집적회로(IC) 시장 예측(-2030년) : 제품 유형, 패키지 유형, 설계 방법, 기술, 최종사용자, 지역별 세계 분석

According to Stratistics MRC, the Global Integrated Circuits (ICs) Market is accounted for $742.6 billion in 2024 and is expected to reach $1,708.7 billion by 2030, growing at a CAGR of 14.9% during the forecast period. Integrated circuits (ICs) are miniaturized electronic circuits containing numerous components, such as transistors, resistors, and capacitors, fabricated on a single semiconductor chip. These compact, versatile devices form the foundation of modern electronics, powering everything from smartphones to industrial equipment. The IC market encompasses the design, manufacturing, and sale of these chips across various applications, including consumer electronics, automotive, telecommunications, and other various sectors.

According to data from the Semiconductor Industry Association (SIA), sales of automotive ICs increased by 29.2% year-over-year in 2022, reaching $34.1 billion.

Market Dynamics:

Driver:

Increasing demand for electronics

The growing adoption of smartphones, tablets, wearables, and other consumer electronics is driving significant demand for ICs. Additionally, emerging technologies like IoT, AI, and 5G are creating new applications that require advanced IC solutions. The automotive sector's shift towards electric and autonomous vehicles is also boosting IC usage. This rising demand across multiple end-use industries is a major factor propelling market growth.

Restraint:

High R&D costs

Developing new IC designs and manufacturing processes requires substantial investments in research and development. As IC technology advances, the complexity and costs associated with designing and fabricating chips continue to increase. This high barrier to entry can limit innovation and market participation, especially for smaller companies. The need for specialized equipment and facilities also adds to the overall costs, potentially restraining market growth.

Opportunity:

Market expansion in developing countries

Emerging economies in Asia, Africa, and Latin America present significant growth opportunities for the IC market. Rising disposable incomes, increasing urbanization, and growing technology adoption in these regions are driving demand for consumer electronics and other IC-enabled products. Additionally, government initiatives to boost domestic manufacturing capabilities in countries like India and Vietnam could create new market opportunities for IC companies.

Threat:

Intellectual property theft

The highly competitive nature of the IC industry makes intellectual property (IP) a critical asset. However, the risk of IP theft, especially through corporate espionage or state-sponsored activities, poses a significant threat to companies' competitive advantages and innovation efforts. This can discourage investments in R&D and potentially slow down technological advancements in the industry.

Covid-19 Impact:

The pandemic initially disrupted global supply chains and manufacturing operations, causing production delays and shortages. However, increased demand for electronics supporting remote work and digital services partially offsets these challenges. The crisis also accelerated digital transformation trends, potentially creating long-term growth opportunities for the market.

The application-specific integrated circuits (ASICs) segment is expected to be the largest during the forecast period

The ASICs segment is expected to dominate the market. ASICs are designed for specific applications, offering optimized performance, power efficiency, and cost-effectiveness compared to general-purpose ICs. The growing demand for customized solutions in areas like AI, cryptocurrency mining, and IoT is driving ASIC adoption. Additionally, ASICs' ability to provide enhanced security and IP protection makes them attractive for various industries, contributing to their market dominance.

The silicon-germanium (SiGe) segment is expected to have the highest CAGR during the forecast period

The SiGe segment is projected to experience the highest CAGR. SiGe technology offers superior performance in high-frequency and high-speed applications compared to traditional silicon. This makes it particularly suitable for 5G infrastructure, automotive radar systems, and satellite communications. The growing demand for these applications, coupled with SiGe's ability to enable smaller, more energy-efficient devices, is driving its rapid market growth.

Region with largest share:

Asia Pacific is expected to dominate the integrated circuits (ICs) market. The dominance is driven by the presence of major semiconductor manufacturing hubs in countries like Taiwan, South Korea, and China. The region's strong consumer electronics market, coupled with government initiatives to boost domestic IC production, contributes to its large market share. Additionally, the presence of key players and a well-established supply chain further solidify Asia Pacific's leading position.

Region with highest CAGR:

Asia Pacific is anticipated to witness lucrative growth in the integrated circuits (ICs) market. The high growth rate is fueled by increasing investments in semiconductor manufacturing capabilities, particularly in countries like India and Vietnam. The region's rapidly expanding consumer electronics market, coupled with the adoption of emerging technologies like 5G and IoT, is driving demand for ICs. Government support for domestic chip production and the shift of global supply chains towards Asia are also contributing to the region's accelerated growth.

Key players in the market

Some of the key players in Integrated Circuits (ICs) market include AMD, Analog Devices, Broadcom Inc., Infineon Technologies AG, Intel Corporation, Marvell Technology, Inc., MediaTek Inc., Micron Technology, Inc., Nvidia Corporation, NXP Semiconductors N.V., ON Semiconductor Corporation, Qualcomm Technologies, Inc., Renesas Electronics Corporation, Samsung Electronics, SK Hynix, STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company (TSMC), and Texas Instruments.

Key Developments:

In June 2024, Intel Corporation has achieved a revolutionary milestone in integrated photonics technology for high-speed data transmission. At the Optical Fiber Communication Conference (OFC) 2024, Intel's Integrated Photonics Solutions (IPS) Group demonstrated the industry's most advanced and first-ever fully integrated optical compute interconnect (OCI) chiplet co-packaged with an Intel CPU and running live data. Intel's OCI chiplet represents a leap forward in high-bandwidth interconnect by enabling co-packaged optical input/output (I/O) in emerging AI infrastructure for data centers and high performance computing (HPC) applications.

In May 2024, MediaTek held the MediaTek Dimensity Developer Conference (MDDC) 2024 in Shenzhen, where the Taiwan-based semiconductor company unveiled its latest flagship 5G chipset, the Dimensity 9300+. With a theme of "AI Empowers Everything," MDDC 2024 delved into the applications and advances in artificial intelligence technology across various domains, and the possibilities it brings to terminal devices. The Dimensity 9300+ has adopted TSMC's third-generation 4nm process technology, according to MediaTek. The new chip boasts big-core CPU architecture, housing an octa-core CPU comprising four Cortex-X4 ultra-large cores clocked at up to 3.4 GHz, and four Cortex-A720 large cores operating at 2.0 GHz.

Product Types Covered:

• Digital ICs
• Analog ICs
• Memory ICs
• Mixed-Signal ICs
• Other ICs

Packaging Types Covered:

• Surface-Mount Devices (SMD)
• Through-Hole Devices
• Integrated Circuit Modules
• Advanced Packaging

Design Approaches Covered:

• General-Purpose ICs
• Application-Specific Integrated Circuits (ASICs)
• Field-Programmable Gate Arrays (FPGAs)
• System-on-Chip (SoC)
• Application-Specific Standard Products (ASSPs)
• Custom ICs

Technologies Covered:

• Complementary Metal-Oxide-Semiconductor (CMOS)
• Bipolar Complementary Metal-Oxide-Semiconductor (BiCMOS)
• Bipolar
• Gallium Arsenide (GaAs)
• Silicon-Germanium (SiGe)
• Other Technologies

End Users Covered:

• Consumer Electronics
• Automotive
• IT & Telecommunications
• Manufacturing & Automation
• Healthcare
• Aerospace & Defense
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Product Analysis
• 3.7 Technology Analysis
• 3.8 End User Analysis
• 3.9 Emerging Markets
• 3.10 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Integrated Circuits (ICs) Market, By Product Type

• 5.1 Introduction
• 5.2 Digital ICs
  • 5.2.1 Microprocessors
  • 5.2.2 Microcontrollers
  • 5.2.3 Digital Signal Processors (DSPs)
  • 5.2.4 Logic ICs
• 5.3 Analog ICs
  • 5.3.1 Linear ICs
  • 5.3.2 Power Management ICs
• 5.4 Memory ICs
  • 5.4.1 DRAM
  • 5.4.2 SRAM
  • 5.4.3 Flash Memory
  • 5.4.4 ROM
• 5.5 Mixed-Signal ICs
• 5.6 Other ICs

6 Global Integrated Circuits (ICs) Market, By Packaging Type

• 6.1 Introduction
• 6.2 Surface-Mount Devices (SMD)
  • 6.2.1 Quad Flat Packages (QFP)
  • 6.2.2 Ball Grid Array (BGA)
  • 6.2.3 Chip-Scale Package (CSP)
  • 6.2.4 Chip-on-Board (COB)
  • 6.2.5 Other SMD Packages
• 6.3 Through-Hole Devices
  • 6.3.1 Dual In-line Packages (DIP)
  • 6.3.2 Pin Grid Array (PGA)
  • 6.3.3 Other Through-Hole Device Packages
• 6.4 Integrated Circuit Modules
  • 6.4.1 System-in-Package (SiP)
  • 6.4.2 Multi-Chip Modules (MCM)
  • 6.4.3 2.5D & 3D IC Packaging
• 6.5 Advanced Packaging
  • 6.5.1 Fan-out Package on Laminate (FOPL)
  • 6.5.2 Integrated Fan-Out (IFO)
  • 6.5.3 Chip-on-Wafer (CoW)
  • 6.5.4 Other Advanced Packaging

7 Global Integrated Circuits (ICs) Market, By Design Approach

• 7.1 Introduction
• 7.2 General-Purpose ICs
• 7.3 Application-Specific Integrated Circuits (ASICs)
• 7.4 Field-Programmable Gate Arrays (FPGAs)
• 7.5 System-on-Chip (SoC)
• 7.6 Application-Specific Standard Products (ASSPs)
• 7.7 Custom ICs

8 Global Integrated Circuits (ICs) Market, By Technology

• 8.1 Introduction
• 8.2 Complementary Metal-Oxide-Semiconductor (CMOS)
• 8.3 Bipolar Complementary Metal-Oxide-Semiconductor (BiCMOS)
• 8.4 Bipolar
• 8.5 Gallium Arsenide (GaAs)
• 8.6 Silicon-Germanium (SiGe)
• 8.7 Other Technologies

9 Global Integrated Circuits (ICs) Market, By End User

• 9.1 Introduction
• 9.2 Consumer Electronics
• 9.3 Automotive
• 9.4 IT & Telecommunications
• 9.5 Manufacturing & Automation
• 9.6 Healthcare
• 9.7 Aerospace & Defense
• 9.8 Other End Users

10 Global Integrated Circuits (ICs) Market, By Geography

• 10.1 Introduction
• 10.2 North America
  • 10.2.1 US
  • 10.2.2 Canada
  • 10.2.3 Mexico
• 10.3 Europe
  • 10.3.1 Germany
  • 10.3.2 UK
  • 10.3.3 Italy
  • 10.3.4 France
  • 10.3.5 Spain
  • 10.3.6 Rest of Europe
• 10.4 Asia Pacific
  • 10.4.1 Japan
  • 10.4.2 China
  • 10.4.3 India
  • 10.4.4 Australia
  • 10.4.5 New Zealand
  • 10.4.6 South Korea
  • 10.4.7 Rest of Asia Pacific
• 10.5 South America
  • 10.5.1 Argentina
  • 10.5.2 Brazil
  • 10.5.3 Chile
  • 10.5.4 Rest of South America
• 10.6 Middle East & Africa
  • 10.6.1 Saudi Arabia
  • 10.6.2 UAE
  • 10.6.3 Qatar
  • 10.6.4 South Africa
  • 10.6.5 Rest of Middle East & Africa

11 Key Developments

• 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 11.2 Acquisitions & Mergers
• 11.3 New Product Launch
• 11.4 Expansions
• 11.5 Other Key Strategies

12 Company Profiling

• 12.1 AMD
• 12.2 Analog Devices
• 12.3 Broadcom Inc.
• 12.4 Infineon Technologies AG
• 12.5 Intel Corporation
• 12.6 Marvell Technology, Inc.
• 12.7 MediaTek Inc.
• 12.8 Micron Technology, Inc.
• 12.9 Nvidia Corporation
• 12.10 NXP Semiconductors N.V.
• 12.11 ON Semiconductor Corporation
• 12.12 Qualcomm Technologies, Inc.
• 12.13 Renesas Electronics Corporation
• 12.14 Samsung Electronics
• 12.15 SK Hynix
• 12.16 STMicroelectronics N.V.
• 12.17 Taiwan Semiconductor Manufacturing Company (TSMC)
• 12.18 Texas Instruments