전자 제품 포장 시장 예측(-2030년) : 재료 유형별, 포장 유형별, 유통 채널별, 용도별, 최종사용자별, 지역별 세계 분석

According to Stratistics MRC, the Global Electronic Goods Packaging Market is accounted for $2.1 billion in 2024 and is expected to reach $3.4 billion by 2030, growing at a CAGR of 8.6% during the forecast period. The materials and procedures used to safeguard, store, and move electronic goods are known as electronic goods packaging. It guarantees the security of sensitive gadgets during handling and transportation, including computers, televisions, and cell phones. Plastics, paperboard, metal, foam, and glass are examples of packaging materials that offer tamper-proofing, cushioning, and protection from the elements.

According to the data from the Indian government, exports of electronic goods increased by 14.41% to USD 2.63 billion in December 2022 compared to USD 2.30 billion in the same month the previous year.

Market Dynamics:

Driver:

Rising demand for consumer electronics

The exponential growth in consumer electronics is driving the electronic goods packaging market. Increasing smartphone penetration, rising disposable incomes and technological advancements are fueling demand for sophisticated electronic devices. Consumers are constantly seeking advanced gadgets with improved features, leading to rapid product innovation. The proliferation of smart devices, including wearables, IoT-enabled products, and home automation systems, further accelerates the need for specialized packaging solutions that protect delicate electronic components during manufacturing, transportation, and storage.

Restraint:

Cost of advanced packaging

Advanced electronic packaging technologies involve significant research and development investments, resulting in higher production costs. Sophisticated packaging solutions require specialized materials, precision manufacturing techniques, and advanced protective mechanisms. These factors substantially increase the overall packaging expenses for manufacturers. Small and medium-sized electronics companies might struggle to adopt cutting-edge packaging technologies due to budget constraints. The complexity of designing protective packaging that meets stringent performance and safety standards further contributes to escalating costs.

Opportunity:

Expansion of e-commerce

The rapid growth of e-commerce presents substantial opportunities for the electronic goods packaging market. Online retail platforms have witnessed exponential expansion, particularly after the COVID-19 pandemic. Increased digital shopping behaviors necessitate robust packaging solutions that ensure product safety during transit. E-commerce platforms require innovative packaging designs that protect fragile electronic items, minimize damage, and reduce return rates. The surge in cross-border online sales and the need for sustainable, lightweight packaging solutions further amplify market potential.

Threat:

Plastic waste concerns

Growing awareness about plastic pollution and stringent regulatory frameworks are compelling manufacturers to reconsider traditional packaging materials. Consumers and governments are increasingly demanding eco-friendly packaging solutions that minimize environmental impact. The electronics packaging industry faces pressure to develop biodegradable, recyclable alternatives to conventional plastic packaging. Failure to address these environmental concerns could result in reputational damage, potential regulatory penalties, and reduced market acceptance.

Covid-19 Impact:

The COVID-19 pandemic transformed the electronic goods packaging market. Increased digital consumption, remote work requirements, and heightened online shopping accelerated packaging demand. E-commerce platforms experienced unprecedented growth, driving innovative packaging solutions. Manufacturers prioritized protective, hygienic packaging designs. Supply chain disruptions prompted companies to develop more resilient packaging strategies. The crisis underscored the critical role of packaging in ensuring product safety and maintaining consumer confidence.

The plastics segment is expected to be the largest during the forecast period

During the forecast period, the plastics segment is anticipated to register the largest market share due to its versatility, cost-effectiveness, and protective properties. Plastic materials offer excellent shock absorption, moisture resistance, and lightweight characteristics essential for electronic component protection. Advanced polymer technologies enable manufacturers to create customized packaging solutions with enhanced durability and performance. Plastic packaging supports miniaturization trends in electronics, providing precise, form-fitting protection for increasingly compact devices. Its adaptability to various manufacturing processes and relatively low production costs further solidify its market leadership.

The online retail segment is expected to have the highest CAGR during the forecast period

During the projection period, the online retail segment is expected to grow at the highest CAGR, driven by transformative digital shopping experiences. Exponential e-commerce expansion, particularly in emerging markets, propels packaging innovation. Online platforms require specialized packaging solutions that ensure product integrity, minimize shipping damages, and enhance unboxing experiences. The segment's growth is fueled by increasing internet penetration, smartphone usage, and changing consumer preferences. Advanced packaging technologies that support secures, sustainable, and aesthetically pleasing delivery mechanisms are critical to this segment's remarkable expansion.

Region with largest share:

Over the forecasted timeframe, the Asia Pacific region is anticipated to dominate the market share, propelled by robust manufacturing ecosystems and rapid technological adoption. Countries like China, Japan, South Korea, and India serve as global electronics production hubs. The region's substantial consumer electronics manufacturing capabilities, increasing disposable incomes and massive population drive packaging market growth. Additionally, technological advancements, extensive supply chain networks, and government support for electronics industries contribute to the region's market leadership.

Region with highest CAGR:

During the estimation period, Asia Pacific is projected to achieve the highest compound annual growth rate, underpinned by dynamic economic development and technological transformation. Emerging economies demonstrate accelerating digital adoption, expanding middle-class populations, and increasing technological investments. The region's electronics manufacturing prowess, coupled with rising consumer electronics demand, creates unprecedented packaging market opportunities. Rapid urbanization, infrastructure improvements, and government initiatives supporting technological innovation contribute to the region's exceptional growth trajectory.

Key players in the market

Some of the key players in Electronic Goods Packaging Market include DS Smith Plc, Mondi Group, International Paper Company, Sonoco Products Company, Sealed Air Corporation, Huhtamaki Oyj, Smurfit Kappa Group PLC, WestRock Company, UFP Technologies, Inc., Stora Enso Oyj, DuPont de Nemours, Inc., SCHOTT AG, Pregis Corporation, Billerud AB, Plastic Ingenuity, Dunapack Packaging Group, Hangzhou Xunda Packaging Co., and Berry Global Inc.

Key Developments:

In February 2023, The International Paper plants in Mortagne (Societe Normande de Carton Ondule - SNCO) and Chalon (Emballages Laurent SAS) will benefit from investments of nearly € 23 million to adapt their production capacity to the growth of the e-commerce sector and to offer even more sustainable packaging to customers. As part of the project, up to 50 new positions will be created in France. This investment is the largest at the two facilities in several years, and includes the installation of new equipment that will increase converting capacity at the Mortagne and Chalon sites by 60% and 50% respectively. It will allow International Paper to offer customers an even wider choice of premium corrugated packaging solutions.

In May 2022, Mondi, a global leader in sustainable packaging and paper, has collaborated with German machine supplier beck packautomaten to create a functional paper solution that has the potential to revolutionise eCommerce by replacing plastic packaging and creating right-sized packaging for a wide range of products.

Material Types Covered:

• Plastics
• Paper and Paperboard
• Metal
• Glass
• Foam
• Other Material Types

Packaging Types Covered:

• Primary Packaging
• Secondary Packaging
• Tertiary Packaging

Distribution Channels Covered:

• Online Retail
• Offline Retail

Applications Covered:

• Mobile Phones and Accessories
• Computers and Laptops
• Televisions
• Audio Equipment
• Kitchen Appliances
• Gaming Consoles
• Wearable Electronics
• Home Appliances
• Other Applications

End Users Covered:

• Consumer Electronics
• Automotive Electronics
• IT and Telecom
• Medical Devices
• Aerospace and Defense
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Application Analysis
• 3.7 End User Analysis
• 3.8 Emerging Markets
• 3.9 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Electronic Goods Packaging Market, By Material Type

• 5.1 Introduction
• 5.2 Plastics
  • 5.2.1 Polyethylene (PE)
  • 5.2.2 Polypropylene (PP)
  • 5.2.3 Polyvinyl Chloride (PVC)
  • 5.2.4 Polyethylene Terephthalate (PET)
  • 5.2.5 Other Plastics
• 5.3 Paper and Paperboard
• 5.4 Metal
• 5.5 Glass
• 5.6 Foam
• 5.7 Other Material Types

6 Global Electronic Goods Packaging Market, By Packaging Type

• 6.1 Introduction
• 6.2 Primary Packaging
  • 6.2.1 Boxes
  • 6.2.2 Bags
  • 6.2.3 Blisters
  • 6.2.4 Clamshells
  • 6.2.5 Pouches
• 6.3 Secondary Packaging
  • 6.3.1 Corrugated Boxes
  • 6.3.2 Inserts and Dividers
  • 6.3.3 Protective Wrapping
• 6.4 Tertiary Packaging
  • 6.4.1 Pallets
  • 6.4.2 Shrink Wrap
  • 6.4.3 Strapping

7 Global Electronic Goods Packaging Market, By Distribution Channel

• 7.1 Introduction
• 7.2 Online Retail
• 7.3 Offline Retail

8 Global Electronic Goods Packaging Market, By Application

• 8.1 Introduction
• 8.2 Mobile Phones and Accessories
• 8.3 Computers and Laptops
• 8.4 Televisions
• 8.5 Audio Equipment
• 8.6 Kitchen Appliances
• 8.7 Gaming Consoles
• 8.8 Wearable Electronics
• 8.9 Home Appliances
• 8.10 Other Applications

9 Global Electronic Goods Packaging Market, By End User

• 9.1 Introduction
• 9.2 Consumer Electronics
• 9.3 Automotive Electronics
• 9.4 IT and Telecom
• 9.5 Medical Devices
• 9.6 Aerospace and Defense
• 9.7 Other End Users

10 Global Electronic Goods Packaging Market, By Geography

• 10.1 Introduction
• 10.2 North America
  • 10.2.1 US
  • 10.2.2 Canada
  • 10.2.3 Mexico
• 10.3 Europe
  • 10.3.1 Germany
  • 10.3.2 UK
  • 10.3.3 Italy
  • 10.3.4 France
  • 10.3.5 Spain
  • 10.3.6 Rest of Europe
• 10.4 Asia Pacific
  • 10.4.1 Japan
  • 10.4.2 China
  • 10.4.3 India
  • 10.4.4 Australia
  • 10.4.5 New Zealand
  • 10.4.6 South Korea
  • 10.4.7 Rest of Asia Pacific
• 10.5 South America
  • 10.5.1 Argentina
  • 10.5.2 Brazil
  • 10.5.3 Chile
  • 10.5.4 Rest of South America
• 10.6 Middle East & Africa
  • 10.6.1 Saudi Arabia
  • 10.6.2 UAE
  • 10.6.3 Qatar
  • 10.6.4 South Africa
  • 10.6.5 Rest of Middle East & Africa

11 Key Developments

• 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 11.2 Acquisitions & Mergers
• 11.3 New Product Launch
• 11.4 Expansions
• 11.5 Other Key Strategies

12 Company Profiling

• 12.1 DS Smith Plc
• 12.2 Mondi Group
• 12.3 International Paper Company
• 12.4 Sonoco Products Company
• 12.5 Sealed Air Corporation
• 12.6 Huhtamaki Oyj
• 12.7 Smurfit Kappa Group PLC
• 12.8 WestRock Company
• 12.9 UFP Technologies, Inc.
• 12.10 Stora Enso Oyj
• 12.11 DuPont de Nemours, Inc.
• 12.12 SCHOTT AG
• 12.13 Pregis Corporation
• 12.14 Billerud AB
• 12.15 Plastic Ingenuity
• 12.16 Dunapack Packaging Group
• 12.17 Hangzhou Xunda Packaging Co.
• 12.18 Berry Global Inc.