밀폐 포장 시장 예측(-2030년) : 제품별, 구성별, 용도별, 최종사용자별, 지역별 세계 분석

According to Stratistics MRC, the Global Hermetic Packaging Market is accounted for $4.13 billion in 2024 and is expected to reach $6.77 billion by 2030 growing at a CAGR of 8.6% during the forecast period. Hermetic packaging is a method used to seal electronic components, microelectromechanical systems (MEMS), and other sensitive devices in an airtight and moisture-resistant environment. This packaging technique prevents the ingress of gases, moisture, and contaminants, ensuring the reliability and longevity of the enclosed components. It is crucial for applications in harsh environments, such as aerospace, medical devices, and telecommunications. Hermetic packaging is essential for protecting high-value components from degradation and failure due to environmental exposure.

According to the EV volumes report, annual sales of EVs reached a new high of 10.2 million units globally in 2022, up 55% from the previous year. According to the State of Council Information Office of The People's Republic of China, in 2024, in China among main items, mobile phone output increased 6.9 percent year on year to 1.57 billion units, with smartphone production up 1.9 percent year on year to 1.14 billion.

Market Dynamics:

Driver:

Growth in the semiconductor industry

The growth in the semiconductor industry is a significant driver of the hermetic packaging market. As demand for advanced electronics and miniaturized devices increases, the need for reliable and durable semiconductor components becomes critical. Hermetic packaging provides an airtight seal, protecting sensitive semiconductor components from environmental factors such as moisture, dust, and temperature fluctuations, which can compromise their performance and longevity. With the proliferation of applications in consumer electronics, automotive, healthcare, and aerospace sectors, the semiconductor industry's expansion directly boosts the demand for hermetic packaging solutions to ensure optimal functionality and reliability of electronic components.

Restraint:

Limited applications

The hermetic packaging market faces several restraints that could hinder its growth. One significant challenge is the high cost associated with hermetic packaging materials and processes, which can be prohibitive for smaller companies. Additionally, the complexity and precision required in manufacturing hermetically sealed components can limit production scalability. Regulatory compliance and the need for specialized equipment further add to operational costs and complexity. Market growth is also tempered by the limited availability of skilled labor and technical expertise necessary for high-quality hermetic sealing.

Opportunity:

Increasing demand in aerospace and defense

The increasing demand in the aerospace and defense sectors presents a significant opportunity for the hermetic packaging market. Hermetic packaging, known for its ability to provide airtight seals, is crucial for protecting sensitive electronic components in harsh environments like those found in aerospace and defense applications. With advancements in technology driving the need for smaller and more powerful electronics, the demand for reliable hermetic packaging solutions is on the rise. Aerospace and defense companies require robust packaging to ensure the integrity and performance of critical systems, making hermetic packaging a vital component in their supply chain. This trend is expected to drive growth in the hermetic packaging market as these industries continue to expand and innovate.

Threat:

Shifts in consumer preferences

Shifts in consumer preferences pose a significant threat to the hermetic packaging market. As consumer demands evolve, driven by factors such as sustainability, convenience, and health consciousness, traditional hermetic packaging may face challenges. Consumers increasingly seek eco-friendly packaging solutions and are inclined towards minimalist designs that reduce waste. Moreover, the demand for packaging that ensures freshness and product safety remains high. To mitigate this threat, companies in the hermetic packaging sector must adapt by innovating sustainable materials, incorporating smart packaging technologies, and enhancing product aesthetics to align with changing consumer preferences.

Covid-19 Impact:

The latest COVID-19 epidemic has impacted the resources and financial situation of hermetic packaging suppliers. A worldwide health crisis brought on by the pandemic is having a negative impact on global financial markets, national economies, and end-use businesses for hermetic packaged goods. This is anticipated to trigger an economic slump and have a detrimental impact on the demand for electrical components that are hermetically sealed. The overall long-term impact of COVID-19 on the hermetic packaging market is anticipated to rely on a number of variables, including the pandemic's global spread and length, the response of different governments around the world, and the disease's severity.

The reed glass segment is expected to be the largest during the forecast period

The reed glasses segment is estimated to have a lucrative growth. Through millions of switching cycles, Reed Glasses offer incredibly stable encapsulation of reed switches. Where discrete electronic components need to be sealed, isolated, or protected, glass tubes are frequently employed in electronic applications. Yet, the purpose of this glass is typically to hermetically seal or electrically insulate passive components. Hot water boiler switches, belt sensors, and centralised locking systems for automobiles have all utilised reed glass.

The military & defense segment is expected to have the highest CAGR during the forecast period

The military & defense segment is anticipated to witness the fastest CAGR growth during the forecast period, due to the demand for hermetic packaging is anticipated to increase over the course of the forecast period as a result of rising security concerns, expanding defence budgets, and shifting political dynamics. Hermetic packaging is likely to experience growth due to rising public and private expenditure in space exploration.

Region with largest share:

North America is projected to have the highest largest share over the forecast period, owing to the region's government's increased spending on the aerospace and defence industries. Also, the aviation sector boosts demand for hermetic packaging by relying on new aircraft, which benefits the hermetic packaging sector. In the automotive industry, hermetic is utilised to guarantee sensor performance in rollover devices and airbag apparatus. As a result, the market might require hermetic packaging if airbag equipment becomes more common.

Region with highest CAGR:

Asia Pacific is projected to hold the highest market CAGR during the forecast period owing to factors like rising energy needs, developing economies, and rising defence spending, this market is expanding in the area. The demand for hermetic packaging for delicate electronic components is increasing as a result of the growing military prowess of emerging nations like China, India, and South Korea.

Key players in the market

Some of the key players in Hermetic Packaging market include Ametek, Inc., Amkor Technology, Egide S.A., Kyocera Corporation, Mackin Technologies, Materion Corporation, NGK Spark Plug Co., Ltd., Schott AG, SGA Technologies, Sinclair Manufacturing Company, Special Hermetic Products, Inc., SST International, Teledyne Microelectronic Technologies and Willow Technologies

Key Developments:

In May 2024, AMETEK Level Measurement Solutions (LMS) has launched BrightTEK, a state-of-the-art wireless Industrial Internet of Things (IIoT) solution designed to redefine operational efficiency and cost-effectiveness in various industries. Initially available for the North American market, BrightTEK leverages wireless technology to facilitate seamless data transmission from AMETEK LMS branded transmitters - including Magnetrol, Orion Instruments, Drexelbrook, SWI and B/W Controls, offering visibility to key variables to help optimise on-site operations.

In January 2024, Lumus Ltd., a developer of reflective waveguide technology for augmented reality (AR) eyewear, is expanding its five-year long partnership with international technology group Schott AG. To support this partnership, Schott is adding a new production facility to its site in Penang, Malaysia.

Products Covered:

• Transponder Glass
• Reed Glass
• Passivation Glass
• Ceramic-Metal Sealing (CERTM)
• Glass-Metal Sealing (GTMS)
• Other Products

Configurations Covered:

• Pressed Ceramic Packages
• Multilayer Ceramic Packages
• Metal Can Packages

Applications Covered:

• Transistors
• Micro-Electro-Mechanical Systems (MEMS) Switch
• Lasers
• Airbag Ignitors
• Oscillating Crystals
• Photo Diodes
• Sensors
• Other Applications

End Users Covered:

• Military & Defense
• Energy & Nuclear Safety
• Consumer Electronics
• Automotive
• Aeronautics & Space
• Medical
• Telecommunication
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Product Analysis
• 3.7 Application Analysis
• 3.8 End User Analysis
• 3.9 Emerging Markets
• 3.10 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Hermetic Packaging Market, By Product

• 5.1 Introduction
• 5.2 Transponder Glass
• 5.3 Reed Glass
• 5.4 Passivation Glass
• 5.5 Ceramic-Metal Sealing (CERTM)
• 5.6 Glass-Metal Sealing (GTMS)
• 5.7 Other Products

6 Global Hermetic Packaging Market, By Configuration

• 6.1 Introduction
• 6.2 Pressed Ceramic Packages
• 6.3 Multilayer Ceramic Packages
• 6.4 Metal Can Packages

7 Global Hermetic Packaging Market, By Application

• 7.1 Introduction
• 7.2 Transistors
• 7.3 Micro-Electro-Mechanical Systems (MEMS) Switch
• 7.4 Lasers
• 7.5 Airbag Ignitors
• 7.6 Oscillating Crystals
• 7.7 Photo Diodes
• 7.8 Sensors
• 7.9 Other Applications

8 Global Hermetic Packaging Market, By End User

• 8.1 Introduction
• 8.2 Military & Defense
• 8.3 Energy & Nuclear Safety
• 8.4 Consumer Electronics
• 8.5 Automotive
• 8.6 Aeronautics & Space
• 8.7 Medical
• 8.8 Telecommunication
• 8.9 Other End Users

9 Global Hermetic Packaging Market, By Geography

• 9.1 Introduction
• 9.2 North America
  • 9.2.1 US
  • 9.2.2 Canada
  • 9.2.3 Mexico
• 9.3 Europe
  • 9.3.1 Germany
  • 9.3.2 UK
  • 9.3.3 Italy
  • 9.3.4 France
  • 9.3.5 Spain
  • 9.3.6 Rest of Europe
• 9.4 Asia Pacific
  • 9.4.1 Japan
  • 9.4.2 China
  • 9.4.3 India
  • 9.4.4 Australia
  • 9.4.5 New Zealand
  • 9.4.6 South Korea
  • 9.4.7 Rest of Asia Pacific
• 9.5 South America
  • 9.5.1 Argentina
  • 9.5.2 Brazil
  • 9.5.3 Chile
  • 9.5.4 Rest of South America
• 9.6 Middle East & Africa
  • 9.6.1 Saudi Arabia
  • 9.6.2 UAE
  • 9.6.3 Qatar
  • 9.6.4 South Africa
  • 9.6.5 Rest of Middle East & Africa

10 Key Developments

• 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 10.2 Acquisitions & Mergers
• 10.3 New Product Launch
• 10.4 Expansions
• 10.5 Other Key Strategies

11 Company Profiling

• 11.1 Ametek, Inc.
• 11.2 Amkor Technology
• 11.3 Egide S.A.
• 11.4 Kyocera Corporation
• 11.5 Mackin Technologies
• 11.6 Materion Corporation
• 11.7 NGK Spark Plug Co., Ltd.
• 11.8 Schott AG
• 11.9 SGA Technologies
• 11.10 Sinclair Manufacturing Company
• 11.11 Special Hermetic Products, Inc.
• 11.12 SST International
• 11.13 Teledyne Microelectronic Technologies
• 11.14 Willow Technologies