯·Î Æò°¡µÇ¾ú°í, ¿¹Ãø ±â°£ µ¿¾È 21.8%ÀÇ ¿¬Æò±Õ º¹ÇÕ ¼ºÀå·ü(CAGR)·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 277¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.
¹«¼± ÃæÀü¿ë IC(ÁýÀûȸ·Î)´Â ÃæÀü ÆÐµå³ª ¼Û½Å±â¿¡¼ ½º¸¶Æ®Æù, ¿þ¾î·¯ºí ±â±â, Àü±âÀÚµ¿Â÷ µîÀÇ Áö¿ø ±â±â¿¡ ¹«¼±À¸·Î Àü·ÂÀ» ½±°Ô °ø±ÞÇÒ ¼ö ÀÖµµ·Ï ÇÏ´Â ¹ÝµµÃ¼ ºÎǰÀÔ´Ï´Ù. ÀÌ IC´Â Àü±â ¿¡³ÊÁö¸¦ È¿À²ÀûÀÎ ¹«¼± ÃæÀü¿¡ ÀûÇÕÇÑ ÇüÅ·Πº¯È¯ÇÏ¿© ÃֽŠÀüÀÚ±â±â¿¡ Æí¸®Çϰí ÄÉÀÌºí ¾øÀÌ Àü·ÂÀ» Àü¼ÛÇÒ ¼ö ÀÖ°Ô ÇØÁÝ´Ï´Ù.
¸ð¹ÙÀÏ ÀÌÄÚ³ë¹Ì º¸°í¼ 2022¿¡ µû¸£¸é, Àü ¼¼°è Àα¸ÀÇ 75%°¡ ½º¸¶Æ®Æù¿¡ Á¢¼ÓÇϰí ÀÖÀ¸¸ç, 2025³â¿¡´Â 84%¸¦ ³ªÅ¸³¾ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.
Àü±âÂ÷(EV) ¹× ½º¸¶Æ® ±â±â µµÀÔ Áõ°¡
EV¿Í ½º¸¶Æ® ±â±â¿¡ ´ëÇÑ ¼ö¿ä°¡ Àü ¼¼°èÀûÀ¸·Î Áõ°¡Çϰí ÀÖÀ¸¸ç, ÀÌ¿¡ µû¶ó È¿À²ÀûÀÌ°í Æí¸®ÇÑ ÃæÀü ¼Ö·ç¼ÇÀÌ ¿ä±¸µÇ°í ÀÖ½À´Ï´Ù. ¹«¼± ÃæÀü¿ë IC´Â ÄÉÀ̺íÀÇ ¹ø°Å·Î¿òÀ» ¾ø¾Ö°í ¿øÈ°ÇÏ°í »ç¿ëÀÚ Ä£ÈÀûÀÎ ÃæÀü °æÇèÀ» Á¦°øÇÑ´Ù´Â ÀåÁ¡ÀÌ ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Ãß¼¼´Â ¹«¼± ÃæÀü ±â¼úÀÇ °³¹ß ¹× º¸±ÞÀ» ÃËÁøÇÏ°í ½ÃÀåÀÇ ±â¼ú Çõ½ÅÀ» ÃËÁøÇÏ¿© ½ÃÀåÀÇ Áö¼ÓÀûÀÎ ¼ºÀå°ú È®ÀåÀ» ÃËÁøÇϰí ÀÖ½À´Ï´Ù.
³ôÀº Ãʱ⠼³Á¤ ºñ¿ë ¹× ÀÎÇÁ¶ó ¿ä±¸ »çÇ×
¹«¼± ÃæÀü ±â¼úÀ» µµÀÔÇÏ·Á¸é Àü¿ë ÃæÀü ÆÐµå, ¼Û½Å±â, ¼ö½Å±â¿¡ ´ëÇÑ ÅõÀÚ°¡ ÇÊ¿äÇϸç, ÀÌ´Â ¼ÒºñÀÚ¿Í ±â¾÷ ¸ðµÎ¿¡°Ô Àüü µµÀÔ ºñ¿ëÀ» Áõ°¡½Ãų ¼ö ÀÖ½À´Ï´Ù. ¶ÇÇÑ, °ø°øÀå¼Ò³ª Á÷Àå¿¡ ³Î¸® º¸±ÞÇϱâ À§ÇÑ ÀÎÇÁ¶ó¸¦ ±¸ÃàÇÏ´Â µ¥¿¡µµ Ãß°¡ÀûÀÎ ÅõÀÚ°¡ ÇÊ¿äÇÕ´Ï´Ù. ÀÌ·¯ÇÑ Ãʱ⠺ñ¿ëÀº ÀáÀçÀûÀÎ µµÀÔÀÚ¸¦ ¾ïÁ¦ÇÏ°í ½ÃÀå ¼ºÀåÀ» Á¦ÇÑÇÒ ¼ö ÀÖ½À´Ï´Ù.
¹«¼± ÃæÀü ±â±â¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡
½º¸¶Æ®Æù, ¿þ¾î·¯ºí ±â±â ¹× ±âŸ ÀüÀÚ±â±â¸¦ À§ÇÑ ¹«¼± ÃæÀü ¼Ö·ç¼ÇÀÇ Æí¸®ÇÔ°ú À¯¿¬¼º¿¡ ´ëÇÑ ¼ÒºñÀÚÀÇ ¼±È£µµ°¡ ³ô¾ÆÁö¸é¼ °í±Þ ¹«¼± ÃæÀü¿ë IC¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Ãß¼¼´Â ÀÚµ¿Â÷, ÇコÄɾî, ¼ÒºñÀÚ °¡Àü µî ´Ù¾çÇÑ »ê¾÷¿¡ ¹«¼± ÃæÀü ±â´ÉÀÌ ÅëÇÕµÇ¸é¼ ´õ¿í °¡¼Óȵǰí ÀÖ½À´Ï´Ù. µû¶ó¼ ±ÞÁõÇÏ´Â ¼ö¿ä¸¦ ÃæÁ·½Ã۰í ÀÌ ºÐ¾ßÀÇ Çõ½ÅÀ» ÁÖµµÇÏ´Â ¹«¼± ÃæÀü IC Á¦Á¶¾÷ü´Â »ó´çÇÑ ½ÃÀå ÀáÀç·ÂÀ» °¡Áö°í ÀÖ½À´Ï´Ù.
±âÁ¸ÀÇ À¯¼± ÃæÀü ¼Ö·ç¼Ç°ú °æÀï
À¯¼± ÃæÀü ¼Ö·ç¼ÇÀº ÀÌ¹Ì ³Î¸® äÅÃµÇ¾î ºü¸£°í ¾ÈÁ¤ÀûÀÎ ÃæÀü ±â´ÉÀ» Á¦°øÇÕ´Ï´Ù. ¸¹Àº ¼ÒºñÀÚ¿Í »ê¾÷°è´Â ȣȯ¼º, ÃæÀü ¼Óµµ ¹× ½Å·Ú¼º¿¡ ´ëÇÑ ¿ì·Á·Î ÀÎÇØ ¹«¼± ´ë¾ÈÀ¸·Î ÀüȯÇÏ´Â °ÍÀ» ÁÖÀúÇÒ ¼ö ÀÖ½À´Ï´Ù. ¶ÇÇÑ À¯¼± ÃæÀüÀÇ ±âÁ¸ ÀÎÇÁ¶ó´Â ±¤¹üÀ§ÇÏ°í ±¤¹üÀ§ÇÏ¿© ¹«¼± ÃæÀüÀÌ ºü¸£°Ô ³Î¸® ¼ö¿ëµÇ´Â µ¥ ¾î·Á¿òÀÌ ÀÖ½À´Ï´Ù.
Äڷγª19ÀÇ ÆÒµ¥¹ÍÀº °ø±Þ¸Á È¥¶õ°ú ºÒÇÊ¿äÇÑ ±â±â¿¡ ´ëÇÑ ¼ÒºñÀÚ ÁöÃâ °¨¼Ò·Î ÀÎÇØ ¹«¼± ÃæÀü IC ½ÃÀåÀ» Ãʱ⿡´Â È¥¶õ¿¡ ºü¶ß·È½À´Ï´Ù. ±×·¯³ª ¿ø°Ý ±Ù¹«¿Í ÀüÀÚ±â±â¿¡ ´ëÇÑ ÀÇÁ¸µµ°¡ ³ô¾ÆÁö¸é¼ ¹«¼± ÃæÀü ¼Ö·ç¼Ç¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÔ¿¡ µû¶ó ½ÃÀåÀº °á±¹ ȸº¹¼¼¸¦ º¸À̰í ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ºñÁ¢ÃË½Ä ±â¼ú·ÎÀÇ ÀüȯÀº ´Ù¾çÇÑ »ê¾÷ ºÐ¾ß¿¡¼ ¹«¼± ÃæÀü ICÀÇ Ã¤ÅÃÀ» ´õ¿í ÃËÁøÇß½À´Ï´Ù.
¿¹Ãø ±â°£ µ¿¾È ¼ö½Å±â IC ºÎ¹®ÀÌ °¡Àå Å« ºñÁßÀ» Â÷ÁöÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.
¼ö½Å±â IC´Â ¼Û½Å±â·ÎºÎÅÍ ¹«¼±À¸·Î Àü·ÂÀ» °ø±Þ¹Þ¾Æ ±â±â°¡ È¿À²ÀûÀ¸·Î ÃæÀüÇÒ ¼ö ÀÖµµ·Ï ÇÏ´Â µ¥ Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. ½º¸¶Æ®Æù, ¿þ¾î·¯ºí ±â±â ¹× ±âŸ °¡ÀüÁ¦Ç°ÀÇ ¹«¼± ÃæÀü äÅÃÀÌ Áõ°¡ÇÔ¿¡ µû¶ó ¼ö½Å±â IC¿¡ ´ëÇÑ ¼ö¿ä°¡ ±ÞÁõÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ¶ÇÇÑ, ¼ö½Å±â IC ±â¼úÀÇ ¹ßÀüÀ¸·Î È¿À²¼º°ú ȣȯ¼ºÀÌ Çâ»óµÇ¸é¼ ½ÃÀå ¸®´õ·Î¼ÀÇ ÀÔÁö¸¦ ´õ¿í °ø°íÈ÷ Çϰí ÀÖ½À´Ï´Ù.
¿¹Ãø ±â°£ µ¿¾È °¡Àå ³ôÀº CAGRÀ» ³ªÅ¸³¾ °ÍÀ¸·Î ¿¹»óµÇ´Â °íÃâ·Â ºÎ¹®
¹«¼± ÃæÀü¿ë IC ½ÃÀå¿¡¼ °íÀü·Â ºÎ¹®Àº ¿¹Ãø ±â°£ µ¿¾È °¡Àå ³ôÀº CAGRÀ» ³ªÅ¸³¾ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ÀÌ·¯ÇÑ ¼ºÀåÀº ƯÈ÷ ÀÚµ¿Â÷ ¹× °¡ÀüÁ¦Ç°°ú °°Àº »ê¾÷¿¡¼ ºü¸£°í È¿À²ÀûÀÎ ÃæÀü ¼Ö·ç¼Ç¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí Àֱ⠶§¹®ÀÔ´Ï´Ù. ¶ÇÇÑ, °íÃâ·Â ¹«¼± ÃæÀü¿ë IC´Â ´õ ºü¸¥ ÃæÀü ¼Óµµ¸¦ Á¦°øÇϰí Àü±âÀÚµ¿Â÷ ¹× ³ëÆ®ºÏ°ú °°Àº ´ëÇü ±â±â¸¦ ÃæÀüÇÒ ¼ö ÀÖ¾î ¼ÒºñÀÚ¿Í ¾÷°èÀÇ ÁøÈÇÏ´Â ¿ä±¸¿¡ ºÎÀÀÇÒ ¼ö ÀÖ½À´Ï´Ù.
ºÏ¹Ì´Â ¸î °¡Áö ¿äÀÎÀ¸·Î ÀÎÇØ ¹«¼± ÃæÀü IC ½ÃÀå¿¡¼ ÁÖµµ±ÇÀ» À¯ÁöÇÒ ¼ö ÀÖ´Â À§Ä¡¿¡ ÀÖ½À´Ï´Ù. ÀÌ Áö¿ªÀº °·ÂÇÑ ±â¼ú Çõ½Å, źźÇÑ ÀÎÇÁ¶ó, ´Ù¾çÇÑ ºÐ¾ßÀÇ ½º¸¶Æ® ±â±â º¸±Þ µîÀÇ ÀÌÁ¡À» ´©¸®°í ÀÖ½À´Ï´Ù. ¶ÇÇÑ, Àü±âÀÚµ¿Â÷ ÀÎÇÁ¶ó¿¡ ´ëÇÑ ÅõÀÚ Áõ°¡¿Í ÁÖ¿ä ½ÃÀå ±â¾÷ÀÇ Á¸Àç´Â ºÏ¹ÌÀÇ ¿ìÀ§¿¡ ±â¿©Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, Á¤ºÎÀÇ Àû±ØÀûÀÎ Áö¿ø°ú ¹«¼± ±â¼ú äÅÿ¡ ´ëÇÑ À¯¸®ÇÑ ±ÔÁ¦´Â ÀÌ Áö¿ª ¼¼°è ½ÃÀå °æÀï·ÂÀ» ´õ¿í °È½Ã۰í ÀÖ½À´Ï´Ù.
¾ÆÅÂÁö¿ªÀº ¹«¼± ÃæÀü¿ë IC ½ÃÀå¿¡¼ ±Þ¼ºÀåÇϰí ÀÖ´Â Áö¿ªÀÔ´Ï´Ù. ÀÌ Áö¿ª¿¡´Â ÁÖ¿ä Á¦Á¶ °ÅÁ¡ÀÌ ÀÖ°í, °¡ÀüÁ¦Ç° ½ÃÀåÀÌ ºü¸£°Ô ¼ºÀåÇϰí ÀÖ¾î ¹«¼± ÃæÀü ¼Ö·ç¼Ç¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ½º¸¶Æ®Æù º¸±Þ·ü Áõ°¡, Àü±âÀÚµ¿Â÷ÀÇ º¸±Þ, Àç»ý¿¡³ÊÁö ¹× ±â¼ú Çõ½ÅÀ» Áö¿øÇÏ´Â Á¤ºÎÀÇ ÀÌ´Ï¼ÅÆ¼ºê´Â ½ÃÀå È®´ë¿¡ ´õ¿í ±â¿©Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, Àεµ, Áß±¹, ÀϺ», Çѱ¹ µî ÁÖ¿ä ±â¾÷ÀÇ Á¸Àç¿Í Áö¼ÓÀûÀÎ ±â¼ú ¹ßÀüÀº ÀÌ Áö¿ª ½ÃÀå ¼ºÀå¿¡ ¹ÚÂ÷¸¦ °¡Çϰí ÀÖ½À´Ï´Ù.
According to Stratistics MRC, the Global Wireless Charging ICs Market is accounted for $6.9 billion in 2023 and is expected to reach $27.7 billion by 2030 growing at a CAGR of 21.8% during the forecast period. Wireless charging ICs (Integrated Circuits) are semiconductor components that facilitate the transfer of power wirelessly from a charging pad or transmitter to a compatible device such as smartphones, wearables, or electric vehicles. These ICs manage the conversion of electrical energy into the appropriate form for efficient wireless charging, enabling convenient and cable-free power transfer for modern electronic devices.
According to the Mobile Economy report 2022, 75% of the world's population has smartphone connection which is expected to reach 84% by 2025.
Increasing adoption of electric vehicles (EVs) and smart devices
The demand for EVs and smart devices is rising globally, and there is a corresponding need for efficient and convenient charging solutions. Wireless charging ICs offer the advantage of eliminating the hassle of cables and providing a seamless and user-friendly charging experience. This trend fuels the development and deployment of wireless charging technology, driving innovation in the market and leading to its sustained growth and expansion.
High initial setup costs and infrastructure requirements
Implementing wireless charging technology necessitates investment in specialized charging pads, transmitters, and receivers, adding to the overall cost of adoption for both consumers and businesses. Moreover, the installation of infrastructure for widespread deployment in public spaces or workplaces requires additional investment. These initial costs may deter some potential adopters, limiting market growth.
Rising demand for wireless charging devices
As consumers increasingly prefer the convenience and flexibility of wireless charging solutions for their smartphones, wearables, and other electronic devices, there is a growing need for advanced wireless charging ICs. This trend is further fueled by the integration of wireless charging capabilities into various industries, such as automotive, healthcare, and consumer electronics. As a result, there is considerable market potential for manufacturers of wireless charging ICs to meet the surging demand and drive innovation in this space.
Competition from established wired charging solutions
Wired charging solutions are already widely adopted and offer fast and reliable charging capabilities. Many consumers and industries may be hesitant to switch to wireless alternatives due to concerns about compatibility, charging speed, and reliability. Additionally, the existing infrastructure for wired charging is extensive, making it challenging for wireless charging to gain widespread acceptance rapidly.
The COVID-19 pandemic initially disrupted the wireless charging ICs market due to supply chain disruptions and decreased consumer spending on non-essential devices. However, the market eventually rebounded as remote working and increased reliance on electronic devices accelerated demand for wireless charging solutions. Additionally, the shift towards contactless technologies further boosted the adoption of wireless charging ICs in various industries.
The receiver ICs segment is expected to be the largest during the forecast period
Receiver ICs play a crucial role in wirelessly receiving power from transmitters, enabling devices to charge efficiently. With the increasing adoption of wireless charging in smartphones, wearables, and other consumer electronics, the demand for receiver ICs is expected to soar. Additionally, advancements in receiver IC technology, such as improved efficiency and compatibility, further contribute to its market leadership position.
The high power segment is expected to have the highest CAGR during the forecast period
In the wireless charging ICs market, the high-power segment is projected to experience the highest CAGR during the forecast period. This growth is driven by the increasing demand for fast and efficient charging solutions, particularly in industries such as automotive and consumer electronics. Moreover, high-power wireless charging ICs offer faster charging speeds and are capable of charging larger devices, such as electric vehicles and laptops, thus catering to the evolving needs of consumers and industries.
North America is positioned to sustain its leadership in the wireless charging ICs market due to several factors. The region benefits from strong technological innovation, robust infrastructure, and widespread adoption of smart devices across various sectors. Additionally, increasing investments in electric vehicle infrastructure and the presence of key market players contribute to North America's dominance. Furthermore, supportive government initiatives and favorable regulations regarding wireless technology adoption further enhance the region's competitiveness in the global market landscape.
Asia Pacific is poised for rapid growth in the wireless charging ICs market. The region is home to major manufacturing hubs and a burgeoning consumer electronics market, driving demand for wireless charging solutions. Additionally, increasing smartphone penetration, the adoption of electric vehicles and government initiatives supporting renewable energy and technology innovation further contribute to the market's expansion. Moreover, the presence of key players and ongoing technological advancements in countries like India, China, Japan, and South Korea fuel market growth in the region.
Key players in the market
Some of the key players in Wireless Charging ICs Market include Analog Devices, Broadcom Inc., Dialog Semiconductor, indie Semiconductor, Infineon Technologies, MediaTek, NXP Semiconductors, ON Semiconductor, Panasonic Corporation, Power Integrations, Qualcomm Technologies, Renesas Electronics Corporation, ROHM Semiconductor, Samsung Electronics, Semtech Corporation, STMicroelectronics, TDK Corporation, Texas Instruments and Vishay Intertechnology.
In June 2023, indie Semiconductor, an Autotech solutions innovator, has launched an integrated automotive wireless power charging system-on-chip (SoC) that offers the industry's highest level of integration. The iND87200 simplifies and accelerates the development of cost-effective WPC 'Qi'-based in-cabin portable device charging designs.
In May 2023, Infineon Unwraps Wireless Power Transmitter IC for up to 50 W Charging. Released in time for PCIM Europe, the new chip's integrated approach is aimed at enabling easier and more-cost-efficient wireless charging designs. The WLC1150 transmitter features include flexible thermal management options, low EMI, integrated adaptive foreign object detection (FOD), and more.